CN209326371U - A kind of air intake structure being sintered DBC semiconductor heat electric substrate nitrogen furnace boiler tube - Google Patents
A kind of air intake structure being sintered DBC semiconductor heat electric substrate nitrogen furnace boiler tube Download PDFInfo
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- CN209326371U CN209326371U CN201822133784.1U CN201822133784U CN209326371U CN 209326371 U CN209326371 U CN 209326371U CN 201822133784 U CN201822133784 U CN 201822133784U CN 209326371 U CN209326371 U CN 209326371U
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- air inlet
- inlet pipe
- intake structure
- air intake
- mounting device
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Abstract
The utility model discloses a kind of air intake structures for being sintered DBC semiconductor heat electric substrate nitrogen furnace boiler tube, it is characterised by comprising: preceding air inlet pipe, air inlet pipe afterwards, preceding air inlet pipe mounting device, advance air pipe outlet, air inlet pipe mounting device afterwards, laggard air pipe outlet and air intake structure mounting layer, multiple preceding air inlet pipe mounting devices and rear air inlet pipe mounting device are provided on the air intake structure mounting layer, the preceding air inlet pipe is arranged on air intake structure mounting layer by preceding air inlet pipe mounting device, air inlet pipe is arranged on air intake structure mounting layer by rear air inlet mounting device after described, multiple advance air pipe outlets are provided in the preceding air inlet pipe, air inlet pipe is provided with multiple laggard air pipe outlets after described.
Description
Technical field
The utility model belongs to DBC semiconductor heat electric substrate production technical field, and in particular to a kind of sintering DBC semiconductor
The air intake structure of thermoelectricity substrate nitrogen furnace boiler tube.
Background technique
With the development of power electronic device, circuit board integrated level and working frequency are continuously improved, and heat dissipation problem has become
The critical issue solved is had in power electronic device development.Ceramic substrate is high-power electronic device, integrated circuit substrate
Encapsulating material, be the key that supplementary material in the technologies such as power electronic, Electronic Packaging and multi-chip module, performance decides
The radiating efficiency and reliability of module.
DBC semiconductor heat electric substrate is that copper foil is directly sintered to Al with DBC technology2O3Or one made of AlN ceramic surface
It is kind compound to cover copper ceramic wafer, have big high-termal conductivity, high electrical insulating property, current capacity, high mechanical strength, with silicon chip phase
The features such as temperature characterisitic matched.Al2O3When potsherd manufacturing process, need to strike out ceramic sheet matrix into single ceramic piece blank,
And the impurity on potsherd blank two sides is got rid of, then potsherd green body is placed in pusher furnace and is fired, the prior art
In, the boiler tube air inlet for being sintered DBC semiconductor substrate nitrogen furnace is single, and in-furnace temperature is uneven.
Utility model content
The purpose of this utility model is to provide a kind of air inlet knots for being sintered DBC semiconductor heat electric substrate nitrogen furnace boiler tube
Structure.
The purpose of this utility model is achieved through the following technical solutions:
A kind of air intake structure being sintered DBC semiconductor heat electric substrate nitrogen furnace boiler tube, characterized by comprising: preceding air inlet
Pipe, rear air inlet pipe, preceding air inlet pipe mounting device, advance air pipe outlet, rear air inlet pipe mounting device, laggard air pipe outlet and
Air intake structure mounting layer is provided with multiple preceding air inlet pipe mounting devices and rear air inlet pipe installation dress on the air intake structure mounting layer
It sets, the preceding air inlet pipe is arranged on air intake structure mounting layer by preceding air inlet pipe mounting device, after the rear air inlet pipe passes through
Air inlet mounting device is arranged on air intake structure mounting layer, and multiple advance air pipe outlets, institute are provided in the preceding air inlet pipe
It states rear air inlet pipe and is provided with multiple laggard air pipe outlets.
The preceding air inlet pipe and rear air inlet pipe are high temperature resistant heat insulation pipeline.
The top of high temperature furnace is arranged in the air intake structure mounting layer.
At least provided with 3 preceding air inlet pipe mounting devices and rear air inlet pipe mounting device on the air intake structure mounting layer.
The preceding air inlet pipe mounting device and rear air inlet pipe mounting device are high temperature resistant buckle.
The preceding air inlet pipe up to being provided with 3 advance air pipe outlets less.
Air inlet pipe up to being provided with 3 laggard air pipe outlets less after described.
