CN208923181U - A kind of novel LEDCOB illuminating source packaging structure - Google Patents
A kind of novel LEDCOB illuminating source packaging structure Download PDFInfo
- Publication number
- CN208923181U CN208923181U CN201821349272.2U CN201821349272U CN208923181U CN 208923181 U CN208923181 U CN 208923181U CN 201821349272 U CN201821349272 U CN 201821349272U CN 208923181 U CN208923181 U CN 208923181U
- Authority
- CN
- China
- Prior art keywords
- fixedly connected
- layer
- electric wiring
- substrate
- ledcob
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The utility model discloses a kind of novel LEDCOB illuminating source packaging structures, enclosure wall body is fixedly connected to including corresponding position at the top of substrate electric wiring layer, the bottom of LED chip is fixedly connected with electric wiring layer top center position, flourescent sheet is fixedly connected at the top of enclosure wall body, the surface side of substrate is fixedly connected with cooling device, the surface side of enclosure wall body is fixedly connected with minitype heat radiating device, cooling hole is uniformly distributed on the surface of the substrate, the surface of electric wiring layer offers circular hole, circular hole is evenly distributed on the surface of electric wiring layer, the utility model relates to encapsulating structure technical fields.The novel LEDCOB illuminating source packaging structure of the one kind, reach flourescent sheet and LED chip to separate, the effect of good heat dissipation effect, structure is simple, easy to use, flourescent sheet is separated with LED chip, is realized wind water cooling while being radiated, it avoids the problem that light source ages and color change, improves the service life of product.
Description
Technical field
The utility model relates to encapsulating structure technical field, specially a kind of novel LEDCOB illuminating source packaging structure.
Background technique
COB light source is exactly the integrated area source of high photosynthetic efficiency that LED chip is placed directly against on the mirror metal substrate of high reflecting rate
Technology, COB light source can simply be interpreted as high power and integrate area source, and light source can be designed according to product shape structure goes out light
Products characteristics: area and outer dimension are electrically stablized, circuit design, optical design, heat dissipation design are scientific and reasonable；Using heat sink
Technology, it is mating convenient for the secondary optics of product, lighting quality is improved, Gao Xianse, is shone uniformly, without hot spot, health environment-friendly.
Installation is simple, easy to use, reduces Design of Luminaires difficulty, saves lamps and lanterns processing and follow-up maintenance cost.Existing LED light source envelope
Assembling structure is complicated, inconvenient to use, and using fluorescent powder plus the structure for being covered on chip surface after silica gel mixing, this mixing is glimmering
Optical cement be directly and LED chip surface contact, cooling effect is poor, thus the temperature of fluorescent glue can with the temperature of chip raising and
Increase, will lead to fluorescent glue accelerated ageing and change light source color the phenomenon that, and regard relatively high power product when, this
Kind encapsulating structure will become improper, and this patent does not contact the encapsulating structure of LED chip using high temperature resistant flourescent sheet, this is well
It solves the problems, such as light source ages and color change, and the light source product of more high power density can be done.
Utility model content
(1) the technical issues of solving
In view of the deficiencies of the prior art, the utility model provides a kind of novel LEDCOB illuminating source packaging structure, solves
Structure is complicated, inconvenient to use, and flourescent sheet directly and the contact of LED chip surface, is unable to wind water cooling while radiating, heat dissipation
Low efficiency, the problem of leading to fluorescent glue accelerated ageing and change the color of light source.
(2) technical solution
In order to achieve the above object, the utility model is achieved by the following technical programs: a kind of novel LEDCOB light
Source encapsulating structure, including substrate, the surface side of the substrate are fixedly connected with cooling device, and the substrate top is fixedly connected
There is electric wiring layer, corresponding position is fixedly connected to enclosure wall body, the electric wiring layer at the top of the electric wiring layer
The corresponding position in top is fixedly connected to the first electrical wire, the described one end of first electrical wire far from electric wiring layer
It is fixedly connected with LED chip, is connected between the LED chip by the second electrical wire, the bottom of the LED chip and electrical
Line layer top center position is fixedly connected, and flourescent sheet, the surface of the enclosure wall body are fixedly connected at the top of the enclosure wall body
Side is fixedly connected with minitype heat radiating device.
Preferably, the cooling device includes miniature cooling pump, the surface side of the miniature cooling pump and the table of substrate
Face side is fixedly connected, and the water inlet end of the miniature cooling pump, backwater end have been respectively communicated with water inlet pipe, return pipe, the substrate
Inside offer cooling water channel, the water inlet end of the cooling water channel, backwater end respectively with one end of water inlet pipe, return pipe one
End connection, the surface of the substrate offers cooling hole.
Preferably, the cooling hole is uniformly distributed on the surface of the substrate.
Preferably, the surface of the electric wiring layer offers circular hole, and the circular hole is evenly distributed on electric wiring layer
Surface.
