CN209447776U - Wafer taking and placing equipment - Google Patents

Abstract

A wafer picking and placing device comprises a first rail and a second rail used for sliding jigs, a third rail and a fourth rail used for bearing carriers, a first picking and placing unit used for taking out wafers on a bearing disc of the jig positioned on the first rail and placing the wafers on the carrier positioned on the third rail, a second picking and placing unit used for taking out wafers on a carrier positioned on the fourth rail and placing the wafers on the bearing disc of the jig positioned on the second rail, so that the jig and a receiving jig are simultaneously conveyed, the wafer picking and placing device further comprises a first moving unit used for moving a cover plate of the jig, and a second moving unit used for moving the bearing disc of the jig, and the jig received by the wet processing device can be conveyed to the wet processing device again.

Description

Chip fetching device

Technical field

The utility model relates to a kind of chip fetching devices, more particularly to a kind of for that will be loaded with the jig of multiple chips It send to the chip fetching device of a wet type processing device.

Background technique

Existing a kind of for cleaning the wet type processing device for being placed in multiple chips of jig, the wet type processing device has An output end is exported for an input terminal of jig input, and for the jig, it is however generally that, corresponding such wet processed Chip fetching device need to be usually respectively set in the input terminal and the output end in equipment, set on wherein the one of the input terminal Chip fetching device is for removing and placing chip from carrier in the jig, set on wherein another crystalline substance of the output end Piece fetching device is for removing and placing chip from the jig in the carrier, and still, such equipment set-up mode will Make the jig in operation process, needs to be transferred to from the chip fetching device for being set to the output end set on institute by manpower State the chip fetching device of input terminal, very inconvenient in operation and labor intensive and time.

Utility model content

The utility model wherein one is designed to provide a kind of crystalline substance that can improve an at least disadvantage in above-mentioned background technique Piece fetching device.

The chip fetching device of the utility model is suitable for from carrier taking out multiple chips simultaneously in some state sample implementations Be placed in jig and the jig be delivered to wet type processing device, and from the wet type processing device receive the jig and The chip is taken out to from the jig and is placed in the carrier, the jig includes the carrying for carrying the chip Disk, and it is covered on the cover board of the carrier.The chip fetching device is comprising workbench, jig delivery unit, carrier Delivery unit, the first picking and placing unit, the second picking and placing unit, first move unit and second move unit.The jig transport Unit includes the first track and the second track set on the workbench and for sliding for the jig, and set on described the One track and second track are so that multiple drivings that the jig slides on first track and second track Module, first track have first entrance section, in contrast to the first entrance section first outlet section, be located at described first Cover board exhausting section between entrance and the first outlet section, and it is located at the cover board exhausting section and the first outlet section Between chip exhausting section, second track have adjacent to the second entrance section of the first outlet section, in contrast to described Second entrance section and adjacent to the second outlet section of the first entrance section, be located at the second entrance section and the second outlet Wafer placement section between section, and the cover board storing section between the wafer placement section and the second outlet section, Described in first entrance section and the second outlet section be respectively used to be connected to output end and the input of the wet type processing device End.The carrier delivery unit includes the third track and the 4th track set on the workbench and for carrying the carrier. First picking and placing unit is set to the workbench and for that will be located at the jig of the chip exhausting section of first track Carrier on chip take out and be placed on the carrier of the third track.Second picking and placing unit is set to described Workbench and for by be located at the 4th track carrier on chip take out and be placed in the crystalline substance positioned at second track Piece is put on the carrier of the jig of section.Described first moves unit set on the workbench and for that will be located at described the The cover board of the jig of the cover board exhausting section of one track is moved to the cover board for being located at second track to put and be controlled described in section On the carrier of tool.Described second moves unit set on the workbench and for that will be located at the first outlet of first track The carrier of the jig of section is moved to the second entrance section of second track.

In some state sample implementations, first track and second track are located at same level.

In some state sample implementations, first picking and placing unit and second picking and placing unit can simultaneously pick and place the crystalline substance Piece.

