CN209561448U - A kind of pickup of novel flood tide and mounting device towards Micro LED chip - Google Patents

Abstract

The novel flood tide that the utility model discloses a kind of towards Micro LED chip picks up and mounting device, including mobile unit, pickup unit, sensing unit, vision positioning unit, leveling unit and bracket as the above each unit installation foundation.Wherein pickup unit can be realized by electromagnetic force suction type and be picked up to Micro LED chip flood tide, the X of mobile unit guarantee mechanical arm, Y, Z three-axis moving, realize zone-transfer, vision positioning unit, to moving progress real-time monitoring to device and guiding, is provided information for leveling unit and moving cell, is finally completed the transfer of Micro LED chip by vision camera.By the utility model, connected each other between modules unit, it is common to cooperate, it is obviously improved the efficiency of chip transfer, while obtaining the transfer effect high-precision to chip high speed.

Description

A kind of pickup of novel flood tide and mounting device towards Micro LED chip

Technical field

It is specially a kind of towards the novel of Micro LED chip the utility model relates to chip-transfer apparatus technical field Flood tide picks up and mounting device.

Background technique

With the fast development of information industry, electronic product using more and more extensive, demand also increasingly increases.Such as Minimum unit of the small electronic component of chip etc as electronic product, is the basis of Electronic products manufacturing and application, and It uses status and quantity rapid development, and milligram ammonia trend is presented in volume.Currently, electronic equipment becomes increasingly complex, institute The electronic component of use in terms of increase in explosive, shifted in the installation course to guarantee chip high Efficiency and reliability, for the flood tide transfer research of chip high efficient and reliable, the especially research of Micro LED chip flood tide transfer Just do not stopped always, industrial production also proposes increasingly harsher requirement to it, and efficiency has become the skill for restricting development Where art bottleneck.

Utility model content

(1) the technical issues of solving

In view of the deficiencies of the prior art, the utility model provides a kind of novel flood tide towards Micro LED chip and picks up It takes and mounting device, solves the problems, such as the high efficiency of Micro LED chip flood tide transfer.

(2) technical solution

To achieve the above object, the utility model provides the following technical solutions: a kind of towards the new of Micro LED chip Type flood tide pick up and mounting device, including mobile unit, pickup unit, sensing unit, vision positioning unit, leveling unit, with And the bracket as the above each unit installation foundation；

The mobile unit include with X to translation module, Y-direction translation module and Z-direction translation module, the X to translation mould The control terminal of block, Y-direction translation module and Z-direction translation module passes through control line and mobile unit electric connection, and the X is to translation Module, Y-direction translation module and Z-direction translation module are respectively used to execute the pickup unit in the straight of X-axis and Y-axis and Z-direction Line is mobile, thus can realize the pickup and transfer of Micro LED；

The pickup unit includes the first contact head, the second contact head, third contact head, the 4th contact head and corresponding The first contact position, the second contact position, third contact position, the 4th contact position and multiple vacuum slots composition, vacuum slot sets It is equipped with attached electromagnet, contact is in contact with contact position, current turns ON, completes to adsorb chip；

The sensing unit is located at below the sucker of pickup unit, and the sensing unit includes multiple induction outer rings, multiple Incude inner ring and most in induction coil, be uniformly distributed using round multi-turn, the multiple induction outer ring, multiple induction inner rings and most in Induction coil circumferentially equidistantly distributes setting；

The vision positioning unit is made of three vision cameras, three and the vision camera be respectively First look phase Machine, the second vision camera and third vision camera, the First look phase machine testing sucker balance, second vision camera pair Mechanical arm carries out coarse positioning, and the third vision camera cooperates, completes to mechanical arm to mechanical arm fine positioning, three cameras It picks up, the detection of transfer；

The leveling unit is completed by the parallel institution of a freedom degree, the leveling unit be by the first parallel arm, Second parallel arm, third parallel arm, the 4th parallel arm, the 5th parallel arm and the 6th parallel arm composition, the leveling unit pass through Sensing unit and First look positioning camera cooperate, and complete the leveling process of sucker.

