CN208538066U - A kind of plastic cement backboard of foldable assembly - Google Patents

A kind of plastic cement backboard of foldable assembly Download PDF

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Publication number
CN208538066U
CN208538066U CN201820711640.7U CN201820711640U CN208538066U CN 208538066 U CN208538066 U CN 208538066U CN 201820711640 U CN201820711640 U CN 201820711640U CN 208538066 U CN208538066 U CN 208538066U
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China
Prior art keywords
assembled plate
assembled
chimb
plate
plastic cement
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Active
Application number
CN201820711640.7U
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Chinese (zh)
Inventor
钱彬
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dongguan Ke Sheng Sheng Industrial Co Ltd
Original Assignee
Dongguan Ke Sheng Sheng Industrial Co Ltd
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Priority to CN201820711640.7U priority Critical patent/CN208538066U/en
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Publication of CN208538066U publication Critical patent/CN208538066U/en
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Abstract

The utility model discloses a kind of plastic cement backboards of foldable assembly, including the first assembled plate, second assembled plate, assembled seat, screw mounting hole, rectangular heat dissipation hole, video card heat release hole, hexagonal heat release hole, connecting rod, chimb, groove, groove arranged in a uniform there are two being all provided on the left of the right side of described first assembled plate and the second assembled plate, first assembled plate is spliced into one piece of complete graphic card radiator backboard by assembly seat with the second assembled plate, it is uniform that the assembly seat is equipped with two column arrangements, and chimb corresponding with groove, by a column chimb in the groove alignment left side in the first assembled version, by a column chimb on the groove alignment right side on the second assembled plate, then the first assembled plate is passed through with connecting rod, second assembled plate and chimb, the first assembled plate and the second assembled plate are fixed on assembled seat respectively.

