TWI841264B - Circuit board for transmitting signals in frequency band of terahertz and method of manufacturing the same - Google Patents

Abstract

A circuit board for transmitting signals in a frequency band of terahertz and a method of manufacturing the same are provided. The circuit board includes a dielectric layer, a first metal pattern layer, a second metal pattern layer, at least one transceiver antenna and at least one electromagnetic wave transceiver module. The first metal pattern layer has at least one radiation hole. The transceiver antenna and the electromagnetic wave transceiver module are disposed in the dielectric layer, and the transceiver antenna overlaps the radiation hole. When the electromagnetic wave transceiver module generates an electromagnetic wave signal, the transceiver antenna receives the electromagnetic wave signal and radiates an electromagnetic wave. The electromagnetic wave radiates outside from the radiation hole, in which the frequency of the electromagnetic wave signal is in a range of a terahertz band. The frequencies of the electromagnetic wave and the electromagnetic wave signal are the same, thereby performing wireless communication between the electromagnetic wave transceiver module and the transceiver antenna to achieve the advantage of reducing the layout space.

Description

Circuit board for transmitting terahertz frequency signal and manufacturing method thereof

The present application relates to a circuit board and a manufacturing method thereof, and in particular to a circuit board for transmitting terahertz frequency signals and a manufacturing method thereof.

Traditionally, the signal transmission between the transmitting/receiving circuit and the antenna is transmitted through wires, including the use of microstrip lines, strip lines, coaxial cables, etc. However, even if the transmitting/receiving circuit is miniaturized into a chip, the chip and the antenna will still take up more space for wired transmission, which is not conducive to the miniaturization of mobile devices (such as mobile phones or tablets). Currently, the antenna and the transmitting/receiving circuit are integrated into an integrated circuit (chip) through the antenna packaging technology (Antenna in Package, AiP) to become a complete transceiver module. However, the manufacturing process of antenna packaging technology is still quite difficult, resulting in the current antenna packaging yield is still not ideal.

At least one embodiment of the present invention provides a circuit board for transmitting terahertz frequency signals and a manufacturing method thereof, which can enable signal transmission between a transmitting/receiving circuit and an antenna in a wireless transmission manner.

At least one embodiment of the present invention provides a circuit board for transmitting terahertz frequency signals, comprising a dielectric layer, a first metal pattern layer, a second metal pattern layer, at least one transceiver antenna, and at least one electromagnetic wave transceiver module. The first metal pattern layer has at least one radiation hole. The first metal pattern layer, the second metal pattern layer and the dielectric layer are stacked, and the dielectric layer is disposed between the first metal pattern layer and the second metal pattern layer. The transceiver antenna is disposed at the dielectric layer corresponding to the radiation hole, and the vertical projection overlaps with the radiation hole. The electromagnetic wave transceiver module is disposed in the dielectric layer, and there is a transmission distance between the electromagnetic wave transceiver module and the transceiver antenna. When the electromagnetic wave transceiver module generates an electromagnetic wave signal, wherein the frequency of the electromagnetic wave signal is within the terahertz frequency band, the transceiver antenna receives the electromagnetic wave signal and radiates electromagnetic waves, and the electromagnetic waves radiate outward from the radiation hole, wherein the frequency of the electromagnetic waves is the same as the frequency of the electromagnetic wave signal. When the transceiver antenna receives the electromagnetic wave transmitted from outside the radiation hole, the transceiver antenna radiates the electromagnetic wave to the electromagnetic wave transceiver module.

In at least one embodiment of the present invention, the length of the radiation hole is in the range of one quarter to one half of the wavelength of the electromagnetic wave.

In at least one embodiment of the present invention, the transmission distance is in the range of one quarter to one half of the wavelength of the electromagnetic wave.

In at least one embodiment of the present invention, the transceiver antenna is an array antenna and includes a plurality of antenna units. The antenna units are arranged at intervals, and the distance between any two adjacent antenna units is in the range of one eighth to one quarter of the wavelength of the electromagnetic wave.

In at least one embodiment of the present invention, the circuit board includes a plurality of electromagnetic wave transceiver modules, and the distance between any two adjacent electromagnetic wave transceiver modules is greater than twice the wavelength of the electromagnetic wave.

