CN114614245A

CN114614245A - Antenna and manufacturing method thereof

Info

Publication number: CN114614245A
Application number: CN202011412861.2A
Authority: CN
Inventors: 雷登明; 席克瑞; 贾振宇; 林柏全; 秦锋
Original assignee: Shanghai AVIC Optoelectronics Co Ltd
Current assignee: Shanghai AVIC Optoelectronics Co Ltd
Priority date: 2020-12-04
Filing date: 2020-12-04
Publication date: 2022-06-10
Anticipated expiration: 2040-12-04
Also published as: CN114614245B

Abstract

The embodiment of the invention discloses an antenna and a manufacturing method thereof. The antenna comprises a first substrate, a radiation pattern layer and a feed pattern layer; the first substrate includes a radiation region and a feed region; the radiation pattern layer and the feed pattern layer are both arranged on the first substrate; the radiation pattern layer is arranged in the radiation area of the first substrate, and the feed pattern layer is arranged in the feed area of the first substrate; wherein a dielectric constant of the radiation region of the first substrate is smaller than a dielectric constant of the feed region of the first substrate. Compared with the prior art, the embodiment of the invention can give consideration to different requirements of the radiation pattern layer and the feed pattern layer on the first substrate dielectric material, and is beneficial to reducing the loss of the antenna on the basis of improving the radiation rate of the antenna.

Description

Antenna and manufacturing method thereof

Technical Field

The embodiment of the invention relates to the technical field of antennas, in particular to an antenna and a manufacturing method thereof.

Background

With the development of internet technology, the antenna has increasingly complex status in the network as the sensing organ of the mobile communication network, and has increasingly wide application and important function.

An antenna acts as a transformer that transforms a guided wave propagating on a transmission line into an electromagnetic wave propagating in an unbounded medium (usually free space) or vice versa. However, the conventional antenna has problems of large loss and low radiation rate because further improvement is required.

Disclosure of Invention

The embodiment of the invention provides an antenna and a manufacturing method thereof, which are used for reducing the loss of the antenna and improving the radiation rate of the antenna.

In a first aspect, an embodiment of the present invention provides an antenna, including: a first substrate including a radiation region and a feed region;

the radiation pattern layer and the feed pattern layer are arranged on the first substrate; the radiation pattern layer is arranged in the radiation area of the first substrate, and the feed pattern layer is arranged in the feed area of the first substrate;

wherein a dielectric constant of the radiation region of the first substrate is smaller than a dielectric constant of the feed region of the first substrate.

In a second aspect, an embodiment of the present invention further provides a method for manufacturing an antenna, including:

providing a first substrate; the first substrate includes a radiation region and a feed region; the dielectric constant of the radiation area of the first substrate is smaller than that of the feed area of the first substrate;

forming a radiation pattern layer and a feeding pattern layer on the first substrate; the radiation pattern layer is arranged in the radiation area of the first substrate, and the feed pattern layer is arranged in the feed area of the first substrate.

The first substrate comprises a radiation area and a feed area, the radiation pattern layer is arranged in the radiation area of the first substrate, the feed pattern layer is arranged in the feed area of the first substrate, and the dielectric constant of the radiation area is smaller than that of the feed area. Therefore, the dielectric constant of the feed region is larger, the width of the feed pattern layer is favorably reduced, the influence of the radiation of the feed pattern layer on the overall radiation of the antenna is reduced, and the loss is reduced; and the dielectric constant of the radiation area is smaller, which is beneficial to reducing the capacity of the medium in the radiation area for restraining an electric field, reducing the constraint on energy and increasing the energy effectively radiated by the radiation pattern layer, thereby improving the radiation efficiency of the antenna. In summary, the embodiments of the present invention can meet different requirements of the radiation pattern layer and the feed pattern layer for the dielectric material of the first substrate, and are favorable for reducing the loss of the antenna on the basis of improving the radiation rate of the antenna.

Drawings

FIG. 1 is a schematic diagram of a distribution of an electric field under dielectrics with different dielectric constants according to an embodiment of the present invention;

fig. 2 is a schematic structural diagram of an antenna according to an embodiment of the present invention;

fig. 3 is a schematic structural diagram of another antenna provided in the embodiment of the present invention;

fig. 4 is a schematic structural diagram of another antenna provided in the embodiment of the present invention;

fig. 5 is a schematic structural diagram of another antenna provided in an embodiment of the present invention;

fig. 6 is a schematic structural diagram of another antenna provided in an embodiment of the present invention;

fig. 7 is a schematic structural diagram of another antenna according to an embodiment of the present invention;

fig. 8 is a schematic structural diagram of another antenna provided in an embodiment of the present invention;

fig. 9 is a schematic structural diagram of another antenna provided in the embodiment of the present invention;

fig. 10 is a schematic structural diagram of another antenna provided in the embodiment of the present invention;

fig. 11 is a schematic structural diagram of another antenna provided in the embodiment of the present invention;

fig. 12 is a schematic structural diagram of another antenna provided in the embodiment of the present invention;

fig. 13 is a schematic structural diagram of another antenna provided in the embodiment of the present invention;

fig. 14 is a schematic structural diagram of another antenna according to an embodiment of the present invention;

fig. 15 is a schematic structural diagram of another antenna provided in the embodiment of the present invention;

fig. 16 is a schematic flowchart of a method for manufacturing an antenna according to an embodiment of the present invention;

fig. 17 is a schematic structural diagram of a method for manufacturing an antenna according to an embodiment of the present invention in each step;

fig. 18 is a schematic structural diagram of a method for manufacturing a first substrate in steps according to an embodiment of the present invention;

fig. 19 is a schematic structural diagram of another method for manufacturing a first substrate according to an embodiment of the invention in each step;

fig. 20 is a schematic structural diagram of a method for manufacturing a first substrate according to another embodiment of the present invention in each step.

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be further noted that, for the convenience of description, only some of the structures related to the present invention are shown in the drawings, not all of the structures.

As described in the background art, the conventional antenna has problems of large loss and low radiation rate. The inventor researches and finds that the reason of the problem is as follows:

the antenna comprises a dielectric substrate, and a radiation electrode and a feed electrode which are arranged on the dielectric substrate, wherein the dielectric constant of the dielectric substrate is one of important parameters influencing the performance of the antenna, and the dielectric constant has important influence on the radiation performance of the antenna and the performance of an antenna feed network.

Fig. 1 is a schematic diagram of a distribution of an electrode electric field under dielectrics with different dielectric constants according to an embodiment of the present invention. Referring to fig. 1, compared with a common dielectric substrate (such as a glass substrate), the high-k substrate has more bound cross-sectional electric field in the region near the electrode, the dielectric bound electric field has stronger capacity, more energy is bound, and electromagnetic leakage is lower. In contrast, the cross-sectional electric field of the low-k substrate in the region near the electrodes is more divergent, so that the electromagnetic field of the electrodes can be radiated as far as possible.

