CN101576212A - LED strip light source and package method thereof - Google Patents
LED strip light source and package method thereof Download PDFInfo
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- CN101576212A CN101576212A CNA2008101418211A CN200810141821A CN101576212A CN 101576212 A CN101576212 A CN 101576212A CN A2008101418211 A CNA2008101418211 A CN A2008101418211A CN 200810141821 A CN200810141821 A CN 200810141821A CN 101576212 A CN101576212 A CN 101576212A
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Abstract
The invention relates to an LED strip light source, which comprises a strip substrate with a circuit, at least one LED chip, a filling colloid and a strip lens, wherein the at least one LED chip is arranged on the strip substrate and is electrically connected with the circuit of the strip substrate; the filling colloid is used for packing the LED chip; and the strip lens and the strip substrate are mutually matched and form a cavity structure. The strip substrate is provided with a glue injecting hole and an exhaust hole; and the filling colloid is packed into the cavity structure through the glue injecting hole and the exhaust hole. The LED strip light source realizes the package structure by matching the lens with a cavity and adopting a mode of injection glue in the bottom of the substrate; the structure can not only simplify the production process and reduce the production cost, but also can improve the consistency of LED strip light source products and achieve the uniform chromaticity. In addition, the invention also provides a package method for manufacturing the LED strip light source.
Description
Technical field
The present invention relates to a kind of optical semiconductor source technology, relate in particular to a kind of light emitting diode (LightEmitting Diode, LED) structure of strip source and method for packing thereof.
Background technology
Light emitting diode (Light Emitting Diode, LED) be the device that the change on rank, energy band position gives off energy with luminous form when utilizing electronics in the semi-conducting material to combine with the hole, it has advantages such as volume is little, the life-span is long, driving voltage is low, power consumption is low, reaction speed is fast, vibration strength is good, be element common in the various application apparatus in the daily life, and it has engendered the every nook and cranny in traditional lighting market.Strip source more and more obtains the extensive use of every field as a staple product classification of semiconductor illuminating light source.
Existing LED strip source, be a metal edge frame (or frame of other materials) to be installed being used to assemble on the metal circuit board of chip, finish chip lay with go between be connected after, in the formed cavity of frame, directly adopt spot gluing equipment to cover the packing colloid that one deck contains fluorescent material.Yet in the overwrite procedure of packing colloid, because the air pressure instability of spot gluing equipment, difference between individuality and the individuality can appear, thereby influence consistency of product, and packaging technology that the packaged LED strip source is related and structure are comparatively complicated, utilize the cost of frame packing colloid higher relatively.
Summary of the invention
In view of this, must provide LED strip source and the method for packing thereof that a kind of production technology is simple, cost is low, colourity is even, uniformity is high.
The objective of the invention is to be achieved through the following technical solutions:
A kind of LED strip source, comprise: have circuit the bar shaped substrate, be arranged on the described bar shaped substrate and at least one led chip that electrically connects with circuit on the described bar shaped substrate and the filling colloid that is used to encapsulate described led chip, it is characterized in that: also include the rod lens that cooperatively interacts with described bar shaped substrate and form cavity body structure, described bar shaped substrate is provided with hole for injecting glue and steam vent, and described filling colloid is to be packaged in the described cavity body structure by described hole for injecting glue and steam vent.
Above-mentioned LED strip source, wherein: have a plurality of locating holes that are used for fixing described rod lens on the described bar shaped substrate, the bottom of described rod lens is provided with a plurality of reference columns that are used for being assembled to bar shaped substrate orientation hole.
Above-mentioned LED strip source, wherein: be mixed with the fluorescent material that is used to realize white light source in the described filling colloid.
Above-mentioned LED strip source, wherein: described rod lens can be the strip structure of strip planar structure, strip curved-surface structure or plane and curved surface combination.
Above-mentioned LED strip source, wherein: the cavity body structure between described rod lens and the bar shaped substrate is to be formed by a cavity, and the inner surface that described rod lens has a cavity is plane.
Above-mentioned LED strip source, wherein: described rod lens is communicated with by a plurality of cavitys with cavity body structure between the bar shaped substrate and forms, and the inner surface that described rod lens has a plurality of cavitys is a plurality of dome shape of caving in.
