TWI818658B - Stacked antenna module and manufacturing method thereof - Google Patents

Abstract

A stacked antenna structure includes a first substrate, a first antenna array, a second substrate, a second antenna array, spacers, and a bonding layer. The first antenna array is located on a first surface of the first substrate. The second substrate is stacked with the first substrate in a vertical direction. The second antenna array is located on a second surface of the second substrate. The second antenna array is stacked with the first antenna array in the vertical direction. The spacers are located on the first surface of the first substrate and on the second surface of the second substrate. The bonding layer is located between the second substrate and the spacers.

Description

Stacked antenna module and manufacturing method thereof

The present disclosure relates to a stacked antenna module and a manufacturing method of the stacked antenna module.

Generally speaking, an antenna module includes a substrate and an antenna array disposed on the substrate to provide antenna gain. In order to improve the antenna gain of the antenna module, the size of the substrate is usually increased to carry more antenna arrays. However, a substrate with a larger size will not be conducive to miniaturization and will increase the space limitations of the antenna module. In addition, setting up multiple antenna arrays can easily degrade the isolation and cause interference between the antenna arrays, making it impossible to effectively increase the antenna gain of the antenna module.

One technical aspect of this disclosure is a stacked antenna module.

According to an embodiment of the present disclosure, a stacked antenna module includes a first substrate, a first antenna array, a second substrate, a second antenna array, a plurality of spacers and a bonding layer. The first antenna array is located on the first surface of the first substrate. The second substrate and the first substrate are stacked in a vertical direction. The second antenna array is located on the second surface of the second substrate. The second antenna array is vertically stacked with the first antenna array. A plurality of spacers are located on the first surface of the first substrate and the second surface of the second substrate. The bonding layer is located between the second substrate and the spacer.

In an embodiment of the present disclosure, the stacked antenna module further includes a grounding area and a feeder. The grounding area is located on a third surface of the first substrate relative to the first surface. The feeder line is located on the first substrate and electrically connected to the first antenna array.

In an embodiment of the present disclosure, the stacked antenna module further includes a first conductive part, a second conductive part and a third conductive part. The first conductive part is located in the first substrate and is electrically connected to the ground area. The second conductive portion is located in the second substrate. The third conductive portion is located in the bonding layer. The first conductive part, the second conductive part and the third conductive part are aligned in the vertical direction. The third conductive part is electrically connected to the second conductive part.

In an embodiment of the present disclosure, the surface material of the spacer is ferrite, and the interior of the spacer is a metal conductor.

In an embodiment of the present disclosure, the first antenna array includes a plurality of first antenna units. The first antenna units are electrically connected to each other. Each of the first antenna units is located between two adjacent spacers. The second antenna array includes a plurality of second antenna elements. The second antenna units are electrically connected to each other. Each of the second antenna units is located between adjacent two of the spacers. An area of one of the first antenna elements is different from an area of one of the second antenna elements.

In an embodiment of the present disclosure, the height of the first substrate is between 25 μm and 300 μm. The height of one of the first antenna units is between 11 μm and 18 μm. The height of the bonding layer is between 95μm and 105μm.

In an embodiment of the present disclosure, the distance between two adjacent first antenna units is less than or equal to the operating wavelength of the stacked antenna module.

One technical aspect of this disclosure is a manufacturing method of a stacked antenna module.

According to an embodiment of the present disclosure, a manufacturing method of a stacked antenna module includes: forming a first substrate, a second substrate and a bonding layer, wherein a first antenna array is formed on a first surface of the first substrate, and a first antenna array is formed on a second surface of the first substrate. A second antenna array is formed on the second surface of the substrate, and a plurality of spacers are formed on the first surface of the first substrate and the second surface of the second substrate; the first substrate, the second substrate and the bonding layer are stacked, so that The second substrate and the first substrate are aligned in the vertical direction, the first antenna array and the second antenna array are stacked in the vertical direction; and the first substrate, the second substrate and the bonding layer are pressed together so that the bonding layer is connected A plurality of spacers of the first substrate and the second substrate.

In an embodiment of the present disclosure, the first substrate, the second substrate and the bonding layer are pressed together such that the first conductive portion located in the first substrate, the second conductive portion located in the second substrate and the third conductive portion located in the bonding layer The three conductive parts are aligned in the vertical direction, and the second conductive part is electrically connected to the third conductive part.

In an embodiment of the present disclosure, the first antenna array and the second antenna array are formed such that the first antenna array includes a plurality of first antenna units, and the second antenna array includes a plurality of second antenna units, An area of one of the plurality of first antenna elements of the first antenna array is different from an area of one of the plurality of second antenna elements of the second antenna array.

In the above embodiments of the present disclosure, the configuration in which the second antenna array and the first antenna array of the stacked antenna module are stacked in the vertical direction can increase the frequency bandwidth and antenna gain of the stacked antenna module, and the second substrate The configuration stacked vertically with the first substrate can reduce the overall size of the stacked antenna module to achieve miniaturization, high gain, and high bandwidth. In addition, the spacer of the stacked antenna module has isolation and shielding functions, so the first antenna array and the second antenna array will not interfere with each other, which can improve the antenna gain of the stacked antenna module.

The following disclosure of embodiments provides many different implementations, or examples, for implementing various features of the provided subject matter. Specific examples of components and arrangements are described below to simplify the present application. Of course, these examples are examples only and are not intended to be limiting. Additionally, reference symbols and/or letters may be repeated in each instance. This repetition is for simplicity and clarity and does not by itself specify a relationship between the various embodiments and/or configurations discussed.

Spatially relative terms such as “below,” “below,” “lower,” “above,” “upper,” and the like may be used herein for convenience of description, to describe The relationship of one element or feature to another element or feature is illustrated in the drawings. Spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation illustrated in the figures. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

In addition, in order to clearly present the technical features of this case, the dimensions (such as length, width, thickness and depth) of the elements (such as layers, films, substrates, regions, etc.) in the drawings are exaggerated at unequal proportions, and some Component count will be reduced. Therefore, the description and explanation of the embodiments below are not limited to the number of components and the sizes and shapes of the components in the drawings, but should cover the size, shape, and deviations in both caused by actual manufacturing processes and/or tolerances. For example, flat surfaces shown in the drawings may have rough and/or non-linear features, while acute angles shown in the drawings may be rounded. Therefore, the components shown in the drawings of this case are mainly for illustration and are not intended to accurately depict the actual shapes of the components, nor are they intended to limit the patent scope of this case.

FIG. 1 illustrates a perspective view of a stacked antenna module 100 according to an embodiment of the present disclosure. Figure 2 illustrates a cross-sectional view along line 2-2 of the stacked antenna module 100 of Figure 1 . Referring to Figures 1 and 2 simultaneously, the stacked antenna module 100 includes a first substrate 110, a first antenna array 120, a second substrate 130a, a third substrate 130b, a second antenna array 140a, and a third antenna array. 140b, the spacer 150 and the bonding layer 160, where the bonding layer 160 is omitted in Figure 1.

In this embodiment, the number of substrates of the stacked antenna module 100 may be three (ie, the first substrate 110 , the second substrate 130 a and the third substrate 130 b ). In other embodiments, the number of substrates may be two or more, and the number of the first antenna array 120, the second antenna array 140a, the third antenna array 140b and the spacers 150 is not limited. The first substrate 110 , the second substrate 130 a and the third substrate 130 b of the stacked antenna module 100 are stacked in the vertical direction V.

In addition, the first antenna array 120 of the stacked antenna module 100 is located on the first surface 112 of the first substrate 110, the second antenna array 140a is located on the second surface 132a of the second substrate 130a, and the third antenna array 140b is located on the top surface 132b of the third substrate 130b. The first antenna array 120, the second antenna array 140a and the third antenna array 140b of the stacked antenna module 100 are stacked in the vertical direction V. The plurality of spacers 150 of the stacked antenna module 100 are respectively located on the first surface 112 of the first substrate 110, the second surface 132a of the second substrate 130a, and the top surface 132b of the third substrate 130b.

Specifically, the configuration in which the first antenna array 120, the second antenna array 140a, and the third antenna array 140b of the stacked antenna module 100 are stacked in the vertical direction V can increase the frequency bandwidth and bandwidth of the stacked antenna module 100. Antenna gain, and the overall size of the stacked antenna module 100 can be reduced to achieve miniaturization, high gain, and high bandwidth effects. In addition, the spacer 150 of the stacked antenna module 100 has the function of isolation and shielding, so the first antenna array 120, the second antenna array 140a and the third antenna array 140b will not interfere with each other, which can improve the stacked antenna module. Antenna gain for group 100.