For the antenna, it is required that the dielectric confinement electric field capability is weak for the radiation electrode. The weaker the medium is in the capacity of restraining the electric field, the less energy is bound, the more energy is effectively radiated out, and the higher the radiation efficiency and the gain of the antenna are. For the feeding electrode, the dielectric confinement electric field capability is required to be strong. The stronger the dielectric constraint electric field capability is, the lower the electromagnetic leakage is, and the more beneficial the width reduction of the feed electrode is, the influence of the radiation of the feed electrode on the overall radiation of the antenna is reduced, and the loss is reduced.

However, in the conventional antenna, the radiation electrode and the feed electrode are usually disposed on the same dielectric substrate, and thus, different requirements of the radiation electrode and the feed electrode on the dielectric constant of the dielectric substrate cannot be met, and the conventional antenna has the problems of large loss and low radiation rate.

In view of this, the present invention provides an antenna. Fig. 2 is a schematic structural diagram of an antenna provided in an embodiment of the present invention, and referring to fig. 2, the antenna includes: a first substrate 110, a radiation pattern layer 120 and a feeding pattern layer 130 are disposed on one side of the first substrate 110.

Wherein the first substrate 110 includes a radiation region 10 and a feeding region 20; the radiation pattern layer 120 and the feeding pattern layer 130 are both disposed on the first substrate 110; and the radiation pattern layer 120 is disposed on the radiation region 10 of the first substrate 110, and the feeding pattern layer 130 is disposed on the feeding region 20 of the first substrate 110. Wherein, the perpendicular projection of the radiation pattern layer 120 on the first substrate 110 overlaps with the radiation region 10; the perpendicular projection of the feeding pattern layer 130 on the first substrate 110 overlaps the feeding region 20. The dielectric constant of the radiation area 10 of the first substrate 110 is smaller than that of the feeding area 20 of the first substrate 110. With such an arrangement, for the radiation electrode, the smaller dielectric constant on the first substrate 110 is beneficial to reducing the weaker electric field restraining capability of the radiation electrode, so that the energy is reduced to be bound, the energy effectively radiated out is increased, and the radiation efficiency and the gain of the antenna are improved; for the feeding electrode, the larger dielectric constant on the first substrate 110 is beneficial to enhancing the electric field restraining capability thereof, so as to reduce electromagnetic leakage, reduce the width of the feeding pattern layer 130, reduce the influence of radiation of the feeding pattern layer 130 on the overall radiation of the antenna, and reduce loss. Therefore, the embodiment of the present invention can consider different requirements of the radiation pattern layer 120 and the feed pattern layer 130 for the dielectric material of the first substrate 110, and reduce the loss of the antenna on the basis of improving the radiation rate of the antenna.

With continued reference to fig. 2, in one embodiment, the first substrate 110 optionally includes: a first substrate layer 100, a first dielectric material layer 510, and a second dielectric material layer 520. The first dielectric material layer 510 and the second dielectric material layer 520 are embedded in the first substrate layer 100, the first dielectric material layer 510 corresponds to the radiation region 10 of the first substrate 110, and the second dielectric material layer 520 corresponds to the feed region 20 of the first substrate 110. In this way, it is achieved that the radiating region 10 and the feeding region 20 have different dielectric constants.

There are various positions and manners for disposing the first dielectric material layer 510 and the second dielectric material layer 520, and some of them will be described below, but not limited to the invention.

With continued reference to fig. 2, in one embodiment, the first substrate layer 100 optionally includes a first slot and a second slot. The first slot is disposed in the radiation region 10 of the first substrate 110, and the second slot is disposed in the feeding region 20 of the first substrate 110; the first dielectric material layer 510 is embedded in the first trench, and the second dielectric material layer 520 is embedded in the second trench. In the embodiment of the invention, the first dielectric material layer 510 and the second dielectric material layer 520 are favorably selected by arranging the slot in the first base material layer. Alternatively, the first dielectric material layer 510 and the second dielectric material layer 520 may be selected from solid materials; alternatively, the first slot and the second slot are arranged to have better sealing performance, and the first dielectric material layer 510 and the second dielectric material layer 520 can also be made of gas, liquid or semisolid materials.

As illustrated in fig. 2, the first slots correspond to the radiation pattern layers 120 one by one, that is, the first dielectric material layer 510 corresponds to the radiation pattern layers 120 one by one. In other embodiments, the first slot may also be disposed as one slot, which overlaps with the projections of all the radiation pattern layers 120 on the first substrate 110, that is, one first dielectric material layer 510 corresponds to all the radiation pattern layers 120, so as to ensure that the first dielectric material layer 510 can reduce the ability of the first dielectric material layer to constrain the electric field of the radiation pattern layers 120, thereby reducing the constraint of energy, increasing the energy effectively radiated out, and improving the radiation efficiency and gain of the antenna.

Fig. 3 is a schematic structural diagram of another antenna provided in the embodiment of the present invention. Referring to fig. 3, in one embodiment, optionally, the first substrate layer 100 includes a first sub-substrate layer 111 and a second sub-substrate layer 112; the first groove is disposed on the surface of the first sub-substrate layer 111 close to the second sub-substrate layer 112; and the second grooves are disposed on the surface of the first sub-substrate layer 111 near the second sub-substrate layer 112. Here, the first and second

sub-substrate layers

111 and 112 may be the same material, for example, glass, ceramic, polyimide, liquid crystal polymer, or the like. In this way, in the manufacturing process of the first substrate layer 100, the first sub-substrate layer 111 may be grooved and filled with the first dielectric material layer 510 and the second dielectric material layer 520, and then the second sub-substrate layer 112 may be attached, so as to implement the embedded process of the first dielectric material layer 510 and the second dielectric material layer 520. As can be seen, providing the first substrate layer 100 including the first and second substrate layers 111 and 112 is advantageous to simplify the process.

Fig. 4 is a schematic structural diagram of another antenna according to an embodiment of the present invention. Referring to fig. 4, unlike in fig. 3, the first grooves are provided on the surface of the first sub-substrate layer 111 near the second sub-substrate layer 112; and the second grooves are disposed on the surface of the second sub-substrate layer 112 close to the first sub-substrate layer 111.

Fig. 5 is a schematic structural diagram of another antenna according to an embodiment of the present invention. Referring to fig. 5, unlike fig. 3 and 4, the first grooves are provided on the surface of the second sub-substrate layer 112 near the first sub-substrate layer 111; and the second grooves are disposed on the surface of the second sub-substrate layer 112 close to the first sub-substrate layer 111.

