CN209389001U - A kind of leads of semiconductor device assembly equipment - Google Patents

A kind of leads of semiconductor device assembly equipment Download PDF

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Publication number
CN209389001U
CN209389001U CN201822233499.7U CN201822233499U CN209389001U CN 209389001 U CN209389001 U CN 209389001U CN 201822233499 U CN201822233499 U CN 201822233499U CN 209389001 U CN209389001 U CN 209389001U
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China
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lead
hawkeye
graphite
mounting
leads
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CN201822233499.7U
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Chinese (zh)
Inventor
邓华鲜
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LESHAN SHARE ELECTRONIC CO Ltd
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LESHAN SHARE ELECTRONIC CO Ltd
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Priority to CN201822233499.7U priority Critical patent/CN209389001U/en
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Abstract

The utility model discloses a kind of leads of semiconductor device assembly equipments, it is related to semiconductor device production field, including bin, bin includes work top, Pin arrangement device, lead grabbing device, hawkeye identification device and lead mounting device are provided on work top, Pin arrangement device includes vibrating disk mounting seat, vibrating disk and lifting body;Lead grabbing device includes manipulator mounting base, four axis robots and lead grasping mechanism;Hawkeye identification device includes hawkeye mounting rack, hawkeye mobile mechanism and CCD industrial camera;Lead mounting device includes graphite positioning disc mechanism and graphite transmission mechanism;PLC controller is provided in bin, Pin arrangement device, lead grabbing device, hawkeye identification device and lead mounting device and PLC controller are electrically connected.The utility model has many advantages, such as to promote labor efficiency, reduce labor intensity and improve product quality.

Description

A kind of leads of semiconductor device assembly equipment
Technical field
The utility model belongs to semiconductor device production field, and in particular to a kind of assembly of leads of semiconductor device is set It is standby.
Background technique
Semiconductor devices is widely applied to rail traffic, household electrical appliances, new energy, power supply, frequency converter, consumer electronics, calculating The fields such as machine and peripheral hardware, network communication, automotive electronics, LED.Semi-conductor discrete device is by chip, welding material, lead frame Frame, encapsulating material and form.Wherein three-dimensional semi-conductor discrete device, four outer leads are perpendicular to radiating surface, in production process Middle needs are welded by multiple assembling parts, and traditional technique production is all made of manually installed lead, and inefficiency, labour is by force Degree is high, and the positions such as employee's shoulder neck, arm are easily strained, and in the case that employee is not careful, is also easy to occur leaking the product such as slotting, anti-inserted Geological Problems.
Summary of the invention
The purpose of this utility model is to provide a kind of promotion labor efficiency, reduces labor intensity and improve product quality Leads of semiconductor device assembly equipment.
The purpose of this utility model is achieved through the following technical solutions:
A kind of leads of semiconductor device assembly equipment, including bin, it is characterised in that: the bin includes work top, Pin arrangement device, lead grabbing device, hawkeye identification device and lead mounting device are provided on the work top, it is described Pin arrangement device includes vibrating disk mounting seat, vibrating disk and lifting body;The lead grabbing device includes manipulator peace Fill seat, four axis robots and lead grasping mechanism;The hawkeye identification device include hawkeye mounting rack, hawkeye mobile mechanism and CCD industrial camera;The lead mounting device includes graphite positioning disc mechanism and graphite transmission mechanism;It is set in the bin It is equipped with PLC controller, the Pin arrangement device, lead grabbing device, hawkeye identification device and lead mounting device and PLC are controlled Device processed is electrically connected.
Preferably, the vibrating disk includes chassis, storage bin, upstream screw feeding section, orientation sieves feeding section, downlink is sent Expect section and discharging section;The storage bin is arranged on chassis, and the inner circumferential of the storage bin is equipped with upstream screw feeding section, the storage The periphery of feed bin is successively arranged orientation screening feeding section, downlink feeding section and discharging section in the transmission direction of pull ring, it is described go out Expect that section is provided with lifting body far from storage bin end.
Preferably, the lifting body include jacking cylinder, jacking ontology, fairlead, optical inductor, jacking mounting base and Contraction block is jacked, the jacking ontology is fixed on work top by jacking mounting base, setting in the jacking ontology There are jacking cylinder and optical inductor, the jacking body upper part is provided with fairlead and jacking contraction block, and the fairlead can hold Receive two leads, the jacking contraction block is connected with jacking cylinder extension end, and the jacking cylinder and optical inductor and PLC control Device is connected.
Preferably, the manipulator mounting base is fixedly connected on work top, and four axis robot is rotationally connected with In manipulator mounting base, the lead grasping mechanism is installed in four axis robots.
Preferably, the lead grasping mechanism includes that two lead crawl cylinders and two leads grab block, the lead Crawl cylinder is fixedly connected with lead crawl block, and lead half bore, described two lead crawls are arranged in lead crawl block lower end The lead half bore composition being arranged on block can accommodate the cavity of a lead.
Preferably, the hawkeye mounting rack is fixedly mounted on work top, and the hawkeye mobile mechanism is mounted on hawkeye On mounting rack, the hawkeye mobile mechanism includes that hawkeye moves the mobile lead screw motor of screw rod, hawkeye shifting sledge and hawkeye, described The mobile lead screw motor of hawkeye is arranged on hawkeye mounting rack, the mobile screw rod rotation of the mobile screw rod motor driven hawkeye of the hawkeye, The mobile screw rod of the hawkeye is arranged in hawkeye shifting sledge, and the hawkeye shifting sledge is fixedly connected on hawkeye mounting rack, It is provided on the mobile screw rod of the hawkeye and the mobile mobile screw of screw rod cooperation hawkeye of hawkeye, the mobile screw of the hawkeye and CCD Industrial camera mounting plate is fixedly connected, and the CCD industrial camera is fixedly mounted on CCD industrial camera mounting plate.
Preferably, the graphite positioning disc mechanism includes positioning mounting plate, and support is provided in the positioning mounting plate Column, for the support column for placing graphite, the positioning mounting plate surrounding is provided with multiple limited blocks.
Preferably, demarcation plate is set in the middle part of the positioning mounting plate.
Preferably, the graphite transmission mechanism includes that graphite drive lead screw, graphite transmission sliding rail and graphite pass Dynamic lead screw motor, the graphite drive lead screw motor are arranged on work top, the graphite drive lead screw motor driven The rotation of graphite drive lead screw, in graphite transmission sliding rail, the graphite transmission is slided for the graphite drive lead screw setting Rail is fixedly connected on work top, is provided on the graphite drive lead screw and is passed with graphite drive lead screw cooperation graphite Dynamic screw, the graphite transmission screw are fixedly connected with positioning mounting plate.
Preferably, the lead mounting device is two, and the lead mounting device is separately positioned on lead grabbing device Two sides.
The technical program has the beneficial effect that:
One, leads of semiconductor device assembly equipment provided by the utility model, including bin, bin include work top, Pin arrangement device, lead grabbing device, hawkeye identification device and lead mounting device, Pin arrangement are provided on work top Device includes vibrating disk mounting seat, vibrating disk and lifting body;Lead grabbing device includes manipulator mounting base, four shaft mechanicals Hand and lead grasping mechanism;Hawkeye identification device includes hawkeye mounting rack, hawkeye mobile mechanism and CCD industrial camera;Lead peace Assembling device includes graphite positioning disc mechanism and graphite transmission mechanism;PLC controller is provided in bin, lead is equipped It sets, lead grabbing device, hawkeye identification device and lead mounting device and PLC controller are electrically connected;In use, passing through PLC Controller starts leads of semiconductor device assembly equipment, vibrates disk startup, lead is put into vibrating disk, and vibration arrangement extremely discharges Graphite, is manually placed on lead mounting device, lead mounting device is moved to hawkeye identification device, hawkeye identification device by section To graphite and take pictures, acquisition position information, and be transferred in PLC controller, lead mounting device is moved to pin station, Lead grabbing device clamps the lead arranged, is moved to above lead mounting device, is inserted into graphite, lead mounting device The mold for sticking with lead is removed into pin station, manually takes out graphite.The utility model, which has, to be promoted labor efficiency, reduces labor The advantages that fatigue resistance and raising product quality.
Two, leads of semiconductor device assembly equipment provided by the utility model, vibrating disk include chassis, storage bin, uplink Screw feeding section, orientation screening feeding section, downlink feeding section and discharging section;Storage bin is arranged on chassis, the storage bin Inner circumferential be equipped with upstream screw feeding section, the periphery of storage bin be successively arranged in the transmission direction of pull ring orientation screening feeding section, Downlink feeding section and discharging section, discharging section is provided with lifting body far from storage bin end, after lead is put into storage bin, because on lead Lower end is different to make Pin arrangement in downlink feeding section in upstream screw feeding section and orientation screening feeding section, and by lead It send to discharging section, discharging section is provided with lifting body far from storage bin end, and lead ejects upwards under lifting body effect, convenient Lead grabbing device grabs lead.
Three, leads of semiconductor device assembly equipment provided by the utility model, lifting body include jacking cylinder, jack this Body, fairlead, optical inductor, jacking mounting base and jacking contraction block, jacking ontology are fixed at work by jacking mounting base Make on table top, jack and be provided with jacking cylinder and optical inductor in ontology, jacking body upper part is provided with fairlead and jacking is received Contracting block, fairlead can accommodate two leads, and jacking contraction block is connected with jacking cylinder extension end, jacking cylinder and optical inductor and PLC controller is connected, and lead enters in fairlead from discharging section, and optical inductor detects lead, if optical inductor is not detected, Start jacking cylinder by PLC controller, jacking contraction block jacks up lead under the action of jacking cylinder.
Four, leads of semiconductor device assembly equipment provided by the utility model, manipulator mounting base are fixedly connected on work On table top, four axis robots are rotationally connected in manipulator mounting base, and lead grasping mechanism is installed in four axis robots, four axis Manipulator is by lead grasping mechanism to discharging section, and after lead grasping mechanism grabs lead, four axis robots are by lead grasping mechanism It being moved at graphite, lead is inserted into graphite by lead grasping mechanism, so that pin speed is faster, it is more acurrate.
Five, leads of semiconductor device assembly equipment provided by the utility model, lead grasping mechanism include that two leads are grabbed Cylinder and two lead crawl blocks are taken, lead grabs cylinder and is fixedly connected with lead crawl block, and lead crawl block lower end setting is drawn Line half bore, two leads, which grab the lead half bore composition being arranged on blocks, can accommodate the cavity of a lead, and lead crawl cylinder goes out Lead crawl block moves out when gas, and lead is unclamped, and after lead enters cavity, lead grabs block when lead grabs cylinder intake Inwardly movement, lead is grabbed.
Six, leads of semiconductor device assembly equipment provided by the utility model, hawkeye mounting rack are fixedly mounted on workbench On face, hawkeye mobile mechanism is mounted on hawkeye mounting rack, and hawkeye mobile mechanism includes hawkeye mobile screw rod, hawkeye shifting sledge With the mobile lead screw motor of hawkeye, the mobile lead screw motor of hawkeye is arranged on hawkeye mounting rack, the mobile screw rod motor driven hawk of hawkeye The mobile screw rod rotation of eye, the mobile screw rod of hawkeye are arranged in hawkeye shifting sledge, and hawkeye shifting sledge is fixedly connected on hawkeye peace It shelves, is provided on the mobile screw rod of hawkeye and the mobile mobile screw of screw rod cooperation hawkeye of hawkeye, the mobile screw of hawkeye and CCD work Industry camera installing plate is fixedly connected, and CCD industrial camera is fixedly mounted on CCD industrial camera mounting plate, on hawkeye mounting rack also Hawkeye driving chain is set, is provided with cable accommodating chamber in hawkeye driving chain, CCD industrial camera is in hawkeye mobile mechanism Move back and forth, acquisition position information, and be transmitted in PLC controller under effect, the setting of hawkeye driving chain so that cable not It is easy to damage.
Seven, leads of semiconductor device assembly equipment provided by the utility model, it includes positioning peace that graphite, which positions disc mechanism, Loading board is provided with support column in positioning mounting plate, and for support column for placing graphite, positioning mounting plate surrounding is provided with multiple limits Position block, positioning mounting plate side is provided with positioning disk driving chain, cable accommodating chamber is provided in positioning disk driving chain, by stone Ink is placed on the support columns, and the limited block of positioning mounting plate surrounding setting is fixed on graphite in positioning mounting plate, is positioned Disk driving chain is arranged so that the cable moved back and forth is hardly damaged.
Eight, leads of semiconductor device assembly equipment provided by the utility model, positioning mounting plate middle part are arranged demarcation plate, make Multiple graphites can be installed simultaneously by obtaining positioning mounting plate.
Nine, leads of semiconductor device assembly equipment provided by the utility model, graphite transmission mechanism include that graphite passes Dynamic screw rod, graphite transmission sliding rail and graphite drive lead screw motor, graphite drive lead screw motor are arranged on work top, The rotation of graphite drive lead screw motor driven graphite drive lead screw, the setting of graphite drive lead screw are driven sliding rail in graphite In, graphite transmission sliding rail is fixedly connected on work top, is provided on graphite drive lead screw and graphite drive lead screw Graphite is cooperated to be driven screw, graphite transmission screw is fixedly connected with positioning mounting plate, and graphite positions disc mechanism in graphite Back and forth movement is realized under box transmission mechanism, the insertion for being conveniently put into graphite, taking out graphite and lead.
Ten, leads of semiconductor device assembly equipment provided by the utility model, lead mounting device are two, lead installation Device is separately positioned on the two sides of lead grabbing device mechanism, and reduction etc. mentions to be placed into the time of graphite and taking-up graphite Rise labor efficiency.