In some state sample implementations, the third track has third entrance, in contrast to the of the third entrance Three outlet sections, and the chip exhausting section between the third entrance and the third outlet section, wherein the third Entrance and each self energy of third outlet section are stacked for multiple carriers, and first picking and placing unit is described for that will be located at Chip on the carrier of the jig of the chip exhausting section of first track takes out and is placed in positioned at the third track On the carrier of chip exhausting section, the 4th track has the 4th entrance, the 4th outlet in contrast to the 4th entrance Section, and the wafer placement section between the 4th entrance and the 4th outlet section, wherein the 4th entrance Stacked for multiple carriers with each self energy of the 4th outlet section, second picking and placing unit will be for that will be located at the 4th rail Chip on the carrier of the wafer placement section in road takes out and is placed in described in the wafer placement section positioned at second track and controls On the carrier of tool, the carrier delivery unit further includes being set to the third track and the 4th track so that the carrier The multiple drive modules slided on the third track and the 4th track.

In some state sample implementations, the chip fetching device also includes the first temporary storage mechanism, and is set to the work The third of platform moves unit, and the third moves unit for that will be located at the jig of the first entrance section of first track It moves to first temporary storage mechanism.

In some state sample implementations, the chip fetching device also includes first pushing away with first temporary storage mechanism Vehicle, first cart are separably set to the workbench.

In some state sample implementations, the chip fetching device also includes the second temporary storage mechanism, and is set to the work The 4th of platform moves unit, and the described 4th moves unit for that will be located at the jig of the second outlet section of second track It moves to second temporary storage mechanism.

In some state sample implementations, the chip fetching device also includes second pushing away with second temporary storage mechanism Vehicle, second cart are separably set to the workbench.

In some state sample implementations, first track and second track are in parallel with each other side by side.

In some state sample implementations, the third track and first track be adjacent to it is parallel side by side, the 4th rail Road and second track be adjacent to it is parallel side by side.

The utility model at least has effects that following: being transported by the jig with first track and second track Defeated unit, first picking and placing unit for picking and placing chip and second picking and placing unit, enable the chip fetching device Simultaneously conveying jig and receive jig, also, by described first of the cover board for moving the jig move unit with Described second for moving the carrier of the jig moves unit, enables the jig in first track and described the It moves between two tracks, is set in favor of the wet processed will be delivered to again from the received jig of the wet type processing device It is standby.

Detailed description of the invention

Other features and effect of the utility model will be clearly presented in the embodiment referring to schema, in which:

Fig. 1 is a schematic top plan view of an embodiment of the utility model chip fetching device；

Fig. 2 is a schematic top plan view, illustrates the carrier of the jig of the embodiment conveying；

Fig. 3 is a schematic top plan view, illustrates the cover board of the jig of the embodiment conveying；

Fig. 4 is a schematic cross-sectional view, illustrates the chip of the corresponding accommodating of the jig；

Fig. 5 is a stereoscopic schematic diagram, illustrates the first track and drive module of the embodiment；

Fig. 6 is a stereoscopic schematic diagram, illustrates the drive module of the embodiment；

Fig. 7 is a stereoscopic schematic diagram, illustrates the first picking and placing unit of the embodiment；And

Fig. 8 is a stereoscopic schematic diagram, illustrates the first cart of the embodiment.

Specific embodiment

Before the utility model is described in detail, it shall be noted that in the following description content, similar element be with It is identically numbered to indicate.

Refering to fig. 1 to Fig. 4, an embodiment of the utility model chip fetching device 10 is suitable for multiple chips 500 certainly Carrier 300 takes out and is placed in jig 400 and the jig 400 is delivered to a wet type processing device 100 to carry out at wet type Reason, and receive the jig 400 from the wet type processing device 100 and take out the chip 500 simultaneously from the jig 400 It is placed in the carrier 300.The jig 400 includes the carrier 401 for carrying the chip 500, and is covered on One cover board 402 of the carrier 401, the carrier 401 is formed with multiple first flushing hole 401A, and is respectively formed in The first flushing hole 401A and for accommodate the multiple support unit 401B for supporting the chip 500, the cover board 402 is formed There are the multiple second flushing hole 402A for respectively corresponding the first flushing hole 401A, and is respectively formed in second flushing hole 402A and the multiple position-limiting unit 402B for being used to limit the chip 500, but it should be recognized that the jig 400 is at other Structure design in state sample implementation can be changed according to demand, be not limited to this embodiment.The chip fetching device 10 is Include a workbench 1, a jig delivery unit 2, a carrier delivery unit 3, one first picking and placing unit 4, one second picking and placing unit 5, it one first moves unit 6 and one second moves unit 7.