Fig. 6 is a schematic structural diagram of another antenna according to an embodiment of the present invention. Referring to fig. 6, unlike fig. 3 to 5, the first grooves are provided on the surface of the second sub-substrate layer 112 near the first sub-substrate layer 111; and the second grooves are disposed on the surface of the first sub-substrate layer 111 near the second sub-substrate layer 112.

Fig. 7 is a schematic structural diagram of another antenna according to an embodiment of the present invention. Referring to fig. 7, in one embodiment, the first substrate layer 100 optionally includes a first sub-substrate layer 111 and a second sub-substrate layer 112. The surface of the first sub-substrate layer 111 close to the second sub-substrate layer 112 is provided with first and second sub-grooves, and the surface of the second sub-substrate layer 112 close to the first sub-substrate layer 111 is provided with third and fourth sub-grooves. The first sub-slot and the third sub-slot are oppositely arranged to form a first slot, and the second sub-slot and the fourth sub-slot are oppositely arranged to form a second slot. The first dielectric material layer 510 is filled in the first trench, and the second dielectric material layer 520 is filled in the second trench. Compared with the scheme in which the radiation region 10 and the feed region 20 are both grooved only by a single-sided substrate layer in the foregoing embodiments, the present embodiment is configured such that the thicknesses of the first groove and the second groove can be increased, so that the first dielectric material layer 510 and the second dielectric material layer 520 are filled more thickly, and the effect of improving the dielectric constant distribution of the first substrate 110 is more obvious.

With continued reference to fig. 3 to 7, in addition to the above embodiments, the first substrate 110 may optionally further include an adhesive layer 610, the adhesive layer 610 being located between the first and second

sub-substrate layers

111 and 112 for fixing and sealing the first and second

sub-substrate layers

111 and 112.

The material of the adhesive layer 610 may be, for example, resin or polyvinyl alcohol. Alternatively, the adhesive layer 610 adheres only to the first and second

sub-substrate layers

111 and 112; or the adhesive layer 610 is also used to attach the first dielectric material layer 510 and the first sub-substrate layer 111, also used to attach the first dielectric material layer 510 and the second sub-substrate layer 112, also used to attach the second dielectric material layer 520 and the first sub-substrate layer 111, and also used to attach the second dielectric material layer 520 and the second sub-substrate layer 112.

Fig. 8 is a schematic structural diagram of another antenna according to an embodiment of the present invention. Referring to fig. 8, in one embodiment, optionally, both the first and second layers of

dielectric material

510 and 520 are secured between the first and second

sub-substrate layers

111 and 112. For example, when the first and second dielectric material layers 510 and 520 may be formed of a solid or semi-solid material, they are disposed between the first and second

sub-substrate layers

111 and 112 by coating or attaching. With this arrangement, it is not necessary to perform a grooving process for the first and second

sub-substrate layers

111 and 112, which is advantageous in simplifying the manufacturing process. Further, a certain gap is maintained between the first substrate layer 111 and the second substrate layer 112, and problems such as bulging due to direct bonding are avoided. At this time, the first and second dielectric material layers 510 and 520 also function to support the first and second

sub-substrate layers

111 and 112.

In one embodiment, the thickness of the first dielectric material layer 510 is optionally greater than the depth of the first trench, and the thickness of the second dielectric material layer 520 is optionally greater than the depth of the second trench. At this time, the first and second dielectric material layers 510 and 520 also function to support the first and second

sub-substrate layers

111 and 112.

Fig. 9 is a schematic structural diagram of another antenna according to an embodiment of the present invention. Referring to fig. 9, in addition to the above embodiments, optionally, the first substrate 110 further includes a support structure 710, and the support structure 710 is disposed between the first and second

sub-substrate layers

111 and 112 to support the first and second

sub-substrate layers

111 and 112, forming a space to accommodate the first and second dielectric material layers 510 and 520. Optionally, the supporting structure 710 is a supporting ball, a supporting column, or a frame sealing glue mixed supporting ball. The material, shape and position of the supporting structure 710 can be set according to actual requirements, and the setting mode is flexible and various. The arrangement of the embodiment of the present invention is equivalent to arranging a plurality of fixing points inside the first substrate 110, which is beneficial to keeping the interval between the first substrate layer 111 and the second substrate layer 112 constant, thereby enhancing the stability of the first substrate 110, being beneficial to preventing the first substrate 110 from collapsing and deforming during the use of the antenna to influence the antenna performance, and being beneficial to avoiding the adverse effect of the small protrusion defect of the first substrate layer 111 or the second substrate layer 112 on the antenna radiation performance.

With continued reference to fig. 3-9, in addition to the above embodiments, the cross-sectional shape of the first dielectric material layer 510 optionally includes: at least one of rectangular and trapezoidal; the cross-sectional shape of the second dielectric material layer 520 includes: at least one of rectangular and trapezoidal. The shapes of the two dielectric material layers can be the same or different, and the shapes and the sizes of the two dielectric material layers can be set according to actual requirements. Optionally, the side walls of the first slot and the second slot may be a plane or an arc, which is not limited in the embodiment of the present invention.

With continued reference to fig. 3-9, in addition to the above embodiments, optionally, the surface of the first sub-substrate layer 111 remote from the second sub-substrate layer 112 is provided with a radiation pattern layer 120 and a feed pattern layer 130; the surface of the second sub-substrate layer 112 remote from the first sub-substrate layer 111 is provided with a ground pattern layer 140. In the embodiment of the invention, the first sub-substrate layer 111 and the second sub-substrate layer 112 are respectively provided with the single-sided conductive pattern layer, so that the process of preparing electrodes on two sides of one substrate is avoided, and the preparation difficulty is reduced.

In the above embodiments, it is exemplarily shown that the thicknesses of the first dielectric material layer 510 and the second dielectric material layer 520 are the same, and in order to realize that the dielectric constant of the radiation region 10 of the first substrate 110 is smaller than that of the feed region 20, it is necessary to set the dielectric constant of the first dielectric material layer 510 to be smaller than that of the second dielectric material layer 520.

In one embodiment, the radiation region 10 of the first substrate 110 is optionally mixed with a first dielectric material, and the feeding region 20 of the first substrate 110 is optionally mixed with a second dielectric material. Wherein the dielectric constant of the first dielectric material is less than the dielectric constant of the second dielectric material. Illustratively, the first substrate 110 is fabricated by doping a first dielectric material into the radiation region 10 of the first substrate 110 through a diffusion process, and doping a second dielectric material into the feed region 20 of the first substrate 110 through the diffusion process, so that the dielectric constant of the radiation region 10 is smaller than that of the feed region 20.

Fig. 10 is a schematic structural diagram of another antenna according to an embodiment of the present invention. Referring to fig. 10, in one embodiment, first dielectric material layer 510 is optionally provided with a different thickness than second dielectric material layer 520. It is understood that the thickness of the material affects the dielectric constant, for example, the thickness of the second dielectric material layer 520 is greater than the thickness of the first dielectric material layer 510, so that the dielectric constant of the radiation region 10 of the first substrate 110 is less than the dielectric constant of the feed region 20.

