CN209424185U - Mega sonic wave washer - Google Patents

Abstract

The utility model discloses a kind of mega sonic wave washers, including overflow launder, processing chamber, wafer carrying mechanism, sonic generator, it reaches at the top of processing chamber in overflow launder and is tightly connected with overflow launder, processing chamber at least lower half is located at the top of inverted conical shape part for the inlet of inverted conical shape and processing chamber, wafer carrying mechanism is set in processing chamber and is located above the inlet of processing chamber, it is placed in the cleaning solution that the wafer to be cleaned in wafer carrying mechanism is immersed in processing chamber, sonic generator is arranged in processing chamber.Processing chamber at least lower half portion is designed as inverted conical shape by the utility model, reduce particle at the accumulation dead angle of inner wall, the cleaning solution of circulation is chamfer from inlet to flow into, the downward spiral shape shearing fluid residual particles big to the density accumulated on processing chamber conical inboard wall are formed to carry out washing away removing, realize the repeats itself cleaning of mega sonic wave washer, the accumulation for effectively avoiding particle, ensure that the cleaning ability of mega sonic wave washer.

Description

Mega sonic wave washer

Technical field

A kind of equipment that the utility model belongs to semiconductor integrated circuit, and in particular to mega sonic wave washer.

Background technique

Wafer refers to Silicon Wafer used in silicon semiconductor production of integrated circuits, and the various electricity of production can be processed on Silicon Wafer Circuit component structure, and become the IC product for having specific electrical functionality.With the rapid development of large scale integrated circuit, semiconductor die Integrated circuit develops to micron order on circle, and integrated circuit fabrication process becomes to become increasingly complex and finely, in order to improve integrated level, Manufacturing cost is reduced, the size of semiconductor devices increasingly reduces, and plane routing has been difficult to meet the requirement of high density distribution, can only Using polylaminate wiring technique, the integration density of semiconductor devices is further increased.Since multilayer interconnection or depth of cracking closure are bigger Deposition process result in the excessive fluctuating of crystal column surface, the difficulty for causing photoetching process to focus enables control to line width Power weakens, and reduces the consistency of line width in whole wafer.For this reason, it may be necessary to be carried out at planarization to irregular crystal column surface Reason.

Chemical mechanical grinding (Chemical Mechanical Polishing, abbreviation CMP) reaches global planarizartion The best approach, especially after semiconductor fabrication process enters submicrometer field, chemical mechanical grinding have become a Xiang Buke or Scarce Manufacturing Techniques.Crystal column surface after chemical mechanical grinding can remain a large amount of sub-micron or nanoscale is ground The pollutants such as abrasive particle, lapping liquid and grinding by-product, therefore carrying out cleaning to wafer is one in chemical mechanical milling tech Road is extremely important and requires relatively high step.

Currently, being generally integrated wafer cleaning function in work-table of chemicomechanical grinding mill, during wafer cleaning first It generallys use mega sonic wave cleaning device to clean wafer tow sides and side, as shown in Figure 1, wafer 1 is placed in and fills In the processing chamber 2 of cleaning solution, the bottom of the processing chamber 2 is arranged in sonic generator 4, and the side lower of processing chamber 2 is equipped with Inlet 5, the upper half of processing chamber 2 are inserted in overflow launder 3, and the contact position of processing chamber 2 and overflow launder 3 is tightly connected, and are overflow The bottom surface of chute 3 is provided with liquid outlet, can be spilled over to overflow from the top opening of processing chamber 2 after cleaning solution is full of processing chamber 2 In slot 3.Partial mill particle or grinding by-product but with the increase of cleaning device working time, after grinding on wafer Etc. can accumulate in mega sonic wave washer internal residual, lead to the reduction of wafer cleaning effect, or even pollute to wafer.

Utility model content

The technical problem to be solved by the present invention is to provide a kind of mega sonic wave washers, can solve existing wafer cleaning The problem of residual particles are accumulated in cleaning device and can not be removed in the process.

In order to solve the above technical problems, mega sonic wave washer provided by the utility model, including overflow launder, processing chamber, crystalline substance Justify load carrier, sonic generator, is reached in overflow launder at the top of the processing chamber and the contact position of processing chamber and overflow launder is close Envelope connection, the bottom of the overflow launder are equipped with liquid outlet, and the processing chamber at least lower half is inverted conical shape, and processing chamber into Liquid mouth is located at inverted conical shape part, and the wafer carrying mechanism is set in processing chamber and is located above the inlet of processing chamber, sets It is immersed in the cleaning solution in processing chamber in the wafer to be cleaned in wafer carrying mechanism, the sonic generator setting is being handled In chamber.

One of structure, the processing chamber include the cylindrical chamber of the upper half and the inverted conical shape chamber of lower half, The cylindrical chamber is connected with inverted conical shape chamber, and the diameter of cylindrical chamber and the upper opening of inverted conical shape chamber are straight Diameter is identical, and the inlet of the processing chamber is set to the top of the inverted conical shape chamber of lower half.

Further, the wafer carrying mechanism is set to the bottom of cylindrical chamber.

Wherein another structure, the processing chamber is inverted conical shape, and the inlet of processing chamber is located at inverted conical shape chamber Middle part.

Wherein yet another construction, the processing chamber include the rectangular chamber of the upper half and the inverted conical shape chamber of lower half, The rectangular chamber is connected with inverted conical shape chamber, and the under shed size of rectangular chamber is less than the maximum of inverted conical shape chamber Diameter, the inlet of the processing chamber are set to the top of the inverted conical shape chamber of lower half.

Preferably, the sonic generator is located between wafer carrying mechanism and the inlet of processing chamber.Alternatively, the sound Wave producer be respectively provided at wafer frontside pair side wall and backside of wafer pair side wall on.

Preferably, the bottom of the processing chamber is equipped with reservoir, and the reservoir is equipped with sewage draining exit.

In said structure, the wafer carrying mechanism uses at least two rollers, and the roller is mounted on processing chamber On side wall and support wafer to be cleaned.Alternatively, the wafer carrying mechanism is cassette.

The utility model improves existing wafer cleaning device structure, and processing chamber at least lower half portion is designed as Inverted conical shape, while chamfer cleaning solution from the top of inverted conical shape chamber and flowing into, form downward spiral shape shearing fluid, place The big residual particles of the density accumulated on reason chamber conical inboard wall are stripped under the souring of cleaning solution, and in gravity and centrifugation It flow to processing chamber bottom under the action of power, to achieve the purpose that mega sonic wave washer repeats itself cleans, effectively avoids grinding The case where particle accumulates in cleaning device ensure that the cleaning ability of mega sonic wave washer.

Detailed description of the invention

Fig. 1 is the schematic diagram of existing mega sonic wave cleaning device；

Fig. 2 is the schematic diagram of the first embodiment of the mega sonic wave washer of the utility model；

Fig. 3 is the schematic diagram of the second embodiment of the mega sonic wave washer of the utility model；

Fig. 4 is the cleaning way schematic diagram of mega sonic wave washer in the utility model.

Wherein the reference numerals are as follows:

1 is wafer；2 be processing chamber；3 be overflow launder；4 be sonic generator；5 be inlet；6 be liquid outlet；7 be liquid storage Slot.

Specific embodiment

Below by way of particular specific embodiment and the embodiments of the present invention is described with reference to the drawings, art technology Personnel can be understood the further advantage and effect of the utility model easily by content disclosed in the present specification.The utility model Also it can be implemented or be applied by other different specific embodiments, the various details in this specification can also be based on different sights Point and application, carry out various modifier changes under the spirit without departing substantially from the utility model.

Mega sonic wave washer provided by the utility model, including overflow launder, processing chamber, wafer carrying mechanism, sound wave occur Device, reaches in overflow launder at the top of the processing chamber and the contact position of processing chamber and overflow launder is tightly connected, the overflow launder Bottom is equipped with liquid outlet, and the processing chamber at least lower half is inverted conical shape, and the inlet of processing chamber is located at inverted conical shape portion Point, the wafer carrying mechanism is set in processing chamber and is located above the inlet of processing chamber, is placed in wafer carrying mechanism Wafer to be cleaned is immersed in the cleaning solution in processing chamber, and the sonic generator is arranged in processing chamber.

