JP2012070237A - Microstrip array antenna - Google Patents

Microstrip array antenna Download PDF

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JP2012070237A
JP2012070237A JP2010213568A JP2010213568A JP2012070237A JP 2012070237 A JP2012070237 A JP 2012070237A JP 2010213568 A JP2010213568 A JP 2010213568A JP 2010213568 A JP2010213568 A JP 2010213568A JP 2012070237 A JP2012070237 A JP 2012070237A
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conductor plate
plate
ground
microstrip
dielectric layer
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Hisataka Kojima
央任 小島
Toru Takahashi
徹 高橋
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Mitsubishi Electric Corp
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Abstract

PROBLEM TO BE SOLVED: To solve the following problem: when an array antenna is to be constructed by arranging a plurality of elements of microstrip antennas on a flat surface, a parallel flat plate mode occurs between first and second ground conductors and coupling between the elements occurs in the parallel flat plate mode and hence a gain of the array antenna lowers and side lobe rises.SOLUTION: Mutual coupling between elements in a parallel flat plate mode is suppressed by arranging connection conductors at sufficiently shorter intervals than a resonance wavelength of a radiation conductor plate between a first ground conductor plate and a second ground plate around a microstrip antenna.

Description

この発明は、トリプレート形ストリップ線路を用い、給電回路と一体化した複数のマイクロストリップアンテナを配列した、マイクロストリップアレーアンテナに関するものである。   The present invention relates to a microstrip array antenna in which a plurality of microstrip antennas integrated with a feeder circuit are arranged using a triplate strip line.

従来のマイクロストリップアンテナとして、トリプレート形ストリップ線路を用い、給電回路と一体化した構造のマイクロストリップアンテナが知られている。   As a conventional microstrip antenna, a microstrip antenna having a structure in which a triplate strip line is used and integrated with a feeding circuit is known.

特許文献１に示すマイクロストリップアンテナは、第１および第２の誘電体層から成り、第１の誘電体層の一方の面に地導体板を有し、第２の誘電体層の一方の面に地導体板及び開口を配置し、上記第１および第２の地導体の概略中央にストリップ導体を配して成るトリプレート形ストリップ線路を構成し、上記ストリップ導体の先端部には、放射導体板を配置し、マイクロストリップアンテナの開口上部に第２の放射導体版を配置している（例えば、特許文献１参照）。   The microstrip antenna shown in Patent Document 1 includes first and second dielectric layers, has a ground conductor plate on one surface of the first dielectric layer, and one surface of the second dielectric layer. A triplate strip line is formed by disposing a ground conductor plate and an opening in the first and second ground conductors and arranging a strip conductor at the approximate center of the first and second ground conductors. A plate is disposed, and a second radiation conductor plate is disposed above the opening of the microstrip antenna (see, for example, Patent Document 1).

特開平４−１７０８０４号公報Japanese Patent Laid-Open No. 4-170804

しかし、従来のマイクロストリップアンテナを平面上に複数素子配列して、アレーアンテナを構成しようとすると、第１および第２の地導体の間に平行平板モードが発生し、平行平板モードで素子間結合が発生することで、アレーアンテナの利得が低下したり、サイドローブが上昇するという問題が発生することが判明した。   However, when an array antenna is configured by arranging a plurality of conventional microstrip antennas on a plane, a parallel plate mode is generated between the first and second ground conductors, and the elements are coupled in the parallel plate mode. As a result, it has been found that problems such as a decrease in array antenna gain and an increase in side lobes occur.

この発明は、係る課題を解決するためになされたものであり、第１および第２の地導体の間の平行平板モードによる、アンテナ素子間の結合を抑制したマイクロストリップアレーアンテナを得ることを目的とする。   The present invention has been made to solve such a problem, and an object of the present invention is to obtain a microstrip array antenna in which coupling between antenna elements is suppressed by a parallel plate mode between the first and second ground conductors. And

この発明によるマイクロストリップアレーアンテナは、積層された第１、第２、及び第３の誘電体層と、上記第１の誘電体層の一方の面に形成された第１の地導体板と、上記第２の誘電体層の一方の面に形成された開口を有する第２の地導体板と、上記第１の誘電体層の他方の面と第２の誘電体層の他方の面に挟まれて形成され、上記第１、第２の誘電体層及び上記第１、第２の地導体板とともにトリプレート形ストリップ線路を構成するストリップ導体と、上記第１の誘電体層の他方の面と第２の誘電体層の他方の面に挟まれて形成され、上記ストリップ導体の先端部に接続され、上記開口に対向して配置され、上記トリプレート形ストリップ線路とともにマイクロストリップアンテナを構成する第１の放射導体板と、上記第１の放射導体板及び開口に対向して配置され、上記第３の誘電体層の他方面に形成された第２の放射導体板と、上記第１の地導体板２と第２の地導体板３の間に接続され、上記ストリップ導体を除く部分で上記放射導体板の周囲を取り囲むように、上記第１の放射導体板の共振波長より十分短い間隔で配列された接続導体とを備え、上上記接続導体に取り囲まれたマイクロストリップアンテナ、及び上記第２の放射導体板が、複数配列されてなる。   A microstrip array antenna according to the present invention includes laminated first, second, and third dielectric layers, a first ground conductor plate formed on one surface of the first dielectric layer, Sandwiched between a second ground conductor plate having an opening formed on one surface of the second dielectric layer, the other surface of the first dielectric layer and the other surface of the second dielectric layer. A strip conductor that forms a triplate strip line together with the first and second dielectric layers and the first and second ground conductor plates, and the other surface of the first dielectric layer. And the other surface of the second dielectric layer, is connected to the tip of the strip conductor, and is disposed to face the opening, and constitutes a microstrip antenna together with the triplate strip line. A first radiation conductor plate and the first radiation conductor; And a second radiating conductor plate disposed opposite the opening and formed on the other surface of the third dielectric layer, and between the first ground conductor plate 2 and the second ground conductor plate 3. Connecting conductors arranged at intervals sufficiently shorter than the resonance wavelength of the first radiating conductor plate so as to surround the radiating conductor plate at a portion excluding the strip conductor, and connected to the upper connecting conductor. A plurality of surrounded microstrip antennas and the second radiation conductor plate are arranged.

この発明によれば、マイクロストリップアンテナの周囲の第１の地導体板２と第２の地導体板の間に、波長より十分短い間隔で接続導体を並べることで、平行平板モードによる素子間相互結合を抑圧し、アレーアンテナの利得の低下やサイドローブ上昇を低減することができる。   According to the present invention, the connection conductors are arranged at intervals sufficiently shorter than the wavelength between the first ground conductor plate 2 and the second ground conductor plate around the microstrip antenna, thereby achieving mutual coupling between elements in the parallel plate mode. It is possible to reduce the gain of the array antenna and the side lobe.

この発明に係る実施の形態１によるマイクロストリップアンテナの構成を示す図である。It is a figure which shows the structure of the microstrip antenna by Embodiment 1 which concerns on this invention. この発明に係る実施の形態１によるマイクロストリップアレーアンテナの構成を示す図である。It is a figure which shows the structure of the microstrip array antenna by Embodiment 1 which concerns on this invention.

実施の形態１．
以下、この発明に係る実施の形態１によるマイクロストリップアレーアンテナについて、図を用いて説明する。図１は、実施の形態１によるマイクロストリップアンテナの構成を示す図であり、（ａ）は上面透視図、（ｂ）は側面断面図である。図２は、図１のマイクロストリップアンテナを、複数個並べてマイクロストリップアレーアンテナを構成した例を示す図である。 Embodiment 1 FIG.
Hereinafter, a microstrip array antenna according to Embodiment 1 of the present invention will be described with reference to the drawings. 1A and 1B are diagrams showing a configuration of a microstrip antenna according to Embodiment 1, wherein FIG. 1A is a top perspective view, and FIG. 1B is a side sectional view. FIG. 2 is a diagram showing an example in which a microstrip array antenna is configured by arranging a plurality of the microstrip antennas of FIG.

図１において、マイクロストリップアンテナ５は、矩形状の第１の放射導体板１と、第１の地導体板２と、第１の誘電体基板（層）３と、第２の誘電体基板（層）４と、第２の地導体板６と、ストリップ導体７と、接続導体１２から構成されている。また、第２の誘電体基板（層）４の上方には、矩形状の第２の放射導体１０と、第３の誘電体基板（層）１１が設けられている。   In FIG. 1, a microstrip antenna 5 includes a rectangular first radiating conductor plate 1, a first ground conductor plate 2, a first dielectric substrate (layer) 3, and a second dielectric substrate ( Layer) 4, a second ground conductor plate 6, a strip conductor 7, and a connection conductor 12. Further, a rectangular second radiation conductor 10 and a third dielectric substrate (layer) 11 are provided above the second dielectric substrate (layer) 4.

第１の誘電体基板３の上に第２の誘電体基板４が積層され、第２の誘電体基板４の上に第３の誘電体基板１１が積層される。第１の放射導体板１及びストリップ導体７は、第１の誘電体基板３の上面（一方の面）と第２の誘電体基板４の下面（一方の面）の間に挟まれて配置される。ストリップ導体７は、第１の放射導体板１に接続される。第１の地導体板２は、第１の誘電体基板３の下面（他方の面）に配置される。ストリップ導体７、第１の誘電体基板３、及び第１の地導体板２は、トリプレート形マイクロストリップ線路８を構成する。   A second dielectric substrate 4 is laminated on the first dielectric substrate 3, and a third dielectric substrate 11 is laminated on the second dielectric substrate 4. The first radiating conductor plate 1 and the strip conductor 7 are sandwiched between the upper surface (one surface) of the first dielectric substrate 3 and the lower surface (one surface) of the second dielectric substrate 4. The The strip conductor 7 is connected to the first radiation conductor plate 1. The first ground conductor plate 2 is disposed on the lower surface (the other surface) of the first dielectric substrate 3. The strip conductor 7, the first dielectric substrate 3, and the first ground conductor plate 2 constitute a triplate-type microstrip line 8.

第３の誘電体基板１１は、第２の誘電体基板４の上に積層される。第２の地導体板６は、第２の誘電体基板４の上面（他方の面）と第３の誘電体基板１１の下面（一方の面）の間に配置される。第２の地導体板６は、第１の放射導体板１と対向する位置に、矩形状の刳り貫き開口穴が設けられている。第２の放射導体１０は第３の誘電体基板１１の上面（他方の面）に配置され、第１の放射導体板１の上方位置で第１の放射導体板１に対向する。   The third dielectric substrate 11 is stacked on the second dielectric substrate 4. The second ground conductor plate 6 is disposed between the upper surface (the other surface) of the second dielectric substrate 4 and the lower surface (the one surface) of the third dielectric substrate 11. The second ground conductor plate 6 is provided with a rectangular through hole at a position facing the first radiation conductor plate 1. The second radiating conductor 10 is disposed on the upper surface (the other surface) of the third dielectric substrate 11 and faces the first radiating conductor plate 1 at a position above the first radiating conductor plate 1.

接続導体１２は、第１の誘電体基板３及び第２の誘電体基板４を貫通し、第１の地導体板２と第２の地導体板３の間に接続される。接続導体１２は、第１の放射導体板１の周囲に並べられ、第１の放射導体板１の共振波長λの１次モード及び２次モードよりも十分短い間隔（例えば、２０分の１λ以上、４分の１λ以下の間隔）で、ストリップ導体７を除く第１の放射導体板１の周囲を取り囲んでいる。また、接続導体１２は、ストリップ導体７と第１の放射導体板１との接続部の周囲で、ストリップ導体７の両側に位置するように配置されている。   The connection conductor 12 passes through the first dielectric substrate 3 and the second dielectric substrate 4 and is connected between the first ground conductor plate 2 and the second ground conductor plate 3. The connection conductors 12 are arranged around the first radiating conductor plate 1 and are sufficiently shorter than the primary mode and the secondary mode of the resonance wavelength λ of the first radiating conductor plate 1 (for example, 1 / 20λ or more). The space around the first radiating conductor plate 1 excluding the strip conductor 7 is surrounded by an interval of [1/4] or less. Further, the connection conductor 12 is arranged so as to be positioned on both sides of the strip conductor 7 around the connection portion between the strip conductor 7 and the first radiation conductor plate 1.

