CN114614245B - Antenna and manufacturing method thereof - Google Patents
Antenna and manufacturing method thereof Download PDFInfo
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- CN114614245B CN114614245B CN202011412861.2A CN202011412861A CN114614245B CN 114614245 B CN114614245 B CN 114614245B CN 202011412861 A CN202011412861 A CN 202011412861A CN 114614245 B CN114614245 B CN 114614245B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/002—Protection against seismic waves, thermal radiation or other disturbances, e.g. nuclear explosion; Arrangements for improving the power handling capability of an antenna
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/50—Structural association of antennas with earthing switches, lead-in devices or lightning protectors
Abstract
The embodiment of the invention discloses an antenna and a manufacturing method thereof. The antenna comprises a first substrate, a radiation pattern layer and a feed pattern layer; the first substrate comprises a radiation area and a feed area; the radiation pattern layer and the feed pattern layer are arranged on the first substrate; the radiation pattern layer is arranged in a radiation area of the first substrate, and the feed pattern layer is arranged in a feed area of the first substrate; wherein the dielectric constant of the radiation area of the first substrate is smaller than the dielectric constant of the feed area of the first substrate. Compared with the prior art, the embodiment of the invention can give consideration to different requirements of the radiation pattern layer and the feed pattern layer on the dielectric material of the first substrate, and is beneficial to reducing the loss of the antenna on the basis of improving the radiation rate of the antenna.
Description
Technical Field
The embodiment of the invention relates to the technical field of antennas, in particular to an antenna and a manufacturing method thereof.
Background
With the development of internet technology, the role of an antenna as a sensing organ of a mobile communication network in the network is more and more complex, the application is more and more extensive, and the role is more and more important.
The antenna acts as a transducer which converts guided waves propagating on the transmission line into electromagnetic waves propagating in an unbounded medium (usually free space) or vice versa. However, the performance of the conventional antenna needs to be further improved, and there are problems of large loss and low emissivity.
Disclosure of Invention
The embodiment of the invention provides an antenna and a manufacturing method thereof, which are used for reducing the loss of the antenna and improving the emissivity of the antenna.
In a first aspect, an embodiment of the present invention provides an antenna, including: a first substrate including a radiation region and a feed region;
the radiation pattern layer and the feed pattern layer are arranged on the first substrate; the radiation pattern layer is arranged in a radiation area of the first substrate, and the feed pattern layer is arranged in a feed area of the first substrate;
wherein the dielectric constant of the radiation area of the first substrate is smaller than the dielectric constant of the feed area of the first substrate.
In a second aspect, an embodiment of the present invention further provides a method for manufacturing an antenna, including:
providing a first substrate; the first substrate comprises a radiation area and a feed area; the dielectric constant of the radiation area of the first substrate is smaller than that of the feed area of the first substrate;
Forming a radiation pattern layer and a feeding pattern layer on the first substrate; the radiation pattern layer is arranged in the radiation area of the first substrate, and the feed pattern layer is arranged in the feed area of the first substrate.
The first substrate comprises a radiation area and a feed area, the radiation pattern layer is arranged on the radiation area of the first substrate, the feed pattern layer is arranged on the feed area of the first substrate, and the dielectric constant of the radiation area is smaller than that of the feed area. Therefore, the dielectric constant of the feed area is larger, the width of the feed pattern layer is reduced, the influence of the radiation of the feed pattern layer on the overall radiation of the antenna is reduced, and the loss is reduced; and the dielectric constant of the radiation area is smaller, which is favorable for reducing the capacity of the dielectric of the radiation area to restrict the electric field, reducing the constraint on energy and increasing the energy effectively radiated by the radiation pattern layer, thereby improving the radiation efficiency of the antenna. In summary, the embodiment of the invention can give consideration to different requirements of the radiation pattern layer and the feed pattern layer on the dielectric material of the first substrate, and is beneficial to reducing the loss of the antenna on the basis of improving the radiation rate of the antenna.
Drawings
FIG. 1 is a schematic diagram showing the distribution of electric fields of lower electrodes of different dielectric constants according to an embodiment of the present invention;
Fig. 2 is a schematic structural diagram of an antenna according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of another antenna according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of yet another antenna according to an embodiment of the present invention;
fig. 5 is a schematic structural diagram of yet another antenna according to an embodiment of the present invention;
fig. 6 is a schematic structural diagram of yet another antenna according to an embodiment of the present invention;
fig. 7 is a schematic structural diagram of yet another antenna according to an embodiment of the present invention;
fig. 8 is a schematic structural diagram of yet another antenna according to an embodiment of the present invention;
fig. 9 is a schematic structural diagram of yet another antenna according to an embodiment of the present invention;
fig. 10 is a schematic structural diagram of yet another antenna according to an embodiment of the present invention;
fig. 11 is a schematic structural diagram of yet another antenna according to an embodiment of the present invention;
fig. 12 is a schematic structural diagram of yet another antenna according to an embodiment of the present invention;
fig. 13 is a schematic structural diagram of yet another antenna according to an embodiment of the present invention;
fig. 14 is a schematic structural diagram of yet another antenna according to an embodiment of the present invention;
fig. 15 is a schematic structural diagram of yet another antenna according to an embodiment of the present invention;
fig. 16 is a flow chart of a method for manufacturing an antenna according to an embodiment of the present invention;
Fig. 17 is a schematic structural diagram of a manufacturing method of an antenna in each step according to an embodiment of the present invention;
fig. 18 is a schematic structural diagram of a first substrate manufacturing method according to an embodiment of the present invention in each step;
fig. 19 is a schematic structural diagram of another method for manufacturing a first substrate according to an embodiment of the present invention in each step;
fig. 20 is a schematic structural diagram of a manufacturing method of a first substrate according to another embodiment of the present invention in each step.
Detailed Description
The invention is described in further detail below with reference to the drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting thereof. It should be further noted that, for convenience of description, only some, but not all of the structures related to the present invention are shown in the drawings.
As described in the background art, the existing antenna has the problems of high loss and low emissivity. The inventors found that the cause of this problem was as follows:
the antenna comprises a dielectric substrate, and a radiation electrode and a feed electrode which are arranged on the dielectric substrate, wherein the dielectric constant of the dielectric substrate is one of important parameters affecting the performance of the antenna, and has important influence on the radiation performance of the antenna and the performance of an antenna feed network.
Fig. 1 is a schematic diagram of distribution of electric fields of lower electrodes of media with different dielectric constants according to an embodiment of the present invention. Referring to fig. 1, compared to a common dielectric substrate (such as a glass substrate), the cross-sectional electric field of the high dielectric constant substrate in the vicinity of the electrode is more confined, the dielectric confinement electric field capability is stronger, more energy is bound, and electromagnetic leakage is lower. In contrast, the cross-sectional electric field of the low dielectric constant substrate in the area near the electrode is more divergent, so that the electromagnetic field of the electrode can radiate out as much as possible.