Preferably, the flourescent sheet includes flourescent sheet ontology, and the surface of the flourescent sheet ontology is provided with optical waveguide layer, described
Optical waveguide layer is provided with luminous diffusion layer far from the side of flourescent sheet ontology, and the luminous diffusion layer is arranged far from the side of optical waveguide layer
There is proofing dust and protecting layer, the proofing dust and protecting layer is provided with waterproof protective layer, the waterproofing protection far from the side of luminous diffusion layer
Layer is provided with high-temperature-resistant layer far from the side of proofing dust and protecting layer, and the bottom of the high-temperature-resistant layer is provided with reflecting layer.
Preferably, the minitype heat radiating device includes radiating motor, and the radiating motor output end is fixed by shaft coupling
It is connected with heat dissipation shaft, the radiating motor is fixedly connected far from the side of heat dissipation shaft with the surface side of enclosure wall body, described
The shaft that radiates is fixedly connected with radiating vane far from one end of radiating motor.
(3) beneficial effect
The utility model provides a kind of novel LEDCOB illuminating source packaging structure.Have it is following the utility model has the advantages that
(1), the novel LEDCOB illuminating source packaging structure, is fixedly connected with electric wiring layer by substrate top, electrically
Corresponding position is fixedly connected to enclosure wall body at the top of line layer, and the first electrical wire is fixed far from one end of electric wiring layer
It is connected with LED chip, the bottom of LED chip is fixedly connected with electric wiring layer top center position, and the top of enclosure wall body is fixed
Be connected with flourescent sheet, achieved the effect that flourescent sheet is separated with LED chip, it is structurally reasonable simple, it is easy to use, flourescent sheet with
LED chip avoids the problem that light source ages and color change, improves the service life of product convenient for heat dissipation.
(2), the novel LEDCOB illuminating source packaging structure is fixedly connected with cooling device by the surface side of substrate,
The surface side of enclosure wall body is fixedly connected with minitype heat radiating device, and cooling hole is uniformly distributed on the surface of the substrate, electric wiring layer
Surface offer circular hole, circular hole is evenly distributed on the surface of electric wiring layer, has achieved the effect that high efficiency and heat radiation, structurally reasonable
Simply, easy to use, it realizes to internal high efficiency and heat radiation, effectively prevents light source ages and color change, improve product
Service life.
Detailed description of the invention
Fig. 1 is the utility model structure chart；
Fig. 2 is flourescent sheet structural schematic diagram；
Fig. 3 is minitype heat radiating device structural schematic diagram；
Fig. 4 is electric wiring schematic diagram of a layer structure；
Fig. 5 is partial enlarged view at A in Fig. 1.
In figure: 1 substrate, 2 cooling devices, 21 miniature cooling pumps, 22 water inlet pipes, 23 return pipes, 24 cooling water channels, 25 coolings
Hole, 3 electric wiring layers, 31 circular holes, 4 enclosure wall bodies, 5 first electrical wires, 6LED chip, 7 second electrical wires, 8 flourescent sheets, 81
Flourescent sheet ontology, 82 optical waveguide layers, 83 luminous diffusion layers, 84 proofing dust and protecting layers, 85 waterproof protective layers, 86 high-temperature-resistant layers, 87 reflections
Layer, 9, minitype heat radiating device, 91 radiating motors, 92 heat dissipation shafts, 93 radiating vanes.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
Every other embodiment obtained, fall within the protection scope of the utility model.