Detailed description of the invention
The utility model aforementioned and being detailed description below becomes more apparent upon when reading in conjunction with the following drawings, in attached drawing:
Fig. 1 is the structural schematic diagram of the utility model;
Fig. 2 is the structural schematic diagram of the utility model Pin arrangement device;
Fig. 3 is the structural schematic diagram of the utility model lifting body;
Fig. 4 is the structural schematic diagram of the utility model top lead grasping mechanism;
Fig. 5 is the structural schematic diagram of the utility model hawkeye identification device;
Fig. 6 is the structural schematic diagram of the utility model lead mounting device;
In figure:
1, bin;2, work top;3, Pin arrangement device;4, lead grabbing device;5, hawkeye identification device;6, lead Mounting device;7, vibrating disk mounting seat;8, vibrating disk;9, lifting body;10, manipulator mounting base;11, four axis robot; 12, lead grasping mechanism;13, hawkeye mounting rack;14, hawkeye mobile mechanism;15, CCD industrial camera;16, graphite positioning disk Mechanism;17, graphite transmission mechanism;18, chassis;19, storage bin;20, upstream screw feeding section;21, orientation screening feeding section; 22, downlink feeding section;23, discharging section;24, ontology is jacked;25, fairlead;26, mounting base is jacked;27, lead grabs cylinder; 28, lead grabs block;29, the mobile screw rod of hawkeye;30, hawkeye shifting sledge;31, the mobile lead screw motor of hawkeye;32, CCD industry Camera installing plate;33, hawkeye driving chain;34, positioning mounting plate;35, support column;36, limited block;37, positioning disk transmission chain Item;38, demarcation plate;39, graphite drive lead screw;40, graphite is driven sliding rail;41, graphite drive lead screw motor.
Specific embodiment
It is further illustrated below by several specific embodiments and realizes the utility model aim technical solution, needed Bright, the technical solution of the requires of the utility model protection includes but is not limited to following embodiment.
Embodiment 1
As a kind of most basic embodiment of the utility model, present embodiment discloses a kind of leads of semiconductor device dresses With equipment, as shown in Figure 1, including bin 1, the bin 1 includes work top 2, is provided with lead on the work top 2 Array apparatus 3, lead grabbing device 4, hawkeye identification device 5 and lead mounting device 6, the Pin arrangement device 3 include vibration Disk mounting seat 7, vibrating disk 8 and lifting body 9;The lead grabbing device 4 includes manipulator mounting base 10, four axis robots 11 and lead grasping mechanism 12;The hawkeye identification device 5 includes hawkeye mounting rack 13, hawkeye mobile mechanism 14 and CCD industry Camera 15;The lead mounting device 6 includes graphite positioning disc mechanism 16 and graphite transmission mechanism 17;In the bin 1 It is provided with PLC controller, the Pin arrangement device 3, lead grabbing device 4, hawkeye identification device 5 and lead mounting device 6 It is electrically connected with PLC controller.
Leads of semiconductor device assembly equipment provided by the utility model, including bin 1, bin 1 include work top 2, It is provided with Pin arrangement device 3, lead grabbing device 4, hawkeye identification device 5 and lead mounting device 6 on work top 2, draws Line collating unit 3 includes vibrating disk mounting seat 7, vibrating disk 8 and lifting body 9;Lead grabbing device 4 is installed including manipulator 10, four axis robots 11 of seat and lead grasping mechanism 12;Hawkeye identification device 5 includes hawkeye mounting rack 13, hawkeye mobile mechanism 14 and CCD industrial camera 15;Lead mounting device 6 includes graphite positioning disc mechanism 16 and graphite transmission mechanism 17;Bin 1 Inside be provided with PLC controller, Pin arrangement device 3, lead grabbing device 4, hawkeye identification device 5 and lead mounting device 6 with PLC controller is electrically connected;In use, starting leads of semiconductor device assembly equipment by PLC controller, vibrating disk 8 starts, Lead is put into vibrating disk 8, graphite is manually placed on lead mounting device 6 by vibration arrangement to discharging section 23, lead peace Assembling device 6 is moved to hawkeye identification device 5, and hawkeye identification device 5 is to graphite and takes pictures, acquisition position information, and transmits Into PLC controller, lead mounting device 6 is moved to pin station, and lead grabbing device 4 clamps the lead arranged, mobile It to 6 top of lead mounting device, is inserted into graphite, the mold for sticking with lead is removed pin station, people by lead mounting device 6 Work takes out graphite.The utility model has many advantages, such as to promote labor efficiency, reduce labor intensity and improve product quality.
