CN209305094U

CN209305094U - A kind of low dielectric flexible copper-clad plate

Info

Publication number: CN209305094U
Application number: CN201821555648.5U
Authority: CN
Inventors: 徐莎; 陈庞英; 张家煌; 刘沛然
Original assignee: Zhongshan Allstar Electronic Materials Co Ltd
Current assignee: Zhongshan Allstar Electronic Materials Co Ltd
Priority date: 2018-09-21
Filing date: 2018-09-21
Publication date: 2019-08-27
Anticipated expiration: 2028-09-21

Abstract

The utility model discloses a kind of low dielectric flexible copper-clad plate, it include the first copper clad laminate and the second copper clad laminate, the first macromolecule low dielectric layer is coated on first copper clad laminate, the second macromolecule low dielectric layer is coated on second copper clad laminate, the first thermosetting polyimides layer that polyimide acid is formed is coated on first macromolecule low dielectric layer, it is coated with the second thermosetting polyimides layer that polyimide acid is formed on second macromolecule low dielectric layer, is bonded and is connected by thermoplastic polyimide layer between the first thermosetting polyimides layer and the second thermosetting polyimides layer.Surface-treated low dielectric filler and low dielectric high molecular polymer and polyimide acid are mixed to form the low dielectric latex solution of macromolecule and are coated on copper-clad surface by the utility model, dielectric materials are concentrated in this layer of structure, only in the low dielectric latex solution of copper foil contact surface coating macromolecule, this layer of small coating thickness, the loss of low transmission needed for reaching high frequency material using a small amount of low dielectric high molecular material require.

Description

A kind of low dielectric flexible copper-clad plate

[technical field]

The utility model relates to a kind of low dielectric flexible copper-clad plates.

[background technique]

As International Organization for standardization 3GPP completes first edition whole world 5G standardization, high bandwidth, high speed in June in this year The 5G communication applications commercialization of degree transmission will become electronic equipment and electronic product main trend.5G technology is as the 4th industry leather The core technology of life, countries in the world are all actively disposed in national policy, and national 5G material and 5G technology how are pushed How fast development to strive for the development first chance for seizing 5G technology as early as possible and application market, will be that various countries' high frequency material must strive it Ground.

Electronic product develops to 5G again to the 10G in future soon from 4G, and data transmission throughput is increasing, the frequency used Rate is higher and higher；Electronic product and the miniature requirement of equipment make high frequency high stability flexible copper-clad plate material more and more simultaneously More uses is to the electronic apparatus such as NPC antenna transmission, car radar sensor, 5G communication, AI intelligence and internet terminal equipment Equipment.High frequency high stability flexible copper-clad plate with low dielectric property will will occupy in future electronic printed wire plate material Increasing market.

For root it was found that signal transmits under high frequency band, the loss and distortion of signal occur mainly in circuit surface, i.e., golden Belong to the position that layer is contacted with insulating layer, therefore the material for high-frequency high-speed equipment mainly solves and the insulating layer at wiring circuit contact position Dielectric constant.The structure for being generally used for low dielectric flexible copper-clad plate material at present is copper foil-low dielectric-epoxy adhesive-basement membrane Structure, this structure needs reached using a large amount of dielectric materials low transmission required for high frequency material consumption require, property It can be poor.

[utility model content]

The technical problem to be solved by the present invention is to provide a kind of heat-resist, softness is good, and dielectric constant is low 2.6-3.2 (10GHz), dielectric loss are lower than 0.006 (10GHz), can make under high frequency condition suitable for flexible circuit board A kind of low dielectric flexible copper-clad plate.

In order to solve the above technical problems, the utility model uses a kind of following technical proposals: low dielectric flexible copper-clad plate, It is characterised in that it includes having the first copper foil layer and the second copper foil layer, the low dielectric latex solution of macromolecule is coated on the first copper foil layer And formed with a thickness of 2~8 μm of the first macromolecule low dielectric layer, be coated with the low dielectric latex solution of macromolecule on the second copper foil layer and The second macromolecule low dielectric layer with a thickness of 2~8 μm is formed, is formed on the first macromolecule low dielectric layer coated with polyimide acid The first thermoset polyimide layer, the second thermosetting polyamides that polyimide acid is formed is coated on the second macromolecule low dielectric layer Imine layer, it is viscous by thermoplastic polyimide layer between first thermoset polyimide layer and the second thermosetting polyimides layer Close connection.

A kind of low dielectric flexible copper-clad plate as described above, which is characterized in that first copper foil layer and the second copper foil layer Using calendering copper or electrolysis copper material, the thickness d 1 of the first copper foil layer and the second copper foil layer meets 9 μm≤d1≤35 μm.