For antennas, a weak dielectric confining electric field capability is required for the radiating electrode. The weaker the dielectric confinement field capability, the less energy is bound, and the more energy is effectively radiated, the higher the radiation efficiency and gain of the antenna. For the feed electrode, a strong dielectric confining electric field capability is required. The stronger the dielectric confinement electric field capability is, the lower the electromagnetic leakage is, and the wider the feed electrode is, the influence of the radiation of the feed electrode on the overall radiation of the antenna is reduced, and the loss is reduced.
However, in the conventional antenna, the radiation electrode and the feed electrode are generally disposed on the same dielectric substrate, so that the different requirements of the radiation electrode and the feed electrode on the dielectric substrate dielectric constants cannot be satisfied, and the problems of high loss and low emissivity are caused.
In view of the above, an embodiment of the present invention provides an antenna. Fig. 2 is a schematic structural diagram of an antenna according to an embodiment of the present invention, referring to fig. 2, the antenna includes: the first substrate 110, one side of the first substrate 110 is provided with a radiation pattern layer 120 and a feeding pattern layer 130.
Wherein the first substrate 110 includes a radiation region 10 and a feeding region 20; the radiation pattern layer 120 and the feeding pattern layer 130 are both disposed on the first substrate 110; the radiation pattern layer 120 is disposed in the radiation area 10 of the first substrate 110, and the feeding pattern layer 130 is disposed in the feeding area 20 of the first substrate 110. Wherein the vertical projection of the radiation pattern layer 120 on the first substrate 110 overlaps the radiation area 10; the vertical projection of the feeding pattern layer 130 on the first substrate 110 overlaps the feeding region 20. The dielectric constant of the radiating region 10 of the first substrate 110 is smaller than the dielectric constant of the feeding region 20 of the first substrate 110. In this way, for the radiation electrode, the smaller dielectric constant on the first substrate 110 is beneficial to reducing the weak capability of restraining the electric field, so that the energy is reduced to be restrained, the energy effectively radiated is increased, and the radiation efficiency and gain of the antenna are improved; for the feeding electrode, the larger dielectric constant on the first substrate 110 is beneficial to enhancing the electric field confining capability, so that electromagnetic leakage is reduced, meanwhile, the width of the feeding pattern layer 130 is reduced, the influence of the radiation of the feeding pattern layer 130 on the overall radiation of the antenna is reduced, and the loss is reduced. Therefore, the embodiment of the invention can give consideration to different requirements of the radiation pattern layer 120 and the feed pattern layer 130 on the dielectric material of the first substrate 110, and reduce the loss of the antenna on the basis of improving the emissivity of the antenna.
With continued reference to fig. 2, in one embodiment, optionally the first substrate 110 includes: a first substrate layer 100, a first dielectric material layer 510, and a second dielectric material layer 520. The first dielectric material layer 510 and the second dielectric material layer 520 are embedded in the first substrate layer 100, and the first dielectric material layer 510 corresponds to the radiation region 10 of the first substrate 110, and the second dielectric material layer 520 corresponds to the feeding region 20 of the first substrate 110. In this way it is achieved that the radiating region 10 and the feeding region 20 have different dielectric constants.
The first dielectric material layer 510 and the second dielectric material layer 520 may be disposed in various positions and manners, and several of them are described below, but the present invention is not limited thereto.
With continued reference to fig. 2, in one embodiment, the first substrate layer 100 optionally includes first and second grooves. The first slot is arranged in the radiation area 10 of the first substrate 110, and the second slot is arranged in the feed area 20 of the first substrate 110; the first dielectric material layer 510 is embedded within the first slot and the second dielectric material layer 520 is embedded within the second slot. The embodiment of the invention is beneficial to the selection of the materials of the first dielectric material layer 510 and the second dielectric material layer 520 by arranging the grooves in the first substrate layer. Alternatively, the first dielectric material layer 510 and the second dielectric material layer 520 may be selected from solid materials; alternatively, the first slot and the second slot may be provided with better sealing properties, and the first dielectric material layer 510 and the second dielectric material layer 520 may be made of a gas, liquid or semi-solid material.
Illustratively in fig. 2, the first slots are in one-to-one correspondence with the radiation pattern layers 120, i.e., the first dielectric material layers 510 are in one-to-one correspondence with the radiation pattern layers 120. In other embodiments, the first slot may be set to be one, which overlaps with the projection of all the radiation pattern layers 120 on the first substrate 110, that is, one first dielectric material layer 510 corresponds to all the radiation pattern layers 120, so as to ensure that the first dielectric material layer 510 can reduce the capability of restricting the electric field of the radiation pattern layers 120, thereby reducing the constraint of energy, increasing the energy effectively radiated, and improving the radiation efficiency and gain of the antenna.
Fig. 3 is a schematic structural diagram of another antenna according to an embodiment of the present invention. Referring to fig. 3, in one embodiment, the first substrate layer 100 optionally includes a first sub-substrate layer 111 and a second sub-substrate layer 112; the first slot is disposed on the surface of the first sub-substrate layer 111 near the second sub-substrate layer 112; and the second slot is disposed on the surface of the first sub-substrate layer 111 near the second sub-substrate layer 112. The first sub-substrate layer 111 and the second sub-substrate layer 112 may be made of the same material, such as glass, ceramic, polyimide, or liquid crystal polymer. In this way, in the process of manufacturing the first substrate layer 100, the first sub-substrate layer 111 may be grooved and filled with the first dielectric material layer 510 and the second dielectric material layer 520, and then the second sub-substrate layer 112 is attached, so as to implement the embedded process of the first dielectric material layer 510 and the second dielectric material layer 520. It can be seen that providing the first substrate layer 100 comprising the first sub-substrate layer 111 and the second sub-substrate layer 112 is advantageous for simplifying the process.
Fig. 4 is a schematic structural diagram of another antenna according to an embodiment of the present invention. Referring to fig. 4, unlike in fig. 3, the first slot is disposed on the surface of the first sub-substrate layer 111 adjacent to the second sub-substrate layer 112; and the second slot is disposed on the surface of the second sub-substrate layer 112 near the first sub-substrate layer 111.
Fig. 5 is a schematic structural diagram of another antenna according to an embodiment of the present invention. Referring to fig. 5, unlike fig. 3 and 4, the first slot is disposed on the surface of the second sub-substrate layer 112 near the first sub-substrate layer 111; and the second slot is disposed on the surface of the second sub-substrate layer 112 near the first sub-substrate layer 111.
Fig. 6 is a schematic structural diagram of another antenna according to an embodiment of the present invention. Referring to fig. 6, unlike fig. 3 to 5, the first slot is disposed on the surface of the second sub-substrate layer 112 near the first sub-substrate layer 111; and the second slot is disposed on the surface of the first sub-substrate layer 111 near the second sub-substrate layer 112.