Refering to Fig. 5 and Fig. 6, the jig delivery unit 2 includes set on the workbench 1 and for supplying the jig for cooperation 400 one first tracks 21 and one second track 22 slided, and be set to first track 21 and second track 22 with The multiple drive modules 23 for sliding the jig 400 on first track 21 and second track 22.Described first Track 21 have a first entrance section 211, in contrast to a first outlet section 212 of the first entrance section 211, be located at described the A cover board exhausting section 213 between one entrance 211 and the first outlet section 212, and it is located at the cover board exhausting section 213 A chip exhausting section 214 between the first outlet section 212, second track 22 have adjacent to the first outlet One second entrance section 221 of section 212, in contrast to the second entrance section 221 and adjacent to the one the of the first entrance section 211 Two outlet sections 222, the wafer placement section 223 between the second entrance section 221 and the second outlet section 222, with And the cover board between the wafer placement section 223 and the second outlet section 222 puts section 224, wherein described first Entrance 211 and the second outlet section 222 be respectively used to be connected to an output end 100A of the wet type processing device 100 with One input terminal 100B.In the present embodiment, the cross section of first track 21 is general u-shaped and is equipped with and is used to support in inside Multiple back-up roller wheels 215 of the jig 400 are equipped with multiple lateral for supplying the lateral margin of the jig 400 to abut against in top Idler wheel 216, so that the jig 400 can be slided swimmingly on first track 21.And first track 21 is in two Inside is set there are two sliding rail 217, and the quantity of the drive module 23 of the jig delivery unit 2 is four, and two of them drive mould Block 23 is set to first track 21, and wherein another two drive module 23 is set to second track 22, but drive module 23 Quantity is not limited system.And two drive module 23 for being set to first track 21 is respectively correspondingly arranged in the sliding rail 217, each drive module 23 has an ontology 231 of the extending direction extension along first track 21, is connected to described 231 lower section of body and the slide section 232 for being slidingly disposed at corresponding sliding rail 217, and it is rotatably arranged in the ontology 231 Both ends and two clamping parts 233 that are spaced apart according to the size of the jig 400 and being in the form of a column, the clamping part 233 It can be rotated up relative to the ontology 231 to clamp the jig 400 jointly, in the present embodiment, the clamping part 233 is Driven by cylinder (not shown), but not limited to this, enable whereby the drive module 23 clamp the jig 400 and The jig 400 can be driven to slide on first track 21.Set on the drive module 23 of second track 22 Set-up mode is identical as the set-up mode of the drive module 23 of first track 21 is set to, and substantially second rail The structure in road 22 is identical as the structure of first track 21, repeats no more in this.It should be noted that in the present embodiment only A kind of mechanism of drive module 23 of example constructs, but in other state sample implementations, and the drive module 23 can be controlled for energy band is dynamic Any existing mechanism of 400 sliding of tool, is not limited to this embodiment system.