The technical program has the beneficial effect that:
1. it is more that the utility model is distributed the outlet of nitrogen, more uniform, so that nitrogen cooling is more efficient, increase
Whole sintering efficiency is added.
Detailed description of the invention
The utility model aforementioned and being detailed description below becomes more apparent upon when reading in conjunction with the following drawings, in attached drawing:
Fig. 1 is the structural schematic diagram of the utility model；
In figure:
1, preceding air inlet pipe, 2, rear air inlet pipe, 3, preceding air inlet pipe mounting device, 4, advance air pipe outlet, 5, rear air inlet pipe
Mounting device, 6, laggard air pipe outlet, 7, air intake structure mounting layer.
Specific embodiment
It is further illustrated below by several specific embodiments and realizes the utility model aim technical solution, needed
Bright, the technical solution of the requires of the utility model protection includes but is not limited to following embodiment.
Embodiment 1
A kind of air intake structure being sintered DBC semiconductor heat electric substrate nitrogen furnace boiler tube, characterized by comprising: preceding air inlet pipe
1, rear air inlet pipe 2, preceding air inlet pipe mounting device 3, advance air pipe outlet 4, rear air inlet pipe mounting device 5, rear air inlet pipe outlet
Mouthfuls 6 and air intake structure mounting layer 7, multiple preceding air inlet pipe mounting devices 3 and rear air inlet are provided on the air intake structure mounting layer 7
Pipe mounting device 5, the preceding air inlet pipe 1 is arranged on air intake structure mounting layer 7 by preceding air inlet pipe mounting device 3, after described
Air inlet pipe 2 by rear air inlet mounting device 5 be arranged on air intake structure mounting layer 7, be provided in the preceding air inlet pipe 1 it is multiple before
Air inlet pipe gas outlet 4, the rear air inlet pipe 2 are provided with multiple laggard air pipe outlets 6.
Embodiment 2
A kind of air intake structure being sintered DBC semiconductor heat electric substrate nitrogen furnace boiler tube, characterized by comprising: preceding air inlet pipe
1, rear air inlet pipe 2, preceding air inlet pipe mounting device 3, advance air pipe outlet 4, rear air inlet pipe mounting device 5, rear air inlet pipe outlet
Mouthfuls 6 and air intake structure mounting layer 7, multiple preceding air inlet pipe mounting devices 3 and rear air inlet are provided on the air intake structure mounting layer 7
Pipe mounting device 5, the preceding air inlet pipe 1 is arranged on air intake structure mounting layer 7 by preceding air inlet pipe mounting device 3, after described
Air inlet pipe 2 by rear air inlet mounting device 5 be arranged on air intake structure mounting layer 7, be provided in the preceding air inlet pipe 1 it is multiple before
Air inlet pipe gas outlet 4, the rear air inlet pipe 2 are provided with multiple laggard air pipe outlets 6.
The preceding air inlet pipe 1 and rear air inlet pipe 2 are high temperature resistant heat insulation pipeline.
Embodiment 3
A kind of air intake structure being sintered DBC semiconductor heat electric substrate nitrogen furnace boiler tube, characterized by comprising: preceding air inlet pipe
1, rear air inlet pipe 2, preceding air inlet pipe mounting device 3, advance air pipe outlet 4, rear air inlet pipe mounting device 5, rear air inlet pipe outlet
Mouthfuls 6 and air intake structure mounting layer 7, multiple preceding air inlet pipe mounting devices 3 and rear air inlet are provided on the air intake structure mounting layer 7
Pipe mounting device 5, the preceding air inlet pipe 1 is arranged on air intake structure mounting layer 7 by preceding air inlet pipe mounting device 3, after described
Air inlet pipe 2 by rear air inlet mounting device 5 be arranged on air intake structure mounting layer 7, be provided in the preceding air inlet pipe 1 it is multiple before
Air inlet pipe gas outlet 4, the rear air inlet pipe 2 are provided with multiple laggard air pipe outlets 6.
The preceding air inlet pipe 1 and rear air inlet pipe 2 are high temperature resistant heat insulation pipeline.
The top of high temperature furnace is arranged in the air intake structure mounting layer 7.
