CN116564857A

CN116564857A - LED lamp bead packaging structure

Info

Publication number: CN116564857A
Application number: CN202310598699.5A
Authority: CN
Inventors: 王伟; 吴国庆; 尹建平
Original assignee: Shenzhen Weifangcheng Technology Co ltd
Current assignee: Shenzhen Weifangcheng Technology Co ltd
Priority date: 2023-05-25
Filing date: 2023-05-25
Publication date: 2023-08-08
Anticipated expiration: 2043-05-25
Also published as: CN116564857B

Abstract

The application relates to the technical field of LED encapsulation, discloses a LED lamp pearl packaging structure, which comprises a substrate, be provided with logical groove on the base plate, be provided with the chip in the logical groove, base plate top lid is equipped with the apron, the apron passes through connecting device with the base plate fixedly, be provided with the roof that transparent material made on the apron, set up on the roof all with logical groove intercommunication's hand hole and play hole, hand hole and play hole interval set up, the aperture of hand hole is greater than the aperture of play hole. The application has the effect of high-efficient even encapsulating, improves encapsulation quality.

Description

LED lamp bead packaging structure

Technical Field

The application relates to the technical field of LED packaging, in particular to an LED lamp bead packaging structure.

Background

The LED lamp bead package needs to use transparent packaging materials to package the chip, provides better protection for the chip, and can transmit light.

Traditional LED lamp pearl encapsulation is fixed in the chip on the base, through artifical point gum, encapsulates the chip on the base. However, in the process of implementing the related technical scheme, at least the following technical problems are found: however, when a worker manually dispensing, the dispensing is not uniform easily, so that bubbles appear in the sealing glue, and the product packaging quality is affected.

Disclosure of Invention

The utility model provides a through providing a LED lamp pearl packaging structure, solved among the prior art staff when manual point is glued, the inhomogeneous is glued to the point appears easily, and makes to appear the bubble in the encapsulation, influences the problem of product packaging quality, has realized evenly encapsulating high-efficiently, improves packaging quality.

The application provides a LED lamp pearl packaging structure, which comprises a substrate, be provided with logical groove on the base plate, be provided with the chip in the logical groove, the base plate top lid is equipped with the apron, the apron passes through connecting device with the base plate fixedly, be provided with the roof that transparent material made on the apron, set up on the roof all with logical groove intercommunication's access hole and play hole, access hole and play hole interval set up, the aperture of access hole is greater than the aperture of play hole.

Further, the connecting device comprises four connecting columns, the four connecting columns are respectively close to four corners of the cover plate, the upper ends of the connecting columns are provided with threaded columns, and the threaded columns sequentially penetrate through the base plate and the cover plate and are in threaded connection with fixing nuts.

Further, the lower end face of the substrate is provided with a heat radiating device, the heat radiating device comprises a ceramic plate, the through groove penetrates through the lower end face of the substrate, and the ceramic plate is embedded in the through groove and is fixed with the lower end face of the chip.

Further, the lower end face of the ceramic plate is fixed with a copper plate, the lower end face of the substrate is provided with a bottom plate, and the bottom plate is in butt joint with the lower end face of the copper plate.

Further, the lower terminal surface shaping of ceramic plate has first recess, the up end shaping of copper has the second recess that corresponds with first recess, first recess and second recess form the cooling chamber, the cooling intracavity is filled with the coolant liquid.

Further, the bottom plate below is provided with cooling device, cooling device includes cooling tube, cooling box, the cooling tube is provided with a plurality of, the one end and the cooling chamber intercommunication of cooling tube, the other end and the lateral wall intercommunication of cooling box of cooling tube, the tip and the lateral wall of cooling box intercommunication of cooling tube are tangent, the top of cooling box is provided with cooling motor, the cooling box is cavity discoid, and the interior top rotation of cooling box is connected with the carousel, cooling motor's output shaft is fixed with the carousel center, the lower terminal surface of carousel is fixed with a plurality of arc flabellum, one side and the central interval setting of cooling box of arc flabellum, the opposite side and the lateral wall sliding fit of cooling box of arc flabellum.

Further, a circulating cavity is formed in the top plate, a first circulating pipe is communicated with the center of the lower end face of the cooling box, the other end of the first circulating pipe is communicated with the circulating cavity, a second circulating pipe is communicated with the circulating cavity, and the other end of the second circulating pipe is communicated with the cooling cavity.

Further, a plurality of cooling pipes are distributed in a ring shape, and a plurality of cooling pipes are provided with radiating fins.