The carrier delivery unit 3 includes the third track set on the workbench 1 and for carrying the carrier 300 31 and one the 4th track 32.In the present embodiment, the third track 31 has a third entrance 311, in contrast to described the One third outlet section 312 of three entrances 311, and between the third entrance 311 and the third outlet section 312 A chip exhausting section 313, wherein the third entrance 311 supplies multiple loads with each self energy of the third outlet section 312 Tool 300 is stacked.4th track 32 has one the 4th entrance 321, goes out in contrast to the one the 4th of the 4th entrance 321 Mouth section 322, and the wafer placement section 323 between the 4th entrance 321 and the 4th outlet section 322, In, the 4th entrance 321 is stacked for multiple carriers 300 with each self energy of the 4th outlet section 322, and the carrier Delivery unit 3 further includes being set to the third track 31 with the 4th track 32 so that the carrier 300 is in the third rail The multiple drive modules 33 slided on road 31 and the 4th track 32.In more detail, the carrier delivery unit 3 is in this reality Apply in example further includes set on the third entrance 311, the third outlet section 312, the 4th entrance 321 and described the Multiple supporting mechanism (not shown) of four outlet sections 322, the supporting mechanism are respectively used to that the third will be stacked and placed on from bottom Entrance 311, the third outlet section 312, the 4th entrance 321 and the carrier 300 of the 4th outlet section 322 are upward Support is high, so that the drive module 33 is able to drive is not supportted high carrier 300 in the third track 31 and described the upwards It is slided on four tracks 32.The drive module of the drive module 33 of the carrier delivery unit 3 and the jig delivery unit 2 23 structure is roughly the same, repeats no more in this.

Refering to fig. 1 to Fig. 4 and Fig. 7, first picking and placing unit 4 is set to the workbench 1 and for that will be located at described the Chip 500 on the carrier 401 of the jig 400 of the chip exhausting section 214 of one track 21 takes out and is placed in positioned at institute On the carrier 300 for stating the chip exhausting section 313 of third track 31.In the present embodiment, first picking and placing unit 4 has one to hang Frame 41 and a chip pick and place module 42.The hanger 41 is set on the workbench 1 and described with being across with being located above One boom 411 of the chip exhausting section 313 of the chip exhausting section 214 of the first track 21 and the third track 31, the chip Picking and placing module 42 has the sliding seat 421 for being slidingly disposed at the boom 411, and set on the one of the sliding seat 421 Vacsorb component 422, the vacsorb component 422 have the multiple suctions to form a line and for adsorbing the chip 500 Mouth 422a.

Second picking and placing unit 5 is set to the workbench 1 and for that will be located at the wafer placement of the 4th track 32 Chip 500 on the carrier 300 of section 323 takes out and is placed in described in the wafer placement section 223 positioned at second track 22 On the carrier 401 of jig 400.In the present embodiment, there is second picking and placing unit 5 hanger 51 and a chip to take Amplification module 52, the hanger 51 be set to workbench 1 and having be across the wafer placement section 223 of second track 22 with it is described One boom 511 of the wafer placement section 323 of the 4th track 32, second picking and placing unit 5 and first picking and placing unit 4 are substantially It is identical, it is repeated no more in this.And in the present embodiment, first picking and placing unit 4 can be simultaneously with second picking and placing unit 5 The chip 500 is picked and placed, so that the chip fetching device 10 is carried out chip 500 to two jigs 400 simultaneously whereby and picks and places, That is the chip 500 that the processing on jig 400 is completed can simultaneously be taken out and be placed in load by the chip fetching device 10 Tool 300, and chip 500 untreated on another carrier 300 is taken out and is placed in another jig 400.

Described first moves unit 6 set on the workbench 1 and the cover board recycling for that will be located at first track 21 The cover board 402 of the jig 400 of section 213 moves to the cover board for being located at second track 22 jig for putting section 224 On 400 carrier 401.In the present embodiment, described first unit 6 is moved with a hanger 61 and a moving module 62, The hanger 61 be set to workbench 1 and having be across the cover board exhausting section 213 of first track 21 with it is described The cover board of second track 22 puts a boom 611 of section 224, described in the moving module 62 has and is slidingly disposed at One sliding seat 621 of boom 611, and set on the sliding seat 621 and can clamp the jig 400 cover board 402 a folder Take mechanism 622.And it should be noted that described first to move unit 6 in the present embodiment be that will first be located at first track The cover board 402 of the jig 400 of 21 cover board exhausting section 213 picks up and moves the cover board 402 to second track 22 cover board puts the top of section 224, and until the cover board positioned at second track 22 puts the jig of section 224 After 400 carrier 401 is ready to complete, just the cover board 402 is moved to the carrier 401, but described first moves Unit 6 is not limited to this embodiment system as flowing mode.