Embodiment 4
A kind of air intake structure being sintered DBC semiconductor heat electric substrate nitrogen furnace boiler tube, characterized by comprising: preceding air inlet pipe
1, rear air inlet pipe 2, preceding air inlet pipe mounting device 3, advance air pipe outlet 4, rear air inlet pipe mounting device 5, rear air inlet pipe outlet
Mouthfuls 6 and air intake structure mounting layer 7, multiple preceding air inlet pipe mounting devices 3 and rear air inlet are provided on the air intake structure mounting layer 7
Pipe mounting device 5, the preceding air inlet pipe 1 is arranged on air intake structure mounting layer 7 by preceding air inlet pipe mounting device 3, after described
Air inlet pipe 2 by rear air inlet mounting device 5 be arranged on air intake structure mounting layer 7, be provided in the preceding air inlet pipe 1 it is multiple before
Air inlet pipe gas outlet 4, the rear air inlet pipe 2 are provided with multiple laggard air pipe outlets 6.
The preceding air inlet pipe 1 and rear air inlet pipe 2 are high temperature resistant heat insulation pipeline.
The top of high temperature furnace is arranged in the air intake structure mounting layer 7.
At least provided with 3 preceding air inlet pipe mounting devices 3 and rear air inlet pipe mounting device on the air intake structure mounting layer 7
5。
Embodiment 5
A kind of air intake structure being sintered DBC semiconductor heat electric substrate nitrogen furnace boiler tube, characterized by comprising: preceding air inlet pipe
1, rear air inlet pipe 2, preceding air inlet pipe mounting device 3, advance air pipe outlet 4, rear air inlet pipe mounting device 5, rear air inlet pipe outlet
Mouthfuls 6 and air intake structure mounting layer 7, multiple preceding air inlet pipe mounting devices 3 and rear air inlet are provided on the air intake structure mounting layer 7
Pipe mounting device 5, the preceding air inlet pipe 1 is arranged on air intake structure mounting layer 7 by preceding air inlet pipe mounting device 3, after described
Air inlet pipe 2 by rear air inlet mounting device 5 be arranged on air intake structure mounting layer 7, be provided in the preceding air inlet pipe 1 it is multiple before
Air inlet pipe gas outlet 4, the rear air inlet pipe 2 are provided with multiple laggard air pipe outlets 6.
The preceding air inlet pipe 1 and rear air inlet pipe 2 are high temperature resistant heat insulation pipeline.
The top of high temperature furnace is arranged in the air intake structure mounting layer 7.
At least provided with 3 preceding air inlet pipe mounting devices 3 and rear air inlet pipe mounting device on the air intake structure mounting layer 7
5。
The preceding air inlet pipe mounting device 3 and rear air inlet pipe mounting device 5 are high temperature resistant buckle.
Embodiment 6
A kind of air intake structure being sintered DBC semiconductor heat electric substrate nitrogen furnace boiler tube, characterized by comprising: preceding air inlet pipe
1, rear air inlet pipe 2, preceding air inlet pipe mounting device 3, advance air pipe outlet 4, rear air inlet pipe mounting device 5, rear air inlet pipe outlet
Mouthfuls 6 and air intake structure mounting layer 7, multiple preceding air inlet pipe mounting devices 3 and rear air inlet are provided on the air intake structure mounting layer 7
Pipe mounting device 5, the preceding air inlet pipe 1 is arranged on air intake structure mounting layer 7 by preceding air inlet pipe mounting device 3, after described
Air inlet pipe 2 by rear air inlet mounting device 5 be arranged on air intake structure mounting layer 7, be provided in the preceding air inlet pipe 1 it is multiple before
Air inlet pipe gas outlet 4, the rear air inlet pipe 2 are provided with multiple laggard air pipe outlets 6.
The preceding air inlet pipe 1 and rear air inlet pipe 2 are high temperature resistant heat insulation pipeline.
The top of high temperature furnace is arranged in the air intake structure mounting layer 7.
At least provided with 3 preceding air inlet pipe mounting devices 3 and rear air inlet pipe mounting device on the air intake structure mounting layer 7
5。
The preceding air inlet pipe mounting device 3 and rear air inlet pipe mounting device 5 are high temperature resistant buckle.
At least provided with 3 advance air pipe outlets 4 in the preceding air inlet pipe 1.
