CN209544568U - A kind of liquid crystal phase shifter and liquid crystal antenna - Google Patents
A kind of liquid crystal phase shifter and liquid crystal antenna Download PDFInfo
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- CN209544568U CN209544568U CN201920454817.4U CN201920454817U CN209544568U CN 209544568 U CN209544568 U CN 209544568U CN 201920454817 U CN201920454817 U CN 201920454817U CN 209544568 U CN209544568 U CN 209544568U
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Abstract
The utility model discloses a kind of liquid crystal phase shifters, the liquid crystal layer including the first substrate and the second substrate that are oppositely arranged and between first substrate and the second substrate；The second substrate side is provided with the first metallic diaphragm in first substrate；First substrate side is provided with the second metallic diaphragm in the second substrate, the first metallic diaphragm and the second metallic diaphragm are pattern metal film layer；First substrate and the second substrate are pcb board material.The utility model additionally provides a kind of liquid crystal antenna, including above-mentioned liquid crystal phase shifter.In ultra-high frequency wireless communication, the dielectric constant and dielectric loss value of baseplate material are bigger, dielectric loss is bigger, signal is poorer, the application uses pcb board material as the substrate of liquid crystal antenna, the dielectric constant and dielectric loss of pcb board material glass substrate more common than liquid crystal display panel are lower, and dielectric loss is smaller, are conducive to promote the performance that liquid crystal antenna is applied in hyper band.
Description
Technical field
The utility model relates to wireless communication technology fields, and in particular, to a kind of liquid crystal phase shifter and liquid crystal antenna.
Background technique
The development of information network is maked rapid progress, and all or will generate major transformation in every field, wherein hot spot skill
Art just has 5G and the satellite mobile Internet communication technology.
The core equipment that antenna sends and receives as the communication information, having become influences information network performance indicator and use
The key factor of family application effect.
Currently, because the radio magnetic wave frequency spectrum resource of height frequency range (centimeter wave is hereinafter, such as frequency≤10GHz) is quite tight
, therefore, the hyper band or more (frequency spectrum of centimeter wave to Terahertz, 10GHz or more) can only be developed and used.
How critical component of the liquid crystal phase shifter as liquid crystal antenna designs and produces and is suitable for the above frequency spectrum of hyper band
Liquid crystal phase shifter and liquid crystal antenna are those skilled in the art's problems to be solved.
Utility model content
To solve the above-mentioned problems, the utility model provides a kind of liquid crystal phase shifter and liquid crystal antenna.
The utility model provides a kind of liquid crystal phase shifter, including the first substrate and the second substrate that are oppositely arranged and position
Liquid crystal layer between the first substrate and the second substrate；The second substrate side is provided with first in first substrate
Metallic diaphragm；The first substrate side is provided with the second metallic diaphragm in the second substrate, first metallic diaphragm and
Second metallic diaphragm is pattern metal film layer；The first substrate and the second substrate are pcb board material.
Preferably, with the first vector layer of light transmission, second gold medal between first metallic diaphragm and first substrate
Belong to the Second support layer between film layer and the second substrate with light transmission.
Preferably, there is the first glue-line, the Second support layer and second between the first vector layer and first substrate
There is the second glue-line between substrate.
Preferably, the pcb board material is PTFE high frequency plate.
Preferably, first metallic diaphragm and the second metallic diaphragm are layers of copper.
Preferably, the metallic diaphragm thickness of first metallic diaphragm and the second metallic diaphragm is not less than 2.0 μm.
Preferably, the first vector layer and Second support layer are PI layers.
Preferably, the first vector layer and the first metallic diaphragm are that copper foil PI substrate is covered in integration, and described second carry
Body layer and the second metallic diaphragm are that copper foil PI substrate is covered in integration.
The utility model additionally provides a kind of liquid crystal antenna, including liquid crystal phase shifter as described above, the liquid crystal antenna
It further include antenna radiation unit.
Compared with prior art, the utility model has the following beneficial effects:
1. the dielectric constant and dielectric loss value of baseplate material are bigger, and dielectric loss is bigger in ultra-high frequency wireless communication,
Signal is poorer.The application uses pcb board material as the substrate of liquid crystal antenna, and the dielectric constant and dielectric loss of pcb board material compare liquid
The common glass substrate of crystal panel is lower, and dielectric loss is smaller, is conducive to promote the performance that liquid crystal antenna is applied in hyper band.
2. it is further, it is PTFE high frequency plate in pcb board material, there is PTFE high frequency plate lower dielectric constant and dielectric to damage
Consumption, dielectric loss is smaller, can further promote the performance that liquid crystal phase shifter and liquid crystal antenna are applied in hyper band.