Above-mentioned LED strip source, wherein: described hole for injecting glue and described steam vent are separately positioned on the opposite end of described bar shaped substrate, and between described rod lens and bar shaped substrate the inboard of cavity body structure.
A kind of method for packing of LED strip source comprises the steps: to prepare to have the bar shaped substrate of circuit, on described bar shaped substrate hole for injecting glue and steam vent is set; At least one led chip is installed on described bar shaped substrate, and the circuit on described led chip and the bar shaped substrate is electrically connected; Preparation has the rod lens of at least one cavity, and the position of described cavity need guarantee to cover described led chip; Described rod lens is mounted to the side that described bar shaped substrate is equipped with led chip, forms cavity body structure between described bar shaped substrate and the rod lens; To fill colloid from the hole for injecting glue of described bar shaped base plate bottom and inject cavity body structure; And after treating that injecting glue is finished, will fill the colloid sclerosis, promptly finish the moulding of LED strip source.
The method for packing of above-mentioned LED strip source, wherein: the step that described preparation has the bar shaped substrate of circuit also is included in a plurality of locating holes of processing on the bar shaped substrate, and, in the set-up procedure of rod lens, also include and on rod lens, be provided with a plurality of and the corresponding reference column of locating hole, when described rod lens being mounted on the described bar shaped substrate, the reference column of rod lens fixedly is inserted in the bar shaped substrate positioning hole corresponding.
The method for packing of above-mentioned LED strip source, wherein: the colloid that injects from the hole for injecting glue of described bar shaped base plate bottom is the filling colloid that is mixed with fluorescent material.
The method for packing of above-mentioned LED strip source, wherein: it is characterized in that described rod lens can be processed into the strip structure of strip planar structure, strip curved-surface structure or plane and curved surface combination.
The method for packing of above-mentioned LED strip source, wherein: the inner surface of described rod lens can be processed into the cavity plane or dome shape of caving in.
Thereby LED strip source of the present invention and method for packing thereof are to cooperatively interact by bar shaped substrate and the rod lens with cavity to form cavity body structure, and the mode that adopts the base plate bottom injecting glue will be filled colloid injection cavity body structure, this kind encapsulation can be simplified production technology, reduce production costs, and the shape by cavity body structure between rod lens and the bar shaped substrate limits the shape of filling colloid, can improve LED strip source consistency of product, and realize that colourity is even.
Description of drawings
In order to be easy to explanation, the present invention is done to describe in detail by following preferred embodiment and accompanying drawing.
Fig. 1 is the solid combination schematic diagram of LED strip source of the present invention;
Fig. 2 is the substrate of LED strip source of the present invention and the three-dimensional exploded view of lens;
Fig. 3 is the substrate of LED strip source in an embodiment of the present invention and heat sink three-dimensional exploded view;
Fig. 4 is the method for packing flow chart of LED strip source in an embodiment of the present invention.
The specific embodiment
The present invention is described in further detail below in conjunction with drawings and Examples:
See also Fig. 1 and shown in Figure 2, LED strip source 1 of the present invention comprises bar shaped substrate 2, a plurality of chip 3, rod lens 4 and fills colloid (not shown).
Please in conjunction with Fig. 2 and shown in Figure 3, described substrate 2 can be metal circuit board or is to be equipped with heat sink common line plate.In the present embodiment, be that employing common line plate embeds heat sink 6 strip source substrate 2, described bar shaped substrate 2 is provided with the counterbore 20 that is used to install chip 3, and following hole 200 diameters of counterbore 20 are greater than last hole 201 diameters.In each counterbore 20, all be fixed with one be used to dispel the heat heat sink 6, described heat sink 6 be step-like, and the structure of its shape and counterbore 20 is complementary.Heat sink 6 upper surface can be stamped and form depressed part (not shown), and can form reflector at the depressed part electroplate.Described chip 3 is fixedly installed in described heat sink 6 the reflector, and interconnects by lead (not shown) and the circuit 21 that is printed on above the bar shaped substrate 2.In the present embodiment, circuit 21 is to be printed on the bar shaped substrate 2, and is arranged on and rod lens 4 contacted sides, and adopts adhesive bonding between chip 3 and heat sink 6.Certainly, in other embodiments, can adopt other fixed forms between the chip 3 and heat sink 6.