In some embodiments, the stacked antenna module 100 further includes a first conductive part 116 , a second conductive part 136 and a third conductive part 166 . The first conductive portion 116 is located in the first substrate 110 and electrically connects the plurality of spacers 150 and the grounding area 170 . The second conductive portion 136 is located in the second substrate 130a and the third substrate 130b. The third conductive portion 166 is located in the bonding layer 160 . The third conductive part 166 is electrically connected to the second conductive part 136 and the spacer 150 . The first conductive part 116 , the second conductive part 136 and the third conductive part 166 are aligned in the vertical direction V. In this description, positional alignment means that elements can be substantially on the same straight line.

In some embodiments, the height H1 of the first substrate 110 may be between 25 μm and 300 μm (eg, 50 μm). The materials of the first substrate 110 , the second substrate 130 a and the third substrate 130 b may include BT resin, Ajinomoto build-up film (ABF) resin, liquid crystal polymer (LCP), polytetrafluoroethylene (Polytetraethylene, PTFE) and polyethylene. Polyimide (PI). The height H3 of the bonding layer 160 may be between 95 μm and 105 μm (eg, 100 μm) to improve the structural stability of the stacked antenna module 100 .

In some embodiments, the surface material of the spacer 150 may be ferrite. For example, ferrite can be an electromagnetic absorber. The plurality of spacers 150 located around the first antenna array 120 can absorb electromagnetic waves overflowing from the first antenna array 120 so that the planar arrays of the first antenna array 120 are not affected by each other. The plurality of spacers 150 located around the second antenna array 140a can absorb electromagnetic waves overflowing from the second antenna array 140a, so that the second antenna arrays 140a are not affected by each other. The plurality of spacers 150 located around the third antenna array 140b can absorb electromagnetic waves overflowing from the third antenna array 140b, so that the third antenna arrays 140b are not affected by each other. The plurality of spacers 150 can achieve isolation. The interior of the spacer 150 can be a metal conductor, which has a shielding effect. In addition, the radiation directivity of the stacked antenna module 100 can be controlled by adjusting the spacing between the spacers 150 .

In some embodiments, the first antenna array 120, the second antenna array 140a, and the third antenna array 140b of the stacked antenna module 100 have functions of receiving (RX) and transmitting (TX). The stacked antenna module 100 can be mixed with the local oscillator in the signal generator, the adjustable radio transmitter, and the radio receiver into TX mode and RX mode. In addition, the transmit (TX) output power of the stacked antenna module 100 can be adjusted by the first antenna array 120, the second antenna array 140a, and the third antenna array 140b in a hybrid beam forming (Hybrid Beam Forming) architecture.

FIG. 3 illustrates a perspective view of the first substrate 110 according to an embodiment of the present disclosure. Referring to FIGS. 1 to 3 , the first antenna array 120 includes a plurality of first antenna units 122 . The first antenna units 122 are electrically connected to each other. Each of the first antenna units 122 is located between two adjacent ones of the spacers 150 . The height H2 of the first antenna unit 122 may be between 11 μm and 18 μm. In some embodiments, when the center frequency is 23 GHz or 24 GHz, the gain of the first antenna array 120 may be 11.8 (dBi). When the center frequency is 25 GHz, the gain of the first antenna array 120 may be 11.1 (dBi). When the center frequency is 26 GHz, the gain of the first antenna array 120 may be 10.4 (dBi). Furthermore, the length (L1) of the first antenna unit 122 may be expressed as ,in . f is the center frequency of the stacked antenna module 100, and the center frequency can be between any millimeter wave frequency, for example, between 30 GHz and 300 GHz. ε is the dielectric constant, which can range from 2.8 to 3.0. The width (W1) of the first antenna element 122 can be expressed as . The area of the first antenna unit 122 can be expressed as .

The second antenna array 140a includes a plurality of second antenna elements 142a. The second antenna units 142a are electrically connected to each other. Each of the second antenna units 142a is located between adjacent two of the spacers 150. In addition, the length (L2) of the second antenna unit 142a can be expressed as ,in is the wavelength corresponding to the length of the first antenna unit 122 and is between 0.115mm and 1.45mm. The width (W2) of the second antenna element 142a can be expressed as ,in is the wavelength corresponding to the width of the first antenna unit 122 and is between 0.175mm and 1.79mm. The area of the second antenna unit 142a can be expressed as .