The above embodiments exemplarily show the case where the first substrate 110 includes the first dielectric material layer 510 and the second dielectric material layer 520, but do not limit the present invention. In other embodiments, the first substrate 110 may include only one dielectric material layer in addition to the first substrate layer 100. Next, a case where the first substrate 110 includes only one dielectric material layer will be described.

Fig. 11 is a schematic structural diagram of another antenna according to an embodiment of the present invention. Referring to fig. 11, in one embodiment, the first substrate 110 optionally includes: a first substrate layer 100 and a first dielectric material layer 510; the first substrate layer 100 includes a first slot, the first slot is disposed in the radiation region 10 of the first substrate, and the first dielectric material layer 510 is embedded in the first slot; the dielectric constant of the first dielectric material layer 510 is smaller than that of the first substrate layer 100. Thus, the first dielectric material layer 510 is only added to the radiation region 10 of the first substrate 110, so that the preparation process can be simplified; and setting the dielectric constant of the first dielectric material layer 510 to be smaller than that of the first substrate layer 100 can ensure that the dielectric constant of the radiation region 10 is smaller than that of the feed region 20.

Optionally, the material of the first dielectric material layer 510 includes: at least one of air or vacuum. The first dielectric material layer 510 is disposed in a vacuum manner, which is beneficial to reducing the dielectric constant of the radiation region 10 and reducing the electromagnetic loss; the first dielectric material layer 510 is filled with air, and after the first substrate layer 100 is provided with the first slot, the operation of vacuumizing the first slot is not needed, which is beneficial to simplifying the process steps and the process difficulty.

Fig. 12 is a schematic structural diagram of another antenna according to an embodiment of the present invention. Referring to fig. 12, in one embodiment, the first substrate 110 optionally includes: a first substrate layer 100 and a second dielectric material layer 520; the first substrate 110 includes a second slot, the second slot is disposed in the feeding region 20 of the first substrate 110, and the second dielectric material layer 520 is embedded in the second slot; the dielectric constant of the second dielectric material layer 520 is greater than the dielectric constant of the first substrate layer 100. In this way, the second dielectric material layer 520 is only added in the feeding region 20, so that the preparation process can be simplified; and setting the dielectric constant of the second dielectric material layer 520 to be greater than that of the first substrate layer 100 can ensure that the dielectric constant of the radiation region 10 is less than that of the feed region 20. Optionally, the material of the second dielectric material layer 520 includes: at least one of ceramic and lead zirconate titanate to ensure a greater dielectric constant of the second dielectric material layer 520.

Fig. 13 is a schematic structural diagram of another antenna according to an embodiment of the present invention. Referring to fig. 13, on the basis of the above embodiments, optionally, the size of the first dielectric material layer 510 is larger than that of the radiation pattern layer 120; the size of the second dielectric material layer 520 is larger than that of the feeding pattern layer 130, so that the effect of the first dielectric material layer 510 and the second dielectric material layer 520 in improving the dielectric constant of the first substrate 110 is more obvious.

With continued reference to fig. 2-13, on the basis of the above embodiments, optionally, the requirements of the dielectric materials of the first substrate 110 for the radiation pattern layer 120 and the feeding pattern layer 130 can also be met by setting the loss tangent values of the dielectric materials of the radiation region 10 and the feeding region 20. Illustratively, the dielectric material of the radiation region 10 is set to be a material with a smaller loss tangent value, which is beneficial to further increase the gain of the antenna; the dielectric material of the feeding region 20 is set to be a material with a smaller loss tangent value, which is beneficial to further reducing the loss of the antenna.

With continued reference to fig. 2-13, based on the above embodiments, the antenna may optionally be a liquid crystal antenna. The antenna further includes: a liquid crystal layer 310 and a second substrate 210, the liquid crystal layer 310 being located between the first substrate 110 and the second substrate 210; the second substrate 210 includes a phase shift pattern layer 220. In the embodiment of the present invention, the materials of the second substrate 210 and the phase shift pattern layer 220 are not limited, and the structure capable of forming the liquid crystal antenna is within the protection scope of the present invention. Exemplarily, the second substrate 210 may be a glass substrate, a ceramic substrate, a polyimide substrate, a liquid crystal polymer substrate, or the like. The phase shift pattern layer 220 may be, for example, a metal layer, preferably a copper layer or a gold layer.

In order to facilitate understanding of the present invention, a specific structure of the liquid crystal antenna and its operation principle will be described below.

With continued reference to fig. 2-13, illustratively, the ground pattern layer 140 is disposed below the first substrate 110, the conductive pattern layer on the second substrate 210 is the phase shift pattern layer 220, the phase shift pattern layer 220 and the ground pattern layer 140 together form a cell inner electrode of a liquid crystal cell, and an electric field is generated between the phase shift pattern layer 220 and the ground pattern layer 140 to drive the liquid crystal molecules to deflect. The phase shift pattern layer 220 may also be referred to as a transmission electrode, and the phase shift pattern layer 220 is used for driving liquid crystal molecules to deflect and coupling electromagnetic waves and transmit the electromagnetic waves. Further, the ground pattern layer 140 includes openings 141, and the vertical projections of the openings 141 on the second substrate 210 overlap the phase shift pattern layer 220. Alternatively, the phase shift pattern layers 220 correspond to the openings 141 one to one. The conductive pattern layer over the first substrate 110 includes a feeding pattern layer 130 and a radiation pattern layer 120. Wherein the feeding pattern layer 130 is electrically connected to the antenna connector. The radiation pattern layer 120 is used to radiate or receive an antenna signal, and a perpendicular projection of the radiation pattern layer 120 on the first substrate 110 overlaps the opening 141.

With continued reference to fig. 2-13, based on the above embodiments, the liquid crystal antenna optionally further includes a first support 410. The first supporting member 410 may be, for example, a frame sealing adhesive. Supporting the first and

second substrates

110 and 210 by the first support 410 while the first and

second substrates

110 and 210 form a liquid crystal cell; and, the first support 410 is disposed around the liquid crystal layer 310, and also serves to seal the liquid crystal cell, preventing the liquid crystal layer 310 from overflowing.

Optionally, the liquid crystal antenna further includes a second supporting member (not shown in the figure) disposed inside the liquid crystal cell for supporting the first substrate 110 and the second substrate 210. Wherein the second support may be, for example, a support ball or a support column (PS column), etc.

With continued reference to fig. 2 to 13, on the basis of the above embodiments, optionally, a first conductive layer 230 may be further disposed on a portion of the second substrate 210 located outside the liquid crystal cell, as a pad bonded to a Flexible printed circuit Board (FPC), and the material of the pad may be, for example, molybdenum.