Described second moves unit 7 set on the workbench 1 and for that will be located at the first outlet of first track 21 The carrier 401 of the jig 400 of section 212 is moved to the second entrance section 221 of second track 22.In the present embodiment In, described second moves unit 7 with a hanger 71 and a moving module 72, the hanger 71 have set on workbench 1 and Second entrance section 221 with the first outlet section 212 and second track 22 for being across first track 21 One boom 711, the moving module 72 have the sliding seat 721 for being slidingly disposed at the boom 711, and are set to described Sliding seat 721 and a gripping body 722 that the carrier 401 of the jig 400 can be clamped.

In the present embodiment, first track 21 is located at same level, and described first with second track 22 In parallel with each other side by side, the third track 31 is adjacent to parallel with first track 21 for track 21 and second track 22 Side by side, the 4th track 32 and second track 22 be adjacent to it is parallel side by side, can make whereby first picking and placing unit 4, Second picking and placing unit 5, described first move unit 6 with described second move unit 7 pick and place or move the chip 500 with When jig 400, it is not required to rotate the chip 500 to adjust placement angle with jig 400, system that but not limited to this.

Further say, the process that the chip fetching device 10 operates in the present embodiment approximately as:

The output end 100A by the wet type processing device 100 is received from the first entrance section 211 of first track 21 The jig 400 that the processing of conveying is completed, after the jig 400 to be moved to the cover board exhausting section 213 of first track 21, Unit 6 is moved by described first to recycle the cover board 402 of the jig 400；

The carrier 401 of the jig 400 is moved to the chip exhausting section 214 of first track 21, and by described The chip 500 that processing on the carrier 401 of the jig 400 is completed is taken out and is placed in positioned at institute by the first picking and placing unit 4 On the carrier 300 for stating the chip exhausting section 313 of third track 31；

The carrier 401 of the jig 400 is moved to the first outlet section 212 of first track 21, and by described Second, which moves unit 7, moves the carrier 401 of the jig 400 to the second entrance section 221 of second track 22；

The carrier 401 of the jig 400 is moved to the wafer placement section 223 of second track 22, and by described Second picking and placing unit 5 takes untreated chip 500 on the carrier 300 for being located at the wafer placement section 323 of the 4th track 32 Out and it is placed on the carrier 401 of the jig 400；

The cover board that the carrier 401 of the jig 400 moves to second track 22 is put into section 224, and by described First moves the carrier 401 that the cover board 402 of recycling is placed on the jig 400 by unit 6；

The jig 400 is moved to the second outlet section 222 of second track 22, and extremely by the jig 400 output The input terminal 100B of the wet type processing device 100 is loaded in the chip 500 of the jig 400 to handle.

And, it is understood that the chip fetching device 10 can be loaded with multiple described simultaneously in above-mentioned process Jig 400 is to carry out operation.

In addition, cooperating above-mentioned process at 300 aspect of carrier, the carrier 300 of untreated chip 500 will be loaded with It is placed in the 4th entrance 321 of the 4th track 32, and the carrier 300 is moved into the 4th track 32 in order Wafer placement section 323 carries out the 4th outlet section 322 that the 4th track 32 is then moved to after chip 500 is put, on the other hand, will The carrier 300 for not being loaded with chip 500 is placed in the third entrance 311 of the third track 31, and in order by the carrier The 300 chip exhausting sections 313 for moving to the third track 31 then move to the of the third track 31 after carrying out recycling chip 500 Three outlet sections 312.In addition, it should be noted that, in other change aspects, third entrance 311 and third outlet section 312 relative to chip exhausting section 313 position can with the way of example in the present embodiment on the contrary, and the 4th entrance 321 with 4th outlet section 322 can also be with the way of example in the present embodiment on the contrary, not with this relative to the position of wafer placement section 323 Embodiment is limited.