In at least one embodiment of the present invention, the circuit board includes a plurality of electromagnetic wave transceiver modules and at least one shielding structure, and the shielding structure is disposed between any two adjacent electromagnetic wave transceiver modules.

At least one embodiment of the present invention provides a method for manufacturing a circuit board for transmitting terahertz frequency signals, including: providing a first substrate, the first substrate including a first substrate dielectric layer and a first substrate metal layer, wherein the first substrate dielectric layer and the first substrate metal layer are stacked, the first substrate metal layer has at least one radiation hole, at least one transceiver antenna is arranged at the first substrate dielectric layer corresponding to the radiation hole, and its vertical projection overlaps with the radiation hole; providing a second substrate, the second substrate including a second substrate dielectric layer and a second substrate metal layer, wherein the second substrate dielectric layer and the second substrate metal layer are stacked, at least one electromagnetic wave transceiver module is arranged in the second substrate dielectric layer; and stacking the first substrate and the second substrate, and aligning the electromagnetic wave transceiver module with the transceiver antenna.

In at least one embodiment of the present invention, the step of forming the first substrate includes: providing a first single panel; patterning the metal layer of the first single panel to form a radiation hole; providing a double panel; patterning one of the metal layers of the double panel to form a transceiver antenna; patterning the other metal layer of the double panel to form at least one hole, wherein the vertical projection of the transceiver antenna overlaps with the hole; and pressing the first single panel and the double panel together to combine the first single panel and the double panel, wherein the vertical projection of the transceiver antenna overlaps with the radiation hole.

In at least one embodiment of the present invention, when there are a plurality of transceiver antennas, the step of providing a first substrate further includes: forming a shielding hole between any two adjacent transceiver antennas on the first substrate; and filling the shielding structure into the shielding hole.

In at least one embodiment of the present invention, the step of forming the second substrate includes: providing a first dielectric layer, a bonding dielectric layer, a second single-sided board and an electromagnetic wave transceiver module, wherein the bonding dielectric layer is located between the first dielectric layer and the second dielectric layer of the second single-sided board, and the bonding dielectric layer forms at least one through-hole, and the electromagnetic wave transceiver module is located in the through-hole; and pressing the first dielectric layer, the bonding dielectric layer and the second single-sided board to combine the first dielectric layer, the bonding dielectric layer and the second single-sided board.

Based on the above, in the circuit board disclosed in the above embodiments, the electromagnetic wave transceiver module disposed in the dielectric layer can emit electromagnetic wave signals in the terahertz frequency band and receive electromagnetic waves, and this terahertz frequency band overlaps with the frequency range of the millimeter wave radiated by the transceiver antenna, so that wireless signal transmission can be performed between the electromagnetic wave transceiver module and the transceiver antenna, thereby achieving the advantage of reducing the layout space of the circuit board.

In the following text, in order to clearly present the technical features of the present invention, the dimensions (e.g., length, width, thickness, and depth) of the elements (e.g., layers, films, substrates, and regions, etc.) in the drawings will be enlarged in unequal proportions, and the number of some elements will be reduced. Therefore, the description and explanation of the embodiments below are not limited to the number of elements in the drawings and the dimensions and shapes presented by the elements, but should cover the dimensions, shapes, and deviations therefrom caused by actual processes and/or tolerances. For example, the flat surface shown in the drawings may have rough and/or nonlinear features, and the sharp corners shown in the drawings may be rounded. Therefore, the elements presented in the drawings of the present invention are mainly used for illustration, and are not intended to accurately depict the actual shape of the elements, nor are they intended to limit the scope of the patent application of the present invention.

Secondly, the words "approximately", "approximately" or "substantially" used in the present case not only cover the numerical values and numerical ranges clearly recorded, but also cover the permissible deviation range that can be understood by a person of ordinary skill in the art to which the invention belongs, wherein the deviation range can be determined by the error generated during measurement, and the error is caused by, for example, the limitation of the measurement system or the process conditions. In addition, "approximately" can mean within one or more standard deviations of the above numerical values, such as ±30%, ±20%, ±10% or ±5%. The words "approximately", "approximately" or "substantially" used in this text may select an acceptable range of deviation or standard deviation according to the optical, etching, mechanical or other properties, and do not apply a single standard deviation to all the above optical, etching, mechanical and other properties.