Preferably, vacuum suction and electromagnetic force absorption can be used in the pickup unit, and chip adsorbs preferred electromagnetic force absorption, Electromagnet is connect with parallel institution using vacuum suction mode, and the conductive contact on the pickup unit is uniform using four circles It is circumferentially distributed, four on the pickup unit suction nozzle is uniformly distributed using circle, during suction electromagnet, is picked up Four on unit suction nozzles are taken to contact with four conductive contact absorption, electromagnet, which is powered, at this time completes, and electromagnet can work, most The absorption to chip is completed eventually, and entire workflow is that vacuum slot adsorbs electromagnet, and contact is conductive in the process, electromagnetism Power is opened, and completes chip absorption later.

Preferably, the sensor being arranged on the sensing unit is pressure sensor, and distribution is from induction outer ring up to most In induction coil, each circle circle remote interval is equal, to be uniformly distributed, the sucker of the sensor being evenly distributed below pickup unit Bottom.

Preferably, the first setting camera is arranged in front of working machine workspace, and camera lens is in the horizontal direction towards work Make area, balanced for positioning sucker disk, be balanced monitoring and information is fed back, the second setting camera is vacantly placed in working machine Workspace side, camera lens is downward with indefinite angle tilt, shifts to chip and carries out coarse positioning, and feedback position information, under guide Camera is arranged in one moved further direction and distance, the third, is bonded mechanical arm edge after sorbing substrate, lens direction is along vertical side To downward, to precise positioning is carried out in chip transfer process, accurate location information, the leveling are provided to chip mount position Unit takes six-degree-of-freedom parallel connection mechanism, and sucker and the first crawl complete laminating type in surface, use below the pickup unit The parallel institution and pressure sensor of six degree of freedom, by sensor feedback data, the spontaneous adjusting sucker angle of parallel institution is protected Card is that sucker keeps parallel with fitting plane in pickup, movement, installation course.

S1, the depth of parallelism of vision camera detection sucker and working face in picking up folding process；

S2, in sensing unit in contact of the sensor with chip each pressure sensor stress condition；

S3, data transmission carry out model analysis and Data Analysis Services into data analysis；

S4, levelling mechanism are adjusted by 6 mechanical arms of parallel institution, the leveling to sucker；

S5 carries out the parallelism detection with working face to sucker again；

S6, depth of parallelism judgement, if reaching requirement, carries out a step job, conversely, returning to S3, continues to level；

S7, mechanical arm continue pickup work, complete the pickup to chip.

(3) beneficial effect

The utility model provides a kind of novel flood tide towards Micro LED chip and picks up and mounting device.

Have it is following the utility model has the advantages that

(1), it is somebody's turn to do the pickup of novel flood tide and mounting device towards Micro LED chip, passes through the mistake for combining chip transfer Journey re-starts layout designs to the overall construction of Micro LED chip transfer equipment, while as flat in picked up to its key structure The specific structure and its set-up mode of weighing apparatus device, positioning device etc. are studied and are improved, accordingly can compared with existing equipment The effect for significantly improving the efficiency of transfer is provided simultaneously with the features such as compact-sized, convenient for manipulation, precision and high degree of automation, It is therefore particularly suitable for the large-batch industrial large-scale production occasion of chip transfer.

Detailed description of the invention

Fig. 1 is Micro LED flood tide transfer device front view；

Fig. 2 is Micro LED flood tide transfer device top view；

Fig. 3 is electromagnetic force adsorption structure distribution map；

Fig. 4 is the distribution mode of sensor in sensing unit；

Fig. 5 is the distribution top view of sensor in sensing unit；

Fig. 6 is the distribution mode of vision camera in vision positioning unit；

Fig. 7 is the structure of parallel institution in leveling unit；

Fig. 8 is leveling flow diagram.

In figure: 100, mobile unit；101, X to translation module；102, Y-direction translation module；103, Z-direction translation module； 200, pickup unit；2001, the first contact head；2002, the second contact head；2003, third contact head；2004, the 4th contact head； 2010, the first contact position；2020, the second contact position；2030, third contacts position；2040, the 4th contact position；300, sensing is single Member；310, incude outer ring；320, incude inner ring；3n0 most in induction coil；400, vision positioning unit；401, First look phase Machine；402, the second vision camera；403, third vision camera；500, leveling unit；501, the first parallel arm；502, second simultaneously Joint arm；503, third parallel arm；504, the 4th parallel arm；505, the 5th parallel arm；506, the 6th parallel arm；600, each unit is pacified Fill the bracket on basis.

