CN113871864A - Liquid crystal antenna and manufacturing method thereof - Google Patents

Liquid crystal antenna and manufacturing method thereof Download PDF

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Publication number
CN113871864A
CN113871864A CN202010621666.4A CN202010621666A CN113871864A CN 113871864 A CN113871864 A CN 113871864A CN 202010621666 A CN202010621666 A CN 202010621666A CN 113871864 A CN113871864 A CN 113871864A
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China
Prior art keywords
liquid crystal
substrate
circuit board
printed circuit
flexible substrate
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CN202010621666.4A
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Chinese (zh)
Inventor
扈映茹
段勤肄
侯东全
杨作财
席克瑞
王东花
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Chengdu Tianma Micro Electronics Co Ltd
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Chengdu Tianma Micro Electronics Co Ltd
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Priority to CN202010621666.4A priority Critical patent/CN113871864A/en
Publication of CN113871864A publication Critical patent/CN113871864A/en
Pending legal-status Critical Current

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q3/00Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system
    • H01Q3/26Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the relative phase or relative amplitude of energisation between two or more active radiating elements; varying the distribution of energy across a radiating aperture
    • H01Q3/2676Optically controlled phased array
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/36Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/50Structural association of antennas with earthing switches, lead-in devices or lightning protectors

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Abstract

The embodiment of the application provides a liquid crystal antenna and a manufacturing method thereof, relates to the technical field of communication, and can improve the performance of the antenna. The manufacturing method of the liquid crystal antenna comprises the following steps: forming a liquid crystal structure layer, wherein the liquid crystal structure layer comprises a liquid crystal layer and a first flexible substrate positioned on one side of the liquid crystal layer; providing a first printed circuit board; and pressing one side of the first flexible substrate, which is far away from the liquid crystal layer, with the first printed circuit board.

Description

Liquid crystal antenna and manufacturing method thereof
Technical Field
The present application relates to the field of communications technologies, and in particular, to a liquid crystal antenna and a method for manufacturing the same.
Background
The liquid crystal antenna is used for adjusting the phase of electromagnetic waves and is widely applied to the fields of radars, missile attitude control, accelerators, communication, instruments and even music and the like. Although the microstrip antenna has the advantages of small volume, light weight and the like, the performance of the existing liquid crystal antenna is limited due to the limitation of the manufacturing process of the liquid crystal antenna.
Disclosure of Invention
The embodiment of the application provides a liquid crystal antenna and a manufacturing method thereof, which can improve the performance of the antenna.
In one aspect, an embodiment of the present application provides a method for manufacturing a liquid crystal antenna, including:
forming a liquid crystal structure layer, wherein the liquid crystal structure layer comprises a liquid crystal layer and a first flexible substrate positioned on one side of the liquid crystal layer;
providing a first printed circuit board;
and pressing one side of the first flexible substrate, which is far away from the liquid crystal layer, with the first printed circuit board.
In a second aspect, an embodiment of the present application further provides a liquid crystal antenna, including:
the liquid crystal display panel comprises a liquid crystal structure layer and a first printed circuit board, wherein the liquid crystal structure layer comprises a liquid crystal layer and a first flexible substrate located on one side of the liquid crystal layer, and the first flexible substrate is located between the liquid crystal layer and the first printed circuit board.
The liquid crystal antenna and the manufacturing method thereof in the embodiment of the application, through making the liquid crystal structure layer with the first flexible substrate and the liquid crystal layer first, in order to realize the protection and the sealing to the liquid crystal layer, press fit between the first flexible substrate and the first printed circuit board, in order to realize the combination between the liquid crystal layer and the first printed circuit board, provide component and circuit with liquid crystal layer matched with through the first printed circuit board, compare in traditional glass substrate, printed circuit board can set up the multilayer conducting layer in substrate both sides or one side, can set up thicker insulating layer between the adjacent conducting layer, in order to satisfy the radio frequency signal transmission demand, can realize connecting through the mode of punching between each layer, consequently, can provide the circuit structure of higher performance, improve the antenna performance, including reaching higher frequency range.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments or related technologies of the present application, the drawings needed to be used in the description of the embodiments or related technologies are briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic flow chart illustrating a method for manufacturing a liquid crystal antenna according to an embodiment of the present application;
fig. 2 is a schematic structural diagram of a liquid crystal antenna according to an embodiment of the present application;
FIG. 3 is a schematic flow chart illustrating another method for fabricating a liquid crystal antenna according to an embodiment of the present disclosure;
FIG. 4a is a schematic diagram of another liquid crystal antenna according to an embodiment of the present application;
FIG. 4b is an exploded view of the liquid crystal structure layer of FIG. 4a before and after irradiation;
FIG. 5a is a schematic diagram of a partial exploded step of the method for fabricating the liquid crystal antenna of FIG. 4;
FIG. 5b is a schematic diagram of another liquid crystal antenna according to the present embodiment;
FIG. 6 is a schematic flow chart illustrating another method for fabricating a liquid crystal antenna according to an embodiment of the present disclosure;
FIG. 7 is a schematic diagram of a partially exploded step of the method for fabricating the liquid crystal antenna of FIG. 6;
FIG. 8 is a schematic diagram of another liquid crystal antenna according to an embodiment of the present application;
FIG. 9 is a schematic structural diagram of a first printed circuit board according to an embodiment of the present disclosure;
FIG. 10 is a top view of a first printed circuit board according to an embodiment of the present application;
FIG. 11 is a schematic cross-sectional view along AA' of FIG. 10;
FIG. 12 is a schematic view of another cross-sectional structure along direction AA' in FIG. 10.
Detailed Description
To make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions of the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application,
the terminology used in the embodiments of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used in the examples of this application and the appended claims, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.
As shown in fig. 1 and fig. 2, fig. 1 is a schematic flow chart of a method for manufacturing a liquid crystal antenna in an embodiment of the present application, and fig. 2 is a schematic structural diagram of a liquid crystal antenna in an embodiment of the present application, where the embodiment of the present application provides a method for manufacturing a liquid crystal antenna, including:
step 101, forming a liquid crystal structure layer 10, wherein the liquid crystal structure layer 10 comprises a liquid crystal layer 1 and a first flexible substrate 21 positioned on one side of the liquid crystal layer 1;
step 102, providing a first printed circuit board 31;
step 103, pressing the first flexible substrate 21 away from the liquid crystal layer 1 and the first printed circuit board 31.
Specifically, the thickness of the liquid crystal layer 1 is in a micron order, and a high-temperature process exists in the preparation process of the liquid crystal layer 1, so in this embodiment, the liquid crystal structure layer 10 is formed first, the liquid crystal structure layer 10 is used for protecting and sealing the liquid crystal layer 1, in addition, one side of the liquid crystal structure layer 10 is provided with the first flexible substrate 21, after the liquid crystal structure layer 10 is manufactured, the first flexible substrate 21 and the first printed circuit board 31 are pressed, after the first flexible substrate 21 and the first printed circuit board 31 are pressed, the first printed circuit board 31 can be used for providing elements and lines required by a liquid crystal antenna, and the liquid crystal layer 1 is used for realizing the moving function of an antenna signal through liquid crystal rotation. The first printed circuit board 31 may include a base material layer and elements on both sides or one side of the base material layer. In addition, a counter substrate 42 is disposed on a side of the liquid crystal layer 1 away from the first flexible substrate 21, an alignment layer 5 may be disposed between the counter substrate 42 and the liquid crystal layer 1, and a sealant 6 is further disposed between the counter substrate 42 and the first flexible substrate 21 for implementing liquid crystal encapsulation.
The liquid crystal antenna manufacturing method in the embodiment of the application, through making the liquid crystal structure layer that has first flexible base plate and liquid crystal layer earlier, in order to realize protection and the sealed to the liquid crystal layer, with pressfitting between first flexible base plate and the first printed circuit board again, in order to realize the combination between liquid crystal layer and the first printed circuit board, provide component and circuit with liquid crystal layer matched with through first printed circuit board, compare in traditional glass substrate, printed circuit board can set up the multilayer conducting layer in substrate both sides or one side, can set up thicker insulating layer between the adjacent conducting layer, in order to satisfy the radio frequency signal transmission demand, can realize connecting through the mode of punching between each layer, consequently, can provide the circuit structure of higher performance, improve the antenna performance, including reaching higher frequency range. The reason that the printed circuit board is more suitable for high frequency compared with a glass substrate is that the manufacturing process of the printed circuit board is less limited, multiple conductive layers can be manufactured, connection among the multiple conductive layers is achieved through a punching mode, a wire embedding mode, a hole filling mode and the like, each conductive layer can achieve a complex circuit structure, the higher the complexity of the circuit structure is, the easier the driving of high-frequency signals is, and therefore, through the combination of the printed circuit board and a liquid crystal structure layer, the formed liquid crystal antenna can achieve higher frequency. In addition, the liquid crystal structure layer and the first printed circuit board are manufactured separately and then are pressed to form the liquid crystal antenna, if the printed circuit board is manufactured first and then liquid crystal is manufactured or packaged on the printed circuit board, the printed circuit board is damaged due to a high-temperature process in the manufacturing process of the liquid crystal layer, the air tightness of the printed circuit board is poor, and the liquid crystal cannot be packaged.
Optionally, as shown in fig. 3, fig. 4a and fig. 4b, fig. 3 is a schematic flow chart of another method for manufacturing a liquid crystal antenna in the embodiment of the present application, fig. 4a is a schematic structural diagram of another liquid crystal antenna in the embodiment of the present application, fig. 4b is a schematic exploded diagram of the liquid crystal structure layer in fig. 4a before and after irradiation, and the liquid crystal layer 1 includes a Polymer Dispersed Liquid Crystal (PDLC); before the step 103, pressing the side of the first flexible substrate 21 away from the liquid crystal layer 1 and the first printed circuit board 31, the method further includes: and 104, irradiating and exposing the preset area 20 in the liquid crystal structure layer 10 through a mask to cure the polymer dispersed liquid crystal in the preset area 20.
Specifically, before the liquid crystal layer 1 is irradiated and exposed, the polymer monomer 01 and the liquid crystal 02 in the polymer dispersed liquid crystal are dispersed in the liquid crystal layer 1, the preset region 20 in the liquid crystal structure layer 10 is irradiated and exposed by ultraviolet rays through the mask 03, the mask 03 is transparent at the position corresponding to the preset region 20 and opaque at other positions, therefore, the ultraviolet rays can only penetrate through part of the region and irradiate the preset region 20 of the liquid crystal structure layer 10, in the ultraviolet irradiated preset region 20, the polymer monomer 01 is attracted to the preset region 20 for combined curing, and the liquid crystal 02 can normally rotate outside the preset region 20, even if the polymer dispersed liquid crystal is cured to form a support structure for realizing the support of the liquid crystal layer 1, the overall structural strength of the liquid crystal structure layer 10 is improved, so that the liquid crystal structure layer 10 and the first printed circuit board 31 are pressed in the step 103, and the integral structural strength is improved by the support structure formed by curing the polymer dispersed liquid crystal during and after the pressing process. In the structure shown in fig. 4a, the upper substrate is a glass substrate, and the lower substrate is a first printed circuit board 31, and on the basis of this structure, the following three specific structures may be further included: first, a fixed potential electrode plate and a radiator are provided on a glass substrate, and a microstrip line and a power divider network are provided on a first printed circuit board 31; secondly, a fixed potential electrode plate is arranged on a glass substrate, and a microstrip line, a power divider network and a radiator are arranged on a first printed circuit board 31; thirdly, a fixed potential electrode plate and a radiator are arranged on the glass substrate, a microstrip line is arranged on the first flexible substrate 21, and a power divider network is arranged on the first printed circuit board 31.
Optionally, before the step 103, pressing the side of the first flexible substrate 21 away from the liquid crystal layer 1 and the first printed circuit board 31, the method further includes: step 105, forming a microstrip line and a power divider network on the first printed circuit board 31. The microstrip line is used for transmitting radio frequency signals and is used as an electrode for controlling liquid crystal deflection, and the power divider network is used for providing the radio frequency signals for the microstrip line.
Optionally, as shown in fig. 3 and fig. 5a, fig. 5a is a schematic diagram of a partial exploded step in the manufacturing method of the liquid crystal antenna in fig. 4, and the step 101 of forming a liquid crystal structure layer includes:
step 1011, forming a first flexible substrate 21 on the first rigid substrate 41;
step 1012, providing the opposite substrate 42;
step 1013, aligning and attaching the first rigid substrate 41 and the opposite substrate 42 to form a liquid crystal layer between the first flexible substrate 21 and the opposite substrate 42, wherein the first flexible substrate 21, the opposite substrate 42 and the liquid crystal layer form a liquid crystal structure layer 10, and in the step, if the liquid crystal needs to be aligned, the alignment process is included, and in addition, the processes of coating frame sealing glue between the substrates and dropping/pouring the liquid crystal are also included;
step 103, the process of pressing the first flexible substrate 21 between the surface of the side away from the liquid crystal layer 1 and the first printed circuit board 31 includes:
step 1031 of peeling the first rigid substrate 41 from the first flexible substrate 21;
step 1032 is to press the first printed circuit board 31 and the first flexible substrate 21 with the first rigid substrate 41 peeled off.
Specifically, the liquid crystal structure layer 10 is firstly manufactured on the first rigid substrate 41 to ensure the sealing performance of the liquid crystal layer 1, and after the liquid crystal structure layer 10 is manufactured, the first rigid substrate 41 is peeled off and the first flexible substrate 21 and the first printed circuit board 31 are pressed, so that the combination of the liquid crystal structure layer 10 and the first printed circuit board 31 is realized. For example, a microstrip line 06 is disposed on the first printed circuit board 31, after the first printed circuit board 31 and the first flexible substrate 21 are laminated, the microstrip line 06 directly contacts the surface of the first flexible substrate 21, a fixed potential electrode plate is disposed on the opposite substrate 42, and an electric field can be generated by a voltage action between the microstrip line 06 and the fixed potential electrode plate to control the liquid crystal deflection therebetween, so that the phase changes due to the deflection action of the liquid crystal during the transmission of the radio frequency signal on the microstrip line.
Alternatively, as shown in fig. 5b, fig. 5b is a schematic structural diagram of another liquid crystal antenna in the embodiment of the present application, and the step 1012 of providing the opposite-side substrate 42 includes: a fixed potential electrode plate 04 is formed on a second rigid substrate, wherein the second rigid substrate is the opposite substrate 42, the fixed potential plate can be grounded, for example, and is used for providing another electrode plate for controlling the liquid crystal deflection in the liquid crystal layer 1, in the working process of the liquid crystal antenna, the radio frequency signal is transmitted through the microstrip line, meanwhile, the microstrip line and the fixed potential electrode plate 04 respectively provide two voltages, the liquid crystal in the liquid crystal layer 1 deflects under the control of an electric field generated by the two voltages, and the radio frequency signal can move due to the deflection of the liquid crystal in the transmission process, thereby realizing the function of the liquid crystal moving.
Optionally, the method further includes: a radiator 05 is formed on the opposite-side substrate 42 or the first printed circuit board 31, and the radiator 05 is used to realize radiation of radio frequency signals. The position of the radiator 05 is not limited in the embodiment of the present application, for example, in the structure shown in fig. 5b, the radiator 05 may be disposed on the opposite substrate 42, the first flexible substrate 21, the first printed circuit board 31, or the second printed circuit board 32 in the structure shown in fig. 7. In the structure shown in fig. 5b, since the opposite-side substrate 42 is further provided with the fixed potential electrode plate 04, the fixed potential electrode plate 04 is located between the opposite-side substrate 42 and the liquid crystal layer 1, the fixed potential electrode plate 04 is located on one side of the opposite-side substrate 42 away from the liquid crystal layer 1, and the microstrip line is located on the first flexible substrate 21 or the first printed circuit board 31, in order to ensure the coupling effect between the microstrip line and the radiator 05, a hollow-out region needs to be provided on the fixed potential electrode plate 04, and the radiator 05 is provided at a position corresponding to the hollow-out region, so that the radiator 05 can be coupled to the microstrip line through the hollow-out region.
Optionally, in the step 104, the irradiation exposure is performed on the preset region 20 in the liquid crystal structure layer 10 through a mask, and a process of curing the polymer dispersed liquid crystal in the preset region 20 is as follows: and irradiating and exposing the preset area 20 in the liquid crystal structure layer 10 from the first rigid substrate 41 to the opposite substrate 42 through a mask plate to cure the polymer dispersed liquid crystal in the preset area 20.
Specifically, when the second rigid substrate, i.e., the opposite substrate 42, is provided with the fixed-potential electrode plate, since the fixed-potential electrode plate occupies a larger space and is opaque, in order to ensure the curing effect of the polymer dispersed liquid crystal, the direction of the ultraviolet light during curing is set to be the direction from the first rigid substrate 41 to the opposite substrate 42, so as to avoid the fixed-potential electrode plate blocking the light during curing. At this time, the microstrip line and the power divider network are arranged on the first printed circuit board 31, so that when the polymer dispersed liquid crystal is cured through ultraviolet irradiation, the first printed circuit board 31 and the liquid crystal structure layer 10 are not pressed together, and therefore, the shielding of the microstrip line and the power divider network from the opaque structure to the ultraviolet light is avoided.
Alternatively, the first flexible substrate 21 sequentially comprises a flexible base material 211 and an alignment film 212 in a direction gradually away from the first rigid substrate 41, wherein the flexible base material 211 is used as a base of the first flexible substrate 21, and the alignment film 212 is used for achieving initial alignment of liquid crystals in the liquid crystal layer 1.
Alternatively, the first flexible substrate 21 includes a flexible base 211, a silicon nitride film 213, and an alignment film 212 in this order in a direction gradually away from the first rigid substrate 41.
Specifically, the first flexible substrate 21 may be manufactured by first coating a polyimide thin film with a different thickness of 5 μm to 200 μm on the first rigid substrate 41 as the flexible base 211, the first rigid substrate 41 may be a glass substrate, a silicon substrate, a hard resin or a metal sheet, etc., the silicon nitride film 213 may be a film with a thickness of 0.1 μm to 5 μm for buffering and planarization between the flexible base 211 and the alignment film 212, and the alignment film 212 may also be a polyimide thin film.
Alternatively, as shown in fig. 6 and 7, fig. 6 is a schematic flowchart of another method for manufacturing a liquid crystal antenna in the embodiment of the present application, fig. 7 is a schematic partial exploded step diagram of the method for manufacturing a liquid crystal antenna in fig. 6, and the step 1012 of providing a counter substrate includes: forming a second flexible substrate 22 on the second rigid substrate 42, the second flexible substrate 22 serving as an opposite substrate;
step 103, the process of pressing the first flexible substrate 21 between the surface of the side away from the liquid crystal layer 1 and the first printed circuit board 31 further includes:
step 1031 of peeling the second rigid substrate 42 from the second flexible substrate 22;
step 1032 is to press-fit the second printed circuit board 32 and the second flexible substrate 22 with the second rigid substrate 42 peeled off, and the second printed circuit board 32 is provided with a fixed potential electrode plate (not shown).
Specifically, the second flexible substrate 22 includes a flexible base 221, a silicon nitride film 223, and an alignment film 222 in this order in a direction gradually away from the second rigid substrate 42. That is, the second flexible substrate 22 may be manufactured in the same process as the first flexible substrate 21, except that the second flexible substrate 22 may be manufactured as the opposite substrate, and the second flexible substrate 22 may be peeled off from the second rigid substrate 42 and then laminated with the second printed circuit board 32, and the opposite components and lines, including, for example, the fixed potential electrode plates, may be provided through the second printed circuit board 32, in addition to the above-described manner of directly manufacturing the fixed potential electrodes on the second rigid substrate and then using the second rigid substrate as the opposite substrate 42. In the liquid crystal antenna structure finally formed in fig. 7, the lower substrate is the first printed circuit board 31, and the upper substrate is the second printed circuit board 32, on the basis of this structure, the following three specific structures can be further provided: first, a fixed potential electrode plate and a radiator are arranged on the second printed circuit board 32, and a microstrip line and a power divider network are arranged on the first printed circuit board 31; second, a fixed potential electrode plate is arranged on the second printed circuit board 32, and a microstrip line, a power divider network and a radiator are arranged on the first printed circuit board 31; thirdly, a fixed potential electrode plate and a radiator are provided on the second printed circuit board 32, a microstrip line is provided on the first flexible substrate 21, and a power divider network is provided on the first printed circuit board 31.
Optionally, as shown in fig. 3 and fig. 8, fig. 8 is a schematic structural diagram of another liquid crystal antenna in an embodiment of the present application, where the step 101 of forming a liquid crystal structure layer includes:
step 1011, forming a first flexible substrate 21 on the first rigid substrate, wherein the first flexible substrate 21 sequentially comprises a flexible base material 211, a microstrip line 214 and an alignment film 212 in a direction gradually away from the first rigid substrate;
step 1013, aligning and attaching the first rigid substrate and the opposite substrate 42 to form a liquid crystal layer between the first flexible substrate 21 and the opposite substrate 42, wherein the first flexible substrate 21, the opposite substrate 42 and the liquid crystal layer 1 form a liquid crystal structure layer 10; the first printed circuit board 31 includes a power divider network (not shown).
Specifically, in the structure shown in fig. 8, a part of the elements, for example, the microstrip line 214 is provided on the first flexible substrate 21, and another part of the elements, for example, the power divider network is provided on the first printed circuit board 31. With this structure, the microstrip line 214 is disposed at a corresponding position outside the predetermined region 20, so as to avoid the degradation of the curing effect caused by the light shielding effect of the microstrip line 214.
Alternatively, as shown in fig. 8, the first flexible substrate 21 includes a flexible base 211, a silicon nitride film 213, a microstrip line 214, and an alignment film 212 in this order in a direction gradually away from the first rigid substrate.
Alternatively, the mask has a grid-shaped light-transmitting area, that is, in step 104, the polymer dispersed liquid crystal in the liquid crystal layer can be cured into a grid-shaped supporting structure by ultraviolet irradiation through the mask having the grid-shaped light-transmitting area, so as to provide a more stable supporting effect.
As shown in fig. 2, an embodiment of the present application further provides a liquid crystal antenna, including: the liquid crystal display panel comprises a liquid crystal structure layer 10 and a first printed circuit board 31, wherein the liquid crystal structure layer 10 comprises a liquid crystal layer 1 and a first flexible substrate 21 positioned on one side of the liquid crystal layer 1, and the first flexible substrate 21 is positioned between the liquid crystal layer 1 and the first printed circuit board 31.
Specifically, the thickness of the liquid crystal layer 1 is in a micron order, and a high-temperature process exists in the preparation process of the liquid crystal layer 1, so in this embodiment, the liquid crystal structure layer 10 is formed first, the liquid crystal structure layer 10 is used for protecting and sealing the liquid crystal layer 1, in addition, one side of the liquid crystal structure layer 10 is provided with the first flexible substrate 21, after the liquid crystal structure layer 10 is manufactured, the first flexible substrate 21 and the first printed circuit board 31 are pressed, after the first flexible substrate 21 and the first printed circuit board 31 are pressed, the first printed circuit board 31 can be used for providing elements and lines required by a liquid crystal antenna, and the liquid crystal layer 1 is used for realizing the moving function of an antenna signal through liquid crystal rotation.
The liquid crystal antenna in the embodiment of the application, through the liquid crystal structure layer that earlier the preparation has first flexible base plate and liquid crystal layer, in order to realize protection and the sealing to the liquid crystal layer, again with pressfitting between first flexible base plate and the first printed circuit board, in order to realize the combination between liquid crystal layer and the first printed circuit board, provide component and circuit with liquid crystal layer matched with through first printed circuit board, compare in traditional glass substrate, printed circuit board can set up the multilayer conducting layer in substrate both sides or one side, can set up thicker insulating layer between the adjacent conducting layer, in order to satisfy radio frequency signal transmission demand, can realize connecting through modes such as punching between each layer, bury the line, the filler hole, consequently, can provide the circuit structure of higher performance, improve the antenna performance, including reaching higher frequency range.
Alternatively, as shown in fig. 4b, the liquid crystal layer 1 includes polymer dispersed liquid crystal, and the polymer dispersed liquid crystal is cured in a partial region.
Alternatively, as shown in fig. 9, fig. 9 is a schematic structural diagram of a first printed circuit board in an embodiment of the present application, and the first printed circuit board 31 has a microstrip line 312 and a power divider network 313. For example, the first printed circuit board 31 may include a substrate layer 311, a microstrip line 312, a power divider network 313, an insulating layer 314 and a protective layer 315, where the microstrip line 312 and the power divider network 313 may be located on two sides of the substrate layer 311 respectively, or may be located on the same side of the substrate layer 311, and when located on the same side, the microstrip line 312 and the power divider network 313 may be disposed on the same layer, and at this time, the microstrip line 312 and the power divider network 313 may be directly connected or coupled; when the microstrip line 312 and the power divider network 313 are located on two sides of the substrate layer 311, the microstrip line 312 and the power divider network 313 are connected through a through hole on the substrate layer 311, so that the power divider network 313 can provide a required signal for the microstrip line 312, optionally, no through hole is arranged on the substrate layer 311 for connection, and at this time, the signal on the power divider network 313 can be coupled to the microstrip line 312 in a coupling manner.
Optionally, as shown in fig. 9, the liquid crystal antenna further includes: the opposite substrate 42 is located on the side of the liquid crystal layer 1 away from the first printed circuit board 31, the fixed potential electrode plate 420 is disposed on the opposite substrate 42, and optionally, the fixed potential electrode plate 420 is grounded.
Alternatively, the opposite-side substrate 42 includes a rigid substrate.
Optionally, the liquid crystal antenna further includes: a radiator 05 on the first printed circuit board 31 or the opposite substrate 42.
Alternatively, as shown in fig. 9, the first flexible substrate 21 includes a flexible base 211 and an alignment film 212 in this order in a direction from the first printed circuit board 31 toward the liquid crystal layer 1.
Alternatively, as shown in fig. 9, the first flexible substrate 21 includes a flexible base 211, a silicon nitride film 213, and an alignment film 212 in this order in a direction from the first printed circuit board 31 toward the liquid crystal layer 1.
Alternatively, as shown in fig. 7, the opposite-side substrate includes a second flexible substrate 22 and a second printed circuit board 32, and the second flexible substrate 22 is positioned between the liquid crystal layer 1 and the second printed circuit board 32.
Alternatively, as shown in fig. 8, a microstrip line 214 is disposed on the first flexible substrate 21, and a power divider network (not shown) is disposed on the first printed circuit board 31.
Alternatively, the polymer dispersed liquid crystal is cured in the grid-like regions.
Referring to fig. 10, fig. 11 and fig. 12, a structure of a first printed circuit board 31 in an embodiment of the present invention is described below, where fig. 10 is a top view of a first printed circuit board in an embodiment of the present invention, fig. 11 is a schematic cross-sectional structure in a direction AA 'in fig. 10, fig. 12 is a schematic cross-sectional structure in a direction AA' in fig. 10, a liquid crystal antenna generally includes a plurality of liquid crystal phase shifter units, in the above embodiment, only structural features in one liquid crystal phase shifter unit are described, in fig. 10, each dashed-line frame 200 represents a region corresponding to one liquid crystal phase shifter unit in the liquid crystal antenna, the first printed circuit board includes a substrate layer 311, the substrate layer 311 is provided with microstrip lines 312 and power divider networks 313, where each liquid crystal phase shifter unit is provided with one microstrip line 312, the power divider networks 313 are distributed in the whole first printed circuit board, connected to each microstrip line 312 for providing signals to the microstrip line 312 in each liquid crystal phase shifter unit, for example, providing high frequency radio frequency signals to each microstrip line 312 through a power divider network 313, and providing low frequency signals to each microstrip line 312 for controlling liquid crystal deflection. In the structures shown in fig. 11 and fig. 12, the power divider network 311 and the microstrip line 312 are located on the same layer, but this is not limited in this embodiment, for example, in other realizable implementations, the power divider network 311 and the microstrip line 312 may be located on different layers, at this time, when the networks are arranged on different layers, an insulating layer is disposed between the microstrip line and the power divider network, the insulating layer may be perforated to implement direct connection between the microstrip line and the power divider network, or may not be perforated, at this time, the microstrip line and the power divider network need to be overlapped, and coupling of signals is implemented at the overlapped position; it should be noted that, in fig. 10, the microstrip line only uses a routing manner of bending a serpentine routing, and may also be circular, quadrilateral, polygonal, etc., which is not limited herein; in addition, in fig. 10, the power divider network may simultaneously multiplex transmission of the radio frequency signal and the driving signal for driving the liquid crystal to rotate, or the driving signal for driving the liquid crystal to rotate may be separately connected between the driving circuit of the first printed circuit board and the microstrip line through a lead (not shown in the drawing) to implement signal transmission, which is not limited herein; in the structure shown in fig. 11, the radiator is not disposed on the first printed circuit board, while in the structure shown in fig. 12, the radiator 05 is further disposed on the first printed circuit board, the radiator 05 is located on one side of the base material layer 311, and the microstrip line 312 and the power divider network 313 are located on the other side of the base material layer 311.
The above description is only exemplary of the present application and should not be taken as limiting the present application, as any modification, equivalent replacement, or improvement made within the spirit and principle of the present application should be included in the scope of protection of the present application.
Finally, it should be noted that: the above embodiments are only used for illustrating the technical solutions of the present application, and not for limiting the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present application.

Claims (24)

1. A method for manufacturing a liquid crystal antenna is characterized by comprising the following steps:
forming a liquid crystal structure layer, wherein the liquid crystal structure layer comprises a liquid crystal layer and a first flexible substrate positioned on one side of the liquid crystal layer;
providing a first printed circuit board;
and pressing one side of the first flexible substrate, which is far away from the liquid crystal layer, with the first printed circuit board.
2. The method of claim 1,
the liquid crystal layer includes polymer dispersed liquid crystal;
before the pressing between the side of the first flexible substrate far away from the liquid crystal layer and the first printed circuit board, the method further comprises:
and irradiating and exposing a preset area in the liquid crystal structure layer through a mask plate to solidify the polymer dispersed liquid crystal in the preset area.
3. The method of claim 2,
before the pressing between the side of the first flexible substrate far away from the liquid crystal layer and the first printed circuit board, the method further comprises:
and forming a microstrip line and a power divider network on the first printed circuit board.
4. The method of claim 3,
the forming of the liquid crystal structure layer comprises:
forming the first flexible substrate on a first rigid substrate;
providing a counter substrate;
aligning and attaching the first rigid substrate and the opposite side substrate to form a liquid crystal layer between the first flexible substrate and the opposite side substrate, wherein the first flexible substrate, the opposite side substrate and the liquid crystal layer form the liquid crystal structure layer;
the process of pressing the surface of one side of the first flexible substrate, which is far away from the liquid crystal layer, and the first printed circuit board comprises the following steps:
peeling the first rigid substrate from the first flexible substrate;
and pressing the first printed circuit board and the first flexible substrate stripped of the first rigid substrate.