3. since pcb board material is opaque, it is unfavorable for grabbing mark method using light transmission contraposition fitting is carried out to two plate bases, causes
Can not exactitude position, be unable to satisfy the design requirement of liquid crystal phase shifter, and then liquid crystal antenna performance is greatly reduced.The application is into one
Register guide is respectively set in step on the first metallic diaphragm and the second metallic diaphragm, and sets respectively on first substrate and the second substrate
Set with the corresponding through-hole of contraposition cursor position, can use light transmission after improvement and grab mark contraposition fitting is carried out to two panels；For simplification
Process and technique, register guide are respective metal film layer metal register guide as obtained from exposure etching, the ruler of metal register guide
The very little size less than through-hole, metal register guide are unable to get support after the etching；By between metallic diaphragm and corresponding substrate
The carrier layer of light transmission is set, and the metal register guide for enabling exposure etching to obtain is supported, while the carrier layer of light transmission will not
It influences light transmission and grabs mark contraposition fitting.
Detailed description of the invention
Fig. 1 is a kind of structural schematic diagram of liquid crystal phase shifter provided by the utility model embodiment one；
Fig. 2 is the first substrate, the first gold medal when aligning fitting of liquid crystal phase shifter provided by the utility model embodiment one
Belong to a kind of structural schematic diagram of film layer, first vector layer；
Fig. 3 is the first substrate, the first gold medal when aligning fitting of liquid crystal phase shifter provided by the utility model embodiment one
Belong to a kind of structural schematic diagram of film layer, first vector layer and the first glue-line；
Fig. 4 is the first substrate, the first gold medal when aligning fitting of liquid crystal phase shifter provided by the utility model embodiment one
Belong to another structural schematic diagram of film layer, first vector layer and the first glue-line；
Fig. 5 is the first base of the big plate base when aligning fitting of liquid crystal phase shifter provided by the utility model embodiment one
Plate structural schematic diagram；
Fig. 6 is a kind of flow chart of the production method of liquid crystal phase shifter provided by the utility model embodiment three；
Fig. 7 is the process of step S1 in a kind of liquid crystal phase shifter production method provided by the utility model embodiment three
Figure.
Appended drawing reference:
11- first substrate, the first metallic diaphragm of 21-, 31- first alignment layer, 12- the second substrate, the second metal film of 22-
Layer, 32- second orientation layer, 111- first through hole, 211- metal pattern, the first register guide of 212-, 40- frame glue, 50- liquid crystal layer,
The first glue-line of 61-, the first aperture of 611-, 71- first vector layer.
Specific embodiment
It is practical to this below in conjunction with attached drawing in order to keep the purpose of this utility model, technical solution and advantage clearer
It is novel to be described in further detail, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than
Whole embodiments.Based on the embodiments of the present invention, those of ordinary skill in the art are not making creative work
Under the premise of all other embodiment obtained, fall within the protection scope of the utility model.
With reference to the accompanying drawings and examples, the utility model is described in further detail:
Embodiment one:
As shown in Figure 1, being the utility model embodiment one, this specific embodiment provides a kind of liquid crystal phase shifter.Liquid crystal
Phase shifter includes the first substrate 11 being oppositely arranged and the second substrate 12, further include positioned at first substrate 11 and the second substrate 12 it
Between liquid crystal layer 50.
Also there is frame glue 40, frame glue 40 is located at first substrate 11 and the second substrate between first substrate 11 and the second substrate 12
12 edge is used for sealing fluid crystal layer 50.Preferably, the support containing plastic ball and epoxy frame glue 40 is distributed in liquid crystal layer 50
Object.
First substrate 11 is provided with the first conductive layer, the second substrate 12 is provided with the second conductive layer.
12 side of the second substrate is provided with the first metallic diaphragm 21 in first substrate 11, in 12 court of the second substrate
11 side of first substrate is provided with the second metallic diaphragm 22.
First metallic diaphragm 21 and the second metallic diaphragm 22 are patterned metallic diaphragms.
First substrate 11 and the second substrate 12 select stability and insulation effect preferably while the extremely low material of dielectric loss
Material, first substrate 11 and the second substrate 12 can be glass substrate, vitreous silica, ABS, ceramic base material and ceramic thermosetting polymer
Composite material.In the present embodiment, first substrate 11 and the second substrate 12 are preferably pcb board material.
In ultra-high frequency wireless communication, the dielectric constant and dielectric loss value of baseplate material are bigger, and dielectric loss is bigger, letter
It is number poorer.The application uses pcb board material as the substrate of liquid crystal phase shifter, and the dielectric constant and dielectric loss of pcb board material compare liquid
The common glass substrate of crystal panel is lower, and dielectric loss is smaller, is conducive to be promoted liquid crystal phase shifter and liquid crystal antenna in hyperfrequency
The performance of Duan Yingyong.
Pcb board material as liquid crystal phase shifter substrate can be FR4(epoxy resin glass) plate, PTFE(polytetrafluoroethylene (PTFE))
Plate, PPS(polyphenylene sulfide), PS(polystyrene), PPO(polyphenylene oxide plate) etc. plates, but pcb board material is preferably high frequency plate, is selected
PTFE high frequency plate is more preferably.In pcb board material, PTFE high frequency plate has lower dielectric constant and dielectric loss, and dielectric loss is got over
It is small, it can further promote the performance that liquid crystal phase shifter and liquid crystal antenna are applied in hyper band.
