CN209435551U - A kind of LED light source board - Google Patents
A kind of LED light source board Download PDFInfo
- Publication number
- CN209435551U CN209435551U CN201821889063.7U CN201821889063U CN209435551U CN 209435551 U CN209435551 U CN 209435551U CN 201821889063 U CN201821889063 U CN 201821889063U CN 209435551 U CN209435551 U CN 209435551U
- Authority
- CN
- China
- Prior art keywords
- paste layer
- light source
- led light
- tin paste
- welding point
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000003466 welding Methods 0.000 claims abstract description 65
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 50
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 22
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 22
- 238000000034 method Methods 0.000 claims abstract description 10
- 238000005476 soldering Methods 0.000 claims abstract description 6
- 229910000831 Steel Inorganic materials 0.000 claims description 13
- 239000010959 steel Substances 0.000 claims description 13
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 abstract description 15
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 abstract description 15
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 abstract description 15
- 230000008901 benefit Effects 0.000 abstract description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 14
- 229910000679 solder Inorganic materials 0.000 description 11
- 238000010586 diagram Methods 0.000 description 10
- 229910052742 iron Inorganic materials 0.000 description 7
- 239000004411 aluminium Substances 0.000 description 2
- 239000006071 cream Substances 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- YPFNIPKMNMDDDB-UHFFFAOYSA-K 2-[2-[bis(carboxylatomethyl)amino]ethyl-(2-hydroxyethyl)amino]acetate;iron(3+) Chemical compound [Fe+3].OCCN(CC([O-])=O)CCN(CC([O-])=O)CC([O-])=O YPFNIPKMNMDDDB-UHFFFAOYSA-K 0.000 description 1
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Led Device Packages (AREA)
Abstract
The utility model discloses a kind of LED light source boards, it includes aluminum-based circuit board, at least one exposed electrode welding point is provided in aluminum-based circuit board, one layer of tin paste layer is printed on electrode welding point, the area of tin paste layer is at least 2 times of the area of electrode welding point, and tin paste layer forms the bump that thickness reaches 1 millimeter or more after reflow soldering process solidifies；When advantage is that it is welded with external wire, without mending tin, avoids and the phenomenon that rosin joint occur, and improve the welding efficiency of manual welding.
Description
Technical field
The utility model relates to a kind of light source boards, more particularly, to a kind of LED light source board.
Background technique
LED light source board is a kind of photoelectric device by LED lamp bead integrated installation in one piece of aluminum-based circuit board, is answered extensively
For in LED illumination device.
It needs to connect with external wire when LED light source board is installed in LED illumination device, passes through two external wires and city
Electricity is electrically connected, and the connection type of LED light source board and external wire is usually to weld.Before welding external wire, to ensure
Tin cream, which is only printed on the exposed electrode welding point 12 of aluminum-based circuit board 11 as shown in Figure 1 b, to be needed in aluminum-based circuit board 11
One layer of steel mesh 13 as shown in Figure 1a is covered on surface, the size of steel mesh 13 is identical as aluminum-based circuit board 11, opens up on steel mesh 13
There is the corresponding printing hole 14 in and position identical as electrode welding 12 sizes of point；Then tin cream is coated in electrode by printing hole 14
One layer of tin paste layer 15 as illustrated in figure 1 c has been printed on the surface of pad 12 in advance on electrode welding point 12；Then it uses
Reflow soldering process makes tin paste layer 15 harden into bump as shown in Figure 1 d；Electric iron is recycled to weld the end of external wire 17
It is connected on bump 16, as shown in fig. le.Tin paste layer 15 due to printing in existing LED light source board is being welded than relatively thin
Need to mend tin welding when connecing external wire 17, the end of external wire 17 is directly welded on scolding tin after dipping solder stick by electric iron
On point 16, the rosin in the welding process since the temperature on electric iron head is higher, when dipping solder stick in solder stick
It is not easy to be attached to electric iron head and fall on station, and rosin is a kind of scaling powder, on the one hand rosin can aoxidize weldering
On the other hand the oxide on 16 surface of tin point can increase scolding tin in welding to increase the binding force of solder stick Yu bump 16
The mobility of silk reduces the tension between solder stick and bump 16, allow solder stick it is more rounded be attached to bump
On 16, however because of the reduction of rosin, results in and is easy to appear bump 16 in the welding process and becomes not mellow and full, burr occur,
As shown in fig. le, so that the contact area after bonding wire between external wire 17 and bump 16 is reduced, finally there is rosin joint；
If it is manual welding, then the low problem of welding efficiency is existed simultaneously.
Summary of the invention
The technical problem to be solved by the utility model is to provide a kind of LED light source boards, when being welded with external wire, nothing
Tin need to be mended, avoids and the phenomenon that rosin joint occurs, and improves the welding efficiency of manual welding.