Further, the lower terminal surface of copper is provided with a plurality of branches, and is a plurality of the lower extreme of branch is fixed with the mount, motor fixed mounting is on the mount, the lower terminal surface of mount rotates and is connected with the pivot, the upper end of pivot is fixed with cooling motor's output shaft, the lower extreme and the carousel of pivot are fixed, radiating fin is annular to be provided with a plurality ofly along the direction of height interval of cooling tube, cooling motor is located radiating fin.

Further, a cooling fan is arranged on the rotating shaft.

The technical scheme provided in the application has at least the following technical effects or advantages:

1. due to the fact that the cover plate is arranged, the base plate and the cover plate are fixed through the connecting device, the packaging glue is injected through the inlet holes, after the packaging glue is filled in the through grooves, the glue can overflow from the outlet holes, the glue can be uniformly filled in the through grooves, the problem that in the prior art, when manual glue dispensing is carried out by workers, glue dispensing is uneven easily, bubbles appear in the packaging glue, the packaging quality of products is affected, efficient uniform glue filling is achieved, and packaging quality is improved is solved.

2. Due to the adoption of the heat dissipation device, the top and the bottom of the packaging structure can be timely and simultaneously dissipated, the cooling effect of the whole structure is improved, the problem that the heat dissipation of the packaging structure is poor is effectively solved, and then the efficient heat dissipation of the packaging structure is realized.

Drawings

FIG. 1 is a schematic overall structure of an embodiment of the present application;

fig. 2 is a schematic structural diagram of a heat dissipating device according to an embodiment of the present application;

FIG. 3 is a schematic view of the location of a cooling device in an embodiment of the present application;

FIG. 4 is an enlarged schematic view of FIG. 2 at A;

in the figure: 1. a substrate; 11. a through groove; 12. sealing the glue cavity; 2. a cover plate; 21. a mounting groove; 22. a top plate; 23. a hole is formed; 24. a hole is formed; 25. a flow-limiting sheet; 26. a circulation chamber; 3. a bottom plate; 31. a fixing groove; 4. a connecting device; 41. a connecting column; 42. a threaded column; 43. a base; 5. a heat sink; 51. a ceramic plate; 511. a first groove; 52. copper plate; 521. a second groove; 53. a cooling chamber; 6. a cooling device; 61. a cooling tube; 62. a cooling box; 63. a heat radiation fin; 64. a turntable; 65. arc-shaped fan blades; 66. a first circulation pipe; 67. a second circulation pipe; 68. cooling the motor; 7. a conical tube; 71. a threaded tube; 72. sealing cover; 8. a support rod; 81. a fixing frame; 82. a rotating shaft; 83. and a cooling fan.

Detailed Description

The embodiment of the application discloses provides a LED lamp pearl packaging structure, fixes base plate 1 and apron 2 through utilizing connecting device 4, utilizes hole 23 to pour into the encapsulation and glues, waits to lead to behind the inslot 11 to be full of the encapsulation and glue, can overflow from hole 24, can guarantee to lead to evenly being full of glue in the inslot 11 to combine heat abstractor 5, strengthen the whole heat dispersion to packaging structure.

In order to better understand the above technical solutions, the following detailed description will refer to the accompanying drawings and specific embodiments.

Referring to fig. 1 and 2, an LED lamp bead packaging structure includes a substrate 1, a through groove 11 is formed on the substrate 1, a chip is disposed in the through groove 11, a tapered inclined plane is formed on a groove wall of the through groove 11 near the upper end, and an opening at the upper end of the through groove 11 is the largest. The conical inclined surface is coated with a reflective coating, so that light can be concentrated to the center of the through groove 11. The upper end face of the base plate 1 is covered by a cover plate 2, the lower end face of the base plate 1 is provided with a bottom plate 3, and the cover plate 2, the bottom plate 3 and the base plate 1 are fixed through a connecting device 4. The cover plate 2 and the through groove 11 are internally provided with a sealing cavity 12. The cover plate 2 is provided with a mounting groove 21, and the bottom of the mounting groove 21 penetrates through the cover plate 2 and is communicated with the through groove 11. A top plate 22 is fixedly installed on one side of the installation groove 21, and the top plate 22 is made of transparent material, so that the inside of the through groove 11 can be observed. The top plate 22 is provided with an inlet hole 23 and an outlet hole 24 which are communicated with the through groove 11, and the inlet hole 23 and the outlet hole 24 are arranged at intervals and are respectively close to two ends of the top plate 22. The aperture of the inlet hole 23 is larger than that of the outlet hole 24, and the packaging adhesive is injected into the inlet hole 23, so that the outlet hole 24 is smaller, the overflowed packaging adhesive is slower, and the packaging adhesive cavity 12 can be filled as fully as possible. Install the restriction piece 25 in the play hole 24, the centre hole has been seted up at the centre of restriction piece 25, a plurality of perforation along restriction piece 25 radial arrangement are seted up to the pore wall in centre hole, separate restriction piece 25 into a plurality of triangle-shaped's spacer, have certain elastic deformation ability, specifically plastic sheet, after seal glue chamber 12 intussuseption is filled with the encapsulation and is glued, glue overflows from the centre hole, when seal glue chamber 12 internal pressure is too big, can extrude the spacer deformation for unnecessary encapsulation glue overflows fast. And wiping the overflowed superfluous packaging adhesive to finish the packaging adhesive of the chip.