The two ends of bar shaped substrate 2 have the screw locating hole 22 that is used for fixing LED strip source 1 respectively, and be respectively equipped with hole for injecting glue 23 and steam vent 24 in the inboard of described two screw locating holes 22, described hole for injecting glue 23 is all the through hole that runs through substrate 2 with steam vent 24.For the colloid that guarantees to inject is not overflowed, hole for injecting glue 23 and steam vent 24 preferably are separately positioned on the opposite end of bar shaped substrate 2.The both sides, long limit of bar shaped substrate 2 also have the locating hole 25 that is used for fixing rod lens 4.
In the present embodiment, hole for injecting glue 23 respectively is 1 with the quantity of steam vent 24, and the quantity of locating hole 25 is 3 pairs, and counterbore 20 all is the yi word pattern arrangement with chip 3.Certainly, in other embodiments, the quantity of hole for injecting glue 23, steam vent 24, locating hole 25 can be other numerical value, and counterbore 20 and chip 3 can be set to singlely or a plurality of, having when a plurality of, can adopt multiple arrangement mode to be distributed on the bar shaped substrate 2.
Can adopt the connected mode of mixing that is connected in series, is connected in parallel or connect with in parallel to realize between described a plurality of chip 3.
The bottom margin part 41 of rod lens 4 has the outward extending reference column 40 from the bottom surface, is used for being mounted to the locating hole 25 of bar shaped substrate 2, and the quantity and the position of locating hole 25 are corresponding on the quantity of described reference column 40 and position and the bar shaped substrate 2.In the present embodiment, described reference column 40 is formed in one with lens 4.The lower hollow of rod lens 4 (not shown), promptly cave inward and form a plurality of cavitys from the bottom lower surface, described a plurality of cavity respectively be arranged on bar shaped substrate 2 on a plurality of chips 3 corresponding, after the installation of substrate 2 and lens 4, form airtight cavity body structure by being interconnected of a plurality of cavitys between the two.
In the present embodiment, described rod lens 4 is many curved surfaces compound lens structure, and has a predetermined curvature, thereby can be controlled so that direction is penetrated in illumination, and in other embodiments, rod lens 4 can be other structures such as strip plane, and the inner surface of rod lens 4 can be processed into the cavity of plane or a plurality of dome shape of caving in.Rod lens 4 of the present invention can be materials such as transparent epoxy resin, PVC, PC, lucite.
Be mixed with fluorescent material in the described filling colloid, be used to realize the LED white light source, and in embodiment of the present invention, described chip 3 is for being used to produce the blue light or the ultraviolet chip of white light source.Described filling colloid can be materials such as silica gel or epoxy resin.Fill colloid and be injected in the cavity body structure between lens 4 and the substrate 2, and pass through steam vent 24 gas in the cavity body structure is discharged by the hole for injecting glue on the bar shaped substrate 2 23.Because the concentration of fluorescent material and the color that consumption will have influence on white light, so the restriction of the shape of scioptics 4 intracavity structures is mixed with the shape of the filling colloid of fluorescent material, thereby can realize the uniformity of LED strip source 1 colourity.
Figure 4 shows that the flow chart of LED strip source method for packing in an embodiment of the present invention, in the present embodiment, is to adopt the common line plate to embed heat sink strip source substrate, and its technological process is as follows:
At step S100, prepare the bar shaped substrate:
Preparation has the bar shaped substrate 2 of a plurality of counter bore structures 20, interconnective circuit 21 between the guaranteed chip 3 of the surface printing of bar shaped substrate 2.Adopt the hole processing technology to prepare hole for injecting glue 23, steam vent 24 and many locating holes 25 in the outside of counter bore structure 20 and printed wire 21 to being used for fixing rod lens 4.Wherein, the Working position of hole for injecting glue 23 and steam vent 24 is below lens 4 cavity body structures, and hole for injecting glue 23 and steam vent 24 are processed the opposite end at bar shaped substrate 2 respectively.In addition, need to be processed with the screw locating hole 22 of a pair of LED of being used for fixing strip source 1 at the two ends of bar shaped substrate 2.
