CN209461455U - Tandem diode package structure - Google Patents
Tandem diode package structure Download PDFInfo
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- CN209461455U CN209461455U CN201920555348.5U CN201920555348U CN209461455U CN 209461455 U CN209461455 U CN 209461455U CN 201920555348 U CN201920555348 U CN 201920555348U CN 209461455 U CN209461455 U CN 209461455U
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- diode package
- package structure
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
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Abstract
The utility model provides a kind of tandem diode package structure, belongs to technical field of semiconductor device.The tandem diode package structure includes insulating part, multiple conduct pieces, multiple chips and multiple first leads, multiple conduct pieces are arranged at intervals on the insulating part, the chip is mounted on any one of conduct piece, the area of the chip is less than the area of the conduct piece.The second end of the connection of the first end of the conduct piece under one of chip in two neighboring chip and first lead, another chip and first lead connects.The utility model improves the technical problem that prior art production technology is more difficult, at high cost and low production efficiency.
Description
Technical field
The utility model relates to technical field of semiconductor device, in particular to a kind of tandem diode package knot
Structure.
Background technique
As high-frequency high-voltage circuit is using more and more extensive, to tandem diode package structure high pressure resistant and restore
The requirement of time is also higher and higher.Existing tandem diode package structure is the requirement for reaching high pressure resistant and fast quick-recovery,
Be by two chip-in series together.And in process of production, usually two chips are stacked and are welded together with reality
Existing concatenated purpose.
In the prior art, the chip to enable two to be stacked together is cascaded, usually will be in two chips
One it is two-sided silver-plated, the silver-plated another side of another chip one side is aluminized.The prior art uses two different chips, not only can
Cost is improved, production technology complexity is also resulted in, reduces production efficiency.Meanwhile to enable tandem diode package structure
High pressure resistant and fast quick-recovery needs to be completely coincident two chips when welding two chips, also results in production technology complexity
Change, reduces production efficiency.
Utility model content
The purpose of this utility model is to provide a kind of tandem diode package structures, to solve prior art production work
More difficult, the at high cost and low production efficiency technical problem of skill.
The utility model provides a kind of tandem diode package structure, and tandem diode package structure includes insulation
Part, multiple conduct pieces, multiple chips and multiple first leads；
Multiple conduct pieces are arranged at intervals on insulating part, and a chip is mounted on any one conduct piece, chip
Area is less than the area of conduct piece；
The connection of the first end of the conduct piece under one of chip in two neighboring chip and first lead, another core
The connection of the second end of piece and first lead.
Further, multiple conduct pieces are successively set on insulating part in linear type.
Further, conduct piece includes placing part and interconnecting piece, and placing part is connect with interconnecting piece, and chip is mounted on placing part
On, the second end of first lead is connect with interconnecting piece；
Multiple conduct pieces include head end conduct piece, intermediate conduct piece and tail end conduct piece, the interconnecting piece of head end conduct piece and
The interconnecting piece of intermediate conduct piece is L shape.
Further, tandem diode package structure further includes the second lead, and the first end of the second lead is hanging, and second
The second end of lead is connect with the chip on head end conduct piece.
Further, tandem diode package structure further includes external conduct piece, and external conduct piece is arranged in insulating part
On, and it is located at the side of head end conduct piece, the first end of the second lead is connect with external conduct piece.
Further, external conduct piece is L shape.
Further, tandem diode package structure further includes the first pin, and the first pin is bar shaped, the first pin
One end in both ends is connect with external conduct piece, and the other end of the first pin is hanging.
Further, the interconnecting piece of tail end conduct piece is bar shaped.
Further, tandem diode package structure further includes second pin, and second pin is bar shaped, second pin
One end in both ends is connect with the interconnecting piece of tail end conduct piece, and the other end of second pin is hanging.
Further, tandem diode package structure further includes plastic part and heat-dissipating frame, insulating part, multiple conductions
Part, multiple chips and multiple first leads are arranged in plastic part, and plastic part is mounted on heat-dissipating frame.
Tandem diode package structure provided by the utility model can generate it is following the utility model has the advantages that
Tandem diode package structure provided by the utility model include insulating part, multiple conduct pieces, multiple chips and
Multiple first leads, multiple conduct pieces are arranged at intervals on insulating part, and a chip, core are mounted on any one conduct piece
The area of piece is less than the area of conduct piece.