Technical solution adopted by the utility model to solve the above technical problems is as follows: a kind of LED light source board, including aluminium base line
Road plate is provided at least one exposed electrode welding point in the aluminum-based circuit board, prints on the electrode welding point
There is one layer of tin paste layer, it is characterised in that: the area of the tin paste layer is at least 2 times of the area of the electrode welding point,
The tin paste layer forms the bump that thickness reaches 1 millimeter or more after reflow soldering process solidifies.
The shape of the electrode welding point is round or oval or rectangular or other any shapes, the tin paste layer
The shape tin paste layer consistent and described with the shape of the electrode welding point center and the electrode welding point in
Heart alignment.
The area of the tin paste layer is 6~10 square millimeters.The area that tin paste layer is found by a large number of experiments is 6~10
Square millimeter can make the thickness of the bump formed after solidifying reach 1 millimeter or more.
The bump with a thickness of 1 millimeter.It can be reached when by a large number of experiments discovery bump with a thickness of 1 millimeter
To good contact effect, rosin joint rate is lower.
The mode of printing of the tin paste layer is steel mesh printing, is offered and electrode welding point on the steel mesh
The corresponding printing hole in position, the area and shape of the printing hole should need the tin paste layer of printing to determine, if needing
8 square millimeters of printing and shape are circular tin paste layer, then printing hole is designed to that area is 8 square millimeters of round hole.
Compared with the prior art, the advantages of the utility model are:
By increasing the area for the tin paste layer being printed on electrode welding point, so that tin paste layer solidifies by reflow soldering process
It (is the 2~8 of the thickness of the bump in existing LED light source board that the thickness of the bump formed afterwards, which reaches 1 millimeter or more,
Times), when welding external wire in this way, without mending tin, directly the end of external wire is welded on bump using electric iron
, since electric iron head directly acts on bump, the rosin in bump is damaged still in bump without rosin
Consumption, so that bump surface is mellow and full always, impulse- free robustness occurs, while because the area of bump is larger and thickness is larger, when welding
Contact area between the end and bump of external wire is larger, and firm welding is less prone to rosin joint phenomenon；Further, since
Directly the end of external wire can be welded on bump using electric iron, therefore eliminate electric iron and dip solder stick benefit tin
Process, improve the welding efficiency of manual welding.
Detailed description of the invention
Fig. 1 a is steel used by print solder paste on the electrode welding point in the aluminum-based circuit board in existing LED light source board
The structural schematic diagram of net；
Fig. 1 b is the structural schematic diagram of the aluminum-based circuit board in existing LED light source board；
Fig. 1 c be existing LED light source board in aluminum-based circuit board on electrode welding point on be printed with the knot after tin paste layer
Structure schematic diagram；
Fig. 1 d is to be printed with tin paste layer on electrode welding point in the aluminum-based circuit board in existing LED light source board and solidify
At the structural schematic diagram after bump；
Fig. 1 e is print solder paste layer on the electrode welding point in the aluminum-based circuit board in existing LED light source board and is solidified into
Structural schematic diagram after bump and external wire welding；
Fig. 2 a is adopted by print solder paste on the electrode welding point in the aluminum-based circuit board in the LED light source board of the utility model
The structural schematic diagram of steel mesh；
Fig. 2 b is the structural schematic diagram of the aluminum-based circuit board in the LED light source board of the utility model；
Fig. 2 c be the utility model LED light source board in aluminum-based circuit board on electrode welding point on be printed with tin paste layer
Structural schematic diagram afterwards；
Fig. 2 d be the utility model LED light source board in aluminum-based circuit board on electrode welding point on be printed with tin paste layer
And it is solidified into the structural schematic diagram after bump；
Fig. 2 e be the utility model LED light source board in aluminum-based circuit board on electrode welding point on print solder paste layer simultaneously
Structural schematic diagram after being solidified into bump and external wire welding.
Specific embodiment
The utility model is described in further detail below in conjunction with figure embodiment.