The third antenna array 140b includes a plurality of third antenna elements 142b. The third antenna units 142b are electrically connected to each other. Each of the third antenna units 142b is located between two adjacent ones of the spacer 150. In addition, the length (L3) of the third antenna unit 142b can be expressed as ,in is the wavelength corresponding to the length of the second antenna unit 142a and is between 0.057mm and 0.725mm. (W3) of the third antenna unit 142b can be expressed as ,in is the wavelength corresponding to the width of the second antenna unit 142a and is between 0.087mm and 0.895mm. The area of the third antenna unit 142b can be expressed as .

It is worth noting that the area of the first antenna unit 122 is different from the area of the second antenna unit 142a, and the area of the second antenna unit 142a is different from the area of the third antenna unit 142b. In detail, the area of the first antenna unit 122 is larger than the area of the second antenna unit 142a, and the area of the second antenna unit 142a is larger than the area of the third antenna unit 142b. Such a configuration can enable the stacked antenna module 100 to have a high antenna gain effect.

In some embodiments, the stacked antenna module 100 further includes a grounding region 170 and a feeder 180 . The grounding area 170 of the stacked antenna module 100 is located on the third surface 114 of the first substrate 110 relative to the first surface 112 . The feeder line 180 of the stacked antenna module 100 is located on the first substrate 110 and is electrically connected to the first antenna array 120 .

In some embodiments, the operating wavelength (λ) of the stacked antenna module 100 may be between 1/4λ and λ of the corresponding frequency band, for example, between 0.01 mm and 10 mm. The distance d1 between two adjacent first antenna units 122 and the distance d3 between two adjacent third antenna units 142b are less than or equal to the operating wavelength of the stacked antenna module 100 . For example, the distance d1 between two adjacent first antenna units 122 and the distance d3 between two adjacent third antenna units 142b may be half of the operating wavelength of the stacked antenna module 100 (λ/ 2), such a configuration allows the stacked antenna module 100 to achieve beamforming effects and reduce side lobe radiation (Grating lobe effects). The relationship between the working wavelength (λ) and the center frequency (f) of the stacked antenna module 100 is λ=C/f, where C is the speed of light.

It should be understood that the connection relationships and functions of the components that have been described will not be repeated and will be explained first. In the following description, the manufacturing method of the stacked antenna module will be explained.

FIG. 4 illustrates a flow chart of a manufacturing method of a stacked antenna module according to an embodiment of the present disclosure. The manufacturing method of the stacked antenna module includes the following steps. First, in step S1, a first substrate, a second substrate and a bonding layer are formed, wherein a first antenna array is formed on the first surface of the first substrate, and a second antenna array is formed on the second surface of the second substrate. , forming a plurality of spacers on the first surface of the first substrate and the second surface of the second substrate. Then in step S2, the first substrate, the second substrate and the bonding layer are stacked so that the second substrate and the first substrate are aligned in the vertical direction, and the first antenna array and the second antenna array are stacked in the vertical direction. . Then in step S3, the first substrate, the second substrate and the bonding layer are pressed together, so that the bonding layer connects the plurality of spacers of the first substrate and the second substrate. In the following description, each of the above steps will be explained in detail.

Figures 5A and 5B illustrate cross-sectional views at different stages of a manufacturing method of the first substrate 110 according to an embodiment of the present disclosure. Referring to FIGS. 5A and 5B simultaneously, first, the metal layer can be integrally formed on the first surface 112 of the first substrate 110 by thermal compression. Afterwards, the metal layer is etched to form the first antenna array 120, and the spacer 150 may be formed on the first surface 112 of the first substrate 110. Then, a first opening O1 can be formed in the first substrate 110 and the ground area 170 , where the first opening O1 can be formed by drilling or etching. After the first opening O1 is formed, the first conductive portion 116 can be formed in the first opening O1 to form a structure as shown in FIG. 5B.

Figures 6A and 6B illustrate cross-sectional views at different stages of a manufacturing method of the second substrate 130a according to an embodiment of the present disclosure. Referring to Figures 6A and 6B simultaneously, first, the metal layer can be integrally formed on the second surface 132a of the second substrate 130a by thermal compression. Afterwards, the metal layer is etched to form the second antenna array 140a, and the spacers 150 may be formed on the second surface 132a of the second substrate 130a. Next, a second opening O2 may be formed in the second substrate 130a, wherein the formation method of the second opening O2 may be the same as the formation method of the first opening O1. After the second opening O2 is formed, the second conductive portion 136 can be formed in the second opening O2 to form a structure as shown in FIG. 6B.