First metallic diaphragm 21 and the second metallic diaphragm 22 select the metal material with high conductivity and magnetic conductivity, can be with
Using the metals such as aluminium, copper, silver, gold, cadmium, chromium, molybdenum, niobium, nickel, iron, preferably silver, copper, gold, aluminium and its alloy.
The loss of wireless communication is lower, and its performance is better, i.e., insertion loss (contain conductor losses) be also more low performance more
It is good, the demanding conductivity of the metal material as required for liquid crystal phase shifter and magnetic conductivity, it is general select silver, copper, gold, aluminium and
Its alloy.
In metal material silver, copper, gold, aluminium and its alloy, the conductivity of silver and gold is good, but cost is expensive.As sexual valence
Than best scheme, the metal material of metallic diaphragm is preferably copper product.First metallic diaphragm 21 and the second metallic diaphragm 22 are
For layers of copper.
Known metal material and metallic diaphragm thickness and conductor losses have relationship, and skin effect is exactly the body of conductor losses
It is existing.Since alternating current has skin effect, skin effect indirectly increases the resistance of conductor, and energy thermal losses also increases therewith
Greatly.In the wave band of the high bands such as microwave, skin effect is clearly.Different metal materials has different skin depths.
Skin effect: when having alternating current or alternating electromagnetic field in conductor, the current distribution is uneven of conductor is even, electric current
The appearance parts of skin of conductor is concentrated on, closer to conductive surface, current density is bigger, actually electric current very little inside conducting wire.
As a result increase the resistance of conductor, increase its loss power also.This phenomenon is exactly skin effect (skin effect).
Skin depth δ is given by:
δ=(1/ π f μ σ)1/2,
Wherein, μ indicates that the magnetic conductivity of metal material, σ are the conductivity of conductor, and f indicates the carried signal of liquid crystal antenna
Frequency.
The demanding conductivity of the metal material as required for liquid crystal phase shifter and magnetic conductivity, it is general select silver, copper,
Gold, aluminium and its alloy, therefore skin effect required by liquid crystal phase shifter and liquid crystal antenna, generally require corresponding first metal film
The metallic diaphragm thickness of layer 21 and the second metallic diaphragm 22 is respectively between 3 times to 5 times of skin depth δ.The thickness of metallic diaphragm
Degree will reach the thick film of μm grade, could protect the performance that preferably card guarantees liquid crystal antenna.
When the first metallic diaphragm 21 and the second metallic diaphragm 22 are layers of copper, the first metallic diaphragm 21 and the second metal film
The metallic diaphragm thickness of layer 22 is not less than 2.0 μm.
When carrying out contraposition fitting to two plate bases, since contraposition applying machine structure needs the back side (the i.e. base from two plate bases
On plate deviate from respective metal film layer one side) carry out light transmission grab mark.Since pcb board material is opaque, it is unfavorable for grabbing mark using light transmission
Method carries out contraposition fitting to two plate bases, leads to not exactitude position, is unable to satisfy the design requirement of antenna, and then substantially drop
Low antenna performance.If with blind patch is carried out manually, the precision of fitting not can guarantee.In order to solve this problem, in liquid crystal phase shifter
In manufacture craft, when carrying out contraposition fitting to first substrate and the second substrate, there is the first contraposition in the first metallic diaphragm 21
Mark 212 has the second register guide in second metallic diaphragm 22, sets at corresponding first register guide 212 on first substrate 11
It is equipped with first through hole 111, is provided with the second through-hole at corresponding second register guide in the second substrate 12.
Register guide can be circular mark.Alternatively, register guide can also be including in two directions perpendicular to each other
Graticule, such as register guide can be cross or be the two lines in 90 degree of angles.
The application is by being respectively set register guide on the first metallic diaphragm 21 and the second metallic diaphragm 22, and in the first base
Through-hole corresponding with contraposition cursor position is respectively set on plate 11 and the second substrate 12, solves the problems, such as light transmission, pastes contraposition
Mark can be grabbed to the contraposition fitting of two plate bases by light transmission by closing mechanism, and then be conducive to implement the fitting of two plate bases into the technique mistake of box
Journey.
When aligning fitting, it can use CCD camera lens, contraposition fitting carried out to first substrate 11 and the second substrate 12.With
For first substrate 11, CCD camera lens grabs mark from light transmission from the first substrate 11 at 21 back side of the first metallic diaphragm, through first substrate
First through hole 111 on 11, CCD camera lens can see the first register guide 212.
Preferably, the first register guide 212 is completely covered in the size of first through hole 111: assuming that have a virtual plane, it should
Plane is, for example, the plane where first substrate 11, and the first contraposition can be completely covered in the projection of the plane in first through hole 111
Projection of the mark 212 in the plane.Equally, the second register guide is completely covered in the size of the second through-hole.
The first register guide 212 and the second register guide are illustrated below:
First register guide 212 can be set in the first metallic diaphragm 21 in the one side of first substrate 11, facilitate through
First through hole 111 it is seen that.Such as production via hole is used as register guide, or only does locally transparent area and do register guide, or
Person makes the methods of register guide by laser and is made.Equally, the second register guide can be set in the second metallic diaphragm 22 close to
In the one side of two substrates 12, facilitate through the second through-hole it is seen that.