The terms used in this case are only for describing specific embodiments and are not intended to limit the scope of the patent application. Unless otherwise limited, the singular form "a", "an" or "the" can also be used to represent the plural form.

The circuit board for transmitting terahertz frequency signals of the present application can be used in any electronic device with wireless communication function, which can enable signal transmission between the transmitting/receiving circuit and the antenna in a wireless transmission manner.

FIG1A is a cross-sectional schematic diagram of a circuit board 100 for transmitting terahertz frequency signals according to at least one embodiment of the present application. Referring to FIG1A , the circuit board 100 includes multiple dielectric layers 111 and 112, a first metal pattern layer 121, a second metal pattern layer 122, a third metal pattern layer 123, at least one transceiver antenna 130, and at least one electromagnetic wave transceiver module 140. Taking FIG1A as an example, the circuit board 100 includes multiple transceiver antennas 130 and multiple electromagnetic wave transceiver modules 140. In other embodiments, the number of each of the transceiver antenna 130 and the electromagnetic wave transceiver module 140 included in the circuit board 100 may be only one.

In FIG. 1A , the present application uses two dielectric layers 111 and 112 as an example, but the present invention is not limited thereto. The dielectric layers 111 and 112 are located between the first metal pattern layer 121, the second metal pattern layer 122, and the third metal pattern layer 123, and the dielectric layers 111 and 112, the first metal pattern layer 121, the second metal pattern layer 122, and the third metal pattern layer 123 are stacked and bonded together. It should be noted that the board material of the circuit board 100 is not limited, and a soft substrate or a hard substrate can be used.

The first metal pattern layer 121 has a plurality of radiation holes 124, exposing the upper portion of the dielectric layer 111. In addition, the first metal pattern layer 121 also has a trace or/and a ground pattern. The second metal pattern layer 122 also has a trace or/and a ground pattern. The third metal pattern layer 123 has a plurality of holes 125, and the holes 125 overlap with the radiation holes 124 when vertically projected toward the first metal pattern layer 121. In addition, the third metal pattern layer 123 also has a trace or/and a ground pattern.

In this example, the number of the radiation holes 124 and the holes 125 is the same as the number of the transceiver antennas 130, and the positions of the transceiver antennas 130 correspond to and align with the radiation holes 124 and the holes 125. The length l of each radiation hole 124 is in the range of one quarter to one half of the wavelength of the electromagnetic wave radiated by the corresponding transceiver antenna 130, so that the corresponding transceiver antenna 130 obtains a greater gain.

FIG1B is an enlarged schematic diagram of the transceiver antenna 130 of FIG1A . Referring to FIG1A and FIG1B , the transceiver antenna 130 is disposed in the dielectric layer 111 and is located between the radiation hole 124 and the hole 125 . Each transceiver antenna 130 overlaps with the corresponding radiation hole 124 when vertically projected toward the corresponding radiation hole 124 , and overlaps with the corresponding hole 125 when vertically projected toward the corresponding hole 125 . Each transceiver antenna 130 is an array antenna and includes a plurality of antenna units 131 . The antenna units 131 are arranged at intervals, and there is a distance d between any two adjacent antenna units 131, wherein the length of the distance d is in the range of one eighth to one quarter of the wavelength of the electromagnetic wave radiated by the corresponding transceiver antenna 130, so as to improve the bandwidth of the transceiver antenna 130.

The antenna unit 131 is a patch antenna. In this example, the transceiver antenna 130 is an array antenna in which the antenna units 131 are arranged in 1 column and 4 rows (1x4), but the present invention is not limited thereto. The transceiver antenna 130 may also be an array antenna in which the antenna units 131 are arranged in 4 columns and 4 rows (4x4) or 8 columns and 8 rows (8x8). The transceiver antenna 130 may be controlled to form a predetermined antenna pattern in a beamforming manner, and the beam emitted by the transceiver antenna 130 may perform beam scanning from the radiation hole 124 to the outside of the circuit board 100.

The electromagnetic wave transceiver modules 140 are disposed in the dielectric layer 112 and have a transmission distance D with the transceiver antennas 130 . The electromagnetic wave transceiver modules 140 are aligned with the transceiver antennas 130 through the holes 125 , so that each transceiver antenna 130 is aligned with a radiation hole 124 and a hole 125 .