Referring to fig. 1 and 2, the connecting device 4 includes four connecting posts 41, and the four connecting posts 41 are respectively adjacent to four corners of the cover plate 2. The upper end of the connecting column 41 is fixedly provided with a coaxially arranged threaded column 42, the threaded column 42 sequentially penetrates through the bottom plate 3, the base plate 1 and the cover plate 2, the threaded column 42 is in threaded connection with a fixing nut at the position above the cover plate 2, and the fixing nut abuts against the upper end face of the cover plate 2. The end face of the connecting post 41, which is close to the threaded post 42, abuts against the lower end face of the bottom plate 3. Specifically, the other ends of the four connecting posts 41 are fixed with bases 43, and the bases 43 are spaced apart from and parallel to the bottom plate 3.

Referring to fig. 2, a heat sink 5 is attached to the lower end surface of the substrate 1, so that heat can be dissipated in time to the entire substrate. The heat sink 5 is located above the base 43. The heat dissipating device 5 comprises a ceramic plate 51 and a copper plate 52, the through groove 11 penetrates through the lower end face of the substrate 1, the ceramic plate 51 is embedded in the through groove 11 and fixedly connected with the side wall of the through groove 11, and the lower end face of the chip is fixedly connected with the upper end face of the ceramic plate 51. A copper plate 52 is fixed to the lower end surface of the ceramic plate 51. The upper end face of the copper plate 52 is fixed with a coaxial positioning ring near the edge, an annular groove matched with the positioning ring is formed on the lower end face of the ceramic plate 51, and the positioning ring is inserted in the annular groove to limit the ceramic plate 51 and the copper plate 52. The limit groove is formed in the side wall, close to the bottom plate 3, of the through groove 11, a limit ring is fixed to the outer side of the ceramic plate 51, and the limit ring is abutted to the groove top of the limit groove and can limit the ceramic plate 51. The bottom plate 3 abuts against the lower end face of the copper plate 52, and the copper plate 52 is fixed in a limited position.

Referring to fig. 2 and 3, a first groove 511 is formed at a lower end surface of the ceramic plate 51, a second groove 521 corresponding to the first groove 511 is formed at an upper end surface of the copper plate 52, and the first groove 511 and the second groove 521 form a cooling chamber 53, and the cooling chamber 53 is filled with a cooling liquid. By providing a sealing ring on the positioning ring, a seal can be formed to the cooling chamber 53. The cooling device 6 is installed to the below of bottom plate 3, and cooling device 6 includes cooling tube 61, cooling box 62, and cooling tube 61 is provided with a plurality of, and a plurality of cooling tubes 61 are annular distribution to the fixed slot 31 of circular cross-section has been seted up at the lower terminal surface of bottom plate 3, and the groove diameter of fixed slot 31 is less than the external diameter of copper 52. The plurality of cooling pipes 61 are fixedly provided with heat radiating fins 63. The heat dissipation fins 63 are annular, and are provided in plurality at intervals in the height direction of the cooling tube 61. One end of the cooling tube 61 communicates with the cooling chamber 53, and the other end of the cooling tube 61 communicates with the side wall of the cooling box 62. The ends of the cooling pipes 61 communicating with the cooling cavities 53 are all located inside the fixing groove 31, and the ends of the cooling pipes 61 are fixedly connected with the copper plate 52. The cooling pipe 61 is preferably a metal pipe having good heat dissipation properties. The end of the cooling pipe 61 communicating with the cooling tank 62 is tangential to the side wall of the cooling tank 62.

