CN209150093U - A kind of water cooling laser driving power source - Google Patents

A kind of water cooling laser driving power source Download PDF

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Publication number
CN209150093U
CN209150093U CN201821466139.5U CN201821466139U CN209150093U CN 209150093 U CN209150093 U CN 209150093U CN 201821466139 U CN201821466139 U CN 201821466139U CN 209150093 U CN209150093 U CN 209150093U
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Prior art keywords
water cooling
semiconductor
oxide
metal
control circuit
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CN201821466139.5U
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Inventor
钟绪浪
朱宝华
邓文
罗俊
罗又辉
王瑾
高云峰
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Han s Laser Technology Industry Group Co Ltd
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Han s Laser Technology Industry Group Co Ltd
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Abstract

The utility model relates to technical field of laser welding, disclose a kind of water cooling laser driving power source, including the power drives plate and water cooling aluminium sheet being oppositely arranged;Metal-oxide-semiconductor is provided on the power drives plate, the metal-oxide-semiconductor and the water cooling aluminium sheet are fitted closely and be fixed on the water cooling aluminium sheet;The groove for being passed through cooling water is machined on the water cooling aluminium sheet.The power supply device of the utility model, it is ensured that the temperature of entire drive electric power unit is stablized, but also its stable working performance, and then guarantee that the reliability of laser works goes out light and stablizes.