Fig. 7 is a schematic structural diagram of another antenna according to an embodiment of the present invention. Referring to fig. 7, in one embodiment, the first substrate layer 100 optionally includes a first sub-substrate layer 111 and a second sub-substrate layer 112. The surface of the first sub-substrate layer 111, which is close to the second sub-substrate layer 112, is provided with a first sub-slot and a second sub-slot, and the surface of the second sub-substrate layer 112, which is close to the first sub-substrate layer 111, is provided with a third sub-slot and a fourth sub-slot. The first sub-slot and the third sub-slot are oppositely arranged to form a first slot, and the second sub-slot and the fourth sub-slot are oppositely arranged to form a second slot. The first dielectric material layer 510 fills the first trench and the second dielectric material layer 520 fills the second trench. Compared to the above embodiments, the radiation region 10 and the feeding region 20 each have only a single-sided sub-substrate layer for grooving, and this embodiment can increase the thickness of the first and second grooves, so that the first and second dielectric material layers 510 and 520 are filled thicker, and the effect of improving the dielectric constant distribution of the first substrate 110 is more obvious.
With continued reference to fig. 3-7, the first substrate 110 may optionally further include an adhesive layer 610, where the adhesive layer 610 is located between the first sub-substrate layer 111 and the second sub-substrate layer 112, and is used to fix and seal the first sub-substrate layer 111 and the second sub-substrate layer 112.
The material of the adhesive layer 610 may be, for example, resin, polyvinyl alcohol, or the like. Alternatively, the adhesive layer 610 adheres only to the first sub-substrate layer 111 and the second sub-substrate layer 112; or the adhesive layer 610 is also used to attach the first dielectric material layer 510 and the first sub-substrate layer 111, to attach the first dielectric material layer 510 and the second sub-substrate layer 112, to attach the second dielectric material layer 520 and the first sub-substrate layer 111, and to attach the second dielectric material layer 520 and the second sub-substrate layer 112.
Fig. 8 is a schematic structural diagram of another antenna according to an embodiment of the present invention. Referring to fig. 8, in one embodiment, optionally, a first dielectric material layer 510 and a second dielectric material layer 520 are each secured between the first sub-substrate layer 111 and the second sub-substrate layer 112. Illustratively, when the first dielectric material layer 510 and the second dielectric material layer 520 may be composed of solid or semi-solid materials, they are disposed between the first sub-substrate layer 111 and the second sub-substrate layer 112 by coating or bonding. By this arrangement, the first sub-base material layer 111 and the second sub-base material layer 112 do not need to be subjected to grooving treatment, which is advantageous in simplifying the manufacturing process. In addition, a certain gap is kept between the first sub-substrate layer 111 and the second sub-substrate layer 112, so that the problem of bulge caused by direct bonding is avoided. At this time, the first dielectric material layer 510 and the second dielectric material layer 520 also function to support the first sub-substrate layer 111 and the second sub-substrate layer 112.
In one embodiment, the thickness of the first dielectric material layer 510 is optionally greater than the depth of the first slot, and the thickness of the second dielectric material layer 520 is optionally greater than the depth of the second slot. At this time, the first dielectric material layer 510 and the second dielectric material layer 520 also function to support the first sub-substrate layer 111 and the second sub-substrate layer 112.
Fig. 9 is a schematic structural diagram of another antenna according to an embodiment of the present invention. Referring to fig. 9, the first substrate 110 may further include a support structure 710, where the support structure 710 is disposed between the first sub-substrate layer 111 and the second sub-substrate layer 112 to support the first sub-substrate layer 111 and the second sub-substrate layer 112, so as to form a space accommodating the first dielectric material layer 510 and the second dielectric material layer 520. Optionally, the support structure 710 is a support ball, a support post, or a sealant mixing support ball. The material, shape and position of the supporting structure 710 can be set according to practical requirements, and the setting mode is flexible and various. The arrangement of the embodiment of the invention is equivalent to arranging a plurality of fixed points inside the first substrate 110, which is beneficial to keeping the interval between the first sub-substrate layer 111 and the second sub-substrate layer 112 constant, thereby enhancing the stability of the first substrate 110, being beneficial to preventing the influence on the antenna performance caused by the collapse deformation of the first substrate 110 in the use process of the antenna, and being beneficial to avoiding the adverse influence on the antenna radiation performance caused by the small protrusion defect generated by the first sub-substrate layer 111 or the second sub-substrate layer 112.
With continued reference to fig. 3-9, in accordance with the above embodiments, optionally, the cross-sectional shape of the first dielectric material layer 510 includes: at least one of rectangular and trapezoidal; the cross-sectional shape of the second dielectric material layer 520 includes: at least one of rectangular and trapezoidal. The shapes of the two dielectric material layers can be the same or different, and the shapes and the sizes of the two dielectric material layers can be set according to actual requirements. Alternatively, the sidewalls of the first slot and the second slot may be planar or cambered, which is not limited by the embodiment of the present invention.
With continued reference to fig. 3-9, in addition to the above embodiments, optionally, a surface of the first sub-substrate layer 111 remote from the second sub-substrate layer 112 is provided with a radiation pattern layer 120 and a feeding pattern layer 130; the surface of the second sub-substrate layer 112 far from the first sub-substrate layer 111 is provided with a ground pattern layer 140. According to the embodiment of the invention, the single-sided conductive pattern layers are arranged on the first sub-substrate layer 111 and the second sub-substrate layer 112, so that a process of preparing electrodes on two sides of a substrate is avoided, and the preparation difficulty is reduced.
In the above embodiments, the thicknesses of the first dielectric material layer 510 and the second dielectric material layer 520 are exemplarily shown to be the same, and in order to realize that the dielectric constant of the radiation region 10 of the first substrate 110 is smaller than that of the feeding region 20, it is necessary to provide that the dielectric constant of the first dielectric material layer 510 is smaller than that of the second dielectric material layer 520.
In one embodiment, the radiating region 10 of the first substrate 110 is optionally mixed with a first dielectric material and the feeding region 20 of the first substrate 110 is mixed with a second dielectric material. Wherein the dielectric constant of the first dielectric material is smaller than the dielectric constant of the second dielectric material. Illustratively, the first substrate 110 is manufactured by doping the radiation region 10 of the first substrate 110 with a first dielectric material through a diffusion process, and doping the feed region 20 of the first substrate 110 with a second dielectric material through a diffusion process, so that the dielectric constant of the radiation region 10 is smaller than that of the feed region 20.
Fig. 10 is a schematic structural diagram of another antenna according to an embodiment of the present invention. Referring to fig. 10, in one embodiment, a first dielectric material layer 510 is optionally provided at a different thickness than a second dielectric material layer 520. It will be appreciated that the thickness of the material may affect its dielectric constant, for example, the thickness of the second dielectric material layer 520 is greater than the thickness of the first dielectric material layer 510, such that the dielectric constant of the radiating region 10 of the first substrate 110 is less than the dielectric constant of the feed region 20.
The above embodiments exemplarily illustrate the case where the first substrate 110 includes the first dielectric material layer 510 and the second dielectric material layer 520, but do not limit the present invention. In other embodiments, the first substrate 110 may also be provided to include only one dielectric material layer in addition to the first substrate layer 100. Next, a case where the first substrate 110 includes only one dielectric material layer will be described.