また、図２において、マイクロストリップアンテナ５は、第２の放射導体１０とともに、平面上に複数個配列される。ストリップ導体７の間には、ストリップ導体７と第１の放射導体板１との接続部を除き、接続導体１２が配置されていない。   In FIG. 2, a plurality of microstrip antennas 5 are arranged on the plane together with the second radiation conductor 10. Between the strip conductors 7, the connecting conductor 12 is not disposed except for the connecting portion between the strip conductor 7 and the first radiation conductor plate 1.

次に、動作について説明する。
トリプレート形マイクロストリップ線路８を伝播してきた電波は、トリプレート形マイクロストリップ線路８を通して、共振器の一種である放射導体板１及び第１の地導体板２から成るマイクロストリップアンテナ５を励振する。次に、マイクロストリップアンテナ５の励振によって第２の放射導体板１０が励振され、マイクロストリップアンテナ５及び第２の放射導体板１０の両方の励振により、電波が空間に放射される。 Next, the operation will be described.
The radio wave propagating through the triplate type microstrip line 8 excites the microstrip antenna 5 including the radiation conductor plate 1 and the first ground conductor plate 2 which are a kind of resonators through the triplate type microstrip line 8. . Next, the second radiating conductor plate 10 is excited by excitation of the microstrip antenna 5, and radio waves are radiated into the space by excitation of both the microstrip antenna 5 and the second radiating conductor plate 10.

マイクロストリップアンテナ５を励振すると、その周囲に電界が発生する。この電界は、第１の地導体板２と第２の地導体板６の間に電位差を発生させ、２枚の地導体の間で平行平板モードを発生させる。   When the microstrip antenna 5 is excited, an electric field is generated around it. This electric field generates a potential difference between the first ground conductor plate 2 and the second ground conductor plate 6 and generates a parallel plate mode between the two ground conductors.

マイクロストリップアンテナ５を平面上に配列して、アレーアンテナとして用いる場合、平行平板モードは地導体板間を２次元的に伝播し、マイクロストリップアンテナ５の素子間相互結合の強度は距離に比例して減衰することとなる。   When the microstrip antenna 5 is arranged on a plane and used as an array antenna, the parallel plate mode propagates two-dimensionally between the ground conductor plates, and the strength of mutual coupling between elements of the microstrip antenna 5 is proportional to the distance. Will be attenuated.

ここで、第１の地導体板２と第２の地導体板６の間は、波長に比べて短い間隔で接続導体１２により短絡されている。このため、マイクロストリップアンテナ５周囲に発生した電界は、周囲に漏れ出すことができない。従って、第１の地導体板２と第２の地導体板６の間の平行平板モードによる、マイクロストリップアンテナ５の素子間相互結合を抑制することができる。   Here, the first ground conductor plate 2 and the second ground conductor plate 6 are short-circuited by the connection conductor 12 at a shorter interval than the wavelength. For this reason, the electric field generated around the microstrip antenna 5 cannot leak out. Therefore, mutual coupling between elements of the microstrip antenna 5 due to the parallel plate mode between the first ground conductor plate 2 and the second ground conductor plate 6 can be suppressed.