Description

A kind of water cooling laser driving power source
Technical field
The utility model relates to technical field of laser welding, more specifically, in particular to a kind of water cooling Laser Driven electricity Source device.
Background technique
Laser welding is a kind of emerging welding procedure, its relatively various maximum advantage of traditional welding is exactly welding energy Density is high, heated effluent field is small, deformation is small and weld seam is exquisite.Laser welding technology also has molten bath clean-up effect, can pure weldering Material is connect, it is to the welding of of the same race or different materials particularly advantageous, suitable for identical between different metal material, plastic or other material Welding.
High-power semiconductor laser is that LD (laser module) provides power supply by accurate power drives, due to driving power Using the control program of linear constant current, the heat of generation is big, and the position for mainly generating heat is to adjust stream metal-oxide-semiconductor, metal-oxide-semiconductor temperature It is excessively high to will lead to metal-oxide-semiconductor characteristic variations, lead to final output current distortion, energy conversion efficiency is made to be lower, directly affects sharp Light device goes out light, it is therefore desirable to cool down to metal-oxide-semiconductor.
Currently used radiating mode have it is air-cooled, two kinds of water cooling, but all there is disadvantage.It is air-cooled mainly cold using fan But, the cooling effect of this type of cooling is bad, and dust-proof effect is poor, influences machine service life.Water cooling method by Ambient temperature effect is big, and in the lower situation of temperature, machine startup is slow and cooling water may condense, cannot so as to cause machine It works normally, influences working efficiency, and water-cooling power consumption is also big.
Utility model content
The purpose of this utility model is that being directed to technical problem of the existing technology, a kind of water cooling Laser Driven electricity is provided Source device, it is ensured that the temperature of entire drive electric power unit is stablized, but also its stable working performance, and then guarantee laser Light is stablized out.
In order to solve posed problems above, the technical solution adopted in the utility model are as follows:
A kind of water cooling laser driving power source, including the power drives plate and water cooling aluminium sheet being oppositely arranged;The power supply Metal-oxide-semiconductor is provided in driving plate, the metal-oxide-semiconductor and the water cooling aluminium sheet are fitted closely and be fixed on the water cooling aluminium sheet;Institute State the groove being machined on water cooling aluminium sheet for being passed through cooling water.
Further, the distribution of groove is consistent with the distribution of the metal-oxide-semiconductor on the water cooling aluminium sheet.
Further, pitch-dark heat-sink shell is coated on the water cooling aluminium sheet and in the plate face opposite with the metal-oxide-semiconductor.
Further, it is also coated on the water cooling aluminium sheet and between the metal-oxide-semiconductor and the pitch-dark heat-sink shell and leads Hot silicone grease.
Further, the power supply device includes metal-oxide-semiconductor Q1, metal-oxide-semiconductor Q2, enabled control circuit, current regulation control electricity Road and main control circuit;
The S foot connection switch power supply of the metal-oxide-semiconductor Q1, D foot connect the D foot of metal-oxide-semiconductor Q2, make can control described in the connection of G foot Circuit;The S foot connecting laser module of the metal-oxide-semiconductor Q2, G foot connect the current regulation control circuit;It is described to make can control Circuit and the current regulation control circuit are connect with the main control circuit respectively.
Further, the power supply device further includes sample circuit, the sample circuit respectively with the main control circuit It is connected with the laser module, the sample circuit is also connected with ground terminal.
Further, the power supply device further includes filter capacitor C1 and filter capacitor C2, and the anode of the capacitor C1 connects Between Switching Power Supply and the S foot of the metal-oxide-semiconductor Q1, the cathode of the capacitor C1 is grounded, the capacitor C2 and the capacitor C1 It is in parallel.
Compared with prior art, the utility model has the beneficial effects that:
The utility model processes groove on water cooling aluminium sheet by using water cooling aluminium sheet and power drives board group integral device And be passed through cooling water and metal-oxide-semiconductor is cooled down, the heat generated when metal-oxide-semiconductor work is taken away, to guarantee entire driving power dress The temperature set is stablized, but also its stable working performance, and then guarantee that the functional reliability of laser goes out light and stablizes, it is entire to fill The structure set is simple, function is reliably also easy to realize, high-efficient, the heat dissipation effect of Laser Driven.
In addition, the utility model is different from the control mode of traditional laser welding power supply, power supply is using linear constant current Control mode, i.e., acquire the electric current of laser module by sample circuit, and main control circuit passes through according to the circuit received Current regulation control circuit, which is realized, carries out real-time tracking and control to metal-oxide-semiconductor Q2, can be according to laser using linear constant current power supply The performance of device accomplishes that ripple is lower, and the principle of entire circuit is simple, easy to control is also easy to realize.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the utility model water cooling laser driving power source.
Fig. 2 is the structural schematic diagram of groove on water cooling aluminium sheet in the utility model.
The circuit diagram of water cooling laser driving power source in the utility model of the position Fig. 3.
Wherein, 1- power drives plate, 2- water cooling aluminium sheet, 3-MOS pipe, 4- groove, the pitch-dark heat-sink shell of 5-.
Specific embodiment
The utility model is more fully retouched below with reference to relevant drawings for the ease of understanding the utility model, It states.The preferred embodiment of the utility model is given in attached drawing.But the utility model can come in many different forms in fact It is existing, however it is not limited to embodiment described herein.On the contrary, purpose of providing these embodiments is makes public affairs to the utility model The understanding for opening content is more thorough and comprehensive.
Unless otherwise defined, all technical and scientific terms used herein are led with the technology for belonging to the utility model The normally understood meaning of the technical staff in domain is identical.Terminology used in the description of the utility model herein only be The purpose of description specific embodiment, it is not intended that in limitation the utility model.
As shown in fig.1, the utility model provides a kind of water cooling laser driving power source, including 1 He of power drives plate Water cooling aluminium sheet 2, the two is oppositely arranged.Metal-oxide-semiconductor 3, the metal-oxide-semiconductor 3 and the water cooling aluminium sheet are provided on the power drives plate 1 2 fit closely and are fixed on the water cooling aluminium sheet 2.It is machined with groove 4 (refering to shown in Fig. 2) on the water cooling aluminium sheet 2, is used for Cooling water realization is passed through to cool down the metal-oxide-semiconductor 3.
Further, the distribution of groove 4 is consistent with the distribution of the metal-oxide-semiconductor 3 on the water cooling aluminium sheet 2, can protect in this way The heat that the metal-oxide-semiconductor 3 generates can reliably and effectively be taken away by demonstrate,proving the cooling water in the groove 4.
Further, it is coated with pitch-dark heat-sink shell 5 on the water cooling aluminium sheet 2 and in the plate face opposite with the metal-oxide-semiconductor 3, used In in the work of entire power supply device, the heat that the metal-oxide-semiconductor 3 generates can be largely transmitted on water cooling aluminium sheet 2, to make Cooling water energy effectively takes away amount of heat in groove 4, reaches preferable heat dissipation effect.
Further, it is also coated on the water cooling aluminium sheet 2 and between the metal-oxide-semiconductor 3 and the pitch-dark heat-sink shell 5 Heat-conducting silicone grease (is not shown) on figure, for increasing the water cooling aluminium sheet 2 and the thermal conductivity of the metal-oxide-semiconductor 3 between the two.
Further, as shown in fig.3, the power supply device includes metal-oxide-semiconductor Q1, metal-oxide-semiconductor Q2, enabled control circuit, electricity Flow adjusting control circuit and main control circuit.
The S foot connection switch power supply of the metal-oxide-semiconductor Q1, D foot connect the D foot of metal-oxide-semiconductor Q2, make can control described in the connection of G foot Circuit.The S foot connecting laser module of the metal-oxide-semiconductor Q2, G foot connect the current regulation control circuit.It is described to make can control Circuit and the current regulation control circuit are connect with the main control circuit respectively.
Further, the power supply device further includes sample circuit, the sample circuit respectively with the main control circuit It is connected with the laser module, the sample circuit is also connected with ground terminal.
Further, the power supply device further includes filter capacitor C1 and filter capacitor C2, and the anode of the capacitor C1 connects Between Switching Power Supply and the S foot of the metal-oxide-semiconductor Q1, the cathode of the capacitor C1 is grounded, the capacitor C2 and the capacitor C1 It is in parallel.
Among the above, front end power supply reaches metal-oxide-semiconductor Q1 after filter capacitor C1 and filter capacitor C2 filtering processing.It is logical Metal-oxide-semiconductor Q1 is crossed come setting electric current and to export the laser realized to laser module to plate by metal-oxide-semiconductor Q2 after enabling circuit Welding.It is adjustable as needed to obtain required welding energy, meet big slab wlding laser welding demand.
Meanwhile the sample circuit samples the electric current of the laser module, is fed back, and by the sample circuit Obtained electric current is sampled to export to the main control circuit.The main control circuit passes through described respectively according to the electric current received Enabled control circuit control metal-oxide-semiconductor Q1 is enabled, by the current regulation control circuit to metal-oxide-semiconductor Q2 progress real-time control, with Track guarantees the stabilization of output circuit energy.
In the utility model the structure of entire power supply device it is simple, it is easy for installation rationally, the heat dissipation effect of water cooling aluminium sheet compared with Good, circuit performance is also more stable.
Above-described embodiment is the preferable embodiment of the utility model, but the embodiments of the present invention is not by above-mentioned The limitation of embodiment, it is made under other any spiritual essence and principles without departing from the utility model to change, modify, replacing In generation, simplifies combination, should be equivalent substitute mode, is included within the protection scope of the utility model.