On the basis of the above embodiments, a first protective layer having insulating and oxidation-preventing functions may be optionally disposed on the side of the phase shift pattern layer 220 away from the second substrate 210 to protect the phase shift pattern layer 220. A second protective layer having insulating and oxidation preventing functions may be disposed on a side of the ground pattern layer 140 away from the first substrate 110 to protect the ground pattern layer 140. A third protective layer having insulation and oxidation resistance functions may be disposed on the side of the feeding pattern layer 130 and the radiation pattern layer 120 away from the first substrate 110 to protect the feeding pattern layer 130 and the radiation pattern layer 120.

On the basis of the above embodiments, an antenna tab and a pad are optionally disposed at one end of the feeding pattern layer 130 away from the radiation pattern layer 120. Wherein, one end of the antenna connector is connected with the feeding pattern layer 130 and fixed by a bonding pad; the other end of the antenna connector is used for connecting external circuits such as a high-frequency connector.

Illustratively, the liquid crystal antenna operates on the principle that, in the process of transmitting an antenna signal (e.g., an electromagnetic wave), the antenna signal is coupled to the feeding pattern layer 130 through the antenna connector, the feeding pattern layer 130 couples the electromagnetic wave to the phase shift pattern layer 220, the phase of the electromagnetic wave is changed through the change of the dielectric constant of the liquid crystal layer 310, the electromagnetic wave with the changed phase is coupled to the radiation pattern layer 120 through the opening 141, and the radiation pattern layer 120 radiates the electromagnetic wave outwards, thereby completing the transmission process of the antenna signal. The procedure for receiving antenna signals is the reverse of the procedure for transmitting antenna signals, and is not described here in detail.

It should be noted that fig. 2-13 exemplarily show that the phase shift pattern layer 220 and the ground pattern layer 140 are respectively disposed on the second substrate 210 and the first substrate 110 to generate a longitudinal electric field for driving the liquid crystal molecules to deflect, which is not a limitation of the present invention. In other embodiments, the phase shift pattern layer 220 and the ground pattern layer 140 can be disposed on the first substrate 110 (or the second substrate 210) to generate a lateral electric field for driving the liquid crystal molecules to deflect, which can be set as required in practical applications.

Fig. 14 is a schematic structural diagram of another antenna according to an embodiment of the present invention. Referring to fig. 14, based on the above embodiments, optionally, the second substrate 210 includes a second substrate layer 200 and a third dielectric material layer 530, and the third dielectric material layer 530 is embedded in the second substrate layer 200; and the perpendicular projection of the third dielectric material layer 530 on the second substrate 210 overlaps with the perpendicular projection of the phase shift pattern layer 220 on the second substrate. The dielectric constant of the third dielectric material layer 530 is greater than that of the second substrate layer 200, so as to confine the electric field of the phase shift pattern layer 220 in the second substrate 210 as much as possible, and enhance the ability of the second substrate 210 to confine the electric field, thereby reducing electromagnetic leakage, reducing the width of the phase shift pattern layer 220, and reducing the electromagnetic coupling loss between the phase shift pattern layers 220.

In the above embodiments, the phase shift pattern layer 220 is a conductive pattern layer, and the material thereof is not limited in the embodiments of the present invention. Illustratively, the phase shift pattern layer 220 may be a metal layer, preferably a copper layer or a gold layer. Alternatively, the number of the phase shift pattern layers 220 may be one, two or more, and two phase shift pattern layers 220 are included on the second substrate 210 as exemplarily shown in fig. 14, but not limited to the invention.

In addition to the above embodiments, there are various ways to dispose the third dielectric material layer 530, and several of them will be described below.

With continued reference to fig. 14, in one embodiment, the second substrate layer 200 optionally includes a third slot. The third dielectric material layer 530 is embedded in the third trench. In the embodiment of the present invention, the second substrate layer 200 is provided with the slots therein, which is beneficial to the selection of the third dielectric material layer 530. Alternatively, the third dielectric material layer 530 may be selected to be a solid material; alternatively, the third slot may be provided with a better sealing performance, and the third dielectric material layer 530 may also be selected from a gas, a liquid or a semi-solid material.

In the example of fig. 14, the third slots correspond one-to-one to the phase shift pattern layers 220; i.e., the third dielectric material 530 corresponds to the phase shift pattern layers 220 one to one. In other embodiments, the third opening may also be disposed in one, and the vertical projection of the third opening on the second substrate 210 overlaps with the vertical projections of all the phase shift pattern layers 220 on the second substrate 210, that is, one third dielectric material layer 530 corresponds to all the phase shift pattern layers 220, so as to ensure that the third dielectric material layer 530 can enhance the ability of the third dielectric material layer 530 to constrain the electric field of the phase shift pattern layer 120, thereby reducing electromagnetic leakage and loss.

Fig. 15 is a schematic structural diagram of another antenna according to an embodiment of the present invention. Referring to fig. 15, in one embodiment, the second substrate layer 200 optionally includes a third substrate layer 211 and a fourth substrate layer 212. A surface of the third sub-substrate layer 211 adjacent to the fourth sub-substrate layer 212 is provided with a fifth sub-groove, and a surface of the fourth sub-substrate layer 212 adjacent to the third sub-substrate layer 211 is provided with a sixth sub-groove. The fifth sub-slot and the sixth sub-slot are oppositely arranged to form a third slot. The third dielectric material layer 530 is filled in the third trench. Illustratively, the larger the slot, the more dielectric is filled and the more significant the advantage of the change in the dielectric constant of the antenna.

In other embodiments, only one of the third and fourth sub-substrate layers 211 and 212 may be optionally opened with a third slot for filling the third dielectric material layer 530. Among them, the third and fourth sub-substrate layers 211 and 212 may be the same material, for example, glass, ceramic, polyimide, liquid crystal polymer, or the like. In this way, in the process of manufacturing the second substrate layer 200, the third substrate layer 211 or the fourth substrate layer 212 may be subjected to the grooving process and filled with the third dielectric material layer 530, and then the fourth substrate layer 212 or the third substrate layer 211 may be attached, thereby implementing the embedding process of the third dielectric material layer 530. Therefore, only the unilateral base material layer is subjected to slotting treatment, and the process is simplified.

With continued reference to fig. 15, in addition to the above embodiments, the second substrate 210 may optionally further include a second adhesive layer 620, between the third and fourth sub-substrate layers 211 and 212, for fixing and sealing the third and fourth sub-substrate layers 211 and 212.