Description

A kind of plastic cement backboard of foldable assembly
Technical field
The utility model relates to graphic card radiator Backplane areas, more particularly, to a kind of plastic cement backboard of foldable assembly.
Background technique
Integrated circuit is largely used in machine element, it is well known that high temperature is the formidable enemy of integrated circuit, and high temperature not only can Cause system operation unstable, reduced service life causes the heat of high temperature to be not from it could even be possible to burning certain components Outside computer, but computer-internal, or perhaps IC interior, the effect of radiator be exactly by these heat absorptions, Then it diffuses in cabinet or outside cabinet, guarantees that the temperature of machine element is normal, the type of radiator is very more, CPU, shows Card, board chip set, hard disk, cabinet, power supply even CD-ROM drive and memory can all need radiator, and also lack not on each radiator Radiator rear panel, currently, one is individual mezzanines, directly there are mainly two types of commonplace backboards on the market It connects and is pasted onto behind mainboard, but at high cost, disassembly inconvenience, the intensity that cannot reinforce mainboard, another kind are to be integrally formed back Plate, but volume is excessive, when installation, easily occur sliding phenomenon, are not suitable for multi-hole position demand, and both backboards are mostly metal It is made, surface-closed, radiating rate is slow, proposes a kind of plastic cement backboard of foldable assembly thus.
Utility model content
The utility model is to overcome above situation insufficient, it is desirable to provide a kind of technical solution that can solve the above problem.
A kind of plastic cement backboard of foldable assembly, including including the first assembled plate, the second assembled plate, assembled seat, screw peace Fill hole, rectangular heat dissipation hole, video card heat release hole, hexagonal heat release hole, connecting rod, chimb, groove, which is characterized in that described first spells It is all provided on the left of the right side of loading board and the second assembled plate there are two groove arranged in a uniform, the first assembled plate and the second assembled plate are logical Cross assembled seat and be spliced into one piece of complete graphic card radiator backboard, it is uniform that the assembly seat is equipped with two column arrangements, and with groove phase Corresponding chimb is aligned right by a column chimb in the groove alignment left side in the first assembled version, by the groove on the second assembled plate Then one column chimb of side passes through the first assembled plate, the second assembled plate and chimb with connecting rod, respectively by the first assembled plate and the Two assembled plates are fixed on assembled seat.
Preferably, the described first assembled plate is made with the second assembled plate of plastic cement material.
Preferably, the right side of the described first assembled plate and the left side of the second assembled plate are arcuate structure.
Preferably, the chimb is cylindrical structure.
Preferably, the cental axial position of the chimb is equipped with through-hole.
Compared with prior art, the utility model has the beneficial effects that this graphic card radiator backboard by the first assembled plate with Second assembled plate is assembled, and the first assembled plate plate can be folded freely with the second assembled plate, furthermore the first assembly plate and the The edge of two assembled plates is equipped with screw mounting hole, can be fixed graphic card radiator backboard by screw, when video card works The heat of generation can also be dissipated by rectangular heat dissipation hole, video card heat release hole and the hexagonal on the first assembled plate and the second assembled plate Hot hole distributes, and avoiding temperature, to distribute speed slow and damage.
The additional aspect and advantage of the utility model will be set forth in part in the description, partially will be from following description In become obvious, or recognized by the practice of the utility model.
Detailed description of the invention
In order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be to embodiment Or attached drawing needed to be used in the description of the prior art is briefly described, it should be apparent that, the accompanying drawings in the following description is only It is some embodiments of the utility model, for those of ordinary skill in the art, before not making the creative labor property It puts, is also possible to obtain other drawings based on these drawings.
Fig. 1 is a kind of plastic cement back board structure schematic diagram of foldable assembly;
Fig. 2 is a kind of plastic cement backboard side view of foldable assembly;
Fig. 3 is folding device sectional view;
Fig. 4 is a kind of plastic cement backboard partial duty figure of foldable assembly.
In figure: 1, first assembled plate, the 2, second assembled plate, 3, assembled seat, 4, screw mounting hole, 5, rectangular heat dissipation hole, 6, Video card heat release hole, 7, hexagonal heat release hole, 8, connecting rod, 9, chimb, 10, groove.
Specific embodiment
Below by the technical scheme in the utility model embodiment is clearly and completely described, it is clear that described Embodiment is only the utility model a part of the embodiment, instead of all the embodiments, based on the implementation in the utility model Example, every other embodiment obtained by those of ordinary skill in the art without making creative efforts belong to The range of the utility model protection.
Please refer to Fig. 1~4, in the utility model embodiment, a kind of plastic cement backboard of foldable assembly, including first is assembled The assembled plate 2 of plate 1, second, assembled seat 3, screw mounting hole 4, rectangular heat dissipation hole 5, video card heat release hole 6, hexagonal heat release hole 7, connection Bar 8, chimb 9, groove 10, the right side of the described first assembled plate 1 and the left side of the second assembled plate 2 are arcuate structure, and are equipped with two A groove arranged in a uniform 10, the first assembled plate 1 and the second assembled plate 2 are spliced into one piece of complete video card by assembled seat 3 and dissipate Hot device backboard, the assembly seat 3 is equipped with two column arrangements uniformly, and chimb 9 corresponding with groove 10, and the chimb 9 is cylinder Structure, and the cental axial position of chimb 9 is equipped with through-hole, by a column chimb 9 in the alignment of groove 10 left side in the first assembled version 1, By a column chimb 9 on the alignment of groove 10 right side on the second assembled plate 2, the first assembled plate 1, second then is passed through with connecting rod 8 First assembled plate 1 and the second assembled plate 2 are fixed on assembled seat 3 by assembled plate 2 and chimb 9 respectively.
Described first assembled plate 1 is made with the second assembled plate 2 of plastic cement material, and the described first assembled plate 1 is equipped with video card The left side of heat release hole 6, video card heat release hole 6 is identical equipped with several sizes, and rectangular heat dissipation hole 5 arranged in a uniform, the first splicing The edge of plate 1 is set there are five screw mounting hole 4, and the medium position of the described second assembled plate 2 is arranged in a uniform equipped with several Hexagonal heat release hole 7, the edge of second splice plate 2 are set there are four screw mounting hole 4.
Graphic card radiator backboard can be fixed by screw, the heat that video card generates when working can also be spelled by first Loading board 1 is distributed with rectangular heat dissipation hole 6, video card heat release hole 7 and the hexagonal heat release hole on the second assembled plate 2, avoids temperature Degree distributes speed and damages slowly.
It is obvious to a person skilled in the art that the present invention is not limited to the details of the above exemplary embodiments, and And without departing substantially from the spirit or essential attributes of the utility model, it can realize that this is practical new in other specific forms Type.Therefore, in all respects, the present embodiments are to be considered as illustrative and not restrictive, this is practical new The range of type is indicated by the appended claims rather than the foregoing description, it is intended that containing for the equivalent requirements of the claims will be fallen in All changes in justice and range are embraced therein.It should not treat any reference in the claims as limiting Related claim.