Referring to fig. 3 and 4, the cooling box 62 has a hollow disc shape, a turntable 64 is rotatably connected to the inner top of the cooling box 62, and a plurality of arc-shaped blades 65 are fixed to the lower end surface of the turntable 64 and are annularly distributed with respect to the center of the cooling box 62. One side of the arc-shaped fan blade 65 is arranged at intervals with the center of the cooling box 62, and the other side of the arc-shaped fan blade 65 is in sliding fit with the side wall of the cooling box 62. The top plate 22 is internally provided with a circulating cavity 26, two first through pipes are fixed in the circulating cavity 26, and the inlet hole 23 and the outlet hole 24 are communicated with the inside of the through groove 11 through the first through pipes. Four second through pipes are further fixed in the circulation cavity 26, the four second through pipes are respectively close to four corners of the top plate 22, and the top plate 22 and the cover plate 2 are integrally fixed through bolts penetrating through the second through pipes and being in threaded connection with the cover plate 2. Both ends of the first through pipe and the second through pipe are in sealing connection with the inner wall of the circulation cavity 26, so that the circulation cavity 26 is a sealed cavity. The center of the lower end surface of the cooling tank 62 is communicated with a first circulating pipe 66, the other end of the first circulating pipe 66 is communicated with the circulating cavity 26, and the end of the first circulating pipe 66 sequentially penetrates through the bottom plate 3, the base plate 1 and the cover plate 2 to be communicated with the circulating cavity 26. The lower end surface of the top plate 22 is fixedly connected with a second circulation pipe 67, one end of the second circulation pipe 67 is communicated with the circulation chamber 26, and the other end of the second circulation pipe 67 passes through the cooling pipe 61 and is communicated with the bottom center of the cooling chamber 53. A tapered tube 7 is formed at a position close to one side of the upper end surface of the top plate 22, a threaded tube 71 is formed at the upper end of the tapered tube 7, a sealing cover 72 is connected to the threaded tube 71 in a threaded manner, and the large end of the tapered tube 7 is communicated with the inside of the circulation cavity 26. By opening the sealing cap 72, the infusion of cooling liquid can be entered and the provision of the conical tube 7 can facilitate the discharge of the foam formed after a period of cooling liquid circulation.

Referring to fig. 3 and 4, a cooling motor 68 is mounted above the cooling box 62, a plurality of struts 8 are fixedly mounted on the lower end surface of the copper plate 52 and near the center of the copper plate 52, the struts 8 are distributed in a ring shape, a fixing frame 81 is fixed at the lower ends of the struts 8, a plurality of heat dissipation holes are formed in the fixing frame 81, the cooling motor 68 is fixedly mounted on the fixing frame 81, and the cooling motor 68 is located in the heat dissipation fins 63. The lower end surface of the fixing frame 81 is rotatably connected with a rotating shaft 82, the upper end of the rotating shaft 82 is fixed with the output shaft of the cooling motor 68, and the lower end of the rotating shaft 82 passes through the cooling box 62 and is fixed with the center of the turntable 64. A cooling fan 83 is fixedly installed on the rotating shaft 82.

The working principle of the embodiment of the application is as follows: by fixing the top plate 22 to the cover plate 2, the substrate 1, and the bottom plate 3 are integrally locked by the connecting device 4, and the cover plate 2 is pressed against the upper end surface of the substrate 1. The encapsulant is injected from the inlet aperture 23 such that the encapsulant fills the entire encapsulant cavity 12 until the encapsulant overflows from the outlet aperture 24. At the same time, the cooling motor 68 is started to dissipate heat from the whole.

The rotating shaft 82 is driven to rotate by the cooling motor 68, the turntable 64 can be driven to rotate, the cooling liquid in the cooling box 62 is stirred and cooled by the arc-shaped fan blades 65, the cooling liquid in the middle of the cooling box 62 is pumped out into the cooling pipe 61 and flows into the cooling cavity 53, and the bottom of the chip is cooled. When the liquid in the cooling pipe 61 flows, heat can be radiated by the heat radiation fins 63. When the cooling liquid in the cooling chamber 53 is excessive, the cooling liquid is pressed into the second circulation pipe 67, and is pushed into the circulation chamber 26 through the second circulation pipe 67, so that the cooling liquid can radiate heat from above the chip through the circulation chamber 26. The cooling liquid in the circulation chamber 26 can be introduced into the cooling tank 62 through the first circulation pipe 66 to form a cooling circulation, and not only can the upper side of the chip be cooled, but also the lower side of the chip can be cooled. And install cooling fan 83 on pivot 82, not only can drive carousel 64 rotation through cooling motor 68 for circulation chamber 26 and cooling intracavity 53 interior coolant liquid can carry out the convection heat dissipation, can also drive cooling fan 83 and rotate, ventilate the heat dissipation to cooling tube 61 and fin 63, improves holistic heat dispersion.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present application without departing from the spirit or scope of the application. Thus, if such modifications and variations of the present application fall within the scope of the claims and the equivalents thereof, the present application is intended to cover such modifications and variations.

