CN208797035U - A kind of novel LED lamp bead encapsulating structure - Google Patents
A kind of novel LED lamp bead encapsulating structure Download PDFInfo
- Publication number
- CN208797035U CN208797035U CN201821349290.0U CN201821349290U CN208797035U CN 208797035 U CN208797035 U CN 208797035U CN 201821349290 U CN201821349290 U CN 201821349290U CN 208797035 U CN208797035 U CN 208797035U
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- CN
- China
- Prior art keywords
- fixedly connected
- lamp bead
- led lamp
- substrate
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48095—Kinked
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
Landscapes
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The utility model discloses a kind of novel LED lamp bead encapsulating structures, including substrate, the corresponding position of substrate top is fixedly connected to enclosure wall body, electrical wire is fixedly connected with LED lamp bead far from one end of bottom land, the bottom of LED lamp bead is fixedly connected with substrate top central location, flourescent sheet is fixedly connected at the top of enclosure wall body, the surface side of enclosure wall body is fixedly connected with minitype heat radiating device, the surface of the substrate offers S-shaped hole, S-shaped hole is uniformly distributed on the surface of the substrate, waterproof protective layer is provided with high-temperature-resistant layer far from the side of proofing dust and protecting layer, the utility model relates to encapsulating structure technical fields.The novel LED lamp bead encapsulating structure of the one kind, has reached flourescent sheet and LED chip and has separated, the effect of good heat dissipation effect, structure is simple, easy to use, and flourescent sheet is separated with LED chip, good heat dissipation effect avoids the problem that light source ages and color change, improves the service life of product.
Description
Technical field
The utility model relates to encapsulating structure technical field, specially a kind of novel LED lamp bead encapsulating structure.
Background technique
In recent years, the development that LED lighting technology is advanced by leaps and bounds, with the development of power-type LED device technology,
LED obtains huge application in lighting area.LED is high with its luminous efficiency, the service life is long, colour gamut is wide, can working frequency height, nothing
The advantages that mercury, will gradually replace traditional incandescent lamp, and halogen lamp even high-pressure sodium lamp will become the first choice of illumination.It is existing
LED light source encapsulating structure is complicated, inconvenient to use, and the structure of chip surface is covered on after mixing using fluorescent powder plus silica gel,
This mixing fluorescent glue is directly to contact with LED chip surface, and cooling effect is poor, therefore the temperature of fluorescent glue can be with chip
The phenomenon that temperature is increased and is increased, and be will lead to fluorescent glue accelerated ageing and is changed the color of light source, and regard relatively high function
When rate product, this encapsulating structure will become improper, and this patent does not contact the encapsulation knot of LED chip using high temperature resistant flourescent sheet
The problem of structure, this has well solved light source ages and color change, and the light source product of more high power density can be done.
Utility model content
(1) the technical issues of solving
In view of the deficiencies of the prior art, the utility model provides a kind of novel LED lamp bead encapsulating structure, solves to finish
Structure is complicated, and inconvenient to use, heat dissipation effect is poor, and flourescent sheet contacts LED chip, leads to fluorescent glue accelerated ageing and changes light source
The problem of color.
(2) technical solution
In order to achieve the above object, the utility model is achieved by the following technical programs: a kind of novel LED lamp bead envelope
Assembling structure, including substrate, the corresponding position of the substrate top are fixedly connected to enclosure wall body, and the substrate top is corresponding
Position and bottom land is fixedly connected between enclosure wall body, be fixedly connected at the top of the bottom land and electrically lead
Line, the electrical wire are fixedly connected with LED lamp bead, the bottom and substrate top of the LED lamp bead far from one end of bottom land
Portion central location is fixedly connected, and flourescent sheet is fixedly connected at the top of the enclosure wall body, and the surface side of the enclosure wall body is fixed
It is connected with minitype heat radiating device, the surface of the substrate offers S-shaped hole.
Preferably, the material of the electrical wire is set as corrosion-and high-temp-resistant material.
Preferably, the flourescent sheet includes flourescent sheet ontology, and the surface of the flourescent sheet ontology is provided with optical waveguide layer, described
Optical waveguide layer is provided with luminous diffusion layer far from the side of flourescent sheet ontology, and the luminous diffusion layer is arranged far from the side of optical waveguide layer
There is proofing dust and protecting layer, the proofing dust and protecting layer is provided with waterproof protective layer, the waterproofing protection far from the side of luminous diffusion layer
Layer is provided with high-temperature-resistant layer far from the side of proofing dust and protecting layer, and the bottom of the high-temperature-resistant layer is provided with reflecting layer.
Preferably, the flourescent sheet ontology carries out thickening processing, and the anti-skid chequer is evenly distributed on the table of waterproof protective layer
Face.
Preferably, the minitype heat radiating device includes radiating motor, and the radiating motor output end is fixed by shaft coupling
It is connected with heat dissipation shaft, the radiating motor is fixedly connected far from the side of heat dissipation shaft with the surface side of enclosure wall body, described
The shaft that radiates is fixedly connected with radiating vane far from one end of radiating motor.
Preferably, the S-shaped hole is uniformly distributed on the surface of the substrate.
(3) beneficial effect
The utility model provides a kind of novel LED lamp bead encapsulating structure.Have it is following the utility model has the advantages that
(1), the novel LED lamp bead encapsulating structure is fixedly connected to enclosure wall by the corresponding position of substrate top
Body, electrical wire are fixedly connected with LED lamp bead, the bottom and substrate top center position of LED lamp bead far from one end of bottom land
It sets and is fixedly connected, be fixedly connected with flourescent sheet at the top of enclosure wall body, achieved the effect that flourescent sheet is separated with LED chip, structure
Rationally simple, easy to use, flourescent sheet and LED chip avoid the problem that light source ages and color change, improve convenient for heat dissipation
The service life of product.
(2), the novel LED lamp bead encapsulating structure is fixedly connected with miniature heat dissipation by the surface side of enclosure wall body and fills
It sets, the surface of the substrate offers S-shaped hole, and S-shaped hole is uniformly distributed on the surface of the substrate, and waterproof protective layer is far from proofing dust and protecting
The side of layer is provided with high-temperature-resistant layer, has achieved the effect that high efficiency and heat radiation, structurally reasonable simple, easy to use, realizes internally
Portion's high efficiency and heat radiation, effectively prevents light source ages and color change, improves the service life of product.
Detailed description of the invention
Fig. 1 is the utility model structure chart；
Fig. 2 is the utility model bottom plan view；
Fig. 3 is schematic diagram of substrate structure；
Fig. 4 is flourescent sheet structural schematic diagram；
Fig. 5 is minitype heat radiating device structural schematic diagram.
In figure: 1 substrate, 2 enclosure wall bodies, 3 bottom lands, 4 electrical wires, 5LED lamp bead, 6 flourescent sheets, 61 flourescent sheet ontologies,
62 optical waveguide layers, 63 luminous diffusion layers, 64 proofing dust and protecting layers, 65 waterproof protective layers, 66 high-temperature-resistant layers, 67 reflecting layer, 7 miniature heat dissipations
Device, 71 radiating motors, 72 heat dissipation shafts, 73 radiating vanes, 8S shape hole.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
Every other embodiment obtained, fall within the protection scope of the utility model.
Fig. 1-5 is please referred to, the utility model provides a kind of technical solution: a kind of novel LED lamp bead encapsulating structure, including
Substrate 1, the corresponding position in the top of substrate 1 are fixedly connected to enclosure wall body 2, and the corresponding position in 1 top of substrate and being located at is enclosed
Bottom land 3 is fixedly connected between wall 2, the top of bottom land 3 is fixedly connected with electrical wire 4, electrical wire 4
Material is set as corrosion-and high-temp-resistant material, and electrical wire 4 is fixedly connected with LED lamp bead 5, LED far from one end of bottom land 3
The bottom of lamp bead 5 is fixedly connected with 1 top center position of substrate, and the top of enclosure wall body 2 is fixedly connected with flourescent sheet 6, flourescent sheet 6
Including flourescent sheet ontology 61, flourescent sheet ontology 61 carries out thickening processing, increases self-strength, the surface setting of flourescent sheet ontology 61
There is optical waveguide layer 62, optical waveguide layer 62 is provided with luminous diffusion layer 63 far from the side of flourescent sheet ontology 61, and the diffusion layer 63 that shines is separate
The side of optical waveguide layer 62 is provided with proofing dust and protecting layer 64, and proofing dust and protecting layer 64 is provided with waterproof far from the side of luminous diffusion layer 63
Protective layer 65, waterproof protective layer 65 are provided with high-temperature-resistant layer 66, the bottom of high-temperature-resistant layer 66 far from the side of proofing dust and protecting layer 64
It is provided with reflecting layer 67, the surface side of enclosure wall body 2 is fixedly connected with minitype heat radiating device 7, and minitype heat radiating device 7 includes heat dissipation
Motor 71,71 output end of radiating motor are fixedly connected with heat dissipation shaft 72 by shaft coupling, and radiating motor 71 is far from heat dissipation shaft
72 side is fixedly connected with the surface side of enclosure wall body 2, and heat dissipation shaft 72 is fixedly connected with far from one end of radiating motor 71
Radiating vane 73, the surface of substrate 1 offer S-shaped hole 8, and S-shaped hole 8 is evenly distributed on the surface of substrate 1, and S-shaped hole 8 can radiate
Prevent dust from entering simultaneously.