Multiple chips in tandem diode package structure provided by the utility model be by multiple first leads and
Multiple conduct pieces are sequentially connected in series together.After chip is placed in conduct piece, one side that chip is bonded with conduct piece can be with
It is electrically connected with conduct piece, at this time connects the first end of one of chip in two neighboring chip and first lead, it is another
The second end of conduct piece and first lead under a chip connects, and can make to be cascaded between two neighboring chip.According to
The connection type of above-mentioned first lead, first lead, which is connected in turn between multiple chips, successively to go here and there multiple chips
Connection, therefore the material of multiple chips in the present embodiment can be identical.
Due to compared with prior art, multiple chips in tandem diode package structure provided by the utility model
Material can be identical, therefore the cost of tandem diode package structure provided by the utility model is lower.And the utility model
Multiple chips in the tandem diode package structure of offer can be welded on conduct piece, and multiple first leads can will be more
A chip is sequentially connected in series together, and compared to the prior art, tandem diode package structure provided by the utility model is not required to
Multiple chips are overlaped, therefore the manufacturing process of tandem diode package structure provided by the utility model is more existing
Technology is simpler, and production efficiency is higher.
Meanwhile the number of chips in tandem diode package structure provided by the utility model can be more than two, because
This tandem diode package structure provided by the utility model is compared to the prior art more resistant to high pressure.
As can be seen that the utility model improves the skill that prior art production technology is more difficult, at high cost and low production efficiency
Art problem.
Detailed description of the invention
It, below will be right in order to illustrate more clearly of specific embodiment of the present invention or technical solution in the prior art
Specific embodiment or attached drawing needed to be used in the description of the prior art are briefly described, it should be apparent that, it is described below
In attached drawing be that some embodiments of the utility model are not paying creativeness for those of ordinary skill in the art
Under the premise of labour, it is also possible to obtain other drawings based on these drawings.
Fig. 1 is the structural schematic diagram of tandem diode package structure provided by the embodiment of the utility model；
Fig. 2 is the rearview of the tandem diode package structure in Fig. 1；
Fig. 3 is the side view of the tandem diode package structure in Fig. 1；
Fig. 4 be Fig. 1 in chip, conduct piece and lead structural schematic diagram；
Fig. 5 is another structural schematic diagram of tandem diode package structure provided by the embodiment of the utility model；
Fig. 6 is the rearview of the tandem diode package structure in Fig. 5；
Fig. 7 be Fig. 5 in chip, conduct piece and lead structural schematic diagram；
Fig. 8 is the another structural schematic diagram of tandem diode package structure provided by the embodiment of the utility model；
Fig. 9 is the rearview of the tandem diode package structure in Fig. 8；
Figure 10 is the side view of the tandem diode package structure in Fig. 8.
In figure:
1- insulating part；The external conduct piece of 10-；2- conduct piece；20- placing part；21- interconnecting piece；22- head end conduct piece；23-
Intermediate conduct piece；24- tail end conduct piece；3- chip；4- first lead；The second lead of 5-；The first pin of 6-；7- second pin；
8- plastic part；9- heat-dissipating frame.
Specific embodiment
It is practical new below in conjunction with this to keep the objectives, technical solutions, and advantages of the embodiments of the present invention clearer
Attached drawing in type embodiment, the technical scheme in the utility model embodiment is clearly and completely described, it is clear that described
Embodiment be only the utility model a part of the embodiment, instead of all the embodiments.Usually described in attached drawing here
It can arrange and design with a variety of different configurations with the component of the utility model embodiment shown.Therefore, below to
The detailed description of the embodiments of the present invention provided in attached drawing is not intended to limit the model of claimed invention
It encloses, but is merely representative of the selected embodiment of the utility model.Based on the embodiments of the present invention, those skilled in the art exist
Every other embodiment obtained under the premise of creative work is not made, is fallen within the protection scope of the utility model.
It is in the description of the present invention, it should be noted that term " center ", "upper", "lower", "left", "right", " perpendicular
Directly ", the orientation or positional relationship of the instructions such as "horizontal", "inner", "outside" is to be based on the orientation or positional relationship shown in the drawings, and is only
For ease of description the utility model and simplify description, rather than the device or element of indication or suggestion meaning must have it is specific
Orientation, be constructed and operated in a specific orientation, therefore should not be understood as limiting the present invention.In addition, term " the
One ", " second ", " third " are used for descriptive purposes only and cannot be understood as indicating or suggesting relative importance.