FIG2A is a schematic diagram of wireless signal transmission between the transceiver antenna 130 and the electromagnetic wave transceiver module 140, and FIG2B is a block diagram of wireless signal transmission between the transceiver antenna 130 and the electromagnetic wave transceiver module 140. Referring to FIG1A, FIG2A and FIG2B, in this example, the electromagnetic wave transceiver module 140 can be made into a chip, such as an integrated circuit (IC). Each electromagnetic wave transceiver module 140 has a processor 141, a transmitting circuit 142, a receiving circuit 143, an electromagnetic wave transmitter 144 and an electromagnetic wave receiver 145.

The processor 141 is used to process electronic signals to perform operations, identification, eigenvalue sampling and other functions. The transmitting circuit 142 is used to process the electronic signals radiated by the transceiver antenna 130. The receiving circuit 143 is used to process the electronic signals converted from the electromagnetic waves radiated by the transceiver antenna 130. The electromagnetic wave transmitter 144 is used to generate electromagnetic wave signals. The electromagnetic wave transmitter 144 can be a laser diode or a maser diode. The electromagnetic wave receiver 145 is used to convert the received electromagnetic waves into electronic signals. The electromagnetic wave receiver 145 can be a photodiode.

The frequency of the electromagnetic wave signal is within the range of the terahertz frequency band. The terahertz frequency band is a frequency range of 100 GHz (0.1 THz) to 10000 GHz (10 THz), wherein the low frequency portion within the terahertz frequency band overlaps with the frequency band of the millimeter wave of the electromagnetic wave radiated by the transceiver antenna 130. Therefore, the present application generates an electromagnetic wave signal through the electromagnetic wave transceiver module 140, whose frequency is located in the low frequency portion within the terahertz frequency band and is the same as the frequency of the electromagnetic wave radiated by the transceiver antenna 130, thereby enabling wireless signal transmission between the electromagnetic wave transceiver module 140 and the transceiver antenna 130.

Furthermore, the transmission distance D between the electromagnetic wave transceiver module 140 and the transceiver antenna 130 is in the range of one quarter to one half of the wavelength of the electromagnetic wave radiated by the corresponding transceiver antenna 130. The transmission distance D in this range can reduce the loss of electromagnetic wave signals and electromagnetic wave transmission.

The process of radiating electromagnetic waves at the transceiver antenna 130 is as follows: the electronic signal is modulated by the transmitting circuit 142, and the electromagnetic wave transmitter 144 generates and transmits an electromagnetic wave signal to the transceiver antenna 130 according to the modulated electronic signal. The transceiver antenna 130 radiates electromagnetic waves according to the received electromagnetic wave signal, and the electromagnetic wave can radiate outward from the radiation hole 124. The process of receiving electromagnetic waves at the transceiver antenna 130 is as follows: the transceiver antenna 130 receives the electromagnetic wave transmitted from the radiation hole 124 and radiates the electromagnetic wave to the electromagnetic wave transceiver module 140, and the electromagnetic wave receiver 145 converts the received electromagnetic wave into an electronic signal and transmits it to the receiving circuit 143, and the receiving circuit 143 demodulates the electronic signal and transmits it to the processor 141.

It should be noted that the distance L between any two adjacent electromagnetic wave transceiver modules 140 is greater than twice the electromagnetic wave wavelength to avoid interference between the adjacent electromagnetic wave transceiver modules 140. Furthermore, the circuit board 100 also includes a plurality of shielding structures 150, and the shielding structures 150 can be metal structures, such as copper columns. The shielding structures 150 can be arranged between any two adjacent electromagnetic wave transceiver modules 140, so that the shielding effect between the electromagnetic wave transceiver modules 140 can be better. In addition, the shielding structure 150 can also be arranged between any two adjacent transceiver antennas 130 to shield the interference between the transceiver antennas 130.