The material of the second adhesive layer 620 may be, for example, resin, polyvinyl alcohol, or the like. Alternatively, the second adhesive layer 620 is attached only to the third and fourth sub-substrate layers 211 and 212; or the second adhesive layer 620 is also used to attach the third dielectric material layer 530 and the third sub-substrate layer 211, and also to attach the third dielectric material layer 530 and the fourth sub-substrate layer 212.

In one embodiment, optionally, a third layer of dielectric material 530 is secured between the third and fourth sub-substrate layers 211 and 212. With this arrangement, it is not necessary to perform a grooving process on the third base material layer 211 and the third base material layer 212, which is advantageous for simplifying the manufacturing process. Further, a certain gap is maintained between the third substrate layer 211 and the fourth substrate layer 212, and problems such as swelling due to direct bonding are avoided. At this time, the third dielectric material layer 530 also functions to support the third and fourth sub-substrate layers 211 and 212.

On the basis of the above embodiments, the second substrate 210 may further include a support structure disposed between the third and fourth sub-substrate layers 211 and 212 to support the third and fourth sub-substrate layers 211 and 212, forming a space to accommodate the third dielectric material layer 530. In this way, it is advantageous to keep the interval between the third and fourth sub-substrate layers 211 and 212 constant, corresponding to the plurality of fixing points provided inside the second substrate 210, thereby enhancing the stability of the second substrate 210.

To sum up, in the first aspect, the embodiment of the present invention provides that the first substrate 110 includes the radiation region 10 and the feeding region 20, the radiation pattern layer 120 is disposed on the radiation region 10 of the first substrate 110, the feeding pattern layer 10 is disposed on the feeding region 20 of the first substrate 110, and the dielectric constant of the radiation region 10 is set to be smaller than that of the feeding region 20. With such an arrangement, for the radiation electrode, the smaller dielectric constant on the first substrate 110 is beneficial to reducing the weaker electric field restraining capability of the radiation electrode, so that the energy is reduced to be bound, the energy effectively radiated out is increased, and the radiation efficiency and the gain of the antenna are improved; for the feeding electrode, the larger dielectric constant on the first substrate 110 is beneficial to enhancing the electric field restraining capability thereof, so as to reduce electromagnetic leakage, reduce the width of the feeding pattern layer 130, reduce the influence of radiation of the feeding pattern layer 130 on the overall radiation of the antenna, and reduce loss. Therefore, the embodiments of the present invention can give consideration to different requirements of the radiation pattern layer 120 and the feed pattern layer 130 for the dielectric material of the first substrate 110, and reduce the loss of the antenna on the basis of improving the radiation rate of the antenna.

In a second aspect, the second substrate 210 includes a second substrate layer 200 and a third dielectric material layer 530, where the third dielectric material layer 530 is embedded in the second substrate layer 200; and a perpendicular projection of the third dielectric material layer 530 on the second substrate 210 overlaps with a perpendicular projection of the phase shift pattern layer 220 on the second substrate. The dielectric constant of the third dielectric material layer 530 is greater than that of the second substrate layer 200, so as to confine the electric field of the phase shift pattern layer 220 in the second substrate 210 as much as possible, and enhance the ability of the second substrate 210 to confine the electric field, thereby reducing electromagnetic leakage, reducing the width of the phase shift pattern layer 220, and reducing the electromagnetic coupling loss between the phase shift pattern layers 220.

Therefore, compared with the prior art, the embodiment of the invention can reduce the loss of the antenna on the basis of improving the radiation rate of the antenna.

The embodiment of the invention also provides a manufacturing method of the antenna, which can be used for preparing the antenna provided by any embodiment of the invention. According to the antenna prepared by the manufacturing method provided by the embodiment of the invention, the first substrate comprises the radiation area and the feed area, and then the radiation pattern layer and the feed pattern layer are formed on the first substrate; the radiation pattern layer is arranged in the radiation area of the first substrate, the feed pattern layer is arranged in the feed area of the first substrate, and the dielectric constant of the radiation area is smaller than that of the feed area, so that the dielectric constant of the feed area is larger, the width of the feed pattern layer is favorably reduced, the influence of the radiation of the feed pattern layer on the overall radiation of the antenna is reduced, and the loss is reduced; the dielectric constant of the radiation area is small, the capacity of restraining an electric field by the medium of the radiation area is reduced, constraint on energy is reduced, and the energy effectively radiated by the radiation pattern layer is increased, so that the radiation efficiency of the antenna is improved. In summary, the embodiments of the present invention can meet different requirements of the radiation pattern layer and the feed pattern layer for the dielectric material of the first substrate, and are beneficial to reducing the loss of the antenna on the basis of improving the radiation rate of the antenna.

Fig. 16 is a schematic flowchart of a method for manufacturing an antenna according to an embodiment of the present invention, and fig. 17 is a schematic structural diagram of the method for manufacturing an antenna according to the embodiment of the present invention in each step. Referring to fig. 16 and 17, the method for manufacturing the antenna includes the following steps:

s110, providing a first substrate 110; the first substrate 110 includes a radiation region 10 and a feeding region 20; the dielectric constant of the radiation area 10 of the first substrate 110 is smaller than that of the feeding area 20 of the first substrate 110.

S120, forming a radiation pattern layer 120 and a feeding pattern layer 130 on the first substrate 110; the radiation pattern layer 120 is disposed on the radiation region 10 of the first substrate 110, and the feeding pattern layer 130 is disposed on the feeding region 20 of the first substrate 110.

The first substrate 110 has a double-layer conductive pattern thereon. The material of the conductive pattern layer may be, for example, copper or gold. Illustratively, the radiation pattern layer 120 and the feed pattern layer 130 are formed above the first substrate 110, and the ground pattern layer 140 is formed below the first substrate 110. Optionally, a second protection layer is further formed on a side of the ground pattern layer 140 away from the first substrate 110; a third protective layer is further formed on the radiation pattern layer 120 and the feeding pattern layer 130 away from the first substrate 110; the material of both the second protective layer and the third protective layer may be silicon nitride.

S130, providing a second substrate 210, forming the first substrate 110 and the second substrate 210 into a cell, and forming a liquid crystal layer 310 between the first substrate 110 and the second substrate 210.

The second substrate 210 has a single-sided conductive pattern layer thereon. Illustratively, a phase shift pattern layer 220 is formed on a side of the second substrate 210 adjacent to the first substrate 110. Optionally, a first protection layer is further formed on a side of the phase shift pattern layer 220 away from the second substrate 210.

The first substrate 110 and the second substrate 210 are aligned to form a liquid crystal cell, and the liquid crystal cell is filled with a liquid crystal layer 310. Specifically, in the process of forming the liquid crystal cell by the first and

second substrates

110 and 210, the first support 410 is provided to support the first and

second substrates

110 and 210 and seal the liquid crystal layer 310 within the box-shaped structure, preventing the liquid crystal layer 310 from overflowing.