A kind of low dielectric flexible copper-clad plate as described above, which is characterized in that the first macromolecule low dielectric layer and the The thickness d 2 of two macromolecule low dielectric layers meets 3 μm≤d2≤5 μm.

A kind of low dielectric flexible copper-clad plate as described above, which is characterized in that first thermoset polyimide layer Meeting with the thickness d 3 of the second thermosetting polyimides layer is 8 μm≤d3≤25 μm.

A kind of low dielectric flexible copper-clad plate as described above, which is characterized in that first thermoset polyimide layer Meeting with the thickness d 3 of the thickness d 3 of the second thermosetting polyimides layer is 10 μm≤d3≤20 μm.

A kind of low dielectric flexible copper-clad plate as described above, which is characterized in that the thickness of the thermoplastic polyimide layer It spends d4 and meets 4 μm≤d4≤12 μm.

A kind of low dielectric flexible copper-clad plate as described above, which is characterized in that the thickness of the thermoplastic polyimide layer It spends d4 and meets 4 μm≤d4≤6 μm.

Compared with prior art, a kind of low dielectric flexible copper-clad plate of the utility model achieving the following effects:

The utility model is by surface-treated low dielectric filler and low dielectric high molecular polymer and a small amount of polyimides Acid is mixed to form the low dielectric latex solution of macromolecule coated on copper-clad surface, dielectric materials is concentrated in this layer of structure, only in copper Foil contact surface coats the low dielectric latex solution of macromolecule, this layer of small coating thickness is reached using a small amount of low dielectric high molecular material The loss of low transmission needed for high frequency material requires；In addition, polyimide acid is coated on the low dielectric latex solution of macromolecule, two layers Synchronous progress ring-closure reaction reduces macromolecule low dielectric layer and the interface of thermoset polyimide layer separates, and is having copper-clad plate While low-dielectric energy, mechanical property, electric property etc. have also been taken into account.

[Detailed description of the invention]

Specific embodiment of the present utility model is described in further detail with reference to the accompanying drawing, in which:

Fig. 1 is the schematic diagram of the low dielectric flexible copper-clad plate of the utility model.

[specific embodiment]

The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model Clearly and completely describe.

As shown in Figure 1, a kind of low dielectric flexible copper-clad plate, includes the first copper foil layer 1 and the second copper foil layer 2, the first bronze medal The low dielectric latex solution of macromolecule is coated in layers of foil 1 and forms the first macromolecule low dielectric layer 3 with a thickness of 2~8 μm, the second bronze medal The low dielectric latex solution of macromolecule is coated in layers of foil 2 and forms the second macromolecule low dielectric layer 4 with a thickness of 2~8 μm, and first is high The first thermoset polyimide layer 5 that polyimide acid is formed, the second macromolecule low dielectric layer are coated on molecule low dielectric layer 3 The second thermosetting polyimides layer 6 that polyimide acid is formed, first thermoset polyimide layer 5 and second are coated on 4 Pass through the bonding connection of thermoplastic polyimide layer 7 between thermosetting polyimides layer 6.The low dielectric flexible of the utility model covers copper Plate is heat-resist, and softness is good, dielectric constant 2.6-3.2 (10GHz), and dielectric loss is lower than 0.006 (10GHz), can be in height It is suitable for flexible circuit board under the conditions of frequency to use.Only in the low dielectric latex solution of copper foil contact surface coating macromolecule, which is applied Cover that thickness is small, the loss of low transmission needed for reaching high frequency material using a small amount of low dielectric high molecular material requires.

The molecular weight of macromolecule low dielectric layer is between 1 ten thousand to 10 ten thousand.

As shown in Figure 1, in the present embodiment, first copper foil layer 1 and the second copper foil layer 2 are using calendering copper or electrolysis Copper material (Rz value is less than 1.5um), the thickness d 1 of the first copper foil layer 1 and the second copper foil layer 2 meet 9 μm≤d1≤35 μm.

In the present embodiment, the optimum thickness d2 of the first macromolecule low dielectric layer 3 and the second macromolecule low dielectric layer 4 Meet 3 μm≤d2≤5 μm.Heat-resist, softness is good.

As shown in Figure 1, in the present embodiment, first thermoset polyimide layer 5 and the second thermosetting polyimides It is 8 μm≤d3≤25 μm that the thickness d 3 of layer 6, which meets,.The coating polyimide acid on macromolecule low dielectric layer, the layer pass through high temperature Solidification or infrared ray cured rear formation thermoset polyimide layer.