But it is more preferable that register guide is that respective metal film layer is etched by exposure for simple flow and technique
Obtained metal register guide.Specifically, the first register guide 212 is obtained and being exposed etching to the first metallic diaphragm 21
It arrives, the second register guide is obtained by being exposed etching to the second metallic diaphragm 22, the first register guide 212 and the second contraposition
It is designated as metal register guide.It is understood that first register guide 212 is corresponding with the position of the second register guide.
Further, by taking first substrate 11 as an example, as shown in Fig. 2, the first metallic diaphragm 21 and first substrate 11 it
Between with light transmission first vector layer 71.The size of metal register guide is generally less than the size of through-hole, by metallic diaphragm and
The carrier layer of light transmission is set between corresponding substrate, and the metal register guide for enabling exposure etching to obtain is supported, while light transmission
Carrier layer do not interfere with light transmission grab mark contraposition fitting.Likewise, having between the second metallic diaphragm 22 and the second substrate 12
There is the Second support layer of light transmission.
First vector layer 71 and Second support layer can be PI (polyimides) layer, PET (poly terephthalic acid class material)
Layer or PE (polyethylene) layer, they all have good translucency.But it is more preferable that first vector layer 71 and second
The advantages that carrier layer is PI layers, and PI has both better translucency and good heat-resisting quantity.
In practical applications, can select it is integrated cover copper foil PI substrate, i.e. PI substrate layer upper layer superimposition has copper foil layer,
Covering copper foil PI substrate can replace first vector layer 71 and the first metallic diaphragm 21, and make first vector layer 71 and the first metal film
21 integration of layer.Covering copper foil PI substrate can be attached by glue-line and corresponding substrate.As shown in figure 3, in first vector layer
Between 71 and first substrate 11 there is the first glue-line 61, first vector layer 71 and first substrate 11 to be bonded by the first glue-line 61.
Likewise, having the second glue-line between Second support layer and the second substrate 12.It, can also be with alternatively, in other embodiments
First carrier layer such as PI layers are attached on substrate, then make or be arranged metallic diaphragm on a carrier layer.But copper foil is covered with using
The scheme of PI substrate compares, and is generally existing plate due to covering copper foil PI substrate, can directly purchase, relative to first by load
Body layer such as PI layers are attached on substrate, then the scheme for making on a carrier layer or metallic diaphragm being arranged has cost and more supernumerary segment
The advantage made an appointment.
First glue-line 61 and the second glue-line can be pcb board material commonly impermeable gelatin, or be also possible to the light of light transmission
Learn glue.
When the first glue-line 61 and the second glue-line are impermeable gelatin layer, as shown in figure 4, first glue-line 61 corresponding first
The position of register guide 212 is provided with the first aperture 611, and the position of corresponding second register guide of second glue-line is provided with second and opens
Hole.The setting of first aperture 611 and the second aperture makes the first glue-line 61 and the second glue-line that light transmission not interfered to grab mark contraposition fitting.
The first register guide 212 is completely covered in the size of first aperture 611: assuming that have a virtual plane, the plane example
Plane for example where first substrate 11, the first aperture 611 can be completely covered the first register guide 212 in the projection of the plane and exist
The projection of the plane.Equally, the second register guide is completely covered in the size of the second aperture.Preferably, the first aperture 611 is not less than the
First through hole 111 on one substrate 11, the second aperture is not less than the second through-hole in the second substrate 12.
First through hole 111, the second through-hole and the first aperture 611, the second aperture production preferably fitting carrier layer it
Before, damage carrier layer or metallic diaphragm when preventing through-hole or aperture from making.
When aligning fitting, first substrate and the second substrate are generally big plate base.After aligning laminating step, liquid crystal
The production method of phase shifter further include be hot pressed into box, small pieces are cut, liquid filling is sealed, are bound.More than it should be noted that
First register guide 212, the second register guide, first through hole 111, the setting of the second through-hole and first aperture 611,
The setting of two apertures is to facilitate contraposition applying machine structure point from substrate when two plate bases of liquid crystal phase shifter are aligned and are bonded
The back side carry out light transmission grab mark, to realize the accurate contraposition of first substrate and the second substrate.
Therefore the first register guide 212, the second register guide, first through hole 111 and the second through-hole are generally located on liquid crystal phase shift
The marginal position of device product, when subsequent small pieces are cut, the first register guide 212, the second register guide, first through hole 111 and
Two through-holes are generally all cut.
Liquid crystal phase shifter further includes the first alignment layer 31 and second orientation layer for being separately positioned on 50 two sides of liquid crystal layer
32.First alignment layer 31 is prepared on the first substrate 11 for be formed with pattern metal film layer, is being formed with pattern metal film
Second orientation layer 32 is prepared in the second substrate 12 of layer.Oriented layer be used for the initial deflection angle of the brilliant molecule of liquid crystal layer 50 into
Row limits.