Fig. 11 is a schematic structural diagram of another antenna according to an embodiment of the present invention. Referring to fig. 11, in one embodiment, optionally, the first substrate 110 includes: a first substrate layer 100 and a first dielectric material layer 510; the first substrate layer 100 includes a first slot, the first slot is disposed in the radiation area 10 of the first substrate, and the first dielectric material layer 510 is embedded in the first slot; the dielectric constant of the first dielectric material layer 510 is smaller than the dielectric constant of the first substrate layer 100. In this way, the first dielectric material layer 510 is added only to the radiation region 10 of the first substrate 110, and the manufacturing process can be simplified; and the dielectric constant of the first dielectric material layer 510 is set to be smaller than that of the first substrate layer 100, it is possible to ensure that the dielectric constant of the radiation region 10 is smaller than that of the feeding region 20.
Optionally, the materials of the first dielectric material layer 510 include: at least one of air or vacuum. The first dielectric material layer 510 is disposed in vacuum, which is favorable for reducing the dielectric constant of the radiation area 10 and reducing the electromagnetic loss; the first dielectric material layer 510 is filled with air, and after the first substrate layer 100 is provided with the first slot, the operation of vacuumizing the first slot is not needed, which is beneficial to simplifying the process steps and the process difficulty.
Fig. 12 is a schematic structural diagram of yet another antenna according to an embodiment of the present invention. Referring to fig. 12, in one embodiment, optionally, the first substrate 110 includes: a first substrate layer 100 and a second dielectric material layer 520; the first substrate 110 includes a second slot, the second slot is disposed in the feeding region 20 of the first substrate 110, and the second dielectric material layer 520 is embedded in the second slot; the dielectric constant of the second dielectric material layer 520 is greater than the dielectric constant of the first substrate layer 100. In this way, the addition of the second dielectric material layer 520 only to the feeding region 20 can simplify the manufacturing process; and the dielectric constant of the second dielectric material layer 520 is set to be greater than that of the first substrate layer 100, it is possible to ensure that the dielectric constant of the radiation region 10 is smaller than that of the feeding region 20. Optionally, the materials of the second dielectric material layer 520 include: at least one of ceramic and lead zirconate titanate to ensure a relatively high dielectric constant for the second dielectric material layer 520.
Fig. 13 is a schematic structural diagram of another antenna according to an embodiment of the present invention. Referring to fig. 13, in addition to the above embodiments, optionally, the first dielectric material layer 510 has a size larger than that of the radiation pattern layer 120; the size of the second dielectric material layer 520 is larger than that of the feeding pattern layer 130, so that the effect of the first dielectric material layer 510 and the second dielectric material layer 520 on improving the dielectric constant of the first substrate 110 is more remarkable.
With continued reference to fig. 2-13, the dielectric material requirements of the radiation pattern layer 120 and the feeding pattern layer 130 on the first substrate 110 may also be optionally satisfied by setting the loss tangent values of the dielectric materials of the radiation region 10 and the feeding region 20. Illustratively, the dielectric material of the radiation region 10 is set to a material having a small loss tangent value, which is advantageous for further increasing the gain of the antenna; the dielectric material of the feeding region 20 is set to a material having a small loss tangent value, which is advantageous for further reducing the loss of the antenna.
With continued reference to fig. 2-13, the antenna may alternatively be a liquid crystal antenna, based on the embodiments described above. The antenna further comprises: a liquid crystal layer 310 and a second substrate 210, the liquid crystal layer 310 being located between the first substrate 110 and the second substrate 210; the second substrate 210 includes a phase shift pattern layer 220. The materials of the second substrate 210 and the phase-shift pattern layer 220 are not limited in the embodiment of the present invention, so long as the structure capable of forming the liquid crystal antenna is within the protection scope of the present invention. The second substrate 210 may be, for example, a glass substrate, a ceramic substrate, a polyimide substrate, a liquid crystal polymer substrate, or the like. The phase shift pattern layer 220 may be, for example, a metal layer, preferably a copper layer or a gold layer.
In order to facilitate understanding of the present invention, a specific structure of the liquid crystal antenna and its operation principle will be described.
With continued reference to fig. 2-13, illustratively, the ground pattern layer 140 is disposed under the first substrate 110, the conductive pattern layer on the second substrate 210 is a phase-shifting pattern layer 220, the phase-shifting pattern layer 220 and the ground pattern layer 140 together form an intra-cell electrode of the liquid crystal cell, and an electric field is generated between the phase-shifting pattern layer 220 and the ground pattern layer 140 to drive the liquid crystal molecules to deflect. The phase-shifting pattern layer 220 may also be referred to as a transmission electrode, and the phase-shifting pattern layer 220 is used to drive the liquid crystal molecules to deflect and couple and transmit electromagnetic waves. Further, the ground pattern layer 140 includes an opening 141, and vertical projections of the opening 141 on the second substrate 210 overlap with the phase-shift pattern layer 220. Alternatively, the phase-shift pattern layer 220 corresponds to the openings 141 one by one. The conductive pattern layer over the first substrate 110 includes a feeding pattern layer 130 and a radiation pattern layer 120. Wherein the feeding pattern layer 130 is electrically connected to the antenna joint. The radiation pattern layer 120 is used for radiating or receiving antenna signals, and a vertical projection of the radiation pattern layer 120 on the first substrate 110 overlaps the opening 141.
With continued reference to fig. 2-13, the liquid crystal antenna may optionally further include a first support 410 based on the above embodiments. The first support 410 may be, for example, a frame sealing adhesive. When the first and second substrates 110 and 210 form a liquid crystal cell, the first and second substrates 110 and 210 are supported by the first support 410; and, the first support 410 is disposed around the liquid crystal layer 310, and also serves to seal the liquid crystal cell, preventing the liquid crystal layer 310 from overflowing.
Optionally, the liquid crystal antenna further includes a second support (not shown) disposed in the liquid crystal cell for supporting the first substrate 110 and the second substrate 210. The second support may be, for example, a support ball or a support column (PS column), etc.
With continued reference to fig. 2-13, in addition to the above embodiments, optionally, a first conductive layer 230 may be further disposed on a portion of the second substrate 210 located outside the liquid crystal cell, where the material of the pad is, for example, molybdenum, bonded to the flexible circuit board (Flexible printed circuit Board, FPC).
Alternatively, a first protective layer having insulation and oxidation preventing effects may be disposed on a side of the phase-shift pattern layer 220 away from the second substrate 210 to protect the phase-shift pattern layer 220. A second protective layer having insulation and oxidation preventing effects may be disposed on a side of the ground pattern layer 140 away from the first substrate 110 for protecting the ground pattern layer 140. A third protective layer having insulation and oxidation preventing effects may be disposed at a side of the feeding pattern layer 130 and the radiation pattern layer 120 remote from the first substrate 110 to protect the feeding pattern layer 130 and the radiation pattern layer 120.