The foregoing is merely a preferred embodiment of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art, within the scope of the present application, should apply to the present application, and all equivalents and modifications as fall within the scope of the present application.

Claims

1. The utility model provides a LED lamp pearl packaging structure, includes base plate (1), be provided with logical groove (11) on base plate (1), be provided with the chip in logical groove (11), a serial communication port, base plate (1) top lid is equipped with apron (2), apron (2) are fixed through connecting device (4) with base plate (1), be provided with roof (22) that transparent material made on apron (2), set up on roof (22) all with access groove (11) intercommunication's access hole (23) and exit hole (24), access hole (23) and exit hole (24) interval set up, the aperture of access hole (23) is greater than the aperture of exit hole (24).

2. The LED lamp bead packaging structure according to claim 1, wherein the connecting device (4) comprises four connecting posts (41), the four connecting posts (41) are respectively close to four corners of the cover plate (2), a threaded post (42) is arranged at the upper end of the connecting post (41), and the threaded post (42) sequentially penetrates through the base plate (1), the cover plate (2) and is in threaded connection with a fixing nut.

3. The LED lamp bead packaging structure according to claim 1, wherein the lower end face of the substrate (1) is provided with a heat dissipating device (5), the heat dissipating device (5) comprises a ceramic plate (51), the through groove (11) penetrates through the lower end face of the substrate (1), and the ceramic plate (51) is embedded in the through groove (11) and fixed with the lower end face of the chip.

4. A LED lamp bead package structure according to claim 3, wherein a copper plate (52) is fixed to the lower end surface of the ceramic plate (51), a bottom plate (3) is provided to the lower end surface of the substrate (1), and the bottom plate (3) abuts against the lower end surface of the copper plate (52).

5. The LED lamp bead package structure according to claim 4, wherein a first groove (511) is formed on the lower end surface of the ceramic plate (51), a second groove (521) corresponding to the first groove (511) is formed on the upper end surface of the copper plate (52), a cooling cavity (53) is formed by the first groove (511) and the second groove (521), and the cooling cavity (53) is filled with a cooling liquid.

6. The LED lamp bead packaging structure according to claim 5, wherein a cooling device (6) is arranged below the bottom plate (3), the cooling device (6) comprises a cooling pipe (61) and a cooling box (62), the cooling pipe (61) is provided with a plurality of cooling pipes, one end of each cooling pipe (61) is communicated with the cooling cavity (53), the other end of each cooling pipe (61) is communicated with the side wall of the cooling box (62), the end part of each cooling pipe (61) communicated with the cooling box (62) is tangent to the side wall of the cooling box (62), a cooling motor (68) is arranged above the cooling box (62), the cooling box (62) is hollow, the inner top of the cooling box (62) is rotationally connected with a rotary disc (64), the output shaft of the cooling motor (68) is fixedly arranged at the center of the rotary disc (64), a plurality of arc-shaped fan blades (65) are fixedly arranged on the lower end face of the rotary disc (64), one side of each arc-shaped fan blade (65) is arranged at intervals with the center of the cooling box (62), and the other side wall of each arc-shaped fan blade (65) is in sliding fit with the side wall of the cooling box (62).

7. The LED lamp bead packaging structure according to claim 6, wherein the top plate (22) is internally formed with a circulation cavity (26), a first circulation pipe (66) is communicated with the center of the lower end face of the cooling box (62), the other end of the first circulation pipe (66) is communicated with the circulation cavity (26), a second circulation pipe (67) is communicated with the circulation cavity (26), and the other end of the second circulation pipe (67) is communicated with the cooling cavity (53).

8. The LED lamp bead package structure according to claim 6, wherein a plurality of the cooling pipes (61) are annularly distributed, and a plurality of the cooling pipes (61) are provided with heat dissipation fins (63).

9. The LED lamp bead packaging structure according to claim 8, wherein a plurality of struts (8) are provided on the lower end face of the copper plate (52), a plurality of fixing frames (81) are fixed at the lower ends of the struts (8), the motor is fixedly mounted on the fixing frames (81), a rotating shaft (82) is rotatably connected to the lower end face of the fixing frames (81), the upper end of the rotating shaft (82) is fixed to the output shaft of the cooling motor (68), the lower end of the rotating shaft (82) is fixed to the turntable (64), the cooling fins (63) are annular, a plurality of cooling motors (68) are arranged at intervals along the height direction of the cooling tube (61), and the cooling motor (68) is located in the cooling fins (63).

10. The LED lamp bead packaging structure according to claim 9, wherein a cooling fan (83) is provided on the rotating shaft (82).