In a specific embodiment, metal pattern 211 includes phase shifter electricity on patterned second metallic diaphragm 22
Pole, phase shifter electrode are planar transmission line, and planar transmission line is used for transmission microwave signal.Planar transmission line is preferably microstrip line.
The shape of microstrip line can be snakelike or spiral shape, and the shape of microstrip line is not construed as limiting, can be realized microwave signal
Transmission.Metal pattern 211 includes grounding electrode on patterned first metallic diaphragm 21, and liquid crystal phase shifter further includes biasing
Line.In one embodiment, the second metallic diaphragm 22 in the second substrate 12 can be set in offset line.By offset line in micro-strip
Apply voltage between line and grounding electrode, thus it is possible to vary the effective dielectric constant of liquid crystal, therefore change the phase of microwave signal.
When not applying electric field between microstrip line and grounding electrode, liquid crystal molecule is in the first both alignment layers and the second both alignment layers
It arranges under effect along preset direction.Liquid when applying electric field between microstrip line and grounding electrode, in electric field driven liquid crystal layer 50
The deflection of brilliant molecular orientation.
Microwave signal is transmitted between microstrip line and grounding electrode, can be due to liquid crystal in the transmission process of microwave signal
The deflection of molecule and change phase, to realize the phase shift function of microwave signal.By on control microstrip line and grounding electrode
Voltage can control the deflection angle of liquid crystal in liquid crystal layer 50, and then can control to the phase adjusted during phase shift
System.
Using the dielectric of liquid crystal material respectively to characteristic and low power consumption characteristic, by control be applied to the voltage of liquid crystal layer 50 come
Change the effective dielectric constant of liquid crystal, and then controls the phase adjusted during phase shift.Pass through the electrostatic capacitance of special designing
Different liquid crystal antenna elements forms X-Y scheme.It is endowed from antenna reception or the electromagnetic wave emitted quiet with each antenna element
The corresponding phase difference of capacitor, the X-Y scheme that the antenna element different according to electrostatic capacitance is formed have by force in particular directions
Directive property (beam scanning), to realize mutual between antenna reception or the electromagnetic wave and radiofrequency signal (voltage signal) of transmitting
Conversion function.
Compared with prior art, the utility model has the following beneficial effects:
1. the dielectric constant and dielectric loss value of baseplate material are bigger, and dielectric loss is got in ultra-high frequency wireless communication
Greatly, signal is poorer.The application uses pcb board material as the substrate of liquid crystal phase shifter, and the dielectric constant and dielectric of pcb board material damage
The common glass substrate of loss-rate liquid crystal display panel is lower, and dielectric loss is smaller, is conducive to be promoted liquid crystal antenna in hyper band application
Performance.
2. it is further, it is PTFE high frequency plate in pcb board material, there is PTFE high frequency plate lower dielectric constant and dielectric to damage
Consumption, dielectric loss is smaller, can further promote the performance that liquid crystal phase shifter and liquid crystal antenna are applied in hyper band.
3. since pcb board material is opaque, it is unfavorable for grabbing mark method using light transmission contraposition fitting is carried out to two plate bases, causes
Can not exactitude position, be unable to satisfy the design requirement of liquid crystal phase shifter, and then liquid crystal antenna performance is greatly reduced.The application is into one
Register guide is respectively set in step on the first metallic diaphragm and the second metallic diaphragm, and sets respectively on first substrate and the second substrate
Set with the corresponding through-hole of contraposition cursor position, can use light transmission after improvement and grab mark contraposition fitting is carried out to two panels；For simplification
Process and technique, register guide are respective metal film layer metal register guides as obtained from exposure etching；The ruler of metal register guide
The very little size less than through-hole obtains exposure etching by the way that the carrier layer of light transmission is arranged between metallic diaphragm and corresponding substrate
Metal register guide can be supported, while the carrier layer of light transmission do not interfere with light transmission grab mark contraposition fitting.
Embodiment two:
This specific embodiment provides a kind of liquid crystal antenna, which includes liquid crystal phase shift described in embodiment one
Device.Liquid crystal antenna further includes having antenna radiation unit, and antenna radiation unit realizes the feedback of microwave signal for radiating microwave signal
Enter and feeds out.
In the present embodiment, the side of the second substrate 12 is provided with antenna radiation unit in first substrate 11.
Antenna radiation unit is made of high conductivity material.Antenna radiation unit can be rectangle, circle or rectangular patch, and can
With corner cut, liquid crystal phase shifter can also be attached to by paster technique.Alternatively, preferred scheme is, antenna radiation unit is to set
Set the patterned third metallic diaphragm in side of the first substrate 11 far from the second substrate 12.
Embodiment three:
This specific embodiment provides the production method of the liquid crystal phase shifter as described in embodiment one.As shown in fig. 6, should
The production method of liquid crystal phase shifter the following steps are included:
S1: providing the first substrate 11 of pcb board material, have the first metallic diaphragm 21 on first substrate 11,
There is the first register guide 212 on first metallic diaphragm 21, there is on first substrate 11 first through hole 111, described the
The position of one register guide 212 is corresponding with the position of first through hole 111；
S2: the second substrate 12 of pcb board material is provided, there is the second metallic diaphragm 22, the second metal film in the second substrate 12
There is the second register guide, the second substrate 12 has the second through-hole, position and the second through-hole of second register guide on layer 22
Position is corresponding；
S3: contraposition applying machine structure penetrates first through hole 111 and the second through-hole respectively, utilizes the first register guide 212 and second
Register guide carries out contraposition fitting to first substrate 11 and the second substrate 12.