Based on the above embodiments, an antenna joint and a pad may be optionally disposed at an end of the feeding pattern layer 130 remote from the radiation pattern layer 120. One end of the antenna connector is connected with the feeding pattern layer 130 and fixed through a bonding pad; the other end of the antenna joint is used for connecting external circuits such as a high-frequency joint and the like.
Illustratively, the liquid crystal antenna operates on the principle that, during the process of transmitting an antenna signal (e.g., electromagnetic wave), the antenna connector is coupled to the feeding pattern layer 130, the feeding pattern layer 130 couples the electromagnetic wave to the phase-shifting pattern layer 220, the phase of the electromagnetic wave is changed by the change of the dielectric constant of the liquid crystal layer 310, the electromagnetic wave with the changed phase is coupled to the radiation pattern layer 120 through the opening 141, and the radiation pattern layer 120 radiates the electromagnetic wave outwards, thereby completing the process of transmitting the antenna signal. The process of receiving the antenna signal is opposite to the process of transmitting the antenna signal, and will not be described again here.
It should be noted that fig. 2 to 13 exemplarily illustrate that the phase shift pattern layer 220 and the ground pattern layer 140 are disposed on the second substrate 210 and the first substrate 110, respectively, to generate a longitudinal electric field for driving the liquid crystal molecules to deflect, which is not a limitation of the present invention. In other embodiments, the phase shift pattern layer 220 and the ground pattern layer 140 may be disposed on the first substrate 110 (or the second substrate 210) to generate a transverse electric field for driving the liquid crystal molecules to deflect, and may be set according to needs in practical applications.
Fig. 14 is a schematic structural diagram of yet another antenna according to an embodiment of the present invention. Referring to fig. 14, in addition to the above embodiments, optionally, the second substrate 210 includes a second substrate layer 200 and a third dielectric material layer 530, where the third dielectric material layer 530 is embedded in the second substrate layer 200; and the perpendicular projection of the third dielectric material layer 530 on the second substrate 210 overlaps with the perpendicular projection of the phase shift pattern layer 220 on the second substrate. The dielectric constant of the third dielectric material layer 530 is greater than that of the second substrate layer 200, so as to tie up the electric field of the phase-shifting pattern layer 220 in the second substrate 210 as much as possible, enhance the ability of the second substrate 210 to constrain the electric field, thereby reducing electromagnetic leakage, reducing the width of the phase-shifting pattern layer 220, and reducing electromagnetic coupling loss between the phase-shifting pattern layers 220.
In the above embodiment, the phase-shift pattern layer 220 is a conductive pattern layer, and the material of the phase-shift pattern layer is not limited in the embodiment of the present invention. Illustratively, the phase-shifting pattern layer 220 may be a metal layer, preferably a copper layer or a gold layer. Alternatively, the number of phase-shift pattern layers 220 may be one, two or more, and two phase-shift pattern layers 220 are exemplarily shown on the second substrate 210 in fig. 14, but are not limiting of the present invention.
The third dielectric material layer 530 may be disposed in various ways based on the above embodiments, and several of them will be described below.
With continued reference to fig. 14, in one embodiment, the second substrate layer 200 optionally includes third grooves. A third layer of dielectric material 530 is embedded within the third trench. In the embodiment of the present invention, the grooves are formed in the second substrate layer 200, so that the material selection of the third dielectric material layer 530 is facilitated. Alternatively, the third dielectric material layer 530 may be selected to be a solid material; alternatively, the third slot may be provided with better sealing properties, and the third dielectric material layer 530 may be a gaseous, liquid or semi-solid material.
Illustratively in fig. 14, the third slots are in one-to-one correspondence with the phase-shift pattern layers 220; i.e., the third dielectric material 530 corresponds one-to-one with the phase-shift pattern layer 220. In other embodiments, the third slot may be configured to have a vertical projection on the second substrate 210 overlapping with a vertical projection of all the phase-shift pattern layers 220 on the second substrate 210, that is, one third dielectric material layer 530 corresponds to all the phase-shift pattern layers 220, so as to ensure that the third dielectric material layer 530 can enhance the capability of restricting the electric field of the phase-shift pattern layer 120, thereby reducing electromagnetic leakage and loss.
Fig. 15 is a schematic structural diagram of yet another antenna according to an embodiment of the present invention. Referring to fig. 15, in one embodiment, the second substrate layer 200 optionally includes a third sub-substrate layer 211 and a fourth sub-substrate layer 212. The surface of the third sub-substrate layer 211, which is close to the fourth sub-substrate layer 212, is provided with a fifth sub-slot, and the surface of the fourth sub-substrate layer 212, which is close to the third sub-substrate layer 211, is provided with a sixth sub-slot. The fifth sub-slot and the sixth sub-slot are arranged oppositely to form a third slot. The third dielectric material layer 530 fills in the third trenches. Illustratively, the larger the slot, the more dielectric is filled and the more pronounced the advantage to the change in dielectric constant of the antenna.
In other embodiments, only one of the third sub-substrate layer 211 and the fourth sub-substrate layer 212 may be optionally provided with a third trench for filling the third dielectric material layer 530. The third sub-substrate layer 211 and the fourth sub-substrate layer 212 may be made of the same material, such as glass, ceramic, polyimide, or liquid crystal polymer. In this way, in the process of manufacturing the second substrate layer 200, the third sub-substrate layer 211 or the fourth sub-substrate layer 212 may be grooved and filled with the third dielectric material layer 530, and then the fourth sub-substrate layer 212 or the third sub-substrate layer 211 is attached, so as to implement the process of embedding the third dielectric material layer 530. Therefore, only the single-side sub-substrate layer is subjected to grooving treatment, and the process is facilitated to be simplified.
With continued reference to fig. 15, the second substrate 210 may further include a second adhesive layer 620 between the third sub-substrate layer 211 and the third sub-substrate layer 212 for fixing and sealing the third sub-substrate layer 211 and the fourth sub-substrate layer 212, as an option.
The material of the second adhesive layer 620 may be, for example, resin, polyvinyl alcohol, or the like. Optionally, the second adhesive layer 620 is bonded to only the third sub-substrate layer 211 and the fourth sub-substrate layer 212; or the second adhesive layer 620 is also used to attach the third dielectric material layer 530 and the third sub-substrate layer 211, and is also used to attach the third dielectric material layer 530 and the fourth sub-substrate layer 212.
In one embodiment, optionally, a third dielectric material layer 530 is secured between the third sub-substrate layer 211 and the fourth sub-substrate layer 212. By this arrangement, the third sub-substrate layer 211 and the third sub-substrate layer 212 do not need to be subjected to grooving treatment, which is advantageous in simplifying the manufacturing process. In addition, a certain gap is maintained between the third sub-substrate layer 211 and the fourth sub-substrate layer 212, so that the problem of swelling or the like caused by direct bonding is avoided. At this time, the third dielectric material layer 530 also functions to support the third sub-substrate layer 211 and the fourth sub-substrate layer 212.