Claims (5)

1. a kind of plastic cement backboard of foldable assembly, including the first assembled plate, the second assembled plate, assembled seat, screw mounting hole, square Shape heat release hole, video card heat release hole, hexagonal heat release hole, connecting rod, chimb, groove, which is characterized in that the right side of the described first assembled plate It is all provided on the left of side and the second assembled plate there are two groove arranged in a uniform, the first assembled plate and the second assembled plate pass through assembled seat It is spliced into one piece of complete graphic card radiator backboard, the assembly seat is equipped with two column arrangements uniformly, and corresponding with groove convex Side is directed at a column on right side by a column chimb in the groove alignment left side in the first assembled version, by the groove on the second assembled plate Then chimb passes through the first assembled plate, the second assembled plate and chimb with connecting rod, respectively by the first assembled plate and the second assembled plate It is fixed on assembled seat.
2. the plastic cement backboard of the foldable assembly of one kind according to claim 1, which is characterized in that the first assembled plate with Second assembled plate is made of plastic cement material.
3. the plastic cement backboard of the foldable assembly of one kind according to claim 1, which is characterized in that the described first assembled plate Right side and the left side of the second assembled plate are arcuate structure.
4. the plastic cement backboard of the foldable assembly of one kind according to claim 1, which is characterized in that the chimb is cylinder knot Structure.
5. the plastic cement backboard of the foldable assembly of one kind according to claim 1, which is characterized in that the central axis of the chimb Position is equipped with through-hole.
CN201820711640.7U 2018-05-14 2018-05-14 A kind of plastic cement backboard of foldable assembly Active CN208538066U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201820711640.7U CN208538066U (en) 2018-05-14 2018-05-14 A kind of plastic cement backboard of foldable assembly

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201820711640.7U CN208538066U (en) 2018-05-14 2018-05-14 A kind of plastic cement backboard of foldable assembly

Publications (1)

Publication Number Publication Date
CN208538066U true CN208538066U (en) 2019-02-22

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201820711640.7U Active CN208538066U (en) 2018-05-14 2018-05-14 A kind of plastic cement backboard of foldable assembly

Country Status (1)

Country Link
CN (1) CN208538066U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111338435A (en) * 2020-02-12 2020-06-26 新昌县欧赛机械有限公司 Can splice extension type computer chip
CN112377468A (en) * 2020-11-06 2021-02-19 广州菲亚兰德科技有限公司 Heat dissipation panel and heat dissipation equipment

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111338435A (en) * 2020-02-12 2020-06-26 新昌县欧赛机械有限公司 Can splice extension type computer chip
CN111338435B (en) * 2020-02-12 2021-12-03 中科同帜半导体(江苏)有限公司 Can splice extension type computer chip
CN112377468A (en) * 2020-11-06 2021-02-19 广州菲亚兰德科技有限公司 Heat dissipation panel and heat dissipation equipment

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