Embodiment 2
As a kind of preferred embodiment of the utility model, present embodiment discloses a kind of assembly of leads of semiconductor device Equipment, as shown in Figure 1, including bin 1, the bin 1 includes work top 2, is provided with Pin arrangement on the work top 2 Device 3, lead grabbing device 4, hawkeye identification device 5 and lead mounting device 6, the Pin arrangement device 3 include vibrating disk Mounting seat 7, vibrating disk 8 and lifting body 9;The lead grabbing device 4 includes manipulator mounting base 10, four axis robots 11 With lead grasping mechanism 12;The hawkeye identification device 5 includes hawkeye mounting rack 13, hawkeye mobile mechanism 14 and CCD industry phase Machine 15;The lead mounting device 6 includes graphite positioning disc mechanism 16 and graphite transmission mechanism 17;It is set in the bin 1 Be equipped with PLC controller, the Pin arrangement device 3, lead grabbing device 4, hawkeye identification device 5 and lead mounting device 6 with PLC controller is electrically connected.
As shown in Figure 2, it is preferred that the vibrating disk 8 includes chassis 18, storage bin 19, upstream screw feeding section 20, orientation Sieve feeding section 21, downlink feeding section 22 and discharging section 23;The storage bin 19 is arranged on chassis 18, the storage bin 19 Inner circumferential is equipped with upstream screw feeding section 20, and the periphery of the storage bin 19 is successively arranged orientation screening in the transmission direction of pull ring Feeding section 21, downlink feeding section 22 and discharging section 23, the discharging section 23 are provided with lifting body 9 far from 19 end of storage bin.
As shown in Figure 3, it is preferred that the lifting body 9 includes jacking cylinder, jacking ontology 24, fairlead 25, photoinduction Device, jacking mounting base 26 and jacking contraction block, the jacking ontology 24 are fixed at work top 2 by jacking mounting base 26 On, jacking cylinder and optical inductor are provided in the jacking ontology 24,24 top of jacking ontology is provided with fairlead 25 With jacking contraction block, the fairlead 25 can accommodate two leads, and the jacking contraction block is connected with jacking cylinder extension end, institute It states jacking cylinder and optical inductor is connected with PLC controller.
Preferably, the manipulator mounting base 10 is fixedly connected on work top 2, and the rotation of four axis robot 11 connects It is connected in manipulator mounting base 10, the lead grasping mechanism 12 is installed in four axis robots 11.
As shown in Figure 4, it is preferred that the lead grasping mechanism 12 includes that two lead crawl cylinders 27 and two leads are grabbed Block 28 is taken, the lead crawl cylinder 27 is fixedly connected with lead crawl block 28, and lead is arranged in the lead crawl 28 lower end of block Half bore, described two leads, which grab the lead half bore composition being arranged on blocks 28, can accommodate the cavity of a lead.
As shown in Figure 5, it is preferred that the hawkeye mounting rack 13 is fixedly mounted on work top 2, the hawkeye moving machine Structure 14 is mounted on hawkeye mounting rack 13, and the hawkeye mobile mechanism 14 includes hawkeye mobile screw rod 29, hawkeye shifting sledge 30 With the mobile lead screw motor 31 of hawkeye, the mobile lead screw motor 31 of the hawkeye is arranged on hawkeye mounting rack 13, and the hawkeye is mobile Lead screw motor 31 drives the mobile screw rod 29 of hawkeye to rotate, and the mobile screw rod 29 of the hawkeye is arranged in hawkeye shifting sledge 30, institute It states hawkeye shifting sledge 30 to be fixedly connected on hawkeye mounting rack 13, be provided on the mobile screw rod 29 of the hawkeye mobile with hawkeye Screw rod 29 cooperates the mobile screw of hawkeye, and the mobile screw of the hawkeye is fixedly connected with CCD industrial camera mounting plate 32, the CCD Industrial camera 15 is fixedly mounted on CCD industrial camera mounting plate 32, also sets up hawkeye transmission chain on the hawkeye mounting rack 13 Item 33 is provided with cable accommodating chamber in the hawkeye driving chain 33.
As shown in Figure 6, it is preferred that the graphite positioning disc mechanism 16 includes positioning mounting plate 34, the location and installation Support column 35 is provided on plate 34, for placing graphite, 34 surrounding of positioning mounting plate is provided with more the support column 35 A limited block 36,34 side of positioning mounting plate are provided with positioning disk driving chain 37, in the positioning disk driving chain 37 It is provided with cable accommodating chamber.
Preferably, demarcation plate 38 is set in the middle part of the positioning mounting plate 34.
Preferably, the graphite transmission mechanism 17 includes graphite drive lead screw 39, graphite transmission sliding rail 40 and stone Print cartridge drive lead screw motor 41, the graphite drive lead screw motor 41 are arranged on work top 2, the graphite driving wire Bar motor 41 drives graphite drive lead screw 39 to rotate, and the setting of graphite drive lead screw 39 is driven sliding rail 40 in graphite In, graphite transmission sliding rail 40 is fixedly connected on work top 2, is provided on the graphite drive lead screw 39 and stone Print cartridge drive lead screw 39 cooperates graphite to be driven screw, and the graphite transmission screw is fixedly connected with positioning mounting plate 34.