Preferably, the bottom of processing chamber is equipped with reservoir, and the reservoir is equipped with sewage draining exit, can thus pass through blowdown Periodically the residual particles deposited in reservoir are discharged for mouth.

The utility model is described in further detail with specific embodiment with reference to the accompanying drawing.

First embodiment

In the present embodiment, mega sonic wave washer includes overflow launder 3, processing chamber 2, wafer carrying mechanism, sonic generator 4, the processing chamber 2 includes the cylindrical chamber of the upper half and the inverted conical shape chamber of lower half, as shown in Fig. 2, the cylinder Shape chamber is connected with inverted conical shape chamber, and the diameter of cylindrical chamber is identical as the upper opening diameter of inverted conical shape chamber.

The inlet 5 of processing chamber 2 is located at the top (middle part of entire processing chamber 2) of inverted conical shape chamber, for cleaning crystalline substance Circle 1 simultaneously flows into processing chamber 2 from the inlet 5 to the cleaning solution of mega sonic wave cleaner itself progress wash cycles.

Wafer carrying mechanism is set in processing chamber 2, and is located at 5 top of inlet of processing chamber 2, is placed in wafer carrying mechanism On wafer to be cleaned 1 be immersed in the cleaning solution in processing chamber 2.

Preferably, the wafer carrying mechanism is set to the bottom of cylindrical chamber.

The sonic generator 4 is arranged in processing chamber 2.

Second embodiment

In the present embodiment, mega sonic wave washer includes overflow launder 3, processing chamber 2, wafer carrying mechanism, sonic generator 4, the processing chamber 2 is inverted conical shape, as shown in figure 3, and the inlet 5 of processing chamber be located at the middle part of inverted conical shape chamber, use Processing chamber 2 is flowed into from the inlet 5 in cleaning wafer 1 and to the cleaning solution of mega sonic wave cleaner itself progress wash cycles.

Wafer carrying mechanism is set in processing chamber 2, and is located at 5 top of inlet of processing chamber 2, is placed in wafer carrying mechanism On wafer to be cleaned 1 be immersed in the cleaning solution in processing chamber 2.

The sonic generator is arranged in processing chamber 2.

3rd embodiment

In the present embodiment, mega sonic wave washer includes processing chamber, wafer carrying mechanism, sonic generator, the processing Chamber includes the rectangular chamber of the upper half and the inverted conical shape chamber of lower half, and the rectangular chamber is connected with inverted conical shape chamber It is logical, and the under shed size of rectangular chamber is less than the maximum gauge of inverted conical shape chamber.

The inlet of processing chamber is located at the top of inverted conical shape chamber, for cleaning wafer and to mega sonic wave cleaner itself The cleaning solution for carrying out wash cycles flows into processing chamber from the inlet.

Wafer carrying mechanism is set in processing chamber, and is located above the inlet of processing chamber, is placed in wafer carrying mechanism Wafer to be cleaned be immersed in the cleaning solution in processing chamber.

Preferably, the wafer carrying mechanism is located at the bottom of rectangular chamber.

The sonic generator is arranged in processing chamber.

In these above-mentioned embodiments, sonic generator can be arranged according to the specific structure of processing chamber, for example, can set Between wafer carrying mechanism and the inlet of processing chamber, can also be located at wafer frontside pair side wall and backside of wafer institute Pair side wall on, as long as ultrasonic oscillation can be imposed to the cleaning solution in processing chamber.

Meanwhile the wafer carrying mechanism in the utility model can be wafer support platform (such as cassette or other wafer branch Frame), sucked type, drum-type (use at least two rollers, the roller is mounted on the side wall of processing chamber and support crystalline substance to be cleaned Circle), but be not limited to that these, those skilled in the art can also take other suitable structures to treat cleaning wafer progress Support.