FIG. 7 illustrates a cross-sectional view of stacking the first substrate 110 , the second substrate 130 a , the third substrate 130 b and the bonding layer 160 according to an embodiment of the present disclosure. Referring to FIG. 7 , the formation method of the third antenna array 140b is similar to the formation method of the above-mentioned second antenna array 140a. The formation method of the spacer 150 on the third substrate 130b is similar to the formation method of the spacer 150 on the second substrate 130a. The formation method of the second conductive portion 136 on the third substrate 130b is similar to the formation method of the second conductive portion 136 on the second substrate 130a. In addition, the first antenna array 120 , the second antenna array 140 a and the third antenna array 140 b are formed such that the first antenna array 120 includes a plurality of first antenna units 122 and the second antenna array 140 a includes a plurality of second antenna units 122 . The antenna unit 142a and the third antenna array 140b include a plurality of third antenna units 142b. The area of the first antenna element 122 of the first antenna array 120 is different from the area of the second antenna element 142a of the second antenna array 140a. The area of the second antenna element 142a of the second antenna array 140a is different from that of the first antenna element 122 of the first antenna array 120. The area of the third antenna element 142b of the third antenna array 140b.

The interlayer dummy plate may be punched to form the bonding layer 160 , and the third conductive portion 166 may be formed in the bonding layer 160 . After the first substrate 110 , the second substrate 130 a , the third substrate 130 b and the joint layer 160 are formed, the first substrate 110 , the second substrate 130 a , the third substrate 130 b and the joint layer 160 may be stacked such that the first substrate 110 , the third substrate 130 b and the joint layer 160 may be stacked. The two substrates 130a and the third substrate 130b are aligned in the vertical direction V, that is to say, the first substrate 110, the second substrate 130a and the third substrate 130b are aligned with each other. In addition, the first antenna array 120, the second antenna array 140a, and the third antenna array 140b are stacked in the vertical direction V.

Returning to Figure 2, after stacking the first substrate 110, the second substrate 130a, the third substrate 130b and the bonding layer 160, the first substrate 110, the second substrate 130a, the third substrate 130b and the bonding layer 160 can be pressed. The bonding layer 160 connects the spacer 150, the second substrate 130a and the third substrate 130b. In addition, the first substrate 110 , the second substrate 130 a , the third substrate 130 b and the bonding layer 160 are pressed together such that the first conductive portion 116 located in the first substrate 110 , the second conductive portion 116 located in the second substrate 130 a and the third substrate 130 b The conductive part 136 and the third conductive part 166 located in the bonding layer 160 are aligned in the vertical direction V, and the second conductive part 136 is electrically connected to the third conductive part 166 .

The foregoing outlines features of several embodiments so that those skilled in the art may better understand aspects of the present disclosure. Those skilled in the art should appreciate that they may readily use the present disclosure as a basis for designing or modifying other processes and structures for carrying out the same purposes and/or achieving the same advantages of the embodiments introduced herein. Those skilled in the art should also recognize that such equivalent constructions do not depart from the spirit and scope of the present disclosure, and that they can be variously changed, substituted, and altered herein without departing from the spirit and scope of the present disclosure.

100:Stacked antenna module

110: First substrate

112: First surface

114:Third surface

116:First conductive part

120: First antenna array

122: First antenna unit

130a: Second substrate

132a: Second surface

130b: Third substrate

132b:Top surface

136: Second conductive part

140a: Second antenna array

142a: Second antenna unit

140b: Third antenna array

142b: The third antenna unit

150: Spacer

160:Jointing layer

166:The third conductive part

170: touchdown area

180:Feeder

d1: distance

d3: distance

H1: height

H2: height

H3: height

O1: First opening

O2: Second opening

S1: Steps

S2: Step

S3: Steps

V: vertical direction

2-2: Line segment

One embodiment of the present disclosure is best understood from the following detailed description when read in conjunction with the accompanying drawings. It is emphasized that, in accordance with standard industry practice, various features are not drawn to scale and are for illustrative purposes only. In fact, the dimensions of the various features may be arbitrarily increased or reduced for clarity of discussion. Figure 1 is a perspective view of a stacked antenna module according to an embodiment of the present disclosure. Figure 2 shows a cross-sectional view of the stacked antenna module in Figure 1 along line 2-2. FIG. 3 illustrates a perspective view of a first substrate according to an embodiment of the present disclosure. FIG. 4 illustrates a flow chart of a manufacturing method of a stacked antenna module according to an embodiment of the present disclosure. Figures 5A and 5B illustrate cross-sectional views of a manufacturing method of the first substrate at different stages according to an embodiment of the present disclosure. 6A and 6B illustrate cross-sectional views at different stages of a manufacturing method of a second substrate according to an embodiment of the present disclosure. FIG. 7 illustrates a cross-sectional view of stacking a first substrate, a second substrate, a third substrate and a bonding layer according to an embodiment of the present disclosure.