It should be noted that the sequencing of step S1 and step S2 can be adjusted.
Specifically, in step s3, being bonded common CCD light transmission contraposition using liquid crystal display panel contraposition to implement precisely to paste
It closes: using CCD camera lens, CCD camera lens penetrates first through hole 111 and the second through-hole respectively, utilizes the first register guide 212 and second pair
Position mark, aligns first substrate 11 and the second substrate 12 in advance, the state of fitting is slowly moved to after contraposition.
The manufacture craft of first register guide 212 and the second register guide explanation:
First register guide 212 can be set in the first metallic diaphragm 21 in the one side of first substrate 11, facilitate through
First through hole 111 it is seen that.Such as production via hole is used as register guide, or only does locally transparent area and do register guide, or
Person makes the methods of register guide by laser and is made.Equally, the second register guide can be set in the second metallic diaphragm 22 close to
In the one side of two substrates 12, facilitate through the second through-hole it is seen that.
But it is more preferable that register guide is that respective metal film layer is etched by exposure for simple flow and technique
Obtained metal register guide.Specifically, the first register guide 212 is obtained and being exposed etching to the first metallic diaphragm 21
It arrives, the second register guide is obtained by being exposed etching to the second metallic diaphragm 22, the first register guide 212 and the second contraposition
Mark is metal register guide.
The size of metal register guide is generally less than the size of through-hole, grabs mark in order to carry out light transmission through through-hole.It is exposing
After etching, the metal on metal register guide periphery is etched, and metal register guide is made not have support.As improved plan,
With the first vector layer 71 of light transmission between first metallic diaphragm 21 and first substrate 11, in the second metallic diaphragm 22 and the second base
With the Second support layer of light transmission between plate 12.By the way that the carrier layer of light transmission is arranged between metallic diaphragm and corresponding substrate, make
The metal register guide that exposure etching obtains can be supported, while the carrier layer of light transmission does not interfere with light transmission and grabs mark contraposition patch
It closes.
First vector layer 71 and Second support layer can be PI layers, pet layer or PE layers, they all have good
Light.But it is more preferable that first vector layer 71 and Second support layer are PI layers, PI has both better light transmission and high temperature resistant
The advantages that property is good, is resistant to high-temperature baking in subsequent oriented layer manufacture craft.
In practical applications, it can select and cover copper foil PI substrate as metallic diaphragm and carrier layer, cover copper foil PI substrate
I.e. the superimposition of PI substrate layer upper layer has copper foil layer, and covering copper foil PI substrate can be attached by glue-line and corresponding substrate.Specifically,
There is the first glue-line 61 between first vector layer 71 and first substrate 11, have between Second support layer and the second substrate 12
Second glue-line.
Alternatively, in other embodiments, first carrier layer such as PI layers can also be attached on substrate, then on a carrier layer
Production or setting metallic diaphragm.
Therefore, further, as shown in fig. 7, the production method of step S1 includes the following steps:
S11: providing first substrate 11, the first glue-line 61 be arranged on the first substrate 11, makes in first substrate 11
First through hole 111 makes the first aperture 611, the position phase of the first through hole 111 and the first aperture 611 in the first glue-line 61
It is corresponding；
S12: first vector layer 71 is fitted in the first glue-line 61 with the first aperture 611；First metallic diaphragm 21
In first vector layer 71 in the one side of first substrate 11；
S13: to the first metallic diaphragm 21 carry out patterned process, obtain include the first register guide 212 patterning first
Metallic diaphragm 21.
It, can also be with it should be noted that in step s 11, first through hole 111 and the first aperture 611 can make simultaneously
Successively production.
In step s 12, the first metallic diaphragm 21 and first vector layer 71 can be used as an entirety, first vector layer 71
It is bonded with the first glue-line 61, such as directlys adopt and cover copper foil PI substrate, made to cover copper foil PI substrate and the first glue-line 61 carries out
Fitting.Or after individual first vector layer 71 first can also being fitted in the first glue-line 61 with the first aperture 611, then
The first metallic diaphragm 21 is made or is arranged on first vector layer 71.
Likewise, the production method of step S2 includes the following steps:
S21: providing the second substrate 12, the second glue-line be arranged in the second substrate 12, in the production of the second substrate 12 the
Two through-holes, in the second aperture of production of the second glue-line, the position of second through-hole and the second aperture is corresponding；
S22: Second support layer is fitted in the second glue-line with the second aperture；Second metallic diaphragm 22 is located at second and carries
Body layer is in the one side of the second substrate 12；
S23: to the second metallic diaphragm 22 carry out patterned process, obtain include the second register guide the second metal of patterning
Film layer 22.