In addition, in the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term
" installation ", " connected ", " connection " shall be understood in a broad sense, for example, it may be fixedly connected, may be a detachable connection or one
Connect to body；It can be mechanical connection, be also possible to be electrically connected；It can be directly connected, it can also be indirect by intermediary
It is connected, can be the connection inside two elements.For the ordinary skill in the art, on being understood with concrete condition
State the concrete meaning of term in the present invention.
The utility model provides a kind of tandem diode package structure, with reference to the accompanying drawing to provided by the utility model
Tandem diode package structure is described in detail:
Embodiment one:
Please with reference to Fig. 1-7, as shown in figs. 1-7, tandem diode package structure provided in this embodiment includes exhausted
Edge part 1, multiple conduct pieces 2, multiple chips 3 and multiple first leads 4.As shown in Fig. 1, Fig. 4, Fig. 5 and Fig. 7, multiple conduct pieces 2
It is arranged at intervals on insulating part 1, a chip 3 is mounted on any one conduct piece 2, the area of chip 3 is less than conduct piece 2
Area.
Wherein, the material of insulating part 1 can be ceramics, and the material of conduct piece 2 can be copper, and the material of first lead 4 can
Think metal that can be conductive.Further, conduct piece 2 can be is fixed on insulating part 1 using etching technics, chip 3
It can be and be welded on conduct piece 2.
Wherein, the first end of the conduct piece 2 under one of chip 3 in two neighboring chip 3 and first lead 4 connects
It connects, another chip 3 is connect with the second end of first lead 4.
Further, the first end of first lead 4 can be welded on conduct piece 2, and the second end of first lead 4 can
To be welded on chip 3.
Multiple chips as shown in Fig. 1, Fig. 4, Fig. 5 and Fig. 7, in tandem diode package structure provided in this embodiment
3 be sequentially connected in series by multiple first leads 4 with multiple conduct pieces 2 together with.After chip 3 is placed in conduct piece 2, chip 3
The one side being bonded with conduct piece 2 can be electrically connected with conduct piece 2.At this time by two neighboring chip 3 one of chip 3 with
The first end of first lead 4 connects, and the conduct piece 2 under another chip 3 is connect with the second end of first lead 4, such as Fig. 1, figure
4, shown in Fig. 5 and Fig. 7, can make to be cascaded between two neighboring chip 3.According to the connection type of above-mentioned first lead 4,
First lead 4, which is connected in turn between multiple chips 3, to be sequentially connected in series multiple chips 3, therefore more in the present embodiment
The material of a chip 3 can be identical.
Since the material of multiple chips 3 in tandem diode package structure provided in this embodiment can be identical, because
The cost of this tandem diode package structure provided in this embodiment is lower compared with the prior art.And series connection provided in this embodiment
Multiple chips 3 in formula diode package structure can be welded on conduct piece 2, and multiple first leads 4 can be by multiple chips 3
It is sequentially connected in series together, compared to the prior art, tandem diode package structure provided in this embodiment is not required to multiple cores
Piece 3 overlaps, therefore the manufacturing process of tandem diode package structure provided in this embodiment is simpler compared with the prior art
Single, production efficiency is higher.Meanwhile 3 quantity of chip in tandem diode package structure provided in this embodiment can be more than
Two, as shown in Fig. 1, Fig. 4, Fig. 5 and Fig. 7, therefore tandem diode package structure provided in this embodiment is compared to existing
Technology is more resistant to high pressure.
To sum up, the present embodiment improves the problem that prior art production technology is more difficult, at high cost and low production efficiency.
As shown in Fig. 1, Fig. 4, Fig. 5 and Fig. 7, multiple conduct pieces 2 in the present embodiment can be successively set in linear type
On insulating part 1.
Multiple conduct pieces 2 are once arranged on insulating part 1 in linear type can further simplify the present embodiment provides
Tandem diode package structure production technology.Therefore the preferably multiple conduct pieces 2 of the present embodiment are set gradually in linear type
On insulating part 1.
Wherein, the quantity of chip 3 there is no limit, as shown in Figure 1 and Figure 4, the quantity of chip 3 can be 10, such as Fig. 5 and
Shown in Fig. 7, the quantity of chip 3 can also be 5.The quantity of chip 3 can be selected according to actual needs.