Based on the above embodiments, the second substrate 210 may further include a support structure, where the support structure is disposed between the third sub-substrate layer 211 and the fourth sub-substrate layer 212 to support the third sub-substrate layer 211 and the fourth sub-substrate layer 212, so as to form a space for accommodating the third dielectric material layer 530. In this way, it is advantageous to keep the interval between the third sub-base material layer 211 and the fourth sub-base material layer 212 constant, corresponding to providing a plurality of fixing points inside the second substrate 210, thereby enhancing the stability of the second substrate 210.
In summary, in the first aspect, the embodiment of the present invention provides that the first substrate 110 includes the radiation area 10 and the feeding area 20, the radiation pattern layer 120 is disposed on the radiation area 10 of the first substrate 110, and the feeding pattern layer 10 is disposed on the feeding area 20 of the first substrate 110, and the dielectric constant of the radiation area 10 is set to be smaller than that of the feeding area 20. In this way, for the radiation electrode, the smaller dielectric constant on the first substrate 110 is beneficial to reducing the weak capability of restraining the electric field, so that the energy is reduced to be restrained, the energy effectively radiated is increased, and the radiation efficiency and gain of the antenna are improved; for the feeding electrode, the larger dielectric constant on the first substrate 110 is beneficial to enhancing the electric field confining capability, so that electromagnetic leakage is reduced, meanwhile, the width of the feeding pattern layer 130 is reduced, the influence of the radiation of the feeding pattern layer 130 on the overall radiation of the antenna is reduced, and the loss is reduced. Therefore, the embodiment of the invention can give consideration to different requirements of the radiation pattern layer 120 and the feed pattern layer 130 on the dielectric material of the first substrate 110, and reduce the loss of the antenna on the basis of improving the emissivity of the antenna.
In a second aspect, the second substrate 210 includes a second substrate layer 200 and a third dielectric material layer 530, where the third dielectric material layer 530 is embedded in the second substrate layer 200; and the perpendicular projection of the third dielectric material layer 530 on the second substrate 210 overlaps with the perpendicular projection of the phase shift pattern layer 220 on the second substrate. The dielectric constant of the third dielectric material layer 530 is greater than that of the second substrate layer 200, so as to tie up the electric field of the phase-shifting pattern layer 220 in the second substrate 210 as much as possible, enhance the ability of the second substrate 210 to constrain the electric field, thereby reducing electromagnetic leakage, reducing the width of the phase-shifting pattern layer 220, and reducing electromagnetic coupling loss between the phase-shifting pattern layers 220.
Therefore, compared with the prior art, the embodiment of the invention can reduce the loss of the antenna on the basis of improving the emissivity of the antenna.
The embodiment of the invention also provides a manufacturing method of the antenna, which can be used for manufacturing the antenna provided by any embodiment of the invention. The antenna prepared by the manufacturing method of the embodiment of the invention comprises a first substrate, a second substrate, a third substrate, a fourth substrate, a fifth substrate and a fourth substrate, wherein the first substrate comprises a radiation area and a feed area, and then a radiation pattern layer and a feed pattern layer are formed on the first substrate; the radiation pattern layer is arranged in the radiation area of the first substrate, the feed pattern layer is arranged in the feed area of the first substrate, and the dielectric constant of the radiation area is smaller than that of the feed area, so that the dielectric constant of the feed area is larger, the width of the feed pattern layer is reduced, the influence of the radiation of the feed pattern layer on the overall radiation of the antenna is reduced, and the loss is reduced; and the dielectric constant of the radiation area is smaller, which is favorable for reducing the capacity of the dielectric of the radiation area to restrict the electric field, reducing the constraint on energy and increasing the energy effectively radiated by the radiation pattern layer, thereby improving the radiation efficiency of the antenna. In summary, the embodiment of the invention can give consideration to different requirements of the radiation pattern layer and the feed pattern layer on the dielectric material of the first substrate, and is beneficial to reducing the loss of the antenna on the basis of improving the radiation rate of the antenna.
Fig. 16 is a flow chart of a method for manufacturing an antenna according to an embodiment of the present invention, and fig. 17 is a schematic structural diagram of the method for manufacturing an antenna according to an embodiment of the present invention in each step. Referring to fig. 16 and 17, the method for manufacturing the antenna includes the steps of:
s110, providing a first substrate 110; the first substrate 110 includes a radiation region 10 and a feeding region 20; the dielectric constant of the radiating region 10 of the first substrate 110 is smaller than the dielectric constant of the feeding region 20 of the first substrate 110.
S120, forming a radiation pattern layer 120 and a feeding pattern layer 130 on the first substrate 110; the radiation pattern layer 120 is disposed in the radiation region 10 of the first substrate 110, and the feeding pattern layer 130 is disposed in the feeding region 20 of the first substrate 110.
Wherein the first substrate 110 has a double-layered conductive pattern thereon. The material of the conductive pattern layer may be copper or gold, for example. Illustratively, the radiation pattern layer 120 and the feeding pattern layer 130 are formed above the first substrate 110, and the ground pattern layer 140 is formed below the first substrate 110. Optionally, a second protective layer is further formed on a side of the ground pattern layer 140 away from the first substrate 110; a third protective layer is further formed on the radiation pattern layer 120 and the feeding pattern layer 130 at a side far from the first substrate 110; the material of both the second and third protective layers may be silicon nitride.
S130, providing a second substrate 210, forming the first substrate 110 and the second substrate 210 into a box, and forming a liquid crystal layer 310 between the first substrate 110 and the second substrate 210.
Wherein the second substrate 210 has a single-sided conductive pattern layer thereon. Illustratively, a phase shift pattern layer 220 is formed on a side of the second substrate 210 adjacent to the first substrate 110. Optionally, a first protective layer is further formed on a side of the phase-shift pattern layer 220 away from the second substrate 210.
The first substrate 110 and the second substrate 210 are aligned to form a liquid crystal cell, and the liquid crystal cell is filled with the liquid crystal layer 310. Specifically, in the process of forming the liquid crystal cell by the first substrate 110 and the second substrate 210, a first support 410 is provided in the box-like structure for supporting the first substrate 110 and the second substrate 210 and sealing the liquid crystal layer 310 to prevent the liquid crystal layer 310 from overflowing.
Optionally, after the first substrate 110 and the second substrate 210 are formed into a cell, the method for manufacturing an antenna further includes: an antenna joint and a pad are provided at an end of the feeding pattern layer 130 remote from the radiation pattern layer 120. One end of the antenna connector is connected with the feeding pattern layer 130 and fixed through a bonding pad; the other end of the antenna joint is used for connecting external circuits such as a high-frequency joint and the like.
The embodiment of the invention completes the manufacture of the antenna through S110-S130.
In addition to the above embodiments, the first substrate 110 may be manufactured in various ways, and the steps of several manufacturing methods will be described below.