At step S101, assemble heat sink:
Adopt the technology of forging and pressing, make and be step-like heat sink 6, make step-like heat sink 6 just with substrate 2 on counter bore structure 20 be complementary, and assemble in the counter bore structure 20 of embedding substrate 2 in the mode of bonding or interference fit heat sink 6.In embodiment of the present invention, the inside punching press of heat sink 6 upper surface can be made depressed part, and form at the depressed part electroplate and to have the heat sink 6 of reflector, thereby improve the optically focused of light forwards.
At step S102, lay chip:
Adopt adhesive to be bonded in respectively in each reflector of heat sink 6 a plurality of chips 3, described adhesive can be adhesives such as conductive silver paste.Treat chip 3 lay finish after, adopt the electrode and circuit substrate 2 on 21 electric connections of lead (not shown) with chip 3.In other embodiments, do not have reflector as heat sink 6, then chip 3 directly can be fixed on each and get final product on heat sink 6.
At step S103, prepare rod lens:
Preparation has the rod lens 4 of many curved surfaces combination, and lens 4 cave inward from the bottom surface and form a plurality of hollow cavities, the position of each hollow cavity be assemblied in substrate 2 on the position of chip 3 corresponding.Need guarantee between two hollow cavities that close on the installation of substrate 2 after conducting smoothly fill colloid.Be processed with outward extending reference column 40 in that the bottom margin part 41 of lens 4 is integrated from the bottom surface.The position of each reference column 40 and number needs be processed into substrate 2 on the position and the quantity of locating hole 25 corresponding, and the size of described reference column 40 need guarantee to be suitable for inserting in the described locating hole 25.
At step S104, assembling rod lens and bar shaped substrate:
Reference column on the rod lens 4 40 is assembled to respectively in the locating hole 25 of bar shaped substrate 2, thereby between lens 4 and substrate 2, has formed airtight cavity body structure.In the present embodiment, be to adopt the fixing mode of hot pressing that lens 4 and substrate 2 are fixedly secured.
At step S105, inject colloid:
The rod lens 4 that assembles is placed with 2 reversings of bar shaped substrate, and promptly the lower surface of bar shaped substrate 2 is positioned at the top, and the upper surface of rod lens 3 is positioned at the below.The liquid state that is mixed with fluorescent material is filled colloid to be passed through injecting glue equipment (not shown) or adopts manual type in the hole for injecting glue 23 injection lens 4 and the cavity body structure between the substrate 2 of substrate 2 bottoms.Along with the injection of described filling colloid, the air in the cavity body structure is discharged by the steam vent 24 of substrate 2 bottom opposite sides.When filling colloid when being full of whole steam vent 24, the implant operation of colloid finishes.
At step S106, the sclerosis colloid:
Adopt the mode that heats to be mixed with the filling colloid sclerosis of fluorescent material, also can adopt the mode of in natural environment, hardening to realize certainly.After treating that sclerosis is finished, promptly finished the encapsulation process of whole LED strip source.
The specific embodiment of the above is a better embodiment of the present invention, be not to limit concrete practical range of the present invention with this, scope of the present invention comprises and is not limited to this specific embodiment, for example, can be processed to shape or lens surface that strip planar structure, lens surface be curved surface be the shape that curved surface combines with the plane to rod lens; The bar shaped substrate also can not adopt the heat sink mode of assembling, but chip directly is assemblied on other substrates such as ceramic substrate or metal circuit board; The equivalence variation that all shapes according to the present invention, structure are done all comprises in protection scope of the present invention.
Claims (12)
1. LED strip source, comprise: have circuit the bar shaped substrate, be arranged on the described bar shaped substrate and at least one led chip that electrically connects with circuit on the described bar shaped substrate and the filling colloid that is used to encapsulate described led chip, it is characterized in that: also include the rod lens that cooperatively interacts with described bar shaped substrate and form cavity body structure, described bar shaped substrate is provided with hole for injecting glue and steam vent, and described filling colloid is to be packaged in the described cavity body structure by described hole for injecting glue and steam vent.