As shown in Fig. 1, Fig. 4, Fig. 5 and Fig. 7, conduct piece 2 may include placing part 20 and interconnecting piece 21, placing part 20 and even
Socket part 21 connects, and chip 3 is mounted on placing part 20, and the second end of first lead 4 is connect with interconnecting piece 21.
Wherein, multiple conduct pieces 2 include that head end conduct piece 22, intermediate conduct piece 23 and tail end conduct piece 24, head end are conductive
The interconnecting piece 21 of the interconnecting piece 21 of part 22 and intermediate conduct piece 23 is L shape.
Further, the placing part 20 of conduct piece 2 and interconnecting piece 21 can be integrally formed.Such as Fig. 1, Fig. 4, Fig. 5 and
Shown in Fig. 7, when the interconnecting piece 21 of the interconnecting piece 21 of head end conduct piece 22 and intermediate conduct piece 23 is L shape, head end conduct piece
22 and intermediate conduct piece 23 shape can be approximated to be it is Z-shaped.
As shown in Fig. 1, Fig. 4, Fig. 5 and Fig. 7, the interconnecting piece 21 of the interconnecting piece 21 of head end conduct piece 22 and intermediate conduct piece 23
It is that head end conduct piece 22 and intermediate conduct piece 23 can be made to arrange is closer for L shape, and then can save space.Meanwhile may be used also
So that the length of first lead 4 is shorter, cost is further saved.
Wherein, the interconnecting piece 21 of the interconnecting piece 21 of head end conduct piece 22 and intermediate conduct piece 23 is L shape, can also make phase
The distance between the interconnecting piece 21 and another chip 3 of the conduct piece 2 under one of chip 3 in adjacent two chips 3 are relatively close,
When welding process is pipelining, speed of welding can be made faster, further improving production efficiency.
Wherein, the shape of interconnecting piece 21 can be identical as the shape of chip 3, and the area of interconnecting piece 21 can be slightly larger than or
Person is equal to the area of chip 3, and then can save area occupied of multiple conduct pieces 2 on insulating part 1, makes tandem diode
Encapsulating structure minimizes as far as possible.
Wherein, head end conduct piece 22 can be consistent with the shapes and sizes of intermediate conduct piece 23, therefore carves on insulating part 1
, can be by the way of pipelining when losing conduct piece 2, further improving production efficiency.
As shown in Fig. 1, Fig. 4, Fig. 5 and Fig. 7, tandem diode package structure provided in this embodiment can also include the
The first end of two leads 5, the second lead 5 is hanging, and the second end of the second lead 5 is connect with the chip 3 on head end conduct piece 22.
Wherein, the first end of the second lead 5 can be electrically connected with extraneous electrical component, and the second lead 5 is convenient for the series connection
Formula diode package structure is connected with extraneous electrical component.In practical applications, the material of the second lead 5 can be with first lead
4 is identical.
As shown in Fig. 1, Fig. 4, Fig. 5 and Fig. 7, tandem diode package structure provided in this embodiment can also include outer
Connecing conduct piece 10, external conduct piece 10 is arranged on insulating part 1, and is located at the side of head end conduct piece 22, and the of the second lead 5
One end is connect with external conduct piece 10.
After the first end of second lead 5 is connect with external conduct piece 10, external conduct piece 10 can be used for electrical with the external world
Element electrical connection.It is directly electrically connected with extraneous electrical component compared to by the first end of the second lead 5, utilizes external conduct piece 10
Connecting with extraneous electrical component can make the tandem diode package structure stability more preferable.
In the present embodiment, tail end conduct piece 24 can be used for being electrically connected with extraneous electrical component, tail end conduct piece 24
The tandem diode package structure stability can also be made more preferable.
Wherein, chip 3 is not provided on external conduct piece 10, external conduct piece 10 can be electrically connected with head end conduct piece 22
It connects.External conduct piece 10, head end conduct piece 22, intermediate conduct piece 23 and tail end conduct piece 24 can be successively arranged along linear type
On insulating part 1.Wherein, two electricity of external conduct piece 10 and the respectively tandem diode package structure of tail end conduct piece 24
Pole.
In practical applications, external conduct piece 10 and tail end conduct piece 24, which may each be, is etched on insulating part 1.
There is no limit as shown in Fig. 1, Fig. 4, Fig. 5 and Fig. 7, the present embodiment is preferably external to lead the shape of external conduct piece 10
The shape of electric part 10 is L shape.