Preferably, the lead mounting device 6 is two, and the lead mounting device 6 is separately positioned on lead crawl dress Set the two sides of 4 mechanisms.
Leads of semiconductor device assembly equipment provided by the utility model, including bin 1, bin 1 include work top 2, It is provided with Pin arrangement device 3, lead grabbing device 4, hawkeye identification device 5 and lead mounting device 6 on work top 2, draws Line collating unit 3 includes vibrating disk mounting seat 7, vibrating disk 8 and lifting body 9;Lead grabbing device 4 is installed including manipulator 10, four axis robots 11 of seat and lead grasping mechanism 12;Hawkeye identification device 5 includes hawkeye mounting rack 13, hawkeye mobile mechanism 14 and CCD industrial camera 15;Lead mounting device 6 includes graphite positioning disc mechanism 16 and graphite transmission mechanism 17;Bin 1 Inside be provided with PLC controller, Pin arrangement device 3, lead grabbing device 4, hawkeye identification device 5 and lead mounting device 6 with PLC controller is electrically connected;In use, starting leads of semiconductor device assembly equipment by PLC controller, vibrating disk 8 starts, Lead is put into vibrating disk 8, graphite is manually placed on lead mounting device 6 by vibration arrangement to discharging section 23, lead peace Assembling device 6 is moved to hawkeye identification device 5, and hawkeye identification device 5 is to graphite and takes pictures, acquisition position information, and transmits Into PLC controller, lead mounting device 6 is moved to pin station, and lead grabbing device 4 clamps the lead arranged, mobile It to 6 top of lead mounting device, is inserted into graphite, the mold for sticking with lead is removed pin station, people by lead mounting device 6 Work takes out graphite.The utility model has many advantages, such as to promote labor efficiency, reduce labor intensity and improve product quality.
Vibrating disk 8 includes chassis 18, storage bin 19, upstream screw feeding section 20, orientation screening feeding section 21, downlink feeding Section 22 and discharging section 23;Storage bin 19 is arranged on chassis 18, and the inner circumferential of the storage bin 19 is equipped with upstream screw feeding section 20, The periphery of storage bin 19 is successively arranged orientation screening feeding section 21, downlink feeding section 22 and discharging section in the transmission direction of pull ring 23, discharging section 23 is provided with lifting body 9 far from 19 end of storage bin, after lead is put into storage bin 19, because lead upper and lower side is different Sample makes Pin arrangement in downlink feeding section 22 in upstream screw feeding section 20 and orientation screening feeding section 21, and lead is sent To discharging section 23, discharging section 23 is provided with lifting body 9 far from 19 end of storage bin, and lead pushes up upwards under the effect of lifting body 9 Out, lead grabbing device 4 is facilitated to grab lead.Lifting body 9 includes jacking cylinder, jacking ontology 24, fairlead 25, photoinduction Device, jacking mounting base 26 and jacking contraction block, jacking ontology 24 are fixed on work top 2 by jacking mounting base 26, Jacking cylinder and optical inductor are provided in jacking ontology 24, jacking 24 top of ontology is provided with fairlead 25 and jacking is shunk Block, fairlead 25 can accommodate two leads, and jacking contraction block is connected with jacking cylinder extension end, jacking cylinder and optical inductor and PLC controller is connected, and lead enters in fairlead 25 from discharging section 23, and optical inductor detects lead, if optical inductor does not detect Then, jacking cylinder is started by PLC controller, jacking contraction block jacks up lead under the action of jacking cylinder.Manipulator Mounting base 10 is fixedly connected on work top 2, and four axis robots 11 are rotationally connected in manipulator mounting base 10, lead crawl Mechanism 12 is installed in four axis robots 11, and four axis robots 11 are by lead grasping mechanism 12 to discharging section 23, lead gripper After structure 12 grabs lead, lead grasping mechanism 12 is moved at graphite by four axis robots 11, and lead grasping mechanism 12 will draw Line is inserted into graphite, so that pin speed is faster, it is more acurrate.Lead grasping mechanism 12 includes that two leads grab 27 He of cylinder Two leads grab block 28, and lead grabs cylinder 27 and is fixedly connected with lead crawl block 28, and lead crawl 28 lower end of block setting is drawn Line half bore, two leads, which grab the lead half bore composition being arranged on blocks 28, can accommodate the cavity of a lead, and lead grabs cylinder Lead crawl block 28 moves out when 27 outlet, and lead is unclamped, and after lead enters cavity, lead draws when grabbing 27 air inlet of cylinder Line grabs block 28 and inwardly moves, and lead is grabbed.Hawkeye mounting rack 13 is fixedly mounted on work top 2, hawkeye moving machine Structure 14 is mounted on hawkeye