Fig. 18 is a schematic structural diagram of a manufacturing method of a first substrate in each step according to an embodiment of the present invention. Referring to fig. 18, in an embodiment, optionally, the method for manufacturing the first substrate 110 and the film layers thereon includes the following steps:
s111, a first slot 11 and a second slot 21 are formed in the first substrate layer 100 of the first substrate 110, the first slot 11 is disposed in the radiation region 10 of the first substrate 110, and the second slot 20 is disposed in the feed region 20 of the first substrate 110.
Wherein the length, width, thickness and shape of the first slot 11 and the second slot 21 may be different. The cross-sectional shape of the slot may be, but is not limited to, rectangular or trapezoidal. Alternatively, the side walls of the first slot 11 and the second slot 21 may be flat surfaces or cambered surfaces. The manner of slotting the first substrate 110 may be selected according to the actual operation field device, which is not limited in the embodiment of the present invention.
S112, the first dielectric material layer 510 is filled into the first trench 11, and the second dielectric material layer 520 is filled into the second trench 21.
Wherein the dielectric constant of the first dielectric material layer 510 is smaller than the dielectric constant of the second dielectric material layer 520. Illustratively, the materials of the first dielectric material layer 510 include: at least one of air or vacuum; the materials of the second dielectric material layer 520 include: at least one of ceramic and lead zirconate titanate.
The embodiment of the invention completes the manufacture of the first substrate 110 of the antenna through S111-S112, wherein the first substrate 110 comprises a complete first substrate layer 100, and the first dielectric material layer 510 and the second dielectric material layer 520 are added in a slot filling manner, so that the manufacture process is simple and easy to realize.
The above embodiments are exemplary of the solution of grooving and filling a layer of dielectric material in a complete first substrate layer, but are not meant to be limiting of the invention. In other embodiments, the first substrate layer may also be formed from multiple sub-substrate layers. The following description will be made of the steps of the method for manufacturing the first substrate in which the first substrate layer is constituted by two sub-substrate layers.
Fig. 19 is a schematic structural diagram of another method for manufacturing a first substrate according to an embodiment of the present invention in each step. Referring to fig. 19, in an embodiment, optionally, the method for manufacturing the first substrate 110 and the film layers thereon includes the following steps:
S210, providing the first sub-substrate layer 111.
S220, forming a first dielectric material layer 510 and a second dielectric material layer 520 on the first sub-substrate layer 111; the first dielectric material layer 510 is disposed on the radiation region 10 of the first substrate, and the second dielectric material layer 520 is disposed on the feed region 20 of the first substrate.
S230, forming a second sub-substrate layer 112 on the first dielectric material layer 510 and the second dielectric material layer 520, and fixing the first dielectric material layer 510 and the second dielectric material layer 520 between the first sub-substrate layer 111 and the second sub-substrate layer 112.
Optionally, before the second sub-substrate layer 112 is formed, a supporting structure may be further formed on the first sub-substrate layer, which is equivalent to providing a plurality of fixing points inside the first substrate 110, so as to be beneficial to keeping the interval between the first sub-substrate layer 111 and the second sub-substrate layer 112 constant, thereby enhancing the stability of the first substrate 110, being beneficial to preventing the antenna from being affected by the collapse deformation of the first substrate 110 during the use process, and being beneficial to avoiding the adverse effect on the radiation performance of the antenna caused by the small protrusion defect occurring on the first sub-substrate layer 111 or the second sub-substrate layer 112. Optionally, the support structure is a support ball, a support column or a frame sealing glue mixed support ball. The material, shape and position of the supporting structure can be set according to actual requirements.
S240, forming a radiation pattern layer 120 and a feed pattern layer 130 on the second surface of the first sub-substrate layer 111; and a ground pattern layer 140 is formed on the second surface of the second sub-substrate layer 112.
The process of manufacturing the ground pattern layer 140 may be a deposition process and an etching process, and the specific steps include: first, a first electrode material layer is deposited on a second surface of the second sub-substrate layer 112, for example, a chemical vapor deposition process or a physical vapor deposition process; then, the first electrode material layer is patterned by an etching process, such as photolithography or chemical etching, to form the ground pattern layer 140.
Similarly, the second surface of the first sub-substrate layer 111 forms a radiation pattern layer 120 and a feeding pattern layer 130. The materials and the manufacturing process of the first sub-substrate layer 111 and the film layers thereon are similar to those of the second sub-substrate layer 112 and the film layer structures thereon, and will not be described again.
It should be noted that the order of S210 to S240 is merely an exemplary order, and is not limited to the present invention, and the order of the steps may be adjusted according to the requirement in practical application, for example, the steps of forming the radiation pattern layer 120 and the feeding pattern layer 130 in S240 may be placed before S220.
The embodiment of the invention completes the manufacture of the first substrate 110 of the antenna through S210-S240, avoids the step of slotting on the first surfaces of the first sub-substrate layer 111 and the second sub-substrate layer 112, and simplifies the manufacture process.
Fig. 20 is a schematic structural diagram of a manufacturing method of a first substrate according to another embodiment of the present invention in each step. Referring to fig. 20, in an embodiment, optionally, the method for manufacturing the first substrate 110 and the film layers thereon includes the following steps:
s310, providing a first sub-substrate layer 111, and forming a first sub-slot 1111 and a second sub-slot 2111 on a first surface of the first sub-substrate layer 111; a second sub-substrate layer 112 is provided, and third sub-grooves 1112 and fourth sub-grooves 2112 are formed in the first surface of the second sub-substrate layer 112.
In this step, only the first surface of the first sub-substrate layer 111 may be grooved, and after the second sub-substrate layer 112 is provided, the second sub-substrate layer 112 may be directly covered with the grooves on the first sub-substrate layer 111; alternatively, only the first surface of the second sub-substrate layer 112 is grooved; alternatively, the first surfaces of the first sub-substrate layer 111 and the second sub-substrate layer 112 are grooved respectively.
S320, the first surface of the second sub-substrate layer 112 is attached to the first surface of the first sub-substrate layer 111, so that the first sub-slot 1111 and the third sub-slot 1112 form the first slot 11, and the second sub-slot 2111 and the fourth sub-slot 2112 form the second slot 21.
Alternatively, the first sub-substrate layer 111 and the second sub-substrate layer 112 may be fixed using the adhesive layer 610.
S330, a first dielectric material layer 510 is formed in the first slot 11, and a second dielectric material layer 520 is formed in the second slot 21.
Wherein the dielectric constant of the first dielectric material layer 510 is smaller than the dielectric constant of the second dielectric material layer 520.
S340, forming a radiation pattern layer 120 and a feed pattern layer 130 on the second surface of the first sub-substrate layer 111; and a ground pattern layer 140 is formed on the second surface of the second sub-substrate layer 112.
In the embodiment of the invention, the manufacture of the first substrate 110 of the antenna is completed through S310-S340, and the thicknesses of the first dielectric material layer 510 and the second dielectric material layer 520 are increased on the basis of not increasing the overall thickness of the first substrate 110 through the step of grooving the first surfaces of the first sub-substrate layer 111 and the second sub-substrate layer 112, so that the effect caused by the change of dielectric constants of different areas in the first substrate 110 is improved, and the loss of the antenna is reduced on the basis of improving the emissivity of the antenna.