It is more compact between external conduct piece 10 and head end conduct piece 22 that external conduct piece 10 is that L shape can make, and can be so as to
It is welded between external conduct piece 10 and head end conduct piece 22 in by the second lead 5.
As shown in Fig. 1-3 and Fig. 5-6, tandem diode package structure provided in this embodiment can also draw including first
Foot 6, the first pin 6 can be bar shaped, and one end in the both ends of the first pin 6 is connect with external conduct piece 10, the first pin 6
The other end is hanging.
Wherein, the first pin 6 can be metallic rod, and one end in the both ends of the first pin 6, which can be, is fixed in external lead
On electric part 10, the first pin 6 can be electrically connected between external conduct piece 10, and the other end of the first pin 6 can be with the external world
Electrical component electrical connection.
Further, the other end of the first pin 6 can be plugged on extraneous electrical component or the first pin 6 it is another
One end can weld together with extraneous electrical component, and the first pin 6 is convenient for the tandem diode package structure and the external world
Electrical component electrical connection.
Wherein, there is no limit can select the first pin to the length of the first pin 6 according to actual needs in practical applications
6 length.
As shown in Fig. 1, Fig. 4, Fig. 5 and Fig. 7, the interconnecting piece 21 of tail end conduct piece 24 can be bar shaped.
The shape of tail end conduct piece 24 is the area that bar shaped can further save the occupancy of the conduct piece 2 on insulating part 1,
The tandem diode package structure can be made more to minimize.
Further, as shown in Fig. 1, Fig. 4, Fig. 5 and Fig. 7, tandem diode package structure provided in this embodiment is also
It may include second pin 7, second pin 7 or bar shaped, one end and tail end conduct piece 24 in the both ends of second pin 7
Interconnecting piece 21 connect, the other end of second pin 7 is hanging.
Wherein, second pin 7 is also possible to metallic rod, and one end in the both ends of second pin 7, which can be, is fixed in tail end
On conduct piece 24, second pin 7 can be electrically connected between tail end conduct piece 24, the other end of second pin 7 can with it is outer
The electrical connection of boundary's electrical component.
Further, the other end of second pin 7 can also be plugged on extraneous electrical component or second pin 7
The other end can also weld together with extraneous electrical component, and second pin 7 is equally convenient for the tandem diode package knot
Structure is electrically connected with extraneous electrical component.
Also there is no limit can select second pin 7 to the length of second pin 7 according to actual needs in practical applications
Length.
Wherein, the length of the first pin 6 can be identical as the length of second pin 7, the shape and material of the first pin 6
It can be identical as the shape of second pin 7 and material.
As seen in figs. 8-10, tandem diode package structure provided in this embodiment can also include plastic part 8 and dissipate
Hot frame 9, insulating part 1, multiple conduct pieces 2, multiple chips 3 and multiple first leads 4 are arranged in plastic part 8, plastic part 8
It is mounted on heat-dissipating frame 9.
The material of heat-dissipating frame 9 may be copper, and heat-dissipating frame 9 can expand the heat dissipation of tandem diode package structure
Area, and then it is conducive to the heat dissipation of the tandem diode package structure.
Wherein, hole can be set on heat-dissipating frame 9, hole is convenient for for the tandem diode package structure being mounted on
On external object.Bolt is passed through such as in hole, and bolt is connect with external object, it can be by the tandem diode package
Structure is fixed together with external object.
Wherein, plastic part 8 can wrap up multiple chips 3 and insulating part 1, but can be by the another of the first pin 6
The other end of end and second pin 7 is exposed, and plastic part 8 can play a protective role.
Further, plastic part 8, which can be, is moulded on multiple conduct pieces 2, multiple chips 3 and insulating part 1, heat dissipation frame
Frame 9 can be sheet, and plastic part 8, which can be, to be fixed on heat-dissipating frame 9.
It, can be with as shown in figure 8, when tandem diode package structure provided in this embodiment further includes heat-dissipating frame 9
It is not provided with external conduct piece 10.The first end of the second lead 5 can directly be connect with wherein one end of the first pin 6 at this time,
Wherein one end of first pin 6 can connect on heat-dissipating frame 9, and wherein one end of second pin 7, which also can connect, is radiating
It can connect one first on frame 9, and between wherein one end of second pin 7 and the interconnecting piece 21 of tail end conduct piece 24 to draw
Line 4.