Specific embodiment

The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work Every other embodiment obtained, fall within the protection scope of the utility model.

As shown in figures 1-8, the utility model provides a kind of technical solution: a kind of towards the novel huge of Micro LED chip Amount is picked up and mounting device, including mobile unit 100, pickup unit 200, sensing unit 300, vision positioning unit 400, tune Flat unit 500 and bracket 600 as the above each unit installation foundation；Mobile unit 100 include with X to translation module 101, Y-direction translation module 102 and Z-direction be translatable module 103, X to translation module 101, Y-direction translation module 102 and Z-direction be translatable module 103 control terminal passes through control line and mobile unit 100 and is electrically connected, and X is to translation module 101, Y-direction translation module 102 and Z It is respectively used to execute pickup unit 200 in the linear movement of X-axis and Y-axis and Z-direction to translation module 103, thus can realize The pickup and transfer of Micro LED；Pickup unit 200 includes the first contact head 2001, the second contact head 2002, third contact head 2003, the 4th contact head 2004 and the first corresponding contact position 2010, second contact position 2020, third contact position 2030, 4th contact position 2040 and multiple vacuum slots 2100 form, and vacuum slot 2100 is provided with attached electromagnet, contact with contact Position is in contact, current turns ON, completes to adsorb chip；Sensing unit 300 is located at below the sucker of pickup unit 200, and sensing is single Member 300 include multiple induction outer rings 310, multiple induction inner rings 320 and most in induction coil 3n0, uniformly divided using round multi-turn Cloth, multiple induction outer rings 310, multiple induction inner rings 320 and most in induction coil 3n0 circumferentially equidistantly distribute setting；Vision Positioning unit 400 is made of three vision cameras, three and vision camera be respectively First look camera 401, the second vision camera 402 and third vision camera 403, First look camera 401 detects sucker balance, and the second vision camera 402 carries out mechanical arm Coarse positioning, third vision camera 403 cooperate to mechanical arm fine positioning, three cameras, complete to pick up mechanical arm, transfer Detection；Leveling unit 500 is completed by the parallel institution of 6 freedom degrees, and leveling unit 500 is by the first parallel arm 501, Two parallel arms 502, third parallel arm 503, the 4th parallel arm 504, the 5th parallel arm 505 and the 6th parallel arm 506 composition, leveling Unit 500 is cooperated by sensing unit 300 and First look camera 401, completes the leveling process of sucker, pickup unit 200 can be used vacuum suction and electromagnetic force absorption, and chip adsorbs preferred electromagnetic force absorption, and electromagnet and parallel institution use vacuum Suction type connection, conductive contact on pickup unit 200 using four circles uniformly around circle distribution, on pickup unit 200 Four suction nozzles be uniformly distributed using circle, four suction nozzles and four during suction electromagnet, on pickup unit 200 A conductive contact absorption contact, electromagnet, which is powered, at this time completes, and electromagnet can work, and be finally completed the absorption to chip, whole A workflow is that vacuum slot adsorbs electromagnet, and contact is conductive in the process, and electromagnetic force is opened, and completes chip later and inhales Attached, the sensor being arranged on sensing unit 300 is pressure sensor, is distributed from the induction induction coil in most of outer ring 310 3n0, each circle circle remote interval is equal, to be uniformly distributed, the sucker bottom for being evenly distributed on 200 lower section of pickup unit of the sensor Portion, First look camera 401 are arranged in front of working machine workspace, and camera lens is in the horizontal direction towards workspace, for positioning Sucker balance, is balanced monitoring and information is fed back, and the second vision camera 402 is vacantly placed in working machine workspace side, mirror Head is downward with indefinite angle tilt, shifts to chip and carries out coarse positioning, and feedback position information, guide next step moving direction with Distance, third vision camera 403 are bonded mechanical arm edge after sorbing substrate, and lens direction vertically downwards, turns chip Precise positioning is carried out during moving, and provides accurate location information to chip mount position, leveling unit 500 takes six degree of freedom Parallel institution, 200 lower section sucker of pickup unit and the first crawl complete laminating type in surface, using the parallel institution of six degree of freedom With pressure sensor, by sensor feedback data, the spontaneous adjusting sucker angle of parallel institution guarantees to pick up, mobile, places It is that sucker keeps parallel with fitting plane in the process.