Refering to fig. 1 to Fig. 4 and Fig. 8, in addition, in the present embodiment, the chip fetching device 10 further also wraps Unit 8 is moved containing one first cart 20, third, one second cart 30 and one the 4th moves unit 9.The workbench 1 has First entrance section 211 and corresponding one first recess 11 for accommodating first cart 20 adjacent to first track 21, with And second outlet section 222 and corresponding one second recess 12 for accommodating second cart 30 adjacent to second track 22. First cart 20 separably set on the first recess 11 of the workbench 1 and has one first temporary storage mechanism 201, described Third is moved unit 8 set on the workbench 1 and is controlled for will be located at the described of the first entrance section 211 of first track 21 Tool 400 is moved to first temporary storage mechanism 201.Second cart 30 is separably set on the second recessed of the workbench 1 Mouthfuls 12 and there is one second temporary storage mechanism 301, the described 4th moves unit 9 set on the workbench 1 and described for that will be located at The jig 400 of the second outlet section 222 of second track 22 is moved to second temporary storage mechanism 301.The third is moved First entrance section 211 and first temporary storage mechanism 201 of the unit 8 across first track 21, the described 4th moves unit 9 Across second track 22 second outlet section 222 and second temporary storage mechanism 301, and the third move unit 8 with Described 4th moves unit 9, and with described first to move the structure of unit 6 roughly the same, repeats no more in this.Whereby, make the crystalline substance Piece fetching device 10 can will be sent when breaking down by the received jig 400 of the first entrance section 211 of first track 21 To the first temporary storage mechanism 201 of first cart 20, to avoid because described on the first track 21 described caused by failure situations Jig 400 is jammed, and can also move list by the third when needing to change chip 500 with the type of corresponding jig 400 Member 8 moves the old jig 400 to the first temporary storage mechanism 201 of first cart 20, and utilizes first cart 20 are transported to the old jig 400 elsewhere, and utilize second cart 30 by the new jig 400 by other Place is transported to the second recess 12 of the workbench 1, and by the described 4th move unit 9 by the new jig 400 from Second temporary storage mechanism 301 of second cart 30 is moved to second track 22.Furthermore, described first is temporary Mechanism 201 have a pedestal 201A, can slide up and down to set on the pedestal 201A and cross section it is substantially u-shaped and for holding Carry a load-bearing part 201B of the jig 400, and the lifting module (figure for rising or falling the load-bearing part 201B Do not show), the load-bearing part 201B is from bottom to top formed with multiple opposite two-by-two in order on its two sidewalls and is used to accommodate institute The accommodation groove 201C for stating two ora terminalis of jig 400, being risen or fallen by load-bearing part 201B described in the lifting module drive makes The third, which moves unit 8, to move to first temporary storage mechanism from first track 21 for the jig 400 easily Each accommodation groove 201C of 201 load-bearing part 201B.Also, the structure substantially phase of second cart 30 and first cart 20 Together, it therefore repeats no more.In addition, the structure of the 4th temporary storage mechanism is substantially identical as the structure of the third temporary storage mechanism, It is repeated no more in this.

In conclusion the utility model chip fetching device 10, by with first track 21 and second rail The jig delivery unit 2 in road 22, first picking and placing unit 4 for picking and placing chip 500 and second picking and placing unit 5, make The chip fetching device 10 can simultaneously convey jig 400 and receive jig 400, also, by for moving the jig Described the first of 400 cover board 402 moves unit 6 and moves with described second of the carrier 401 for moving the jig 400 Unit 7 enables the jig 400 to move between first track 21 and second track 22, in favor of will from described in The received jig 400 of wet type processing device 100 is delivered to the wet type processing device 100 again.

As described above, only the embodiments of the present invention, when the utility model implementation cannot be limited with this Range, i.e., it is all according to simple equivalent changes and modifications made by the utility model claims book and description, all still belong to The scope of the utility model.