It should be noted that in the step s 21, the second through-hole and the second aperture can make simultaneously, can also successively make
Make.
In step S22, the second metallic diaphragm 22 and Second support layer can be used as an entirety, Second support layer and
Two glue-lines are bonded, such as are directlyed adopt and covered copper foil PI substrate, are made to cover copper foil PI substrate and are bonded with the second glue-line.Or
After individual Second support layer first can also being fitted in the second glue-line with the second aperture；It is made on Second support layer again
Or the second metallic diaphragm 22 of setting.
It should be noted that liquid crystal moves before step S3 carries out contraposition fitting to first substrate 11 and the second substrate 12
The production method of phase device further includes the specific patterned process technique to the first metallic diaphragm 21 and the second metallic diaphragm 22, and
It further include 40 manufacturing process steps of oriented layer and frame glue after being patterned to metallic diaphragm.
To the patterned process process of metallic diaphragm, for known to the skilled artisan, can by gluing,
Precuring, exposure, development, etching, the technique of demoulding obtain.
Oriented layer can be used PI friction process in the prior art and be made, to form orientation notch on the surface.Such as
Can use APR plate, just the default orientation liquid instilled is transferred to the corresponding thereon with metal pattern, passes through high temperature
Solvent while being vapored away so that sufficiently reaction, eventually form solid oriented film layer by baking.Flannelette or cotton are used on oriented film
Cloth is polished to a direction, and formation is finally arranged in parallel according to presetting frictional direction by liquid crystal molecule, and details are not described herein.
40 manufacturing process steps of frame glue dawn known to those skilled in the art, details are not described herein.
After step s 3, the production method of liquid crystal phase shifter further include be hot pressed into box, small pieces are cut, liquid filling is sealed, are tied up
Fixed and etc..
When aligning fitting, first substrate 11 and the second substrate 12 are generally big plate base, in step S3 to first substrate
11 and the second substrate 12 carry out contraposition fitting when, using big plate make.After step S3 contraposition fitting, liquid crystal phase shifter
Production method further include be hot pressed into box, small pieces are cut, liquid filling is sealed, are bound.
By being hot pressed into box, the technique of the substrate posted in advance high pressure-temperature is solidified, just will form certain
Box thickness interval ultimately forms bonding firmness height, multiple sylphons (CELL) of high mechanical strength after sufficiently solidifying.Later
Pass through small pieces cutting process, the liquid crystal phase shifter sylphon of available multiple simple grains again.
It should be noted that above-described first register guide 212, the second register guide, first through hole 111, the second through-hole
Setting and the first aperture 611, the second aperture setting, be in order to two plate bases of liquid crystal phase shifter align be bonded when,
Facilitate contraposition applying machine structure point to carry out light transmission from the back side of substrate and grab mark, to realize the accurate right of first substrate and the second substrate
Position.
Therefore the first register guide 212, the second register guide, first through hole 111 and the second through-hole are generally located on liquid crystal phase shift
The marginal position of device product, Fig. 5 show 11 schematic diagram of first substrate of big plate base, include multiple independences on the big plate base
Unit, first through hole 111 is located at large stretch of substrate edges position.It is only illustrated in Fig. 5 with 4 independent units, each
Unit includes individual frame glue 40, but quantity is not limited to this.When subsequent small pieces are cut, the first 212, second pairs of register guide
Position mark, first through hole 111 and the second through-hole are cut, and are not present in liquid crystal phase shifter product.
Compared with prior art, the utility model has the following beneficial effects:
The utility model provide it is a kind of using pcb board material as substrate and in conjunction with the production method of liquid crystal display panel come batch
The method of the liquid crystal phase shifter of manufacture, the dielectric constant and dielectric loss of pcb board material glass substrate more common than liquid crystal display panel are more
Low, dielectric loss is smaller, is conducive to promote the performance that liquid crystal phase shifter is applied in hyper band；
The utility model also further solves original opaque pcb board material can not be using the light transmission contraposition patch of liquid crystal display panel
The problem of mechanism implements precisely fitting to two plate bases is closed, by being respectively set on the first metallic diaphragm and the second metallic diaphragm
Register guide, and through-hole corresponding with contraposition cursor position is respectively set on first substrate and the second substrate, after improvement
Contraposition fitting is carried out to two panels to grab mark using light transmission.
For simple flow and technique, register guide is that respective metal film layer metal as obtained from exposure etching aligns
Mark；The size of metal register guide is less than the size of through-hole, by the carrier that light transmission is arranged between metallic diaphragm and corresponding substrate
Layer, the metal register guide for enabling exposure etching to obtain is supported, while the carrier layer of light transmission does not interfere with light transmission and grabs mark
Contraposition fitting.
Finally, it should be noted that above embodiments are only to illustrate the technical solution of the utility model embodiment rather than right
It is limited, although the utility model embodiment is described in detail referring to preferred embodiment, this field it is common
Technical staff should understand that still be modified or replaced equivalently the technical solution of the utility model embodiment, and this
A little ranges modified or equivalent replacement cannot also make modified technical solution be detached from the utility model embodiment technical solution.