Fig. 1-5 is please referred to, the utility model provides a kind of technical solution: a kind of novel LEDCOB illuminating source packaging structure,
Including substrate 1, the surface side of substrate 1 is fixedly connected with cooling device 2, and but device 2 includes miniature cooling pump 21, miniature cooling
The surface side of pump 21 is fixedly connected with the surface side of substrate 1, and the water inlet end of miniature cooling pump 21, backwater end have been respectively communicated with
Water inlet pipe 22, return pipe 23, the inside of substrate 1 offer cooling water channel 24, the water inlet end of cooling water channel 24, backwater end respectively with
One end connection of one end, return pipe 23 of water inlet pipe 22, the surface of substrate 1 offer cooling hole 25, and cooling hole 25 is uniformly distributed
On the surface of substrate 1, electric wiring layer 3 is fixedly connected at the top of substrate 1, the surface of electric wiring layer 3 offers circular hole 31, circle
Hole 31 is evenly distributed on the surface of electric wiring layer 3, and the corresponding position in 3 top of electric wiring layer is fixedly connected to enclosure wall body
4, the corresponding position in 3 top of electric wiring layer is fixedly connected to the first electrical wire 5, and the first electrical wire 5 is far from electrical
One end of line layer 3 is fixedly connected with LED chip 6, is connected between LED chip 6 by the second electrical wire 7, LED chip 6
Bottom is fixedly connected with 3 top center position of electric wiring layer, and the top of enclosure wall body 4 is fixedly connected with flourescent sheet 8, flourescent sheet 8
Including flourescent sheet ontology 81, the surface of flourescent sheet ontology 81 is provided with optical waveguide layer 82, and optical waveguide layer 82 is far from flourescent sheet ontology 81
Side is provided with luminous diffusion layer 83, and the diffusion layer 83 that shines is provided with proofing dust and protecting layer 84 far from the side of optical waveguide layer 82, dust-proof
Protective layer 84 is provided with waterproof protective layer 85 far from the side of luminous diffusion layer 83, and waterproof protective layer 85 is far from proofing dust and protecting layer 84
Side be provided with high-temperature-resistant layer 86, the bottom of high-temperature-resistant layer 86 is provided with reflecting layer 87, and the surface side of enclosure wall body 2 is fixed to be connected
It is connected to minitype heat radiating device 9, minitype heat radiating device 9 includes radiating motor 91, and 91 output end of radiating motor is fixed by shaft coupling
It is connected with heat dissipation shaft 92, radiating motor 91 is fixedly connected far from the side of heat dissipation shaft 92 with the surface side of enclosure wall body 2, is dissipated
Hot shaft 92 is fixedly connected with radiating vane 93 far from one end of radiating motor 91.
In use, flourescent sheet is separated with LED chip, avoid contact with convenient for heat dissipation, when device internal temperature is high, starts micro-
Type cooling pump 21 makes its work, and coolant liquid is transported in cooling water channel 24 by miniature cooling pump 2, returns to using return pipe 23 micro-
In type cooling pump 21, circulation is formed, carries out water cooling, starting radiating motor 91 while starting miniature cooling pump 21 makes its work,
91 output end of radiating motor is driven heat dissipation shaft 92 by shaft coupling, to radiating vane 93 be driven, so that internal sky
Gas blows to outside by circular hole 31 and cooling hole 25, forms cross-ventilation, radiates to inside.
It should be noted that, in this document, relational terms such as first and second and the like are used merely to a reality
Body or operation are distinguished with another entity or operation, are deposited without necessarily requiring or implying between these entities or operation
In any actual relationship or order or sequence.Moreover, the terms "include", "comprise" or its any other variant are intended to
Non-exclusive inclusion, so that the process, method, article or equipment including a series of elements is not only wanted including those
Element, but also including other elements that are not explicitly listed, or further include for this process, method, article or equipment
Intrinsic element.In the absence of more restrictions.By sentence " element limited including one ..., it is not excluded that
There is also other identical elements in the process, method, article or equipment for including element ".
While there has been shown and described that the embodiments of the present invention, for the ordinary skill in the art,
It is understood that these embodiments can be carried out with a variety of variations in the case where not departing from the principles of the present invention and spirit, repaired
Change, replacement and variant, the scope of the utility model is defined by the appended claims and the equivalents thereof.
Claims (6)
1. a kind of novel LEDCOB illuminating source packaging structure, including substrate (1), it is characterised in that: the surface one of the substrate (1)
Side is fixedly connected with cooling device (2), is fixedly connected with electric wiring layer (3) at the top of the substrate (1), the electric wiring layer
(3) the corresponding position in top is fixedly connected to enclosure wall body (4), and corresponding position is equal at the top of the electric wiring layer (3)
It is fixedly connected with the first electrical wire (5), first electrical wire (5) is fixedly connected far from the one end of electric wiring layer (3)
Have LED chip (6), between the LED chip (6) by the second electrical wire (7) connect, the bottom of the LED chip (6) with
Electric wiring layer (3) top center position is fixedly connected, and is fixedly connected with flourescent sheet (8) at the top of the enclosure wall body (4), described
The surface side of enclosure wall body (4) is fixedly connected with minitype heat radiating device (9).
2. the novel LEDCOB illuminating source packaging structure of one kind according to claim 1, it is characterised in that: the cooling device
It (2) include miniature cooling pump (21), the fixed company in the surface side of the miniature cooling pump (21) and the surface side of substrate (1)
It connects, the water inlet end of the miniature cooling pump (21), backwater end have been respectively communicated with water inlet pipe (22), return pipe (23), the substrate
(1) inside offers cooling water channel (24), the water inlet end of the cooling water channel (24), backwater end respectively with water inlet pipe (22)
One end connection of one end, return pipe (23), the surface of the substrate (1) offers cooling hole (25).
3. the novel LEDCOB illuminating source packaging structure of one kind according to claim 2, it is characterised in that: the cooling hole
(25) it is evenly distributed on the surface of substrate (1).
4. the novel LEDCOB illuminating source packaging structure of one kind according to claim 1, it is characterised in that: the electric wiring
The surface of layer (3) offers circular hole (31), and the circular hole (31) is evenly distributed on the surface of electric wiring layer (3).