In use, flourescent sheet is separated with LED chip, avoids contact with convenient for heat dissipation, when device internal temperature is high, open at this time
Dynamic radiating motor 71 makes its work, and 71 output end of radiating motor is driven heat dissipation shaft 72 by shaft coupling, thus by heat emission fan
Leaf 73 drives, so that internal air blows to outside by S-shaped hole 8, forms cross-ventilation, radiates to inside, while S-shaped
Hole can radiate while prevent dust from entering.
It should be noted that, in this document, relational terms such as first and second and the like are used merely to a reality
Body or operation are distinguished with another entity or operation, are deposited without necessarily requiring or implying between these entities or operation
In any actual relationship or order or sequence.Moreover, the terms "include", "comprise" or its any other variant are intended to
Non-exclusive inclusion, so that the process, method, article or equipment including a series of elements is not only wanted including those
Element, but also including other elements that are not explicitly listed, or further include for this process, method, article or equipment
Intrinsic element.In the absence of more restrictions.By sentence " element limited including one ..., it is not excluded that
There is also other identical elements in the process, method, article or equipment for including element ".
While there has been shown and described that the embodiments of the present invention, for the ordinary skill in the art,
It is understood that these embodiments can be carried out with a variety of variations in the case where not departing from the principles of the present invention and spirit, repaired
Change, replacement and variant, the scope of the utility model is defined by the appended claims and the equivalents thereof.
Claims (6)
1. a kind of novel LED lamp bead encapsulating structure, including substrate (1), it is characterised in that: corresponding at the top of the substrate (1)
Position be fixedly connected to enclosure wall body (2), corresponding position and equal positioned at enclosure wall body (2) between at the top of the substrate (1)
It is fixedly connected with bottom land (3), is fixedly connected with electrical wire (4), the electrical wire at the top of the bottom land (3)
(4) one end far from bottom land (3) is fixedly connected with LED lamp bead (5), and the bottom and substrate (1) of the LED lamp bead (5) are pushed up
Portion central location is fixedly connected, and is fixedly connected with flourescent sheet (6) at the top of the enclosure wall body (2), the surface of the enclosure wall body (2)
Side is fixedly connected with minitype heat radiating device (7), and the surface of the substrate (1) offers S-shaped hole (8).
2. the novel LED lamp bead encapsulating structure of one kind according to claim 1, it is characterised in that: the electrical wire (4)
Material be set as corrosion-and high-temp-resistant material.
3. the novel LED lamp bead encapsulating structure of one kind according to claim 1, it is characterised in that: flourescent sheet (6) packet
It includes flourescent sheet ontology (61), the surface of the flourescent sheet ontology (61) is provided with optical waveguide layer (62), and the optical waveguide layer (62) is separate
The side of flourescent sheet ontology (61) is provided with luminous diffusion layer (63), and the one of the luminous diffusion layer (63) separate optical waveguide layer (62)
Side is provided with proofing dust and protecting layer (64), and the proofing dust and protecting layer (64) is provided with waterproof guarantor far from the side of luminous diffusion layer (63)
Sheath (65), the waterproof protective layer (65) is provided with high-temperature-resistant layer (66) far from the side of proofing dust and protecting layer (64), described resistance to
The bottom of heat zone (66) is provided with reflecting layer (67).
4. the novel LED lamp bead encapsulating structure of one kind according to claim 3, it is characterised in that: the flourescent sheet ontology
(61) thickening processing is carried out.
5. the novel LED lamp bead encapsulating structure of one kind according to claim 1, it is characterised in that: the miniature heat dissipation dress
Setting (7) includes radiating motor (71), and radiating motor (71) output end is fixedly connected with heat dissipation shaft (72) by shaft coupling,
The radiating motor (71) is fixedly connected far from the side of heat dissipation shaft (72) with the surface side of enclosure wall body (2), the heat dissipation
Shaft (72) is fixedly connected with radiating vane (73) far from the one end of radiating motor (71).
6. the novel LED lamp bead encapsulating structure of one kind according to claim 1, it is characterised in that: the S-shaped hole (8) is equal
The even surface for being distributed in substrate (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821349290.0U CN208797035U (en) | 2018-08-21 | 2018-08-21 | A kind of novel LED lamp bead encapsulating structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821349290.0U CN208797035U (en) | 2018-08-21 | 2018-08-21 | A kind of novel LED lamp bead encapsulating structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208797035U true CN208797035U (en) | 2019-04-26 |
Family
ID=66206307
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821349290.0U Expired - Fee Related CN208797035U (en) | 2018-08-21 | 2018-08-21 | A kind of novel LED lamp bead encapsulating structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208797035U (en) |
-
2018
- 2018-08-21 CN CN201821349290.0U patent/CN208797035U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190426 Termination date: 20210821 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |