CN209517619U - A kind of radiator structure of PCB circuit board - Google Patents
A kind of radiator structure of PCB circuit board Download PDFInfo
- Publication number
- CN209517619U CN209517619U CN201821973287.6U CN201821973287U CN209517619U CN 209517619 U CN209517619 U CN 209517619U CN 201821973287 U CN201821973287 U CN 201821973287U CN 209517619 U CN209517619 U CN 209517619U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- support frame
- backing plate
- heat dissipating
- dissipating layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model provides a kind of radiator structure of PCB circuit board, including backing plate, support frame and circuit board, support frame is located at the upper end of backing plate, and support frame is connect by miniature screw with backing plate, the upper end of support frame is equipped with circuit board, and circuit board is connect by miniature screw with backing plate, and the one side edge of backing plate is with the one side edge keeping parallelism of circuit board to just.The radiator structure of this kind of PCB circuit board, stable structure, and have good heat dissipation performance, improve the reliability and safety that circuit board uses, extraneous partial pressure can be resisted in actual production and assembling simultaneously, be unlikely to deform circuit board, there is very high practical value.
Description
Technical field
The utility model relates to circuit board technology field, the radiator structure of specifically a kind of PCB circuit board.
Background technique
High-power components in PCB circuit board can generate a large amount of heat at runtime, however existing PCB circuit board dissipates
Hot difference can be such that equipment internal temperature rises rapidly and decline the reliability of electronic equipment will, in addition, existing PCB circuit
Hardened structure design is single, lacks certain compression strength, this can all cause circuit board certain in actual production and assembling
Damage, is unfavorable for actually using.Therefore it needs to be upgraded and be transformed on the basis of existing PCB circuit board, it is existing to overcome
Problem and shortage.
Utility model content
The utility model is intended to solve the problems, such as existing PCB circuit board poor radiation, provides a kind of PCB circuit board
Radiator structure is made present apparatus stable structure, and have good heat dissipation performance, is mentioned by setting aluminum substrate, heat dissipating layer and hole
The reliability and safety that circuit board uses have been risen, while extraneous partial pressure can have been resisted in actual production and assembling, has been made
Circuit board is unlikely to deform, and has wide applicability to circuit board technology field.
To achieve the above object, the utility model provides the following technical solutions, a kind of radiator structure of PCB circuit board, packet
Backing plate, support frame and circuit board are included, the support frame is located at the upper end of backing plate, and support frame is connected by miniature screw and backing plate
It connects, the upper end of the support frame is equipped with circuit board, and circuit board is connect by miniature screw with backing plate, and a side of backing plate
Edge is with the one side edge keeping parallelism of circuit board to just；
The circuit board includes aluminum substrate, heat dissipating layer and fixed plate, and the aluminum substrate is located at the inside of circuit board, and aluminium base
Plate is connect by way of bonding with circuit board, and the lower end of the aluminum substrate is equipped with heat dissipating layer, and the lower end of the heat dissipating layer is equipped with
Fixed plate, and connected by way of bonding between heat dissipating layer and fixed plate；
The support frame includes line slot, hole, connecting line and fixing threaded hole, and the line slot is located inside support frame
One end, described hole are evenly distributed on the upper end of line slot, and the connecting line is respectively positioned on the side of line slot, and connecting line with
Line slot inlays connection, and the fixing threaded hole is respectively positioned on one end inside support frame.
Preferably, the heat dissipating layer and aluminum substrate are fixed setting.
Preferably, the upper surface keeping parallelism of a side end face of the aluminum substrate and circuit board.
Preferably, the quantity of described hole is 4, and hole is followed successively by and equidistant " transversely arranged " is distributed in line slot
Upper end.
Preferably, the heat dissipating layer is heat-conducting glue heat dissipating layer.
The utility model provides a kind of radiator structure of PCB circuit board, has the advantages that
(1), the PCB circuit board structure design stability of the utility model is reliable, and has good heat dissipation performance, can be
The heat that PCB circuit board can be generated effectively when operating externally distributes, and heat is avoided to accumulate in circuit board to component
It damages, improves the reliability and safety that circuit board uses.
(2), PCB circuit board provided by the utility model has certain compressive strength, can be in actual production and assembling
Extraneous partial pressure is resisted, circuit board is unlikely to deform, enhances using quality.
To sum up, whole device stable structure, and have good heat dissipation performance, improve reliability that circuit board uses and
Safety, while extraneous partial pressure can be resisted in actual production and assembling, it is unlikely to deform circuit board, there is very high reality
With value.
Detailed description of the invention
Fig. 1 is the overall structure diagram of the utility model.
Fig. 2 is the circuit board partial structurtes diagrammatic cross-section of the utility model.
Fig. 3 is the support frame partial structurtes diagrammatic cross-section of the utility model.
In figure: 1- backing plate；2- support frame；201- line slot；202- hole；203- connecting line；204- fixing threaded hole；3- electricity
Road plate；301- aluminum substrate；302- heat dissipating layer；303- fixed plate.
Specific embodiment
The following is a combination of the drawings in the embodiments of the present utility model 1-3, to the technical scheme in the embodiment of the utility model
It is clearly and completely described, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than complete
The embodiment in portion.Based on the embodiments of the present invention, those of ordinary skill in the art are not before making creative work
Every other embodiment obtained is put, is fallen within the protection scope of the utility model.
Fixed plate 303 and connecting line 203 in the utility model, which can be bought or customize from market, to be obtained, and concrete model is
Ordinary skill in the art means, are no longer repeated.