In use, being suction type pickup Micro LED chip of the sucker using electromagnetic force by pickup unit 200, protect It demonstrate,proves Micro LED chip to pick up and discharge the efficient of process, because Micro LED chip is small in size, and to realize flood tide crawl, adopt The form of electricity consumption magnetic-adsorption guarantees to grab and discharge fitting efficiency, and does not occur obscission in transfer process, In It picks up in adsorption process, is contacted by sensing unit 300 with Micro LED chip, sensing unit is located at sucker bottom surface: to protect Card does not damage Micro LED chip in pick process, therefore die bottom surface can reduce sucker and core using flexible material such as rubber etc. There is buffering course in piece contact process, reduces the impact between sucker and chip；Sensing unit 300 is control electromagnetic adsorption power Size provides Information base, precisely adjusts the size of electromagnetic adsorption power, will not cause to damage chip, adsorption capacity because adsorption capacity is excessive Too small shakiness, cause to fall off and by First look camera 401 observe sucker whether with working face keeping parallelism, through toning The adjustment of flat unit 500, in this process, because a variety of factors cause the inclination of sucker, by the parallel institution to sucker not Disconnected adjustment meets to pick up and places flatness, guarantees that the sucker for picking up chip keeps parallel with bottom surface in work and transfer process, Ensure that chip will not cause wafer damage because of the not parallel working face of sucker, guarantees that chip pickup is gone on smoothly with placement, picking up Mobile unit 100 shifts chip after taking, and by being used cooperatively for three mould groups, mould group 101 and 102 realizes that sucker exists X, Y-direction is mobile, realizes the transfer on in-plane, and mould group 103 realizes that mobile realization of the movement of Z-direction on Z axis is grabbed It takes, places and move, in transfer process, vision positioning unit 400 provides position and sucker balancing information, First look camera 401 Function is that sucker plane balancing monitors camera, provides adjustment information support for adjustment sucker face；Second vision camera 402 is to place Position carries out coarse positioning, and sucker is guided to move to chip fit area, then through 403 fine positioning of third vision camera, guides Sucker precisely reaches fit area, and three axes and positioning unit 400 cooperate, and completes to pick up up and down motion, shifts plane motion, Fitting moves up and down, final to realize global transfer function, while the content being not described in detail in this specification belongs to ability The prior art well known to the professional technician of domain.

It should be noted that, in this document, relational terms such as first and second and the like are used merely to a reality Body or operation are distinguished with another entity or operation, are deposited without necessarily requiring or implying between these entities or operation In any actual relationship or order or sequence.Moreover, the terms "include", "comprise" or its any other variant are intended to Non-exclusive inclusion, so that the process, method, article or equipment including a series of elements is not only wanted including those Element, but also including other elements that are not explicitly listed, or further include for this process, method, article or equipment Intrinsic element.In the absence of more restrictions, the element limited by sentence "including a ...", it is not excluded that There is also other identical elements in process, method, article or equipment including the element.

While there has been shown and described that the embodiments of the present invention, for the ordinary skill in the art, It is understood that these embodiments can be carried out with a variety of variations in the case where not departing from the principles of the present invention and spirit, repaired Change, replacement and variant, the scope of the utility model is defined by the appended claims and the equivalents thereof.