実施の形態１によるマイクロスロリップアレーアンテナは、上下に積層された第１、第２及び第３の誘電体基板３、４、１１から成り、第１の誘電体基板３の一方の面に第１の地導体板２を形成し、第２の誘電体基板４の一方の面に、開口を有した第２の地導体板６を形成し、上記第１の誘電体基板３の他方の面と第２の誘電体基板４の他方の面に挟まれて形成され、上記第１および第２の地導体板２、６の概略中央に配置されたストリップ導体７を備え、上記第１、第２の誘電体基板３、４、上記ストリップ導体７及び上記第１、第２の地導体板２、６はトリプレート形ストリップ線路８を構成する。また、第１の誘電体基板３の他方の面と第２の誘電体基板４の他方の面に挟まれて形成され、上記ストリップ導体７の先端部に接続されるとともに、上記開口に対向して配置された第１の放射導体板１と、上記第１の放射導体板１及び開口に対向して配置され、上記第３の誘電体基板１１の他方面に形成された第２の放射導体板１０と、上記第１の地導体板２と第２の地導体板６の間に接続され、上記ストリップ導体７を除く部分で上記第１の放射導体板１の周囲を取り囲むように、上記第１の放射導体板１の共振波長より十分短い間隔で配列された接続導体１２を備える。上記トリプレート形ストリップ線路８と第１の放射導体板１と接続導体１２はマイクロストリップアンテナ５を構成し、当該接続導体１２に取り囲まれたマイクロストリップアンテナ５、及び上記第２の放射導体板１０を、複数配列してマイクロストリップアレーアンテナが構成される。   The micro-sloppy array antenna according to the first embodiment includes first, second and third dielectric substrates 3, 4, and 11 stacked one above the other. 1 ground conductor plate 2 is formed, a second ground conductor plate 6 having an opening is formed on one surface of the second dielectric substrate 4, and the other surface of the first dielectric substrate 3 is formed. And a strip conductor 7 that is sandwiched between the other surfaces of the second dielectric substrate 4 and disposed at the approximate center of the first and second ground conductor plates 2, 6. The two dielectric substrates 3 and 4, the strip conductor 7, and the first and second ground conductor plates 2 and 6 constitute a triplate strip line 8. Further, it is formed between the other surface of the first dielectric substrate 3 and the other surface of the second dielectric substrate 4 and is connected to the tip of the strip conductor 7 and faces the opening. Arranged on the other surface of the third dielectric substrate 11 and opposed to the first radiation conductor plate 1 and the opening. The plate 10 is connected between the first ground conductor plate 2 and the second ground conductor plate 6 so as to surround the periphery of the first radiation conductor plate 1 at a portion excluding the strip conductor 7. The connection conductors 12 are arranged at intervals sufficiently shorter than the resonance wavelength of the first radiation conductor plate 1. The triplate strip line 8, the first radiating conductor plate 1, and the connecting conductor 12 constitute a microstrip antenna 5, the microstrip antenna 5 surrounded by the connecting conductor 12, and the second radiating conductor plate 10. Are arranged to form a microstrip array antenna.

これによって、マイクロストリップアンテナ５の周囲の第１の地導体板２と第２の地導体板３の間に、波長より十分短い間隔で接続導体１２を並べることで、平行平板モードによるアンテナ素子間相互結合を抑圧し、アレーアンテナの利得の低下やサイドローブ上昇を低減することができる。   Accordingly, the connection conductors 12 are arranged at intervals sufficiently shorter than the wavelength between the first ground conductor plate 2 and the second ground conductor plate 3 around the microstrip antenna 5, so that the antenna elements in the parallel plate mode are arranged. Mutual coupling can be suppressed, and a decrease in array antenna gain and side lobe increase can be reduced.

また、実施の形態１によるマイクロスロリップアレーアンテナを通信、レーダ等幅広い分野のアレーアンテナに利用することによって、アレーアンテナの利得低下やサイドローブ上昇の低減効果の分だけ、所望のアンテナ性能を維持することができる。   In addition, by using the micro-slope array antenna according to the first embodiment for an array antenna in a wide range of fields such as communication and radar, the desired antenna performance is maintained by the effect of reducing the gain of the array antenna and the effect of increasing the side lobe. can do.

１ 第１の放射導体板、２ 第１の地導体板、３ 第１の誘電体基板（層）、４ 第２の誘電体基板（層）、５ マイクロストリップアンテナ、６ 第２の地導体板、７ ストリップ導体、８ トリプレート形マイクロストリップ線路、９ 接続導体、１０ 第２の放射導体板、１１ 第３の誘電体基板（層）、１２ 接続導体。   DESCRIPTION OF SYMBOLS 1 1st radiation conductor plate, 2 1st ground conductor plate, 1st dielectric substrate (layer), 4th dielectric substrate (layer), 5 microstrip antenna, 6 2nd ground conductor plate , 7 strip conductor, 8 triplate type microstrip line, 9 connection conductor, 10 second radiating conductor plate, 11 third dielectric substrate (layer), 12 connection conductor.