Domestic storage information (please note in order of storage institution, date and number) without Overseas storage information (please note in order of storage country, institution, date, and number) without

100:Stacked antenna module

110: First substrate

112: First surface

114:Third surface

116:First conductive part

120: First antenna array

122: First antenna unit

130a: Second substrate

132a: Second surface

130b: Third substrate

132b:Top surface

136: Second conductive part

140a: Second antenna array

142a: Second antenna unit

140b: Third antenna array

142b: The third antenna unit

150: Spacer

160:Jointing layer

166:The third conductive part

170: touchdown area

H1: height

H2: height

H3: height

V: vertical direction

Claims (8)

A stacked antenna module includes: a first substrate; a first antenna array located on a first surface of the first substrate and including a plurality of first antenna units, and the first antenna array is Line units are electrically connected to each other; a second substrate is stacked with the first substrate in a vertical direction; a second antenna array is located on a second surface of the second substrate and includes a plurality of Two antenna units, wherein the second antenna array and the first antenna array are stacked in the vertical direction, and the second antenna units are electrically connected to each other; a plurality of spacers located on the On the first surface of the first substrate and the second surface of the second substrate, each of the first antenna units is located between adjacent two of the spacers, and the Each of the second antenna units is located between adjacent two of the spacers, wherein an area of one of the first antenna units is different from that of one of the second antenna units. an area; and a bonding layer located between the second substrate and the spacer. The stacked antenna module of claim 1, further comprising: a grounding area located on a third surface of the first substrate relative to the first surface; and a feeder located on the first substrate and electrically connected to the first antenna array. The stacked antenna module according to claim 2, further comprising: a first conductive part located in the first substrate and electrically connected to the ground region; a second conductive part located on the second substrate in; and a third conductive portion located in the bonding layer, wherein the first conductive portion, the second conductive portion and the third conductive portion are aligned in the vertical direction, and the The third conductive part is electrically connected to the second conductive part. The stacked antenna module according to claim 1, wherein the surface material of the spacer is ferrite, and the interior of the spacer is a metal conductor. The stacked antenna module according to claim 1, wherein the height of the first substrate is between 25 μm and 300 μm, and the height of one of the first antenna units is between 11 μm and 18 μm, and the The height of the bonding layer is between 95μm and 105μm. The stacked antenna module according to claim 1, wherein the distance between two adjacent first antenna units is less than or equal to the working wavelength of the stacked antenna module. A method of manufacturing a stacked antenna module, including: A first substrate, a second substrate and a bonding layer are formed, wherein a first antenna array is formed on a first surface of the first substrate, and a first antenna array is formed on a second surface of the second substrate. a second antenna array, a plurality of spacers on the first surface of the first substrate and the second surface of the second substrate; stacking the first substrate, the second substrate; The bonding layer enables the second substrate and the first substrate to be aligned in a vertical direction, and the first antenna array and the second antenna array are stacked in the vertical direction; and Pressing the first substrate, the second substrate and the bonding layer so that the bonding layer connects the spacer of the first substrate and the second substrate; wherein the first antenna is formed The array and the second antenna array are such that the first antenna array includes a plurality of first antenna units, and the first antenna units are electrically connected to each other, and each of the first antenna units are located between two adjacent spacers, wherein the second antenna array includes a plurality of second antenna units, and the second antenna units are electrically connected to each other, and the second antenna array Each of the line elements is located between adjacent two of the spacers; wherein the area of one of the first antenna elements of the first antenna array is different from that of the second antenna array The area of one of the second antenna units. The method of claim 7, wherein pressing the first The substrate, the second substrate and the bonding layer include a first conductive portion located in the first substrate, a second conductive portion located in the second substrate and a first conductive portion located in the bonding layer. The three conductive parts are aligned in the vertical direction, and the second conductive part is electrically connected to the third conductive part.

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