mounting rack 13, and hawkeye mobile mechanism 14 includes the mobile screw rod 29 of hawkeye, hawkeye shifting sledge 30 and hawk The mobile lead screw motor 31 of eye, the mobile lead screw motor 31 of hawkeye are arranged on hawkeye mounting rack 13, and the mobile lead screw motor 31 of hawkeye is driven The dynamic mobile screw rod 29 of hawkeye rotates, and the mobile screw rod 29 of hawkeye is arranged in hawkeye shifting sledge 30, and hawkeye shifting sledge 30 is fixed It is connected on hawkeye mounting rack 13, is provided on the mobile screw rod 29 of hawkeye and cooperates the mobile screw of hawkeye with the mobile screw rod 29 of hawkeye, The mobile screw of hawkeye is fixedly connected with CCD industrial camera mounting plate 32, and CCD industrial camera 15 is fixedly mounted on CCD industrial camera On mounting plate 32, hawkeye driving chain 33 is also set up on hawkeye mounting rack 13, and cable receiving is provided in hawkeye driving chain 33 Chamber, CCD industrial camera 15 move back and forth under the action of hawkeye mobile mechanism 14, acquisition position information, and are transmitted to PLC control In device processed, the setting of hawkeye driving chain 33 is so that cable is hardly damaged.It includes positioning mounting plate that graphite, which positions disc mechanism 16, 34, support column 35 is provided in positioning mounting plate 34, for placing graphite, 34 surrounding of positioning mounting plate is provided with support column 35 Multiple limited blocks 36,34 side of positioning mounting plate are provided with positioning disk driving chain 37, are provided in positioning disk driving chain 37 Graphite is placed on support column 35 by cable accommodating chamber, and the limited block 36 of 34 surrounding of positioning mounting plate setting makes graphite solid It is scheduled in positioning mounting plate 34, positioning disk driving chain 37 is arranged so that the cable moved back and forth is hardly damaged.Location and installation Demarcation plate 38 is set in the middle part of plate 34, allows positioning mounting plate 34 that multiple graphites are installed simultaneously.Graphite transmission mechanism 17 Including graphite drive lead screw 39, graphite transmission sliding rail 40 and graphite drive lead screw motor 41, graphite drive lead screw electricity Machine 41 is arranged on work top 2, and graphite drive lead screw motor 41 drives graphite drive lead screw 39 to rotate, graphite transmission The setting of screw rod 39 is in graphite transmission sliding rail 40, and graphite transmission sliding rail 40 is fixedly connected on work top 2, and graphite passes It is provided on dynamic screw rod 39 and cooperates graphite transmission screw with graphite drive lead screw 39, graphite is driven screw and location and installation Plate 34 is fixedly connected, and graphite positioning disc mechanism 16 realizes back and forth movement under graphite transmission mechanism 17, is conveniently put into graphite Box, the insertion for taking out graphite and lead.Lead mounting device 6 is two, and lead mounting device 6 is separately positioned on lead crawl The two sides of 4 mechanism of device, reduction etc. promote labor efficiency to be placed into the time of graphite and taking-up graphite.

Claims (10)

1. a kind of leads of semiconductor device assembly equipment, including bin (1), it is characterised in that: the bin (1) includes workbench Face (2) is provided with Pin arrangement device (3), lead grabbing device (4), hawkeye identification device (5) on the work top (2) With lead mounting device (6), the Pin arrangement device (3) includes vibrating disk mounting seat (7), vibrating disk (8) and jack Structure (9);The lead grabbing device (4) includes manipulator mounting base (10), four axis robots (11) and lead grasping mechanism (12);The hawkeye identification device (5) includes hawkeye mounting rack (13), hawkeye mobile mechanism (14) and CCD industrial camera (15); The lead mounting device (6) includes graphite positioning disc mechanism (16) and graphite transmission mechanism (17);In the bin (1) It is provided with PLC controller, the Pin arrangement device (3), lead grabbing device (4), hawkeye identification device (5) and lead installation Device (6) and PLC controller are electrically connected.
2. leads of semiconductor device assembly equipment according to claim 1, it is characterised in that: the vibrating disk (8) includes Chassis (18), storage bin (19), upstream screw feeding section (20), orientation are sieved feeding section (21), downlink feeding section (22) and are gone out Expect section (23);The storage bin (19) is arranged on chassis (18), and the inner circumferential of the storage bin (19) is equipped with upstream screw feeding Section (20), the periphery of the storage bin (19) are successively arranged orientation screening feeding section (21), downlink in the transmission direction of pull ring Feeding section (22) and discharging section (23), the discharging section (23) are provided with lifting body (9) far from storage bin (19) end.