Finally, it should be noted that embodiment described above, only specific embodiment of the present utility model, to illustrate this
The technical solution of utility model, rather than its limitations, the protection scope of the utility model is not limited thereto, although referring to aforementioned
The utility model is described in detail in embodiment, those skilled in the art should understand that: it is any to be familiar with this skill
The technical staff in art field within the technical scope disclosed by the utility model, still can be to skill documented by previous embodiment
Art scheme modify or can readily occur in variation or equivalent replacement of some of the technical features；And these modifications,
Variation or replacement, the spirit and model of the utility model embodiment technical solution that it does not separate the essence of the corresponding technical solution
It encloses, should be covered within the scope of the utility model.Therefore, the protection scope of the utility model should be wanted with the right
Subject to the protection scope asked.
Claims (10)
1. a kind of tandem diode package structure, which is characterized in that the tandem diode package structure include insulating part,
Multiple conduct pieces, multiple chips and multiple first leads；
Multiple conduct pieces are arranged at intervals on the insulating part, are mounted on described in one on any one of conduct piece
Chip, the area of the chip are less than the area of the conduct piece；
The first end of the conduct piece under one of them described chip in the two neighboring chip and the first lead
Connection, another described chip are connect with the second end of the first lead.
2. tandem diode package structure according to claim 1, which is characterized in that multiple conduct pieces are in a word
Shape is successively set on the insulating part.
3. tandem diode package structure according to claim 2, which is characterized in that the conduct piece includes placing part
And interconnecting piece, the placing part are connect with the interconnecting piece, the chip is mounted on the placing part, the first lead
Second end is connect with the interconnecting piece；
Multiple conduct pieces include head end conduct piece, intermediate conduct piece and tail end conduct piece, the connection of the head end conduct piece
The interconnecting piece of portion and the intermediate conduct piece is L shape.
4. tandem diode package structure according to claim 3, which is characterized in that the tandem diode package
Structure further includes the second lead, and the first end of second lead is hanging, and second end and the head end of second lead are led
Chip connection on electric part.
5. tandem diode package structure according to claim 4, which is characterized in that the tandem diode package
Structure further includes external conduct piece, and the external conduct piece is arranged on the insulating part, and is located at the head end conduct piece
Side, the first end of second lead are connect with the external conduct piece.
6. tandem diode package structure according to claim 5, which is characterized in that the external conduct piece is L shape.
7. tandem diode package structure according to claim 6, which is characterized in that the tandem diode package
Structure further includes the first pin, and first pin is bar shaped, and one end in the both ends of first pin external is led with described
Electric part connection, the other end of first pin are hanging.
8. tandem diode package structure according to claim 3, which is characterized in that the connection of the tail end conduct piece
Portion is bar shaped.
9. tandem diode package structure according to claim 8, which is characterized in that the tandem diode package
Structure further includes second pin, and the second pin is bar shaped, and one end in the both ends of the second pin is led with the tail end
The interconnecting piece of electric part connects, and the other end of the second pin is hanging.
10. -9 described in any item tandem diode package structures according to claim 1, which is characterized in that the tandem
Diode package structure further includes plastic part and heat-dissipating frame, the insulating part, multiple conduct pieces, multiple chips and multiple described
First lead is arranged in the plastic part, and the plastic part is mounted on the heat-dissipating frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920555348.5U CN209461455U (en) | 2019-04-23 | 2019-04-23 | Tandem diode package structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920555348.5U CN209461455U (en) | 2019-04-23 | 2019-04-23 | Tandem diode package structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209461455U true CN209461455U (en) | 2019-10-01 |
Family
ID=68048080
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920555348.5U Active CN209461455U (en) | 2019-04-23 | 2019-04-23 | Tandem diode package structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209461455U (en) |
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2019
- 2019-04-23 CN CN201920555348.5U patent/CN209461455U/en active Active
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Effective date of registration: 20211102 Address after: 132013 No.99, Shenzhen street, high tech Zone, Jilin City, Jilin Province Patentee after: JILIN SINO-MICROELECTRONICS Co.,Ltd. Patentee after: Jilin Huayao Semiconductor Co.,Ltd. Address before: 132013 No.99, Shenzhen street, high tech Zone, Jilin City, Jilin Province Patentee before: JILIN SINO-MICROELECTRONICS Co.,Ltd. |