CN204679923U - A kind of 2U high density server cabinet - Google Patents

Abstract

The utility model relates to server field, and particularly relate to a kind of 2U high density server cabinet, comprise cabinet, this 2U machine box for server comprises 6 nodes.The utility model, in same 2U cabinet, can insert more server, realizes more calculation server node, and this 2U server bulk density is large, and space availability ratio is high, and single computing node cost is low.

Description

A 2U high-density server chassis

technical field

The utility model relates to the server field, in particular to a 2U high-density server case.

Background technique

The 2U-height servers currently used in data centers, in order to increase the density of computing servers, many server manufacturers place two server motherboards or four server motherboards in a 2U-height chassis on the basis of following the conditions of the data center to form a Two computing service nodes or four computing service nodes, also referred to as Gemini or Quadruple; a schematic diagram thereof is shown in FIG. 1 . The server has the following characteristics: a redundant power supply module (PSU for short) is placed in the middle of the chassis for use in the entire chassis; Server 1 and Server 2 are placed on both sides of the power module; the fan (FAN) module is placed in the middle of the chassis; Put the hard disk at the end.

The 2U Gemini products and Quadruple products used in the above-mentioned data centers have achieved more computing service nodes in a limited chassis space; increased cost performance; but the structural layout of the chassis is designed to meet the needs of data centers. The computing service density has not been maximized, and the utilization of the chassis space has not been optimal; the cost of a single computing node is still high.

Utility model content

The purpose of the utility model is to provide a 2U high-density server chassis, which adopts the method of adding computing nodes in a single 2U server chassis, which solves the problem of low computing density, low space utilization rate and high cost of a single computing node in the original 2U server question.

The utility model is realized in the following way: a 2U high-density server case includes the case, and the 2U server case includes 6 nodes.

A further technical solution of the utility model is: the nodes in the chassis are installed independently and support hot swapping.

A further technical proposal of the utility model is: the case further includes a power supply module arranged on one side of the case.

A further technical solution of the utility model is: the power supply module adopts a redundant design and includes a first power supply module and a second power supply module.

A further technical solution of the utility model is: the chassis is also provided with a power adapter board, and the first power module and the second power module are interconnected through the power adapter board.

A further technical solution of the utility model is: the node includes a server mainboard, a hard disk and a signal adapter board.

A further technical solution of the utility model is: the case further includes a cooling fan, and the cooling fan is installed at the back of the case.

A further technical proposal of the utility model is: the right side of the chassis is provided with an air inlet to facilitate the heat dissipation of the power module.

A further technical solution of the present invention is: the heat dissipation air duct of the power module and the heat dissipation air duct of the computing node are independently designed and isolated from each other.

The beneficial effects of the utility model are: the utility model can insert more servers in the same 2U chassis to realize more computing server nodes, the 2U server has high computing density, high space utilization rate, and low cost of a single computing node.

Description of drawings

Fig. 1 is a schematic diagram of the original 2U server provided by the utility model.

Fig. 2 is a layout diagram 1 of the internal structure of the 2U chassis provided by the embodiment of the present invention.

Fig. 3 is the second layout diagram of the internal structure of the 2U chassis provided by the embodiment of the present invention.

Reference signs: 1. Chassis; 2. Node (NODE); 3. Server motherboard; 4. Hard disk; 5. Signal adapter board; 6. Backplane; 7. Fan; 8. Second power supply module; 9. Power supply Distribution interface board; 10. Rear power module adapter board; 11. Front power module adapter board; 12. First power module.

Detailed ways

Node: NODE, also called computing node, also refers to computing node device or node device in this application.

Define the direction of the chassis. As shown in Figure 2 and Figure 3, the end where the fan is installed is the rear of the chassis, and vice versa is the front of the chassis; the end where the power module is installed is the right side of the chassis, and vice versa is the left side of the chassis.

Embodiment 1 is shown in FIG. 2 and FIG. 3 .

Compared with the twin-star products in the traditional data center, this utility model has doubled the computing node density; compared with the quad-star products, it has increased the computing node density by 50%. The following describes in detail how the above-mentioned 6-node server is realized.