3. leads of semiconductor device assembly equipment according to claim 1, it is characterised in that: lifting body (9) packet Include jacking cylinder, jacking ontology (24), fairlead (25), optical inductor, jacking mounting base (26) and jacking contraction block, the top It rises ontology (24) and is fixed on work top (2) by jacking mounting base (26), is provided in the jacking ontology (24) Jacking cylinder and optical inductor, jacking ontology (24) top are provided with fairlead (25) and jacking contraction block, the lead Hole (25) can accommodate two leads, and the jacking contraction block is connected with jacking cylinder extension end, the jacking cylinder and photoinduction Device is connected with PLC controller.
4. leads of semiconductor device assembly equipment according to claim 1, it is characterised in that: the manipulator mounting base (10) it is fixedly connected on work top (2), four axis robot (11) is rotationally connected on manipulator mounting base (10), institute Lead grasping mechanism (12) is stated to be installed on four axis robots (11).
5. leads of semiconductor device assembly equipment according to claim 1, it is characterised in that: the lead grasping mechanism It (12) include two lead crawls cylinder (27) and two lead crawls block (28), lead crawl cylinder (27) is grabbed with lead Block (28) is taken to be fixedly connected, lead half bore is arranged in lead crawl block (28) lower end, and described two leads grab on block (28) The lead half bore composition of setting can accommodate the cavity of a lead.
6. leads of semiconductor device assembly equipment according to claim 1, it is characterised in that: the hawkeye mounting rack (13) It is fixedly mounted on work top (2), the hawkeye mobile mechanism (14) is mounted on hawkeye mounting rack (13), and the hawkeye moves Motivation structure (14) includes that hawkeye mobile screw rod (29), hawkeye shifting sledge (30) and hawkeye are mobile lead screw motor (31), the hawk Eye mobile lead screw motor (31) is arranged on hawkeye mounting rack (13), and the hawkeye mobile lead screw motor (31) driving hawkeye is mobile Screw rod (29) rotation, the hawkeye mobile screw rod (29) are arranged in hawkeye shifting sledge (30), the hawkeye shifting sledge (30) it is fixedly connected on hawkeye mounting rack (13), is provided on the hawkeye mobile screw rod (29) mobile screw rod (29) with hawkeye Cooperate the mobile screw of hawkeye, the mobile screw of the hawkeye is fixedly connected with CCD industrial camera mounting plate (32), the CCD industry Camera (15) is fixedly mounted on CCD industrial camera mounting plate (32).
7. leads of semiconductor device assembly equipment according to claim 1, it is characterised in that: the graphite positioning disk machine Structure (16) includes positioning mounting plate (34), is provided with support column (35) on the positioning mounting plate (34), the support column (35) For placing graphite, positioning mounting plate (34) surrounding is provided with multiple limited blocks (36).
8. leads of semiconductor device assembly equipment according to claim 7, it is characterised in that: the positioning mounting plate (34) Demarcation plate (38) are arranged in middle part.
9. leads of semiconductor device assembly equipment according to claim 1, it is characterised in that: the graphite transmission mechanism It (17) include graphite drive lead screw (39), graphite transmission sliding rail (40) and graphite drive lead screw motor (41), the stone Print cartridge drive lead screw motor (41) is arranged on work top (2), and the graphite drive lead screw motor (41) drives graphite Drive lead screw (39) rotation, graphite drive lead screw (39) setting is in graphite transmission sliding rail (40), the graphite Transmission sliding rail (40) is fixedly connected on work top (2), is provided on the graphite drive lead screw (39) and is passed with graphite Dynamic screw rod (39) cooperation graphite is driven screw, and the graphite transmission screw is fixedly connected with positioning mounting plate (34).
10. leads of semiconductor device assembly equipment according to claim 1, it is characterised in that: the lead mounting device It (6) is two, the lead mounting device (6) is separately positioned on the two sides of lead grabbing device (4).
CN201822233499.7U 2018-12-28 2018-12-28 A kind of leads of semiconductor device assembly equipment Active CN209389001U (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113644015A (en) * 2021-10-15 2021-11-12 四川晶辉半导体有限公司 Semiconductor frame glues core device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113644015A (en) * 2021-10-15 2021-11-12 四川晶辉半导体有限公司 Semiconductor frame glues core device
CN113644015B (en) * 2021-10-15 2021-12-24 四川晶辉半导体有限公司 Semiconductor frame glues core device

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