3A to 3C are cross-sectional schematic diagrams of forming a first substrate 400 in a method of manufacturing a circuit board for transmitting terahertz frequency signals according to at least one embodiment of the present application. Referring to FIG3A , first, a first single-panel board 200 is provided, wherein the first single-panel board 200 includes a dielectric layer 210 and a metal layer 220. The dielectric layer 210 and the metal layer 220 are stacked. Then, the metal layer 220 is patterned to form a plurality of radiation holes 124 to expose the dielectric layer 210, for example, by patterning the metal layer 220 by lithography and etching. Referring to FIG3B , thereafter, a double-panel board 300 is provided, wherein the double-panel board 300 includes a dielectric layer 310 and two metal layers 320 and 330. The metal layers 320 and 330 are stacked on the upper and lower surfaces of the dielectric layer 310. Then, the metal layer 320 is patterned to form the transceiver antenna 130. Further, the metal layer 330 is patterned to form the hole 125, wherein the transceiver antenna 130 overlaps with the hole 125 when vertically projected toward the hole 125. The method of patterning the metal layers 320 and 330 includes, for example, lithography and etching.

Referring to FIG. 3C , the first single panel 200 and the double panel 300 are then pressed together in a manner that the dielectric layer 210 and the metal layer 320 face each other, so that the first single panel 200 and the double panel 300 are combined, wherein the vertical projections of the transceiver antennas 130 toward the radiation holes 124 overlap with the radiation holes 124. The radiation holes 124 and the holes 125 are respectively located on opposite sides of the combined first single panel 200 and the double panel 300.

The first single panel 200 and the double panel 300 are combined to form a first substrate 400, wherein the first substrate 400 includes a first substrate dielectric layer 410 and two first substrate metal layers 420 and 430, and the first substrate metal layers 420 and 430 are respectively stacked on the upper and lower surfaces of the first substrate dielectric layer 410. The transceiver antenna 130 is disposed in the first substrate dielectric layer 410.

Referring to FIG. 1A , the first substrate dielectric layer 410 is the dielectric layer 111 of the circuit board 100. The first substrate metal layer 420 can be patterned to form a wiring or/and a grounding pattern, thereby forming a first metal pattern layer 121. The first substrate metal layer 430 can be patterned to form a wiring or/and a grounding pattern, thereby forming a third metal pattern layer 123. Then, a plurality of shielding holes are formed between any two adjacent transceiver antennas 130 of the first substrate 400, wherein the shielding holes are formed by, for example, laser drilling. Thereafter, the shielding structure 150 is filled into the shielding holes.

FIG4 is a cross-sectional schematic diagram of forming a second substrate 600 in a method for manufacturing a circuit board for transmitting terahertz frequency signals according to at least one embodiment of the present application. Referring to FIG1A and FIG4 , first, a first dielectric layer 510, a bonding dielectric layer 520, a second single-sided board 530, and an electromagnetic wave transceiver module 140 are provided. The second single-sided board 530 includes a second dielectric layer 531 and a metal layer 532, wherein the second dielectric layer 531 and the metal layer 532 are stacked. The bonding dielectric layer 520 is located between the first dielectric layer 510 and the second dielectric layer 531, and forms at least one through-hole 521. In this example, the bonding dielectric layer 520 forms two through-holes 521, and the electromagnetic wave transceiver module 140 is located in the through-holes 521, respectively. The material of the first dielectric layer 510 , the bonding dielectric layer 520 and the second dielectric layer 531 is, for example, liquid crystal polymer (LCP).

Next, the first dielectric layer 510, the bonding dielectric layer 520 and the second single-sided board 530 are pressed together to form a second substrate 600, wherein the second substrate 600 includes a second substrate dielectric layer 610 and a second substrate metal layer 620, and the second substrate dielectric layer 610 and the second substrate metal layer 620 are stacked. The second substrate dielectric layer 610 is the dielectric layer 112 of the circuit board 100. The second substrate metal layer 620 can be patterned to form a routing or/and a grounding pattern, thereby forming a second metal pattern layer 122. The electromagnetic wave transceiver module 140 is disposed in the second substrate dielectric layer 610.

Afterwards, a plurality of shielding holes are formed between any two adjacent electromagnetic wave transceiver modules 140 on the second substrate 600. Next, the shielding structure 150 is filled into the shielding holes.