Optionally, after the first substrate 110 and the second substrate 210 are formed into a cell to form a liquid crystal cell, the method for manufacturing the antenna further includes: an antenna terminal and a pad are disposed at an end of the feeding pattern layer 130 away from the radiation pattern layer 120. Wherein, one end of the antenna connector is connected with the feeding pattern layer 130 and fixed by a bonding pad; the other end of the antenna connector is used for connecting external circuits such as a high-frequency connector.

The embodiment of the invention completes the manufacture of the antenna through S110-S130.

In addition to the above embodiments, there are optionally a plurality of manufacturing methods of the first substrate 110, and the following will explain some steps of the manufacturing methods.

Fig. 18 is a schematic structural diagram of a method for manufacturing a first substrate in each step according to an embodiment of the present invention. Referring to fig. 18, in an embodiment, a method for manufacturing the first substrate 110 and the film layers thereon optionally includes the following steps:

s111, forming a first slot 11 and a second slot 21 in the first base material layer 100 of the first substrate 110, where the first slot 11 is disposed in the radiation region 10 of the first substrate 110, and the second slot 20 is disposed in the feed region 20 of the first substrate 110.

Wherein, the length, width, thickness and shape of the first slot 11 and the second slot 21 can be different. The cross-sectional shape of the slot may be, but is not limited to, rectangular or trapezoidal. Alternatively, the side walls of the first slot 11 and the second slot 21 may be flat surfaces or cambered surfaces. The slotting method for the first substrate 110 may be selected according to the actual field device, which is not limited in the embodiment of the present invention.

S112, the first dielectric material layer 510 is filled into the first trench 11, and the second dielectric material layer 520 is filled into the second trench 21.

The dielectric constant of the first dielectric material layer 510 is smaller than that of the second dielectric material layer 520. Illustratively, the material of the first dielectric material layer 510 includes: at least one of air or vacuum; the material of the second dielectric material layer 520 includes: at least one of a ceramic and lead zirconate titanate.

In the embodiment of the present invention, the first substrate 110 of the antenna is manufactured through S111-S112, wherein the first substrate 110 includes the complete first substrate layer 100, and the first dielectric material layer 510 and the second dielectric material layer 520 are added in a slot filling manner, so that the manufacturing process is simple and easy to implement.

The above embodiments exemplarily show the scheme of slotting and filling the dielectric material layer in the complete first substrate layer, but the invention is not limited thereto. In another embodiment, the first base material layer may be formed of a plurality of base material layers. The following describes a process for producing a first substrate in which a first base material layer is composed of two base material layers.

Fig. 19 is a schematic structural diagram of another method for manufacturing a first substrate according to an embodiment of the invention in each step. Referring to fig. 19, in an embodiment, a method for manufacturing the first substrate 110 and the film layers thereon optionally includes the following steps:

s210, the first sub-substrate layer 111 is provided.

S220, forming a first dielectric material layer 510 and a second dielectric material layer 520 on the first sub-substrate layer 111; the first dielectric material layer 510 is disposed on the radiation region 10 of the first substrate, and the second dielectric material layer 520 is disposed on the feeding region 20 of the first substrate.

S230, forming a second sub-substrate layer 112 on the first dielectric material layer 510 and the second dielectric material layer 520, and fixing both the first dielectric material layer 510 and the second dielectric material layer 520 between the first sub-substrate layer 111 and the second sub-substrate layer 112.

Alternatively, before the second substrate layer 112 is formed, a support structure may be formed on the first substrate layer, which is equivalent to a plurality of fixing points arranged inside the first substrate 110, and is beneficial to keep the interval between the first substrate layer 111 and the second substrate layer 112 constant, so that the stability of the first substrate 110 is enhanced, the first substrate 110 is beneficial to prevent the first substrate 110 from collapsing and deforming during the use of the antenna, and the influence on the antenna performance is beneficial to avoid the adverse effect on the antenna radiation performance caused by the small protrusion defect of the first substrate layer 111 or the second substrate layer 112. Optionally, the support structure is a support ball, a support column, or a frame sealing glue mixed support ball. The material, shape and position of the support structure can be set according to actual requirements.

S240, forming a radiation pattern layer 120 and a feeding pattern layer 130 on the second surface of the first sub-substrate layer 111; and the ground pattern layer 140 is formed on the second surface of the second sub-substrate layer 112.

The manufacturing process of the ground pattern layer 140 may be a deposition process and an etching process, and the specific steps include: first, a first electrode material layer is deposited on a second surface of the second sub-substrate layer 112, a deposition process such as a chemical vapor deposition process or a physical vapor deposition process; then, the first electrode material layer is patterned by an etching process, such as photolithography or chemical etching, to form the ground pattern layer 140.

Similarly, the second surface of the first sub-substrate layer 111 forms the radiation pattern layer 120 and the feed pattern layer 130. The materials and fabrication processes of the first sub-substrate layer 111 and the film layers thereon are similar to those of the second sub-substrate layer 112 and the film layer structures thereon, and are not described again.

It should be noted that the sequence of S210-S240 is merely an exemplary sequence, and is not meant to limit the present invention, and in practical applications, the sequence of the steps may be adjusted according to requirements, for example, the step of forming the radiation pattern layer 120 and the feeding pattern layer 130 in S240 may be placed before S220.

In the embodiment of the present invention, the first substrate 110 of the antenna is manufactured through S210 to S240, and the step of forming the groove on the first surfaces of the first and

second substrates

111 and 112 is avoided, thereby simplifying the manufacturing process.

Fig. 20 is a schematic structural diagram of a method for manufacturing a first substrate according to another embodiment of the present invention in each step. Referring to fig. 20, in an embodiment, a method for manufacturing the first substrate 110 and the film layers thereon optionally includes the following steps:

s310, providing the first sub-substrate layer 111, and forming a first sub-groove 1111 and a second sub-groove 2111 on the first surface of the first sub-substrate layer 111; a second sub-substrate layer 112 is provided, and a third sub-slot 1112 and a fourth sub-slot 2112 are formed in the first surface of the second sub-substrate layer 112.

In this step, grooves may be formed only in the first surface of the first substrate layer 111, and after the second substrate layer 112 is provided, the grooves formed in the first substrate layer 111 may be covered directly with the second substrate layer 112; alternatively, the grooves are formed only in the first surface of the second sub-substrate layer 112; alternatively, grooves are formed in the first surfaces of the first and

second substrates

111 and 112, respectively.

S320, the first surface of the second sub-substrate layer 112 is attached to the first surface of the first sub-substrate layer 111, so that the first sub-slot 1111 and the third sub-slot 1112 form the first slot 11, and the second sub-slot 2111 and the fourth sub-slot 2112 form the second slot 21.

Alternatively, the first and second

sub-substrate layers

111 and 112 may be fixed using an adhesive layer 610.