Claims (9)
1. a kind of liquid crystal phase shifter, including the first substrate and the second substrate that are oppositely arranged and it is located at the first substrate and the
Liquid crystal layer between two substrates；
It is characterized in that, being provided with the first metallic diaphragm towards the second substrate side in first substrate；In the second substrate court
The first substrate side is provided with the second metallic diaphragm, first metallic diaphragm and the second metallic diaphragm are patterning
Metallic diaphragm；The first substrate and the second substrate are pcb board material.
2. liquid crystal phase shifter as described in claim 1, which is characterized in that have between first metallic diaphragm and first substrate
There is the first vector layer of light transmission, with the Second support layer of light transmission between second metallic diaphragm and the second substrate.
3. liquid crystal phase shifter as claimed in claim 2, which is characterized in that have between the first vector layer and first substrate
First glue-line has the second glue-line between the Second support layer and the second substrate.
4. liquid crystal phase shifter as described in claim 1, which is characterized in that the pcb board material is PTFE high frequency plate.
5. liquid crystal phase shifter as described in claim 1, which is characterized in that first metallic diaphragm and the second metallic diaphragm are
Layers of copper.
6. liquid crystal phase shifter as claimed in claim 5, which is characterized in that first metallic diaphragm and the second metallic diaphragm
Metallic diaphragm thickness is not less than 2.0 μm.
7. liquid crystal phase shifter as claimed in claim 2, which is characterized in that the first vector layer and Second support layer are PI
Layer.
8. liquid crystal phase shifter as claimed in claim 7, which is characterized in that the first vector layer and the first metallic diaphragm are one
Cover copper foil PI substrate, the Second support layer and the second metallic diaphragm of body cover copper foil PI substrate for integration.
9. a kind of liquid crystal antenna, including such as liquid crystal phase shifter of any of claims 1-8, the liquid crystal antenna also wrap
Include antenna radiation unit.
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| CN201920454817.4U CN209544568U (en) | 2019-04-04 | 2019-04-04 | A kind of liquid crystal phase shifter and liquid crystal antenna |
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| CN201920454817.4U CN209544568U (en) | 2019-04-04 | 2019-04-04 | A kind of liquid crystal phase shifter and liquid crystal antenna |
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| CN110034358A (en) * | 2019-04-04 | 2019-07-19 | 信利半导体有限公司 | A kind of production method of liquid crystal phase shifter, liquid crystal antenna and liquid crystal phase shifter |
| CN112490677A (en) * | 2020-11-04 | 2021-03-12 | 电子科技大学 | Narrow-band continuously adjustable liquid crystal frequency selection surface and regulating and controlling method thereof |
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| CN113451718A (en) * | 2021-06-30 | 2021-09-28 | 上海天马微电子有限公司 | Phase shifter and antenna |
| CN114388996A (en) * | 2020-10-22 | 2022-04-22 | 上海天马微电子有限公司 | Liquid crystal phase shifter, manufacturing method thereof and liquid crystal antenna |
| CN114614245A (en) * | 2020-12-04 | 2022-06-10 | 上海中航光电子有限公司 | Antenna and manufacturing method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110034358A (en) * | 2019-04-04 | 2019-07-19 | 信利半导体有限公司 | A kind of production method of liquid crystal phase shifter, liquid crystal antenna and liquid crystal phase shifter |
| CN110034358B (en) * | 2019-04-04 | 2024-02-23 | 信利半导体有限公司 | Liquid crystal phase shifter, liquid crystal antenna and manufacturing method of liquid crystal phase shifter |
| CN112787100A (en) * | 2019-11-04 | 2021-05-11 | 群创光电股份有限公司 | Electromagnetic wave adjusting device |
| US11482781B2 (en) * | 2019-11-04 | 2022-10-25 | Innolux Corporation | Electromagnetic wave adjusting device |
| CN114388996A (en) * | 2020-10-22 | 2022-04-22 | 上海天马微电子有限公司 | Liquid crystal phase shifter, manufacturing method thereof and liquid crystal antenna |
| CN114388996B (en) * | 2020-10-22 | 2023-04-07 | 上海天马微电子有限公司 | Liquid crystal phase shifter, manufacturing method thereof and liquid crystal antenna |
| CN112490677A (en) * | 2020-11-04 | 2021-03-12 | 电子科技大学 | Narrow-band continuously adjustable liquid crystal frequency selection surface and regulating and controlling method thereof |
| CN112490677B (en) * | 2020-11-04 | 2022-03-15 | 电子科技大学 | Narrow-band continuously adjustable liquid crystal frequency selection surface and regulating and controlling method thereof |
| CN114614245A (en) * | 2020-12-04 | 2022-06-10 | 上海中航光电子有限公司 | Antenna and manufacturing method thereof |
| CN114614245B (en) * | 2020-12-04 | 2023-10-13 | 上海中航光电子有限公司 | Antenna and manufacturing method thereof |
| CN113451718A (en) * | 2021-06-30 | 2021-09-28 | 上海天马微电子有限公司 | Phase shifter and antenna |
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