FIG5 is a cross-sectional schematic diagram of a first substrate 400 and a second substrate 600 combined in a method for manufacturing a circuit board for transmitting terahertz frequency signals according to at least one embodiment of the present application. Referring to FIG1A and FIG5, the first substrate 400 and the second substrate 600 are stacked (falsely pressed) in a manner that the first substrate metal layer 430 and the second substrate dielectric layer 610 face each other, and the electromagnetic wave transceiver module 140 is aligned with the transceiver antenna 130 to manufacture the circuit board 100. The first substrate dielectric layer 410 is the dielectric layer 111, and the second substrate dielectric layer 610 is the dielectric layer 112. The first substrate metal layer 420 may form a first metal pattern layer 121 , the second substrate metal layer 620 may form a second metal pattern layer 122 , and the first substrate metal layer 430 may form a third metal pattern layer 123 .

In summary, in the circuit board disclosed in the above embodiments, the electromagnetic wave transceiver module disposed in the dielectric layer can emit electromagnetic wave signals in the terahertz frequency band and receive electromagnetic waves, and this terahertz frequency band overlaps with the frequency range of the millimeter waves radiated by the transceiver antenna, so that wireless signal transmission can be performed between the electromagnetic wave transceiver module and the transceiver antenna, thereby achieving the advantage of reducing the layout space of the circuit board.

Although the present invention has been disclosed as above by way of embodiments, they are not intended to limit the present invention. A person having ordinary knowledge in the technical field to which the present invention belongs may make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the definition of the attached patent application scope.

100: Circuit board 111: Dielectric layer 112: Dielectric layer 121: First metal pattern layer 122: Second metal pattern layer 123: Third metal pattern layer 124: Radiation hole 125: Hole 130: Transceiver antenna 131: Antenna unit 140: Electromagnetic wave transceiver module 141: Processor 142: Transmitter circuit 143: Receiving circuit 144: Electromagnetic wave transmitter 145: Electromagnetic wave receiver 150: Shielding structure 200: First single panel 210: Dielectric layer 220: Metal layer 300: Double panel 310: Dielectric layer 320,330: Metal layer 400: First substrate 410: First substrate dielectric layer 420,430: First substrate metal layer 510: First dielectric layer 520: Bonding dielectric layer 521: Perforation 530: Second single panel 531: Second dielectric layer 532: Metal layer 600: Second substrate 610: Second substrate dielectric layer 620: Second substrate metal layer l: Length d: Spacing D: Transmission distance L: Spacing

In order to more fully understand the embodiments and their advantages, reference is now made to the following description in combination with the attached drawings, wherein: [Figure 1A] is a cross-sectional schematic diagram of a circuit board for transmitting terahertz frequency signals in at least one embodiment of the present application; [Figure 1B] is an enlarged schematic diagram of the transceiver antenna of Figure 1A; [Figure 2A] is a schematic diagram of wireless signal transmission between the transceiver antenna and the electromagnetic wave transceiver module; [Figure 2B] is a block diagram of wireless signal transmission between the transceiver antenna and the electromagnetic wave transceiver module; [Figure 3A] to [Figure 3C] are cross-sectional schematic diagrams of forming a first substrate in a method for manufacturing a circuit board for transmitting terahertz frequency signals in at least one embodiment of the present application; [Figure 4] is a schematic cross-sectional view of forming a second substrate in a method for manufacturing a circuit board for transmitting terahertz frequency signals in at least one embodiment of the present application; and [Figure 5] is a schematic cross-sectional view of combining a first substrate and a second substrate in a method for manufacturing a circuit board for transmitting terahertz frequency signals in at least one embodiment of the present application.

Domestic storage information (please note in the order of storage institution, date, and number) None Foreign storage information (please note in the order of storage country, institution, date, and number) None

100: Circuit board

111: Dielectric layer

112: Dielectric layer

121: First metal pattern layer

122: Second metal pattern layer

123: The third metal pattern layer

124: Radiation hole

125: Hole

130: Transceiver antenna

131: Antenna unit

140:Electromagnetic wave transceiver module

150: Shielding structure

l: length

D: Transmission distance

L: Spacing

Claims (10)

A circuit board for transmitting terahertz frequency signals, comprising: a dielectric layer; a first metal pattern layer having at least one radiation hole; a second metal pattern layer, wherein the first metal pattern layer, the second metal pattern layer and the dielectric layer are stacked, and the dielectric layer is disposed between the first metal pattern layer and the second metal pattern layer; at least one transceiver antenna, disposed at the dielectric layer corresponding to the radiation hole, and its vertical projection overlaps with the radiation hole; and at least one electromagnetic wave transceiver module, disposed in the dielectric layer, and there is a transmission distance between the electromagnetic wave transceiver module and the transceiver antenna; When the electromagnetic wave transceiver module generates an electromagnetic wave signal, wherein the frequency of the electromagnetic wave signal is within a terahertz frequency band, the transceiver antenna receives the electromagnetic wave signal and radiates an electromagnetic wave, and the electromagnetic wave radiates outward from the radiation hole, wherein the frequency of the electromagnetic wave is the same as the frequency of the electromagnetic wave signal; When the transceiver antenna receives the electromagnetic wave transmitted from outside the radiation hole, the transceiver antenna radiates the electromagnetic wave to the electromagnetic wave transceiver module. A circuit board for transmitting terahertz frequency signals as described in claim 1, wherein a length of the radiation hole is in the range of one quarter to one half of a wavelength of the electromagnetic wave. A circuit board for transmitting terahertz frequency signals as described in claim 1, wherein the transmission distance is in the range of one quarter to one half of a wavelength of the electromagnetic wave. A circuit board for transmitting terahertz frequency signals as described in claim 1, wherein the transceiver antenna is an array of antennas and includes a plurality of antenna units, the antenna units are arranged at intervals, and the distance between any two adjacent antenna units is in the range of one eighth to one quarter of a wavelength of the electromagnetic wave. The circuit board for transmitting terahertz frequency signals as described in claim 1 includes a plurality of electromagnetic wave transceiver modules, and the distance between any two adjacent electromagnetic wave transceiver modules is greater than twice the wavelength of one electromagnetic wave. The circuit board for transmitting terahertz frequency signals as described in claim 1 includes a plurality of electromagnetic wave transceiver modules and at least one shielding structure, wherein the shielding structure is disposed between any two adjacent electromagnetic wave transceiver modules. A method for manufacturing a circuit board for transmitting terahertz frequency signals, comprising: Providing a first substrate, the first substrate comprising a first substrate dielectric layer and a first substrate metal layer, wherein the first substrate dielectric layer and the first substrate metal layer are stacked, the first substrate metal layer has at least one radiation hole, at least one transceiver antenna is arranged at the first substrate dielectric layer corresponding to the radiation hole, and its vertical projection overlaps with the radiation hole; Providing a second substrate, the second substrate comprising a second substrate dielectric layer and a second substrate metal layer, wherein the second substrate dielectric layer and the second substrate metal layer are stacked, at least one electromagnetic wave transceiver module is arranged in the second substrate dielectric layer; and Stacking the first substrate and the second substrate, and aligning the electromagnetic wave transceiver module with the transceiver antenna. The method for manufacturing a circuit board for transmitting terahertz frequency signals as described in claim 7, wherein the step of forming the first substrate includes: Providing a first single panel; Patterning a metal layer of the first single panel to form the radiation hole; Providing a double panel; Patterning one of the metal layers of the double panel to form the transceiver antenna; Patterning the other metal layer of the double panel to form at least one hole, wherein the vertical projection of the transceiver antenna overlaps with the hole; and Pressing the first single panel and the double panel together, wherein the first single panel and the double panel are combined, wherein the vertical projection of the transceiver antenna overlaps with the radiation hole. The method for manufacturing a circuit board for transmitting terahertz frequency signals as described in claim 7, wherein when the transceiver antenna is a plurality of the transceiver antennas, the step of providing the first substrate further includes: forming a shielding hole between any two adjacent transceiver antennas of the first substrate; filling a shielding structure into the shielding hole. The method for manufacturing a circuit board for transmitting terahertz frequency signals as described in claim 7, wherein the step of forming the second substrate includes: Providing a first dielectric layer, a bonding dielectric layer, a second single-sided board and the electromagnetic wave transceiver module, wherein the bonding dielectric layer is located between the first dielectric layer and a second dielectric layer of the second single-sided board, and the bonding dielectric layer forms at least one through-hole, and the electromagnetic wave transceiver module is located in the through-hole; and Pressing the first dielectric layer, the bonding dielectric layer and the second single-sided board together to bond the first dielectric layer, the bonding dielectric layer and the second single-sided board.

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