The utility model provides the following technical solutions: a kind of radiator structure of PCB circuit board, including backing plate 1, support frame 2
With circuit board 3, support frame 2 is located at the upper end of backing plate 1, and support frame 2 is connect by miniature screw with backing plate 1, support frame 2 it is upper
End is equipped with circuit board 3, and circuit board 3 is connect by miniature screw with backing plate 1, and the one side edge of backing plate 1 with circuit board 3
One side edge keeping parallelism to just, circuit board 3 includes aluminum substrate 301, heat dissipating layer 302 and fixed plate 303, aluminum substrate 301
In the inside of circuit board 3, and aluminum substrate 301 is connect by way of bonding with circuit board 3, and the lower end of aluminum substrate 301, which is equipped with, to be dissipated
The lower end of thermosphere 302, heat dissipating layer 302 is equipped with fixed plate 303, and between heat dissipating layer 302 and fixed plate 303 by way of bonding
Connection, support frame 2 include line slot 201, hole 202, connecting line 203 and fixing threaded hole 204, and line slot 201 is located at support frame 2
Internal one end, hole 202 are evenly distributed on the upper end of line slot 201, and connecting line 203 is respectively positioned on the side of line slot 201, and
Connecting line 203, which is inlayed with line slot 201, to be connect, and fixing threaded hole 204 is respectively positioned on one end inside support frame 2.
Preferably, heat dissipating layer 302 and aluminum substrate 301 are fixed setting, further complementary can be mentioned by aluminum substrate 301
Rise the stability of heat dissipating layer 302.
Preferably, the upper surface keeping parallelism of a side end face of aluminum substrate 301 and circuit board 3, passes through the one of aluminum substrate 301
The characteristic of the upper surface keeping parallelism of side end face and circuit board 3 can make circuit board resist extraneous portion in actual production and assembling
Partial pressure is unlikely to deform circuit board.
Preferably, the quantity of hole 202 is 4, and hole 202 is followed successively by and equidistant " transversely arranged " is distributed in line slot
201 upper end improves heat dissipation performance by the way that hole 202 is further complementary.
Preferably, heat dissipating layer 302 be heat-conducting glue heat dissipating layer 302, by heat-conducting glue heat dissipating layer 302 can fast uniform it is external
Heat dissipation.
Working principle: when using a kind of radiator structure of PCB circuit board provided in this embodiment, first check that this product is each
The tightness connected between component can be supported the pressure being subject to by aluminum substrate 301 when circuit board 3 is when meeting ambient pressure
Disappear or conducts into fixed plate 303, to weaken pressure, simultaneously because heat-conducting glue has brilliant cold-and-heat resistent alternation performance, thus it is logical
The heat external equilibrium crossing heat-conducting glue heat dissipating layer 302 and generating when can run circuit board 3 distributes.
The above are merely preferred embodiments of the present invention, it is noted that for those skilled in the art,
Without departing from the concept of the premise utility, several modifications and improvements can also be made, these also should be considered as practical
Novel protection scope, these all will not influence the effect and patent practicability of the utility model implementation.
Claims (5)
1. a kind of radiator structure of PCB circuit board, including backing plate (1), support frame (2) and circuit board (3), which is characterized in that institute
The upper end that support frame (2) is located at backing plate (1) is stated, and support frame (2) is connect by miniature screw with backing plate (1), the support frame
(2) upper end is equipped with circuit board (3), and circuit board (3) is connect by miniature screw with backing plate (1), and the side of backing plate (1)
One side edge keeping parallelism of the edge with circuit board (3) is to just；
The circuit board (3) includes aluminum substrate (301), heat dissipating layer (302) and fixed plate (303), and the aluminum substrate (301) is located at
The inside of circuit board (3), and aluminum substrate (301) is connect by way of bonding with circuit board (3), the aluminum substrate (301)
Lower end is equipped with heat dissipating layer (302), and the lower end of the heat dissipating layer (302) is equipped with fixed plate (303), and heat dissipating layer (302) and fixation
Plate is connected by way of bonding between (303)；
The support frame (2) includes line slot (201), hole (202), connecting line (203) and fixing threaded hole (204), the line
Road slot (201) is located at the internal one end of support frame (2), and described hole (202) is evenly distributed on the upper end of line slot (201), institute
The side that connecting line (203) is respectively positioned on line slot (201) is stated, and connecting line (203) is inlayed with line slot (201) and connect, institute
It states fixing threaded hole (204) and is respectively positioned on the internal one end of support frame (2).
2. the radiator structure of PCB circuit board according to claim 1, which is characterized in that the heat dissipating layer (302) and aluminium base
Plate (301) is fixed setting.
3. the radiator structure of PCB circuit board according to claim 1, which is characterized in that the side of the aluminum substrate (301)
The upper surface keeping parallelism of end face and circuit board (3).
4. the radiator structure of PCB circuit board according to claim 1, which is characterized in that the quantity of described hole (202) is
4, and hole (202) is followed successively by equidistant " transversely arranged " upper end for being distributed in line slot (201).
5. the radiator structure of PCB circuit board according to claim 1, which is characterized in that the heat dissipating layer (302) is thermally conductive
Glue heat dissipating layer (302).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821973287.6U CN209517619U (en) | 2018-11-28 | 2018-11-28 | A kind of radiator structure of PCB circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821973287.6U CN209517619U (en) | 2018-11-28 | 2018-11-28 | A kind of radiator structure of PCB circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209517619U true CN209517619U (en) | 2019-10-18 |
Family
ID=68191080
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821973287.6U Expired - Fee Related CN209517619U (en) | 2018-11-28 | 2018-11-28 | A kind of radiator structure of PCB circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209517619U (en) |
-
2018
- 2018-11-28 CN CN201821973287.6U patent/CN209517619U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20191018 Termination date: 20201128 |