Embodiment 7
A kind of air intake structure being sintered DBC semiconductor heat electric substrate nitrogen furnace boiler tube, characterized by comprising: preceding air inlet pipe
1, rear air inlet pipe 2, preceding air inlet pipe mounting device 3, advance air pipe outlet 4, rear air inlet pipe mounting device 5, rear air inlet pipe outlet
Mouthfuls 6 and air intake structure mounting layer 7, multiple preceding air inlet pipe mounting devices 3 and rear air inlet are provided on the air intake structure mounting layer 7
Pipe mounting device 5, the preceding air inlet pipe 1 is arranged on air intake structure mounting layer 7 by preceding air inlet pipe mounting device 3, after described
Air inlet pipe 2 by rear air inlet mounting device 5 be arranged on air intake structure mounting layer 7, be provided in the preceding air inlet pipe 1 it is multiple before
Air inlet pipe gas outlet 4, the rear air inlet pipe 2 are provided with multiple laggard air pipe outlets 6.
The preceding air inlet pipe 1 and rear air inlet pipe 2 are high temperature resistant heat insulation pipeline.
The top of high temperature furnace is arranged in the air intake structure mounting layer 7.
At least provided with 3 preceding air inlet pipe mounting devices 3 and rear air inlet pipe mounting device on the air intake structure mounting layer 7
5。
The preceding air inlet pipe mounting device 3 and rear air inlet pipe mounting device 5 are high temperature resistant buckle.
At least provided with 3 advance air pipe outlets 4 in the preceding air inlet pipe 1.
At least provided with 3 laggard air pipe outlets 6 in air inlet pipe 2 after described.
Claims (7)
1. a kind of air intake structure for being sintered DBC semiconductor heat electric substrate nitrogen furnace boiler tube, characterized by comprising: preceding air inlet pipe
(1), rear air inlet pipe (2), preceding air inlet pipe mounting device (3), advance air pipe outlet (4), rear air inlet pipe mounting device (5), after
Air inlet pipe gas outlet (6) and air intake structure mounting layer (7) are provided with multiple preceding air inlet pipe on the air intake structure mounting layer (7)
Mounting device (3) and rear air inlet pipe mounting device (5), the preceding air inlet pipe (1) are arranged by preceding air inlet pipe mounting device (3)
On air intake structure mounting layer (7), the rear air inlet pipe (2) is arranged by rear air inlet mounting device 5 in air intake structure mounting layer (7)
On, multiple advance air pipe outlets (4) are provided on the preceding air inlet pipe (1), the rear air inlet pipe (2) is provided with multiple laggard
Air pipe outlet (6).
2. a kind of air intake structure for being sintered DBC semiconductor heat electric substrate nitrogen furnace boiler tube, feature exist according to claim 1
In: the preceding air inlet pipe (1) and rear air inlet pipe (2) be high temperature resistant heat insulation pipeline.
3. a kind of air intake structure for being sintered DBC semiconductor heat electric substrate nitrogen furnace boiler tube, feature exist according to claim 1
In: the top of high temperature furnace is arranged in the air intake structure mounting layer (7).
4. a kind of air intake structure for being sintered DBC semiconductor heat electric substrate nitrogen furnace boiler tube, feature exist according to claim 1
In: at least provided with 3 preceding air inlet pipe mounting devices (3) and rear air inlet pipe mounting device on the air intake structure mounting layer (7)
(5).
5. a kind of air intake structure for being sintered DBC semiconductor heat electric substrate nitrogen furnace boiler tube, feature exist according to claim 1
In: the preceding air inlet pipe mounting device (3) and rear air inlet pipe mounting device (5) be high temperature resistant buckle.
6. a kind of air intake structure for being sintered DBC semiconductor heat electric substrate nitrogen furnace boiler tube, feature exist according to claim 1
In: at least provided with 3 advance air pipe outlets (4) on the preceding air inlet pipe (1).
7. a kind of air intake structure for being sintered DBC semiconductor heat electric substrate nitrogen furnace boiler tube, feature exist according to claim 1
In: at least provided with 3 laggard air pipe outlets (6) in air inlet pipe (2) after described.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822133784.1U CN209326371U (en) | 2018-12-19 | 2018-12-19 | A kind of air intake structure being sintered DBC semiconductor heat electric substrate nitrogen furnace boiler tube |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822133784.1U CN209326371U (en) | 2018-12-19 | 2018-12-19 | A kind of air intake structure being sintered DBC semiconductor heat electric substrate nitrogen furnace boiler tube |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209326371U true CN209326371U (en) | 2019-08-30 |
Family
ID=67727472
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201822133784.1U Active CN209326371U (en) | 2018-12-19 | 2018-12-19 | A kind of air intake structure being sintered DBC semiconductor heat electric substrate nitrogen furnace boiler tube |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209326371U (en) |
-
2018
- 2018-12-19 CN CN201822133784.1U patent/CN209326371U/en active Active
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