Claims (4)

1. a kind of novel flood tide towards Micro LED chip picks up and mounting device, it is characterised in that: including mobile unit (100), pickup unit (200), sensing unit (300), vision positioning unit (400), leveling unit (500) and as with The bracket (600) of upper each unit installation foundation；

The mobile unit (100) include with X to translation module (101), Y-direction translation module (102) and Z-direction be translatable module (103), the X passes through control to the control terminal of translation module (101), Y-direction translation module (102) and Z-direction translation module (103) Line processed and mobile unit (100) are electrically connected, and the X is translatable module (102) to translation module (101), Y-direction and Z-direction translation mould Block (103) is respectively used to execute the pickup unit (200) in the linear movement of X-axis and Y-axis and Z-direction, thus can realize The pickup and transfer of Micro LED；

The pickup unit (200) include the first contact head (2001), the second contact head (2002), third contact head (2003), 4th contact head (2004) and the first corresponding contact position (2010), the second contact position (2020), third contact position (2030), the 4th contact position (2040) and multiple vacuum slots (2100) composition, vacuum slot (2100) are provided with attached electromagnetism Iron, contact are in contact with contact position, current turns ON, complete to adsorb chip；

The sensing unit (300) is located at below the sucker of pickup unit (200), and the sensing unit (300) includes multiple senses Outer ring (310), multiple induction inner ring (320) He Li induction coils (3n0) are answered, is uniformly distributed using round multi-turn, it is the multiple Induction outer ring (310), multiple induction inner ring (320) He Li induction coils (3n0) circumferentially equidistantly distribute setting；

The vision positioning unit (400) is made of three vision cameras, three and the vision camera be respectively First look phase Machine (401), the second vision camera (402) and third vision camera (403), First look camera (401) the detection sucker are flat Weighing apparatus, second vision camera (402) carry out coarse positioning to mechanical arm, and the third vision camera (403) is fixed to mechanical arm essence Position, three cameras cooperate, and complete to pick up mechanical arm, the detection of transfer；

The leveling unit (500) is completed by the parallel institution of 6 freedom degrees, and the leveling unit (500) is by first Parallel arm (501), the second parallel arm (502), third parallel arm (503), the 4th parallel arm (504), the 5th parallel arm (505) and 6th parallel arm (506) composition, the leveling unit (500) are mutual by sensing unit (300) and First look camera (401) Cooperation, completes the leveling process of sucker.

2. a kind of novel flood tide towards Micro LED chip according to claim 1 picks up and mounting device, feature Be: vacuum suction and electromagnetic force absorption, the side that chip absorption is adsorbed using electromagnetic force can be used in the pickup unit (200) Formula, electromagnet are connect with parallel institution using vacuum suction mode, and the conductive contact on the pickup unit (200) uses four Uniformly around circle distribution, four suction nozzles on the pickup unit (200) are uniformly distributed circle using circle, in suction electricity During magnet, four suction nozzles on pickup unit (200) are contacted with four conductive contact absorption, and electromagnet has been powered at this time At electromagnet can work, and be finally completed the absorption to chip, and entire workflow is that vacuum slot adsorbs electromagnet, herein Contact is conductive in the process, and electromagnetic force is opened, and completes chip absorption later.

3. a kind of novel flood tide towards Micro LED chip according to claim 1 picks up and mounting device, feature Be: the sensor being arranged on the sensing unit (300) is pressure sensor, and distribution is from induction outer ring (310) up to most In induction coil (3n0), each circle circle remote interval is equal, and to be uniformly distributed, which is evenly distributed on pickup unit (200) The sucker bottom of lower section.

4. a kind of novel flood tide towards Micro LED chip according to claim 1 picks up and mounting device, feature Be: the First look camera (401) is arranged in front of working machine workspace, camera lens in the horizontal direction towards workspace, It is balanced for positioning sucker disk, is balanced monitoring and information is fed back, second vision camera (402) is vacantly placed in working machine Workspace side, camera lens is downward with indefinite angle tilt, shifts to chip and carries out coarse positioning, and feedback position information, under guide One moved further direction and distance, the third vision camera (403) are bonded mechanical arm edge after sorbing substrate, lens direction edge Vertical direction is downward, to precise positioning is carried out in chip transfer process, provides accurate location information, institute to chip mount position It states leveling unit (500) and takes six-degree-of-freedom parallel connection mechanism, sucker and the first crawl surface are complete below the pickup unit (200) Full laminating type, using the parallel institution and pressure sensor of six degree of freedom, by sensor feedback data, parallel institution is spontaneous Sucker angle is adjusted, guarantees to pick up, it is mobile, it is that sucker keeps parallel with fitting plane in installation course.