2. LED strip source according to claim 1 is characterized in that, has a plurality of locating holes that are used for fixing described rod lens on the described bar shaped substrate, and the bottom of described rod lens is provided with a plurality of reference columns that are used for being assembled to bar shaped substrate orientation hole.
3. LED strip source according to claim 1 is characterized in that, is mixed with the fluorescent material that is used to realize white light source in the described filling colloid.
4. LED strip source according to claim 1 is characterized in that, described rod lens can be the strip structure of strip planar structure, strip curved-surface structure or plane and curved surface combination.
5. the method for packing of LED strip source according to claim 4 is characterized in that, the cavity body structure between described rod lens and the bar shaped substrate is to be formed by a cavity, and the inner surface that described rod lens has a cavity is plane.
6. LED strip source according to claim 4 is characterized in that, described rod lens is communicated with by a plurality of cavitys with cavity body structure between the bar shaped substrate and forms, and the inner surface that described rod lens has a plurality of cavitys is a plurality of dome shape of caving in.
7. LED strip source according to claim 1 is characterized in that, described hole for injecting glue and described steam vent are separately positioned on the opposite end of described bar shaped substrate, and between described rod lens and bar shaped substrate the inboard of cavity body structure.
8. the method for packing of a LED strip source is characterized in that, comprises the steps:
Preparation has the bar shaped substrate of circuit, on described bar shaped substrate hole for injecting glue and steam vent is set;
At least one led chip is installed on described bar shaped substrate, and the circuit on described led chip and the bar shaped substrate is electrically connected;
Preparation has the rod lens of at least one cavity, and the position of described cavity need guarantee to cover described led chip;
Described rod lens is mounted to the side that described bar shaped substrate is equipped with led chip, forms cavity body structure between described bar shaped substrate and the rod lens;
To fill colloid from the hole for injecting glue of described bar shaped base plate bottom and inject cavity body structure; And
After treating that injecting glue is finished, will fill the colloid sclerosis, promptly finish the moulding of LED strip source.
9. the method for packing of LED strip source according to claim 8, it is characterized in that, the step that described preparation has the bar shaped substrate of circuit also is included in a plurality of locating holes of processing on the bar shaped substrate, and, in the set-up procedure of rod lens, also include a plurality of and the corresponding reference column of locating hole are set on rod lens, when described rod lens being mounted on the described bar shaped substrate, the reference column of rod lens fixedly is inserted in the bar shaped substrate positioning hole corresponding.
10. the method for packing of LED strip source according to claim 8 is characterized in that, the colloid that injects from the hole for injecting glue of described bar shaped base plate bottom is the filling colloid that is mixed with fluorescent material.
11. the method for packing of LED strip source according to claim 8 is characterized in that, it is characterized in that described rod lens can be processed into the strip structure of strip planar structure, strip curved-surface structure or plane and curved surface combination.
12. according to Claim 8 or the method for packing of 11 described LED strip sources, it is characterized in that the inner surface of described rod lens can be processed into the cavity plane or dome shape of caving in.
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| CN2008101418211A CN101576212B (en) | 2008-09-05 | 2008-09-05 | LED strip light source and package method thereof |
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| CN2008101418211A CN101576212B (en) | 2008-09-05 | 2008-09-05 | LED strip light source and package method thereof |
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| CN101576212A true CN101576212A (en) | 2009-11-11 |
| CN101576212B CN101576212B (en) | 2012-07-18 |
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| CN111059480A (en) * | 2019-12-23 | 2020-04-24 | 深圳市丰颜光电有限公司 | Light emitting diode package component and light emitting diode bulb comprising same |
| CN114639309A (en) * | 2021-12-23 | 2022-06-17 | 蚌埠晶显科技有限公司 | Flexible transparent display screen and manufacturing method thereof |
| CN116564857A (en) * | 2023-05-25 | 2023-08-08 | 深圳市伟方成科技有限公司 | LED lamp bead packaging structure |
| CN116564857B (en) * | 2023-05-25 | 2024-02-02 | 深圳市伟方成科技有限公司 | LED lamp bead packaging structure |
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