Claims (10)

1. a kind of chip fetching device, suitable for jig is taken out and be placed in from carrier by multiple chips and conveys the jig To wet type processing device, and the jig is received from the wet type processing device and takes out the chip simultaneously from the jig It is placed in the carrier, the jig includes the carrier for carrying the chip, and is covered on the lid of the carrier Plate；It is characterized in that, the chip fetching device includes:

Workbench；

Jig delivery unit, the first track and the second track including being set to the workbench and for being slided for the jig, And first track and second track are set to so that the jig is on first track and second track Multiple drive modules of sliding, first track have first entrance section, in contrast to the first outlet of the first entrance section Section, the cover board exhausting section between the first entrance section and the first outlet section, and it is located at the cover board exhausting section With the chip exhausting section between the first outlet section, second track has to enter adjacent to the second of the first outlet section Mouthful section, in contrast to the second entrance section and adjacent to the second outlet section of the first entrance section, be located at the second entrance Wafer placement section between section and the second outlet section, and between the wafer placement section and the second outlet section Cover board put section, wherein the first entrance section and the second outlet section are respectively used to be connected to the wet type processing device Output end and input terminal；

Carrier delivery unit, third track and the 4th track including being set to the workbench and for carrying the carrier；

First picking and placing unit, set on the workbench and for the jig of the chip exhausting section of first track will to be located at Carrier on chip take out and be placed on the carrier of the third track；

Second picking and placing unit, the chip on carrier set on the workbench and for that will be located at the 4th track take out juxtaposition It is put on the carrier of the jig of the wafer placement section of second track；

First moves unit, set on the workbench and for that will be located at the jig of the cover board exhausting section of first track Cover board move to be located at second track cover board put section the jig carrier on；And

Second moves unit, set on the workbench and for that will be located at the jig of the first outlet section of first track Carrier move to the second entrance section of second track.

2. chip fetching device according to claim 1, it is characterised in that: first track and second track position In same level.

3. chip fetching device according to claim 1, it is characterised in that: first picking and placing unit takes with described second The chip can simultaneously be picked and placed by putting unit.

4. chip fetching device according to claim 1, it is characterised in that: the third track have third entrance, In contrast to the third outlet section of the third entrance, and between the third entrance and the third outlet section Chip exhausting section, wherein the third entrance and each self energy of third outlet section are stacked for multiple carriers, and described the One picking and placing unit takes out simultaneously for that will be located at the chip on the carrier of the jig of the chip exhausting section of first track Be placed in positioned at the third track chip exhausting section carrier on, the 4th track have the 4th entrance, in contrast to 4th outlet section of the 4th entrance, and chip between the 4th entrance and the 4th outlet section are set Put section, wherein the 4th entrance and each self energy of the 4th outlet section are stacked for multiple carriers, and described second picks and places Unit is used to take out the chip on the carrier for being located at the wafer placement section of the 4th track and be placed in positioned at described second On the carrier of the jig of the wafer placement section of track, the carrier delivery unit further include be set to the third track with 4th track is so that multiple drive modules that the carrier slides on the third track and the 4th track.

5. chip fetching device according to claim 1, it is characterised in that: the chip fetching device also includes first temporary Mechanism is deposited, and moves unit set on the third of the workbench, the third moves unit for that will be located at first rail The jig of the first entrance section in road is moved to first temporary storage mechanism.

6. chip fetching device according to claim 5, it is characterised in that: the chip fetching device also includes with institute The first cart of the first temporary storage mechanism is stated, first cart is separably set to the workbench.

7. chip fetching device according to claim 1, it is characterised in that: the chip fetching device also includes second temporary Mechanism is deposited, and moves unit set on the 4th of the workbench, the described 4th moves unit for that will be located at second rail The jig of the second outlet section in road is moved to second temporary storage mechanism.

8. chip fetching device according to claim 7, it is characterised in that: the chip fetching device also includes with institute The second cart of the second temporary storage mechanism is stated, second cart is separably set to the workbench.

9. chip fetching device according to claim 1, it is characterised in that: first track and second track that This is in parallel side by side.

10. chip fetching device according to claim 9, it is characterised in that: the third track and first track Be adjacent to it is parallel side by side, the 4th track and second track be adjacent to it is parallel side by side.