The utility model proposes a kind of LED light source board, as shown in Fig. 2 a to Fig. 2 e comprising aluminum-based circuit board 21, aluminium
Exposed electrode welding point 22 there are two settings on base circuit board 21, the shape of electrode welding point 22 is round or oval or side
Shape or other any shapes select a steel mesh 23, offer printing hole corresponding with 22 position of electrode welding point on steel mesh 23
24, the area and shape of printing hole 24 are determined according to the tin paste layer 25 that need to be printed, if need to print 8 square millimeters and shape is circle
The tin paste layer 25 of shape is existed then printing hole 24 is designed to that area is 8 square millimeters of round hole using 23 mode of printing of steel mesh
One layer of tin paste layer 25 is printed on electrode welding point 22, the area of tin paste layer 25 is at least 2 times of the area of electrode welding point 22, such as
Area is 6~10 square millimeters, after finding that the area of tin paste layer 25 can make solidification for 6~10 square millimeters by a large number of experiments
The thickness of the bump 26 of formation reaches 1 millimeter or more, and the shape of tin paste layer 25 is consistent with the shape of electrode welding point 22, and
The center of tin paste layer 25 is aligned with the center of electrode welding point 22, and tin paste layer 25 forms thickness after reflow soldering process solidifies and reaches
To 1 millimeter or more of bump 26, such as with a thickness of 1 millimeter, when by a large number of experiments discovery bump 26 with a thickness of 1 millimeter
Good contact effect can be reached, rosin joint rate is lower.
In fig. 2 a, the shape of the printing hole 24 opened up on steel mesh 23 is circle, and the area of printing hole 24 is 8 squares of millis
Rice, about 2 times of the area of electrode welding point 22；In figure 2 c, the shape of tin paste layer 25 is circle, the area of tin paste layer 25
As the area of printing hole 24 is 8 square millimeters；In figure 2d, the thickness of bump 26 reaches 1 millimeter, is shown in Fig. 1 d
5 times of the thickness of bump 16, so that not having to mend tin when welding external wire 27；In Fig. 2 e, bump 26 and external wire
After 27 welding, surface is mellow and full, and impulse- free robustness occurs.
The LED light source board welding of the whole lamp and the utility model that are formed after external wire is welded to existing LED light source board
The whole lamp formed after external wire carries out seasoned test respectively.Test has chosen 5 batches, and two kinds of whole lamps of each batch respectively have
10000 participations.Table 1 gives the LED of the whole lamp and the utility model that are formed after existing LED light source board welding external wire
Each 5 batches of whole lamp formed after light source board welding external wire and each batch 10000 failures carried out after seasoned test
Situation comparison.
The LED light source board welding of the whole lamp and the utility model that are formed after the existing LED light source board of table 1 welding external wire
Each 5 batches of the whole lamp formed after external wire and each batch 10000 failure conditions contrast tables carried out after seasoned test
From table 1 it follows that the seasoned average failure of the whole lamp formed after existing LED light source board welding external wire
Ratio is 4.60 ‰, and the seasoned average failure ratio of the whole lamp formed after the LED light source board of the utility model welding external wire
Example is only 1.60 ‰, and failure ratio is only original 1/3 or so；It is caused in the whole lamp of failure because of external wire rosin joint simultaneously
Seasoned failure in, the average failure ratio of the whole lamp formed after existing LED light source board welding external wire is 31.63%,
And the average failure ratio of the whole lamp formed after the LED light source board welding external wire of the utility model is only 13.52%, because outer
Failure ratio caused by conducting wire rosin joint is only original 2/5 or so is connect, the ratio of external wire rosin joint failure is greatly reduced.
Claims (5)
1. a kind of LED light source board, including aluminum-based circuit board, at least one exposed electrode is provided in the aluminum-based circuit board
Pad is printed with one layer of tin paste layer on the electrode welding point, it is characterised in that: the area of the tin paste layer is at least
2 times of the area of the electrode welding point, the tin paste layer form thickness after reflow soldering process solidifies and reach 1 millimeter
Or more bump.
2. a kind of LED light source board according to claim 1, it is characterised in that: the shape of the electrode welding point is circle
Shape or ellipse or rectangular or other any shapes, the shape one of the shape of the tin paste layer and the electrode welding point
It causes, and the center of the tin paste layer is aligned with the center of the electrode welding point.
3. a kind of LED light source board according to claim 1 or 2, it is characterised in that: the area of the tin paste layer be 6~
10 square millimeters.
4. a kind of LED light source board according to claim 3, it is characterised in that: the bump with a thickness of 1 millimeter.
5. a kind of LED light source board according to claim 1, it is characterised in that: the mode of printing of the tin paste layer is steel
Wire mark brush offers printing hole corresponding with electrode welding point position on the steel mesh, the printing hole
Area and shape should need the tin paste layer of printing to determine.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821889063.7U CN209435551U (en) | 2018-11-16 | 2018-11-16 | A kind of LED light source board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821889063.7U CN209435551U (en) | 2018-11-16 | 2018-11-16 | A kind of LED light source board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209435551U true CN209435551U (en) | 2019-09-24 |
Family
ID=67968601
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821889063.7U Expired - Fee Related CN209435551U (en) | 2018-11-16 | 2018-11-16 | A kind of LED light source board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209435551U (en) |
-
2018
- 2018-11-16 CN CN201821889063.7U patent/CN209435551U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190924 |