Claims (7)

1. a kind of water cooling laser driving power source, it is characterised in that: including the power drives plate (1) being oppositely arranged and water-cooling aluminum Plate (2);It is provided with metal-oxide-semiconductor (3) on the power drives plate (1), the metal-oxide-semiconductor (3) fits closely with the water cooling aluminium sheet (2) And it is fixed on the water cooling aluminium sheet (2);The groove (4) for being passed through cooling water is machined on the water cooling aluminium sheet (2).
2. water cooling laser driving power source according to claim 1, it is characterised in that: ditch on the water cooling aluminium sheet (2) The distribution of slot (4) is consistent with the distribution of the metal-oxide-semiconductor (3).
3. water cooling laser driving power source according to claim 1, it is characterised in that: on the water cooling aluminium sheet (2) simultaneously Pitch-dark heat-sink shell (5) are coated in opposite plate face with the metal-oxide-semiconductor (3).
4. water cooling laser driving power source according to claim 3, it is characterised in that: on the water cooling aluminium sheet (2) simultaneously Heat-conducting silicone grease is also coated between the metal-oxide-semiconductor (3) and the pitch-dark heat-sink shell (5).
5. water cooling laser driving power source according to claim 1, it is characterised in that: the power supply device includes MOS Pipe Q1, metal-oxide-semiconductor Q2, enabled control circuit, current regulation control circuit and main control circuit;
The S foot connection switch power supply of the metal-oxide-semiconductor Q1, D foot connect the D foot of metal-oxide-semiconductor Q2, and G foot connects the enabled control circuit; The S foot connecting laser module of the metal-oxide-semiconductor Q2, G foot connect the current regulation control circuit;The enabled control circuit and The current regulation control circuit is connect with the main control circuit respectively.
6. water cooling laser driving power source according to claim 5, it is characterised in that: the power supply device further includes adopting Sample circuit, the sample circuit are connect with the main control circuit and the laser module respectively, and the sample circuit also connects Ground terminal.
7. water cooling laser driving power source according to claim 6, it is characterised in that: the power supply device further includes filter Wave capacitor C1 and filter capacitor C2, the anode of the capacitor C1 connects between Switching Power Supply and the S foot of the metal-oxide-semiconductor Q1, described The cathode of capacitor C1 is grounded, and the capacitor C2 is in parallel with the capacitor C1.
CN201821466139.5U 2018-09-07 2018-09-07 A kind of water cooling laser driving power source Active CN209150093U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201821466139.5U CN209150093U (en) 2018-09-07 2018-09-07 A kind of water cooling laser driving power source

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201821466139.5U CN209150093U (en) 2018-09-07 2018-09-07 A kind of water cooling laser driving power source

Publications (1)

Publication Number Publication Date
CN209150093U true CN209150093U (en) 2019-07-23

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201821466139.5U Active CN209150093U (en) 2018-09-07 2018-09-07 A kind of water cooling laser driving power source

Country Status (1)

Country Link
CN (1) CN209150093U (en)

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