Claims (1)

積層された第１、第２、及び第３の誘電体層と、
上記第１の誘電体層の一方の面に形成された第１の地導体板と、
上記第２の誘電体層の一方の面に形成された開口を有する第２の地導体板と、
上記第１の誘電体層の他方の面と第２の誘電体層の他方の面に挟まれて形成され、上記第１、第２の誘電体層及び上記第１、第２の地導体板とともにトリプレート形ストリップ線路を構成するストリップ導体と、
上記第１の誘電体層の他方の面と第２の誘電体層の他方の面に挟まれて形成され、上記ストリップ導体の先端部に接続され、上記開口に対向して配置され、上記トリプレート形ストリップ線路とともにマイクロストリップアンテナを構成する第１の放射導体板と、
上記第１の放射導体板及び開口に対向して配置され、上記第３の誘電体層の他方面に形成された第２の放射導体板と、
上記第１の地導体板２と第２の地導体板３の間に接続され、上記ストリップ導体を除く部分で上記放射導体板の周囲を取り囲むように、上記第１の放射導体板の共振波長より十分短い間隔で配列された接続導体と、
を備え、
上記接続導体に取り囲まれたマイクロストリップアンテナ、及び上記第２の放射導体板が、複数配列されてなるマイクロストリップアレーアンテナ。 Laminated first, second, and third dielectric layers;
A first ground conductor plate formed on one surface of the first dielectric layer;
A second ground conductor plate having an opening formed on one surface of the second dielectric layer;
Formed between the other surface of the first dielectric layer and the other surface of the second dielectric layer, the first and second dielectric layers and the first and second ground conductor plates And a strip conductor constituting a triplate strip line, and
Formed between the other surface of the first dielectric layer and the other surface of the second dielectric layer, connected to the tip of the strip conductor, disposed opposite the opening, A first radiation conductor plate constituting a microstrip antenna together with a plate-shaped strip line;
A second radiating conductor plate disposed opposite to the first radiating conductor plate and the opening and formed on the other surface of the third dielectric layer;
The resonance wavelength of the first radiation conductor plate is connected between the first ground conductor plate 2 and the second ground conductor plate 3 and surrounds the periphery of the radiation conductor plate at a portion excluding the strip conductor. Connecting conductors arranged at shorter intervals, and
With
A microstrip array antenna in which a plurality of microstrip antennas surrounded by the connection conductors and the second radiation conductor plate are arranged.
JP2010213568A 2010-09-24 2010-09-24 Microstrip array antenna Pending JP2012070237A (en)

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US9698487B2 (en) 2012-11-07 2017-07-04 Murata Manufacturing Co., Ltd. Array antenna
JP2018182501A (en) * 2017-04-11 2018-11-15 株式会社Ｓｏｋｅｎ Planar antenna
JP2020005047A (en) * 2018-06-26 2020-01-09 Ｊｒｃモビリティ株式会社 Antenna device
JP2020005046A (en) * 2018-06-26 2020-01-09 Ｊｒｃモビリティ株式会社 Antenna device
WO2020113418A1 (en) * 2018-12-04 2020-06-11 深圳市大疆创新科技有限公司 Millimeter wave antenna structure, microwave rotating radar and movable platform
JP2020537851A (en) * 2017-10-17 2020-12-24 ソニー株式会社 Patch antenna corresponding to the cavity

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US9698487B2 (en) 2012-11-07 2017-07-04 Murata Manufacturing Co., Ltd. Array antenna
JP2018182501A (en) * 2017-04-11 2018-11-15 株式会社Ｓｏｋｅｎ Planar antenna
JP2020537851A (en) * 2017-10-17 2020-12-24 ソニー株式会社 Patch antenna corresponding to the cavity
JP7047084B2 (en) 2017-10-17 2022-04-04 ソニーグループ株式会社 Patch antenna corresponding to the cavity
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