As shown in Figure 1, in the present embodiment, first thermoset polyimide layer 5 and the second thermosetting polyimides It is 10 μm≤d3≤20 μm that the thickness d 3 of the thickness d 3 of layer 6, which meets,.

As shown in Figure 1, in the present embodiment, the thickness d 4 of the thermoplastic polyimide layer 7 meet 4 μm≤d4≤ 12μm.On thermoset polyimide layer coat thermoplastic polyimide acid, the layer by hot setting or it is infrared ray cured after Thermoplastic polyimide layer is formed, melting can be pressed at high temperature, the layer is with a thickness of 4-12 μm.

As shown in Figure 1, in the present embodiment, the optimum thickness d4 of the thermoplastic polyimide layer 7 meets 4 μm≤d4 ≤6μm。

In the present embodiment, the first macromolecule low dielectric layer 3 and the second macromolecule low dielectric layer 4 are filled out by low dielectric Material, low dielectric high molecular polymer and polyimide acid mix；Low dielectric filler is polyphenylene oxide or polytetrafluoroethylene (PTFE).

In use, low dielectric flexible copper-clad plate can also using the copper foil layer of successively lamination, macromolecule low dielectric layer and Thermosetting polyimides layer；

Copper foil layer is calendering copper or cathode copper (Rz is less than 1.5um), with a thickness of 9-35 μm.Optimum thickness is 9-18 μm.

Macromolecule low dielectric layer therein is low dielectric filler and the low dielectric polymer of macromolecule and a small amount of polyimide acid It is mixed to form low dielectric macromolecule latex glue, which is 2-8 μm, and optimum thickness is 3-5 μm.

Thermosetting polyimides layer therein, the coating polyimide acid on the low dielectric latex liquid layer of macromolecule, by high temperature Solidification or it is infrared ray cured after form macromolecule low dielectric layer and thermoset polyimide layer, thermoset polyimide layer with a thickness of 6-25 μm, 7-20 μm of optimum thickness.

Thermoplastic polyimide layer therein coats thermoplastic polyimide acid, the layer on thermoset polyimide layer By hot setting or it is infrared ray cured after form thermoplastic polyimide layer, play the role of connection bonding, at high temperature may be used Pressing melting, the layer is with a thickness of 4-12 μm, optimum thickness 4-6um.

Claims

1. a kind of low dielectric flexible copper-clad plate, which is characterized in that it include the first copper foil layer (1) and the second copper foil layer (2), first The low dielectric latex solution of macromolecule is coated on copper foil layer (1) and forms the first macromolecule low dielectric layer (3) with a thickness of 2~8 μm, The low dielectric latex solution of macromolecule is coated on second copper foil layer (2) and forms the second macromolecule low dielectric layer with a thickness of 2~8 μm (4), the first thermoset polyimide layer (5) formed on the first macromolecule low dielectric layer (3) coated with polyimide acid, second The second thermosetting polyimides layer (6) that polyimide acid is formed, first thermosetting property are coated on macromolecule low dielectric layer (4) Pass through thermoplastic polyimide layer (7) bonding connection between polyimide layer (5) and the second thermosetting polyimides layer (6).

2. a kind of low dielectric flexible copper-clad plate according to claim 1, which is characterized in that first copper foil layer (1) and Second copper foil layer (2) is using calendering copper or electrolysis copper material, the satisfaction of thickness d 19 of the first copper foil layer (1) and the second copper foil layer (2) μm≤d1≤35μm。

3. a kind of low dielectric flexible copper-clad plate according to claim 1, which is characterized in that the low dielectric of first macromolecule The thickness d 2 of layer (3) and the second macromolecule low dielectric layer (4) meets 3 μm≤d2≤5 μm.

4. a kind of low dielectric flexible copper-clad plate according to claim 1, which is characterized in that the first thermosetting property polyamides It is 8 μm≤d3≤25 μm that the thickness d 3 of imine layer (5) and the second thermosetting polyimides layer (6), which meets,.

5. a kind of low dielectric flexible copper-clad plate according to claim 4, which is characterized in that the first thermosetting property polyamides It is 10 μm≤d3≤20 μm that the thickness d 3 of the thickness d 3 of imine layer (5) and the second thermosetting polyimides layer (6), which meets,.

6. a kind of low dielectric flexible copper-clad plate according to claim 1, which is characterized in that the thermoplastic polyimide The thickness d 4 of layer (7) meets 4 μm≤d4≤12 μm.

7. a kind of low dielectric flexible copper-clad plate according to claim 6, which is characterized in that the thermoplastic polyimide The thickness d 4 of layer (7) meets 4 μm≤d4≤6 μm.