It is treated during cleaning wafer cleaned using the mega sonic wave washer of the utility model, be may be implemented simultaneously The wash cycles of mega sonic wave washer itself, i.e., during wafer to be cleaned is cleaned, cleaning solution is from positioned at processing chamber Inverted conical shape part inlet beveling enter processing chamber, formed rotating liquid inverted conical shape inner wall is cleaned.It is clear The residual particles that washing lotion is rinsed can be eventually deposited at inverted conical shape cavity bottom, it is preferred that it is accumulated in reservoir, And it is periodically discharged by sewage draining exit.

The utility model improves existing wafer cleaning device structure, and processing chamber at least lower half portion is designed as Inverted conical shape reduces the accumulation dead angle of processing cavity wall particulate matter, so that particulate matter during wafer cleaning be avoided to be deposited on In processing chamber, while the cleaning solution recycled chamfers from the top of inverted conical shape chamber and flows into, and forms downward spiral shape shear flow Body, as shown in figure 4, the big residual particles of the density accumulated on processing chamber conical inboard wall are shelled under the souring of cleaning solution From, and processing chamber bottom is flow under the action of gravity and centrifugal force, to reach the cleaning of mega sonic wave washer repeats itself Purpose, ensure that the cleaning ability of mega sonic wave washer at the case where effectively abrasive grains being avoided to accumulate in cleaning device.

The utility model is described in detail above by specific embodiment, which is only that this is practical new The preferred embodiment of type, the utility model are not limited to above embodiment.The case where not departing from the utility model principle Under, the equivalent replacement and improvement that those skilled in the art makes the shape etc. of wafer carrying mechanism and processing chamber should all regard For in the technology scope that the utility model is protected.

Claims (10)

1. a kind of mega sonic wave washer, which is characterized in that including overflow launder, processing chamber, wafer carrying mechanism, sonic generator, It is reached at the top of the processing chamber in overflow launder and the contact position of processing chamber and overflow launder is tightly connected, the bottom of the overflow launder Equipped with liquid outlet, the processing chamber at least lower half is inverted conical shape, and the inlet of processing chamber is located at inverted conical shape part, institute Wafer carrying mechanism is stated in processing chamber and is located above the inlet of processing chamber, is placed in be cleaned in wafer carrying mechanism Wafer is immersed in the cleaning solution in processing chamber, and the sonic generator is arranged in processing chamber.

2. mega sonic wave washer according to claim 1, which is characterized in that the processing chamber includes the cylinder of the upper half The inverted conical shape chamber of chamber and lower half, the cylindrical chamber are connected with inverted conical shape chamber, and cylindrical chamber Diameter is identical as the upper opening diameter of inverted conical shape chamber, and the inlet of the processing chamber is set to the inverted conical shape chamber of lower half Top.

3. mega sonic wave washer according to claim 2, which is characterized in that the wafer carrying mechanism is set to cylindrical cavity The bottom of room.

4. mega sonic wave washer according to claim 1, which is characterized in that the processing chamber is inverted conical shape, and is handled The inlet of chamber is located at the middle part of inverted conical shape chamber.

5. mega sonic wave washer according to claim 1, which is characterized in that the processing chamber includes the rectangular cavity of the upper half The inverted conical shape chamber of room and lower half, the rectangular chamber is connected with inverted conical shape chamber, and the under shed of rectangular chamber Size is less than the maximum gauge of inverted conical shape chamber, and the inlet of the processing chamber is set to the upper of the inverted conical shape chamber of lower half Portion.

6. mega sonic wave washer according to claim 1, which is characterized in that the sonic generator is located at wafer carrying machine Between structure and the inlet of processing chamber.

7. mega sonic wave washer according to claim 1, which is characterized in that the sonic generator is being respectively provided at wafer just Face pair side wall and backside of wafer pair side wall on.

8. mega sonic wave washer according to claim 1, which is characterized in that the bottom of the processing chamber is equipped with reservoir, The reservoir is equipped with sewage draining exit.

9. mega sonic wave washer according to claim 1, which is characterized in that the wafer carrying mechanism uses at least two Roller, the roller is mounted on the side wall of processing chamber and support wafer to be cleaned.

10. mega sonic wave washer according to claim 1, which is characterized in that the wafer carrying mechanism is cassette.