5. the novel LEDCOB illuminating source packaging structure of one kind according to claim 1, it is characterised in that: the flourescent sheet
It (8) include flourescent sheet ontology (81), the surface of the flourescent sheet ontology (81) is provided with optical waveguide layer (82), the optical waveguide layer (82)
Side far from flourescent sheet ontology (81) is provided with luminous diffusion layer (83), and the luminous diffusion layer (83) is far from optical waveguide layer (82)
Side be provided with proofing dust and protecting layer (84), the proofing dust and protecting layer (84) is provided with anti-far from the side of luminous diffusion layer (83)
Water conservation layer (85), the waterproof protective layer (85) are provided with high-temperature-resistant layer (86), institute far from the side of proofing dust and protecting layer (84)
The bottom for stating high-temperature-resistant layer (86) is provided with reflecting layer (87).
6. the novel LEDCOB illuminating source packaging structure of one kind according to claim 1, it is characterised in that: the miniature heat dissipation
Device (9) includes radiating motor (91), and radiating motor (91) output end is fixedly connected with heat dissipation shaft by shaft coupling
(92), the radiating motor (91) is fixedly connected far from the side of heat dissipation shaft (92) with the surface side of enclosure wall body (4), described
Heat dissipation shaft (92) is fixedly connected with radiating vane (93) far from the one end of radiating motor (91).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821349272.2U CN208923181U (en) | 2018-08-21 | 2018-08-21 | A kind of novel LEDCOB illuminating source packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821349272.2U CN208923181U (en) | 2018-08-21 | 2018-08-21 | A kind of novel LEDCOB illuminating source packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208923181U true CN208923181U (en) | 2019-05-31 |
Family
ID=66702504
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821349272.2U Expired - Fee Related CN208923181U (en) | 2018-08-21 | 2018-08-21 | A kind of novel LEDCOB illuminating source packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208923181U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112885940A (en) * | 2021-01-08 | 2021-06-01 | 深圳市科润光电股份有限公司 | COB technology-based heat dissipation structure for LED packaging unit |
| CN116564857A (en) * | 2023-05-25 | 2023-08-08 | 深圳市伟方成科技有限公司 | LED lamp bead packaging structure |
-
2018
- 2018-08-21 CN CN201821349272.2U patent/CN208923181U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112885940A (en) * | 2021-01-08 | 2021-06-01 | 深圳市科润光电股份有限公司 | COB technology-based heat dissipation structure for LED packaging unit |
| CN116564857A (en) * | 2023-05-25 | 2023-08-08 | 深圳市伟方成科技有限公司 | LED lamp bead packaging structure |
| CN116564857B (en) * | 2023-05-25 | 2024-02-02 | 深圳市伟方成科技有限公司 | LED lamp bead packaging structure |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101649968B (en) | Light-emitting diode illumination apparatus | |
| US9605844B2 (en) | Lighting device with heat dissipation elements | |
| CN203162665U (en) | Multi-tube ceramic LED (light-emitting diode) lamp | |
| CN102518971A (en) | Ultraviolet light emitting diode light source | |
| CN102147068A (en) | LED lamp capable of replacing compact fluorescent lamp | |
| CN208923181U (en) | A kind of novel LEDCOB illuminating source packaging structure | |
| CN202501224U (en) | Ultraviolet light emitting diode (UV LED) light source | |
| CN201032117Y (en) | High-power LED lighting lamp | |
| CN101761894A (en) | Reflecting heat radiation and sealing base of high-power LED light source | |
| CN101387391A (en) | LED lamp | |
| CN203743903U (en) | LED lamp module | |
| CN206943847U (en) | A kind of LED that can quickly assemble | |
| CN101571268B (en) | High power LED lamp | |
| CN203536432U (en) | Photoelectric module of surface-mounted type integrated power LED | |
| TWI572826B (en) | Light emitting diode lamp | |
| CN208797035U (en) | A kind of novel LED lamp bead encapsulating structure | |
| CN101629681A (en) | Large-power LED light source module | |
| CN202001863U (en) | Integrally encapsulated LED light source with high heat radiation performance | |
| CN201655836U (en) | Reflecting, radiating and sealing base of high power LED light source | |
| CN202901966U (en) | Light emitting diode (LED) lamp | |
| CN212510800U (en) | High-efficiency energy-saving LED down lamp | |
| CN202303074U (en) | LED (light emitting diode) tube light | |
| CN102095115A (en) | Standardized light emitting diode (LED) light source assembly | |
| CN202024127U (en) | Combined type light-emitting diode (LED) module | |
| CN202452142U (en) | Eight-string and ten-parallel-branch light emitting diode (LED) chip integrated surface light source |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190531 Termination date: 20210821 |