According to the above description, the height of the chassis is 2U, three computing node devices 2 are placed in the upper 1U space, and three computing node devices 2 are also placed in the lower 1U space; there are a total of six computing nodes in the upper and lower spaces.

Each node device contains: a server motherboard of a specific size 3: the carrier motherboard used to run the operating system; two 3.5-inch SATA hard drives 4: used to install the operating system and data storage; a signal adapter board 5: used Interconnection is performed on the main board 3 and the backplane 6 of the server.

The node device is embedded with a processor, memory, and a certain operating system is installed to form a server node with specific applications; and the node device supports hot swap; each node server will not affect other server nodes during the insertion process run.

As shown in FIG. 2 and FIG. 3 , the backplane 6 is arranged at the tail end of each node, that is, the end where the fan 7 is installed. The aforementioned backplane 6 is used for signal interconnection of all server nodes.

There are four heat dissipation fans 7 in this embodiment, which are used to dissipate heat for the whole machine; the air inlets of these radiator fans are mainly designed with openings on the front panels of the six node servers, and these fans can all support hot swapping, Easy to perform replacement. The front panel shown is a flat panel per node arrangement on the front of the chassis.

There are two power supply modules in the chassis, the first power supply module 12 and the second power supply module 8, also known as redundant modules, adopt a redundant design. In order to solve the space limitation, the distribution of the power modules is somewhat different from the traditional location. Wherein the first power module 12 is located at the front of the case, and the other power module is located at the rear of the case, that is, the second power module 8 . The signal interconnection between the two power supply modules, the two power supply modules are interconnected through the front power adapter board 11 and the rear power module adapter board 10, and finally through the power distribution interface board 9, all power supply signals are transmitted to the backplane 6. Allow all node servers to share the information of the power module. In short, the power adapter board 11 , the front and rear power adapter boards 10 , and the power distribution interface board 9 , the purpose of these three boards is to interconnect the signals of the power modules and transmit them to the backplane 6 .

Regarding the heat dissipation of the power module, the power fan inherits the cooling fan inside. Due to the limitation of the chassis structure, and in order to avoid disturbing the air duct inside the chassis with the cooling fan 7 of the chassis, special attention should be paid to the design of the cooling air duct of the power module. . This invention adopts the following methods to solve this problem: 1. The heat dissipation air duct of the power module is completely isolated from the heat dissipation air duct of the computing node. The purpose of doing this is to have a stable heat dissipation air duct; 2. Some air intake holes are designed on the right side to dissipate heat for the power module. The above design can well solve the heat dissipation of all components inside the chassis.

As shown in Figure 3, the devices of the utility model are shown in the figure, and all node servers support hot swapping; the power module supports hot swapping; the cooling fan supports hot swapping; this is a major feature of the invention.

The above descriptions are only preferred embodiments of the present utility model, and are not intended to limit the present utility model. Any modifications, equivalent replacements and improvements made within the spirit and principles of the present utility model shall be included in this utility model. within the scope of protection of utility models.

Claims (2)

1. a 2U high density server cabinet, comprises cabinet, it is characterized in that: this 2U machine box for server comprises 6 nodes, and the node disjoint in described cabinet is installed, and supports hot plug.

2. machine box for server according to claim 1, is characterized in that: this cabinet also comprises the power module being arranged on cabinet side.

3. machine box for server according to claim 2, is characterized in that: described power module adopts Redundancy Design to comprise the first power module and second source module.

4. machine box for server according to claim 3, is characterized in that: described cabinet is also provided with Power conversion board, and it is interconnected that described first power module and described second source module pass through described Power conversion board.

5. machine box for server according to claim 1, is characterized in that: described node comprises server master board, hard disk and Signals Transfer Board.

6. machine box for server according to claim 1, is characterized in that: described cabinet also comprises radiator fan, and described radiator fan is arranged on after described cabinet.

7. the machine box for server according to any one of claim 2 to 4, is characterized in that: described cabinet right side opening is provided with the air inlet facilitating described power module to dispel the heat.

8. machine box for server according to claim 7, is characterized in that: the heat dissipation wind channel of described power module and the heat dissipation wind channel independent design of computing node, mutually isolated.