Note that the above is only a preferred embodiment of the present invention and the technical principle applied. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, while the invention has been described in connection with the above embodiments, the invention is not limited to the embodiments, but may be embodied in many other equivalent forms without departing from the spirit or scope of the invention, which is set forth in the following claims.
Claims (19)
1. An antenna, comprising:
a first substrate including a radiation region and a feed region;
the radiation pattern layer and the feed pattern layer are arranged on the first substrate; the radiation pattern layer is arranged in a radiation area of the first substrate, and the feed pattern layer is arranged in a feed area of the first substrate;
wherein the dielectric constant of the radiation area of the first substrate is smaller than the dielectric constant of the feed area of the first substrate;
the first substrate includes: a first substrate layer, a first dielectric material layer, and a second dielectric material layer;
the first dielectric material layer and the second dielectric material layer are embedded in the first substrate layer, the first dielectric material layer corresponds to a radiation area of the first substrate, and the second dielectric material layer corresponds to a feed area of the first substrate;
the first substrate layer comprises a first sub-substrate layer and a second sub-substrate layer;
the first dielectric material layer and the second dielectric material layer are both fixed between the first sub-substrate layer and the second sub-substrate layer;
the first substrate further includes: the support structure is arranged between the first sub-substrate layer and the second sub-substrate layer, so as to support the first sub-substrate layer and the second sub-substrate layer, and a space for accommodating the first dielectric material layer and the second dielectric material layer is formed.
2. The antenna of claim 1, wherein the first substrate layer comprises a first slot and a second slot;
the first slot is arranged in a radiation area of the first substrate, and the second slot is arranged in a feed area of the first substrate;
the first dielectric material layer is embedded in the first slot, and the second dielectric material layer is embedded in the second slot.
3. The antenna of claim 2, wherein the first substrate layer comprises a first sub-substrate layer and a second sub-substrate layer;
the first grooves are formed in the surface, close to the second sub-substrate layer, of the first sub-substrate layer; or the first slot is arranged on the surface of the second sub-substrate layer, which is close to the first sub-substrate layer;
the second grooves are formed in the surface, close to the second sub-substrate layer, of the first sub-substrate layer; or, the second slot is disposed on the surface of the second sub-substrate layer, which is close to the first sub-substrate layer.
4. The antenna of claim 2, wherein the first substrate layer comprises a first sub-substrate layer and a second sub-substrate layer;
a first sub-slot and a second sub-slot are formed in the surface, close to the second sub-substrate layer, of the first sub-substrate layer, and a third sub-slot and a fourth sub-slot are formed in the surface, close to the first sub-substrate layer, of the second sub-substrate layer;
The first sub-slot and the third sub-slot are oppositely arranged to form the first slot, and the second sub-slot and the fourth sub-slot are oppositely arranged to form the second slot.
5. The antenna of claim 3 or 4, wherein the first substrate further comprises: and the bonding layer is positioned between the first sub-substrate layer and the second sub-substrate layer and is used for fixing the first sub-substrate layer and the second sub-substrate layer.
6. The antenna according to any one of claims 1, 3-4, wherein a surface of the first sub-substrate layer remote from the second sub-substrate layer is provided with the radiation pattern layer and the feeding pattern layer;
the surface of the second sub-substrate layer far away from the first sub-substrate layer is provided with a grounding pattern layer.
7. The antenna of any one of claims 1-4, wherein the cross-sectional shape of the first dielectric material layer comprises: at least one of rectangular and trapezoidal;
the cross-sectional shape of the second dielectric material layer includes: at least one of rectangular and trapezoidal.
8. The antenna of claim 7, wherein the antenna is a liquid crystal antenna, the antenna further comprising:
A liquid crystal layer and a second substrate, the liquid crystal layer being located between the first substrate and the second substrate; the second substrate includes a phase shift pattern layer.
9. The antenna of claim 8, wherein the second substrate comprises a second substrate layer and a third layer of dielectric material embedded within the second substrate layer; and the vertical projection of the third dielectric material layer on the second substrate is overlapped with the vertical projection of the phase shifting pattern layer on the second substrate;
wherein the dielectric constant of the third dielectric material layer is greater than the dielectric constant of the second substrate layer.
10. The antenna of claim 9, wherein the second substrate layer includes a third slot, the third dielectric material layer being embedded within the third slot.
11. The antenna of any one of claims 1-4, wherein a size of the first dielectric material layer is greater than a size of the radiation pattern layer; the second dielectric material layer has a size larger than that of the feeding pattern layer.
12. The antenna of any one of claims 1-4, wherein the first and second layers of dielectric material are different materials;
And/or the thickness of the first dielectric material layer and the second dielectric material layer are different.
13. The antenna of claim 1, wherein the first substrate comprises: a first substrate layer and a first dielectric material layer; the first substrate layer comprises a first slot, the first slot is arranged in a radiation area of the first substrate, and the first dielectric material layer is embedded in the first slot; the dielectric constant of the first dielectric material layer is smaller than that of the first substrate layer.
14. The antenna of any one of claims 1-4, 13, wherein the material of the first dielectric material layer comprises: at least one of air or vacuum.
15. The antenna of claim 1, wherein the first substrate comprises: a first substrate layer and a second dielectric material layer; the first substrate comprises a second slot, the second slot is arranged in a feed area of the first substrate, and the second dielectric material layer is embedded in the second slot; the dielectric constant of the second dielectric material layer is larger than that of the first substrate layer.
16. The antenna of any one of claims 1-4, 15, wherein the material of the second dielectric material layer comprises: at least one of ceramic and lead zirconate titanate.
17. A method of manufacturing an antenna according to claim 1, comprising:
providing a first substrate; the first substrate comprises a radiation area and a feed area; the dielectric constant of the radiation area of the first substrate is smaller than that of the feed area of the first substrate;
forming a radiation pattern layer and a feeding pattern layer on the first substrate; the radiation pattern layer is arranged in a radiation area of the first substrate, and the feed pattern layer is arranged in a feed area of the first substrate;
a support structure is formed in the first sub-substrate layer prior to forming the second sub-substrate layer.
18. The method of manufacturing an antenna of claim 17, wherein the method of manufacturing a first substrate comprises:
forming a first slot and a second slot in a first substrate layer of the first substrate, wherein the first slot is arranged in a radiation area of the first substrate, and the second slot is arranged in a feed area of the first substrate;
a first layer of dielectric material is filled into the first trench and a second layer of dielectric material is filled into the second trench.
19. The method of claim 18, wherein forming the first slot and the second slot in the first substrate layer of the first substrate comprises:
Providing a first sub-substrate layer, and forming the first grooves and the second grooves on the surface of the first sub-substrate layer;
providing a second sub-substrate layer, and covering the first grooves and the second grooves with the second sub-substrate layer.
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|---|---|
| CN114614245A (en) | 2022-06-10 |
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