CN203930801U - Hot measurement jig - Google Patents
Hot measurement jig Download PDFInfo
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- CN203930801U CN203930801U CN201420313576.9U CN201420313576U CN203930801U CN 203930801 U CN203930801 U CN 203930801U CN 201420313576 U CN201420313576 U CN 201420313576U CN 203930801 U CN203930801 U CN 203930801U
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- heating board
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Abstract
It is a kind of by external power source that the utility model provides, the hot measurement jig of the interior thermal field of the system that realizes and flow field simulation, comprises heating board and heating module, wherein, a cable on heating board is electrically connected an external power source, and the heating power of this heating board is identical with this element under test; Heat transfer module is located on this heating board, absorbs and spread the heat that this heating board produces, and the overall dimensions of this heat transfer module and structure identical with this element under test.When heat test, this hot measurement jig replaces this element under test and is fixed in a system, simulates this element under test and produces thermal source.
Description
Technical field
The utility model relates to a kind of hot measurement jig, particularly relates to the hot measurement jig in a kind of server system heat radiation initial stage simulation thermal field and flow field.
Background technology
Along with the increase of powder consumption of electronic equipment and reducing of structural volume, heat radiation more and more becomes a major issue in product design, heat test has become an important content in product design checking, also be product specification design phase important index simultaneously, but in the model machine stage sometimes due to the imperfection of product function, make the power consumption of equipment can not reach maximum horizontal, the heating index of internal system can not be carried out testing authentication in time, after product development completes, carry out that testing authentication often needs to restructure etc., delay product development cycle.
Taking the hard disk in server system as example, due to the lifting of function and user demand, in server, the data volume of required storage also grows with each passing day, in the cabinet of server, conventionally need to configure multiple hard disks, effectively to increase the data storage capacity of server, therefore the thermal value of multiple hard disks in server system also improves thereupon greatly, and the initial stage of designing and developing at server system, emulation for system radiating design does not have complete hot testing tool (TTV, Thermal Test Vehicle), in prior art, TTV need be powered by mainboard, in the time that mainboard breaks down, test job cannot be waken up with a start, in addition, the heating wattage of each hard disk can be up to 25W, if there is any defect in server system in heat dissipation design, the thermal field on server system and flow field can be produced very important impact by the heating of multiple hard disks, for example long-time or in hot environment is used, easily there is the situation of data storage errors in hard disk chip, there is the situation that chip burns in the substandard product even having, be easy to cause exchanges data mistake, cause very large loss.
Therefore, urgently invent a kind of hot measurement jig without main board power supply, realize the simulation of internal system flow field and thermal field, be beneficial to realize the assessment of system initial stage heat-sinking capability in heat dissipation design.
Summary of the invention
For above-mentioned situation, the purpose of this utility model is mainly to provide a kind of hot measurement jig by external power source, realizes thermal field and flow field simulation in system.
For achieving the above object, the utility model provides a kind of hot measurement jig, comprises heating board and heat transfer module, wherein:
Heating board, the cable on this heating board is electrically connected an external power source, and the heating power of this heating board is identical with this element under test;
Heat transfer module, is located on this heating board, absorbs and spread the heat that this heating board produces, and the overall dimensions of this heat transfer module and structure identical with this element under test;
When heat test, this hot measurement jig replaces this element under test and is fixed in a system, simulates this element under test and produces thermal source.
Especially, described heat transfer module comprises absorber plate, is attached on this heating board, absorbs this heat that this heating board produces.
Especially, described heat transfer module also comprises heat-conducting plate, is located on this absorber plate, evenly spreads this heat of this absorber plate absorption to the surface of this heat-conducting plate.
Especially, described heat-conducting plate is sheet metal.
Especially, described heat transfer module is fixed on this heating board via screw.
Compared to prior art, hot measurement jig of the present utility model, by external power source, simulation heater element produces thermal source, realizes thermal field and flow field simulation in server system, the convenient assessment that realizes system initial stage heat-sinking capability in heat dissipation design.
[brief description of the drawings]
Fig. 1 is the exploded view of an embodiment of the hot measurement jig of the utility model;
Fig. 2 is the assembly drawing of Fig. 1.
[embodiment]
Hot measurement jig of the present utility model, by external power source, simulation heater element produces thermal source, realize thermal field and flow field simulation in system, the convenient assessment that realizes system initial stage heat-sinking capability in heat dissipation design, refer to Fig. 1, for the exploded view of an embodiment of the hot measurement jig of the utility model, for the schematic diagram of the hot measurement jig of hard disk, therefore, below the element under test of indication is hard disk, as shown in Figure 1, described hot measurement jig 1 comprises heating board 11 and heat transfer module, this heat transfer module comprises the first absorber plate 12 and the second absorber plate 13 and the first heat-conducting plate 14 and the second heat-conducting plate 15, a cable (not shown) on heating board 11 is electrically connected an external power source (not shown), the heating power of this heating board 11 is identical with this element under test (hard disk), heat transfer module is located on this heating board 11, absorbs and spread the heat that this heating board 11 produces.