5. The method of claim 4,
the providing the counter substrate includes: a fixed potential electrode plate is formed on the second rigid substrate.
6. The method of claim 5, further comprising:
a radiator is formed on the opposite-side substrate or the first printed circuit board.
7. The method of claim 5,
the process of irradiating and exposing the preset area in the liquid crystal structure layer through the mask to cure the polymer dispersed liquid crystal in the preset area comprises the following steps:
and irradiating and exposing a preset area in the liquid crystal structure layer from the first rigid substrate to the opposite substrate through a mask plate, so that the polymer dispersed liquid crystal in the preset area is cured.
8. The method of claim 5,
in the direction of gradually keeping away from first rigid base plate, first flexible base plate includes flexible base material and alignment film in proper order.
9. The method of claim 8,
in the direction gradually far away from the first rigid substrate, the first flexible substrate sequentially comprises a flexible base material, a silicon nitride film and an alignment film.
10. The method of claim 4,
the providing the counter substrate includes:
forming a second flexible substrate on a second rigid substrate;
the process of pressing the surface of one side of the first flexible substrate, which is far away from the liquid crystal layer, and the first printed circuit board further comprises the following steps:
peeling the second rigid substrate from the second flexible substrate;
and pressing a second printed circuit board and the second flexible substrate stripped of the second rigid substrate, wherein a fixed potential electrode plate is arranged on the second printed circuit board.
11. The method of claim 1,
the forming of the liquid crystal structure layer comprises:
forming a first flexible substrate on a first rigid substrate, wherein the first flexible substrate sequentially comprises a flexible base material, a microstrip line and an alignment film in a direction away from the first rigid substrate;
aligning and attaching the first rigid substrate and the opposite substrate to form a liquid crystal layer between the first flexible substrate and the opposite substrate, wherein the first flexible substrate, the opposite substrate and the liquid crystal layer form the liquid crystal structure layer;
the first printed circuit board includes a power divider network thereon.
12. The method of claim 11,
in the direction away from the first rigid substrate gradually, the first flexible substrate sequentially comprises a flexible base material, a silicon nitride film, a microstrip line and an alignment film.
13. The method of claim 2,
the mask plate is provided with a latticed light-transmitting area.
14. A liquid crystal antenna, comprising:
the liquid crystal display panel comprises a liquid crystal structure layer and a first printed circuit board, wherein the liquid crystal structure layer comprises a liquid crystal layer and a first flexible substrate located on one side of the liquid crystal layer, and the first flexible substrate is located between the liquid crystal layer and the first printed circuit board.
15. The liquid crystal antenna of claim 14,
the liquid crystal layer includes polymer dispersed liquid crystal which is cured in a partial region.
16. The liquid crystal antenna of claim 14,
the first printed circuit board is provided with a microstrip line and a power divider network.
17. The liquid crystal antenna of claim 16, further comprising:
and the opposite side substrate is positioned on one side of the liquid crystal layer, which is far away from the first printed circuit board, and a fixed potential electrode plate is arranged on the opposite side substrate.
18. The liquid crystal antenna of claim 17,
the opposite-side substrate includes a rigid substrate.
19. The liquid crystal antenna of claim 18, further comprising:
a radiator on the first printed circuit board or the opposite side substrate.
20. The liquid crystal antenna of claim 18,
the first flexible substrate includes a flexible base material and an alignment film in this order in a direction from the first printed circuit board toward the liquid crystal layer.
21. The liquid crystal antenna of claim 20,
the first flexible substrate includes a flexible base material, a silicon nitride film, and an alignment film in this order in a direction from the first printed circuit board toward the liquid crystal layer.
22. The liquid crystal antenna of claim 15,
the opposite-side substrate includes a second flexible substrate and a second printed circuit board, the second flexible substrate being located between the liquid crystal layer and the second printed circuit board.
23. The liquid crystal antenna of claim 14,
the first flexible substrate is provided with a microstrip line, and the first printed circuit board is provided with a power divider network.
24. The liquid crystal antenna of claim 15,
the polymer dispersed liquid crystal is cured in the grid-like region.
CN202010621666.4A 2020-06-30 2020-06-30 Liquid crystal antenna and manufacturing method thereof Pending CN113871864A (en)

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