S330, a first dielectric material layer 510 is formed in the first trench 11, and a second dielectric material layer 520 is formed in the second trench 21.

The dielectric constant of the first dielectric material layer 510 is smaller than that of the second dielectric material layer 520.

S340, forming a radiation pattern layer 120 and a feeding pattern layer 130 on the second surface of the first sub-substrate layer 111; and the ground pattern layer 140 is formed on the second surface of the second sub-substrate layer 112.

In the embodiment of the present invention, the first substrate 110 of the antenna is manufactured through S310-S340, and the first substrate layer 111 and the second substrate layer 112 are grooved on the first surfaces, so that the thicknesses of the first dielectric material layer 510 and the second dielectric material layer 520 are increased on the basis of not increasing the overall thickness of the first substrate 110, the effect caused by the change of the dielectric constants of different regions in the first substrate 110 is improved, and the loss of the antenna is reduced on the basis of improving the radiation rate of the antenna.

It is to be noted that the foregoing is only illustrative of the preferred embodiments of the present invention and the technical principles employed. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail by the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the spirit of the present invention, and the scope of the present invention is determined by the scope of the appended claims.

Claims

1. An antenna, comprising:

a first substrate including a radiation region and a feed region;

2. The antenna of claim 1, wherein the first substrate comprises: the first substrate layer, the first dielectric material layer and the second dielectric material layer;

the first dielectric material layer and the second dielectric material layer are embedded in the first base material layer, the first dielectric material layer corresponds to the radiation area of the first substrate, and the second dielectric material layer corresponds to the feed area of the first substrate.

3. The antenna of claim 2, wherein the first substrate layer includes a first slot and a second slot;

the first slot is arranged in the radiation area of the first substrate, and the second slot is arranged in the feed area of the first substrate;

the first dielectric material layer is embedded in the first open groove, and the second dielectric material layer is embedded in the second open groove.

4. The antenna of claim 3, wherein the first substrate layer comprises a first sub-substrate layer and a second sub-substrate layer;

the first groove is arranged on the surface of the first sub-substrate layer close to the second sub-substrate layer; or the first groove is arranged on the surface of the second sub-substrate layer close to the first sub-substrate layer;

the second groove is arranged on the surface, close to the second sub-substrate layer, of the first sub-substrate layer; alternatively, the second groove is provided on a surface of the second sub-substrate layer close to the first sub-substrate layer.

5. The antenna of claim 3, wherein the first substrate layer comprises a first sub-substrate layer and a second sub-substrate layer;

the surface of the first sub-substrate layer, which is close to the second sub-substrate layer, is provided with a first sub-slot and a second sub-slot, and the surface of the second sub-substrate layer, which is close to the first sub-substrate layer, is provided with a third sub-slot and a fourth sub-slot;

the first sub slot and the third sub slot are oppositely arranged to form the first slot, and the second sub slot and the fourth sub slot are oppositely arranged to form the second slot.

6. The antenna of claim 4 or 5, wherein the first substrate further comprises: an adhesive layer between the first and second sub-substrate layers, the adhesive layer for securing the first and second sub-substrate layers.

7. The antenna of claim 2, wherein the first substrate layer comprises a first sub-substrate layer and a second sub-substrate layer;

the first and second layers of dielectric material are both secured between the first and second sub-substrate layers.

8. The antenna of claim 7, wherein the first substrate further comprises: a support structure disposed between the first and second sub-substrate layers to support the first and second sub-substrate layers forming a space to accommodate the first and second layers of dielectric material.

9. An antenna according to any of claims 4-5, 7-8, characterized in that the surface of the first sub-substrate layer remote from the second sub-substrate layer is provided with the radiation pattern layer and the feed pattern layer;

a ground pattern layer is provided on a surface of the second sub-substrate layer remote from the first sub-substrate layer.

10. The antenna of any of claims 2-5, 7-8, wherein the cross-sectional shape of the first layer of dielectric material comprises: at least one of rectangular and trapezoidal;

the cross-sectional shape of the second dielectric material layer includes: at least one of rectangular and trapezoidal.

11. The antenna of claim 10, wherein the antenna is a liquid crystal antenna, the antenna further comprising:

the liquid crystal layer is positioned between the first substrate and the second substrate; the second substrate includes a phase shift pattern layer.

12. The antenna of claim 11, wherein the second substrate comprises a second substrate layer and a third dielectric material layer embedded within the second substrate layer; and a perpendicular projection of the third dielectric material layer on the second substrate overlaps a perpendicular projection of the phase shift pattern layer on the second substrate;

the dielectric constant of the third dielectric material layer is larger than that of the second substrate layer.

13. The antenna of claim 12, wherein the second substrate layer includes a third slot, and wherein the third dielectric material layer is embedded in the third slot.

14. The antenna of any of claims 2-5, 7-8, wherein the first layer of dielectric material has dimensions larger than dimensions of the radiation pattern layer; the size of the second dielectric material layer is larger than that of the feeding pattern layer.

15. The antenna of any of claims 2-5, 7-8, wherein the first layer of dielectric material and the second layer of dielectric material are different materials;

and/or the first dielectric material layer and the second dielectric material layer have different thicknesses.

16. The antenna of claim 1, wherein the first substrate comprises: a first substrate layer and a first dielectric material layer; the first substrate layer comprises a first slot, the first slot is arranged in the radiation area of the first substrate, and the first dielectric material layer is embedded in the first slot; the dielectric constant of the first dielectric material layer is smaller than that of the first base material layer.

17. The antenna of any of claims 2-5, 7-8, 16, wherein the material of the first layer of dielectric material comprises: at least one of air or vacuum.

18. The antenna of claim 1, wherein the first substrate comprises: a first substrate layer and a second dielectric material layer; the first substrate comprises a second slot, the second slot is arranged in the feed area of the first substrate, and the second dielectric material layer is embedded in the second slot; the dielectric constant of the second dielectric material layer is larger than that of the first substrate layer.

19. The antenna of any of claims 2-5, 7-8, 18, wherein the material of the second layer of dielectric material comprises: at least one of a ceramic and lead zirconate titanate.

20. A method for manufacturing an antenna, comprising:

21. The method of claim 20, wherein the method of manufacturing the first substrate comprises:

forming a first slot and a second slot in a first base material layer of the first substrate, wherein the first slot is arranged in a radiation area of the first substrate, and the second slot is arranged in a feed area of the first substrate;

a first dielectric material layer is filled into the first open groove, and a second dielectric material layer is filled into the second open groove.

22. The method of claim 21, wherein forming a first slot and a second slot in a first substrate layer of the first substrate comprises:

providing a first sub-substrate layer, and forming the first and second trenches on a surface of the first sub-substrate layer;

providing a second submount layer and covering the first and second slots with the second submount layer.