In the present embodiment, the first absorber plate 12 and the second absorber plate 13 are attached to respectively the both sides of this heating board 11, absorb the heat that this heating board 11 produces; The first heat-conducting plate 14 is located at this first absorber plate 12 tops, evenly spreads this heat that this first absorber plate 12 absorbs surface to this first heat-conducting plate 14; The second heat-conducting plate 15 is located at the second absorber plate 13 belows, evenly spreads this heat that this second absorber plate 13 absorbs surface to this second heat-conducting plate 15.
In the present embodiment, on the position of the first heat-conducting plate 14 and the second heat-conducting plate 15 and heating board 11 correspondences, be respectively equipped with four threaded holes 3, screw 2 is locked in this threaded hole 3, and this heating board 11 that adheres to this first absorber plate 12 and this second absorber plate 13 is fixed between this first heat-conducting plate 14 and this second heat-conducting plate 15.
Refer to Fig. 2, for the assembly drawing of an embodiment of the hot measurement jig of the utility model, as shown in the figure, the overall dimensions of this heat transfer module and structure are identical with this element under test (being hard disk), when heat test, it is hard disk support bracket that this hot measurement jig 1 this element under test of replacement (being hard disk) is fixed on a system 4() on, provide required power supply by external power source (not shown), this hot measurement jig 1 is generated heat, simulate this element under test (being hard disk) and produce thermal source, be convenient to realize the assessment of initial stage heat-sinking capability in server in heat dissipation design.
In the present embodiment, described the first heat-conducting plate and the second heat-conducting plate are sheet metal.
The utility model also can be used for the heat test of internal memory or pci card, in the time of emulated memory, its size should be identical with real internal memory, on heat transfer module, can be provided with pcb board structure and the chip particle profile of real memory and be electrically connected golden finger, hot measurement jig of the present utility model can directly be inserted in memory slot, provide required power supply by external power source, heating board 11 generates heat, the heat that Reality simulation internal memory produces, identical, in the time of simulation pci card, the external dimensions of heat transfer module is identical with real pci card, make it can insert pci card groove or assembling is fixed on cabinet, provide required power supply by external power source, the heat that Reality simulation pci card produces.
By reference to the accompanying drawings embodiment of the present utility model and embodiment are described in detail above, but the utility model is not limited to the above-described embodiment and examples, in the ken possessing those skilled in the art, can also make a variety of changes without departing from the concept of the premise utility.
Claims (5)
1. a hot measurement jig, is characterized in that, this hot measurement jig comprises:
Heating board, the cable on this heating board is electrically connected an external power source, and the heating power of this heating board is identical with this element under test;
Heat transfer module, is located on this heating board, absorbs and spread the heat that this heating board produces, and the overall dimensions of this heat transfer module and structure identical with this element under test;
When heat test, this hot measurement jig replaces this element under test and is fixed in a system, simulates this element under test and produces thermal source.
2. hot measurement jig according to claim 1, is characterized in that, described heat transfer module comprises absorber plate, is attached on this heating board, absorbs this heat that this heating board produces.
3. hot measurement jig according to claim 2, is characterized in that, described heat transfer module also comprises heat-conducting plate, is located on this absorber plate, evenly spreads this heat of this absorber plate absorption to the surface of this heat-conducting plate.
4. hot measurement jig according to claim 3, is characterized in that, described heat-conducting plate is sheet metal.
5. hot measurement jig according to claim 3, is characterized in that, described heat transfer module is fixed on this heating board via screw.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420313576.9U CN203930801U (en) | 2014-06-12 | 2014-06-12 | Hot measurement jig |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420313576.9U CN203930801U (en) | 2014-06-12 | 2014-06-12 | Hot measurement jig |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203930801U true CN203930801U (en) | 2014-11-05 |
Family
ID=51826579
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420313576.9U Expired - Fee Related CN203930801U (en) | 2014-06-12 | 2014-06-12 | Hot measurement jig |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203930801U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109582552A (en) * | 2018-10-31 | 2019-04-05 | 山东超越数控电子股份有限公司 | A kind of simulating test device of CPU heat dissipation capacity |
| CN113720626A (en) * | 2021-08-31 | 2021-11-30 | 英业达科技有限公司 | Test card body and display adapter for test |
-
2014
- 2014-06-12 CN CN201420313576.9U patent/CN203930801U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109582552A (en) * | 2018-10-31 | 2019-04-05 | 山东超越数控电子股份有限公司 | A kind of simulating test device of CPU heat dissipation capacity |
| CN113720626A (en) * | 2021-08-31 | 2021-11-30 | 英业达科技有限公司 | Test card body and display adapter for test |
| CN113720626B (en) * | 2021-08-31 | 2024-05-17 | 英业达科技有限公司 | Test card body and display adapter for test |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141105 Termination date: 20160612 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |