CN221228071U - Low-agglomeration aluminum nitride substrate - Google Patents
Low-agglomeration aluminum nitride substrate Download PDFInfo
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- CN221228071U CN221228071U CN202322660639.XU CN202322660639U CN221228071U CN 221228071 U CN221228071 U CN 221228071U CN 202322660639 U CN202322660639 U CN 202322660639U CN 221228071 U CN221228071 U CN 221228071U
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- layer
- heat dissipation
- aluminum nitride
- low
- nitride substrate
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- 239000000758 substrate Substances 0.000 title claims abstract description 82
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 title claims abstract description 47
- 238000005054 agglomeration Methods 0.000 title claims abstract description 14
- 230000017525 heat dissipation Effects 0.000 claims abstract description 53
- 238000004220 aggregation Methods 0.000 claims abstract description 27
- 230000003014 reinforcing effect Effects 0.000 claims abstract description 9
- 230000009286 beneficial effect Effects 0.000 abstract description 4
- 230000000704 physical effect Effects 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 238000001816 cooling Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 229910017083 AlN Inorganic materials 0.000 description 3
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 230000006978 adaptation Effects 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000002035 prolonged effect Effects 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model provides a low-agglomeration aluminum nitride substrate. The low-agglomeration aluminum nitride substrate includes: a substrate layer; the connecting layer is arranged on the substrate layer; the heat dissipation layer is arranged on the connecting layer; the circuit layer is arranged on the heat dissipation layer; the plurality of reinforcing ribs are fixedly arranged at the bottom of the substrate layer; the heat dissipation base is arranged on the substrate layer; a plurality of radiating fans which are arranged on the radiating base; and the connecting limiting mechanism is arranged on the substrate layer and the radiating base. The low-aggregation aluminum nitride substrate provided by the utility model has the advantages of effectively reducing the temperature and rapidly radiating after the temperature rises instantly, avoiding high-temperature damage and being beneficial to prolonging the service life.
Description
Technical Field
The utility model relates to the technical field of aluminum substrates, in particular to a low-agglomeration aluminum nitride substrate.
Background
The low-aggregation aluminum nitride substrate is a ceramic substrate prepared by taking aluminum nitride as a base material and adding other elements for sintering.
At present, when a low-aggregation aluminum nitride substrate is used as one of materials of a circuit board, heat is generated due to current passing when the circuit board works, if the current in the circuit is too large or the working load is too heavy, the temperature of the aluminum substrate can be instantaneously increased, and the physical properties of the aluminum substrate can be changed due to the fact that the high temperature lasts for too long, for example: coefficient of expansion, thermal conductivity, etc., which can affect the performance and lifetime of the low-aggregation aluminum nitride substrate in a circuit or device.
Accordingly, there is a need to provide a new low-agglomeration aluminum nitride substrate that solves the above-mentioned technical problems.
Disclosure of utility model
The utility model provides a low-aggregation aluminum nitride substrate, which aims to solve the technical problems that the physical properties of the low-aggregation aluminum nitride substrate are changed and the service life is reduced due to the fact that the low-aggregation aluminum nitride substrate is continuously heated in the background art.
The low-agglomeration aluminum nitride substrate provided by the utility model comprises the following components: a substrate layer; the connecting layer is arranged on the substrate layer; the heat dissipation layer is arranged on the connecting layer; the circuit layer is arranged on the heat dissipation layer; the plurality of reinforcing ribs are fixedly arranged at the bottom of the substrate layer; the heat dissipation base is arranged on the substrate layer; a plurality of radiating fans which are arranged on the radiating base; and the connecting limiting mechanism is arranged on the substrate layer and the radiating base.
Preferably, the connection limiting mechanism comprises two sliding groove plates, two sliding plate plates, a mounting block, a sliding rod, a spring, a pull ring and a limiting block, wherein the two sliding groove plates are symmetrically and fixedly arranged at the bottom of the substrate layer, the two sliding plate plates are respectively and slidably arranged on the two sliding groove plates, the bottoms of the sliding plate plates are fixedly connected with the heat dissipation base, the mounting block is fixedly arranged at the bottom of the substrate layer, the sliding rod is slidably arranged on the mounting block, the spring is sleeved on the sliding rod, the pull ring is fixedly arranged at one end of the sliding rod, the limiting block is fixedly arranged at the other end of the sliding rod, and one end of the limiting block is in clamping connection with the corresponding sliding plate.
Preferably, the top of heat dissipation base fixed mounting has temperature sensor, one side fixed mounting of heat dissipation base has the singlechip controller, singlechip controller and temperature sensor and a plurality of radiator fan looks adaptation.
Preferably, a through hole is formed in one side of the sliding groove plate, the through hole is matched with the limiting block, a limiting groove is formed in one side of the sliding groove plate, and the limiting groove is matched with the limiting block.
Preferably, a plurality of heat dissipation air channels are formed in the heat dissipation layer, a plurality of air inlet holes are formed in the connecting layer and the substrate layer, and the air inlet holes are communicated with the corresponding heat dissipation air channels.
Preferably, the heat dissipation base is provided with a plurality of mounting holes and through holes, and the plurality of mounting holes are matched with the plurality of heat dissipation fans.
Preferably, the mounting block is provided with a sliding hole, and the sliding hole is matched with the sliding rod.
Compared with the related art, the low-aggregation aluminum nitride substrate provided by the utility model has the following beneficial effects:
The utility model provides a low-agglomeration aluminum nitride substrate, which comprises the following components:
1. The novel low-aggregation aluminum nitride substrate can be formed by the arranged substrate layer, the connecting layer, the radiating layer, the circuit layer, the reinforcing ribs, the radiating base and the radiating fan, the temperature of the low-aggregation aluminum nitride substrate can be effectively reduced, the problem that the physical properties of the low-aggregation aluminum nitride substrate change due to the fact that the temperature rises instantaneously and cannot radiate heat rapidly is avoided, and the service life of the low-aggregation aluminum nitride substrate is prolonged;
2. Through the connection stop gear that sets up, but connect the installation radiating base, also can dismantle simultaneously to follow-up clearance radiator fan, but the singlechip controller cooperation temperature sensor through setting up, real-time supervision temperature variation control radiator fan opens and stops, through the radiating wind channel and the fresh air inlet that set up, can guarantee that the wind energy that radiator fan operation produced can smoothly circulate and take away heat, can improve radiating efficiency.
Drawings
FIG. 1 is a schematic diagram of a low-profile aluminum nitride substrate according to a preferred embodiment of the present utility model;
FIG. 2 is a schematic diagram of a heat dissipation base according to the present utility model;
FIG. 3 is a schematic view of the present utility model in front cross-section;
Fig. 4 is an enlarged schematic view of the portion a shown in fig. 3.
Reference numerals in the drawings: 1. a substrate layer; 2. a connection layer; 3. a heat dissipation layer; 4. a circuit layer; 5. reinforcing ribs; 6. a heat dissipation base; 7. a heat radiation fan; 8. a chute plate; 9. a slide plate; 10. a mounting block; 11. a slide bar; 12. a spring; 13. a pull ring; 14. a limiting block; 15. a temperature sensor; 16. and a singlechip controller.
Detailed Description
The utility model will be further described with reference to the drawings and embodiments.
Referring to fig. 1-4 in combination, fig. 1 is a schematic structural diagram of a preferred embodiment of a low-agglomeration aluminum nitride substrate according to the present utility model; FIG. 2 is a schematic diagram of a heat dissipation base according to the present utility model; FIG. 3 is a schematic view of the present utility model in front cross-section; fig. 4 is an enlarged schematic view of the portion a shown in fig. 3.
The low-agglomeration aluminum nitride substrate includes: a substrate layer 1; a connection layer 2, the connection layer 2 being disposed on the substrate layer 1; a heat dissipation layer 3, wherein the heat dissipation layer 3 is arranged on the connection layer 2; a circuit layer 4, the circuit layer 4 being disposed on the heat dissipation layer 3; a plurality of reinforcing ribs 5, wherein the plurality of reinforcing ribs 5 are fixedly arranged at the bottom of the substrate layer 1; a heat dissipation base 6, the heat dissipation base 6 being disposed on the substrate layer 1; a plurality of heat dissipation fans 7, wherein the plurality of heat dissipation fans 7 are arranged on the heat dissipation base 6; connect stop gear, connect stop gear setting on substrate layer 1 and heat dissipation base 6, through substrate layer 1, tie layer 2, heat dissipation layer 3, circuit layer 4, strengthening rib 5, heat dissipation base 6 and radiator fan 7 that set up, can constitute novel low aluminium nitride base plate that gathers, this low aluminium nitride base plate that gathers can effectively reduce temperature, avoids rising in the twinkling of an eye because the temperature can't dispel the heat fast, leads to low aluminium nitride base plate's physical property to change, is favorable to extending its life.
The connecting limiting mechanism comprises two sliding groove plates 8, two sliding bar plates 9, a mounting block 10, a sliding rod 11, a spring 12, a pull ring 13 and a limiting block 14, wherein the two sliding groove plates 8 are symmetrically and fixedly installed at the bottom of the substrate layer 1, the two sliding bar plates 9 are respectively and slidably installed on the two sliding groove plates 8, the bottoms of the two sliding bar plates 9 are fixedly connected with the heat dissipation base 6, the mounting block 10 is fixedly installed at the bottom of the substrate layer 1, the sliding rod 11 is slidably installed on the mounting block 10, the spring 12 is sleeved on the sliding rod 11, the pull ring 13 is fixedly installed at one end of the sliding rod 11, the limiting block 14 is fixedly installed at the other end of the sliding rod 11, one end of the limiting block 14 is clamped with the corresponding sliding bar plate 9, and the heat dissipation base 6 can be installed in a connecting mode through the connecting limiting mechanism, and meanwhile the heat dissipation fan 7 can be detached for cleaning later.
The top fixed mounting of heat dissipation base 6 has temperature sensor 15, one side fixed mounting of heat dissipation base 6 has singlechip controller 16, singlechip controller 16 and temperature sensor 15 and a plurality of radiator fan 7 looks adaptation, but the singlechip controller 16 cooperation temperature sensor 15 through setting up can real-time supervision temperature variation control radiator fan 7 start-stop.
The utility model discloses a sliding chute is characterized in that a through hole is formed in one side of the sliding chute plate 8, the through hole is matched with a limiting block 14, a limiting groove is formed in one side of the sliding chute plate 9, and the limiting groove is matched with the limiting block 14.
A plurality of heat dissipation wind channels have been seted up on the heat dissipation layer 3, a plurality of fresh air inlets have all been seted up on tie layer 2 and the substrate layer 1, and is a plurality of the fresh air inlet is linked together with a plurality of that correspond the heat dissipation wind channel, through the heat dissipation wind channel and the fresh air inlet that set up, can guarantee that the wind energy that radiator fan 7 operation produced can smoothly circulate and take away the heat, can improve radiating efficiency.
The heat dissipation base 6 is provided with a plurality of mounting holes and through holes, and a plurality of mounting holes are matched with a plurality of heat dissipation fans 7.
The mounting block 10 is provided with a sliding hole, and the sliding hole is matched with the sliding rod 11.
It should be noted that, in the present utility model, the circuit, the electronic component and the module are all related to the prior art, and can be completely implemented by those skilled in the art, and needless to say, the protection of the present utility model does not relate to improvement of software and a method, the main body portion of the substrate layer 1 is a flat plate, and is formed by pressing aluminum nitride crystals, the circuit layer 4 is made of a high-conductivity material, such as copper, silver, etc., the heat dissipation layer 3 is made of a metal material, such as copper, aluminum, etc., the connection layer 2 is made of a metal material, such as copper, silver, etc., the reinforcing ribs 5 are made of high-strength, high-heat-conductivity aluminum nitride or aluminum oxide agglomerated aluminum nitride fibers, so as to improve the mechanical strength and toughness of the low-heat-conductivity aluminum nitride substrate.
The working principle of the low-aggregation aluminum nitride substrate provided by the utility model is as follows:
When the low-aggregation aluminum nitride substrate is used as one of materials of a circuit board, the temperature sensor 15 can monitor the temperature of the low-aggregation aluminum nitride substrate in real time when the circuit board works, temperature data of a detection side can be transmitted to the singlechip controller 16, if the current in a circuit is too large or the working load is too heavy, the temperature of the aluminum substrate is increased, when the temperature is higher than a set value of the singlechip controller 16, the singlechip controller 16 sends out a command to start a plurality of cooling fans 7 connected in series with a circuit, the running cooling fans 7 generate strong wind, the strong wind can enter a cooling air channel along an air inlet, and then the strong wind is discharged from the cooling air channel to take away heat, so that the temperature of the low-aggregation aluminum nitride substrate can be effectively reduced, the situation that the temperature is increased instantly and cannot be rapidly cooled is avoided, the physical property of the low-aggregation aluminum nitride substrate is changed, and the service life of the low-aggregation aluminum nitride substrate is prolonged.
Compared with the related art, the low-aggregation aluminum nitride substrate provided by the utility model has the following beneficial effects:
The utility model provides a low-aggregation aluminum nitride substrate, which can form a novel low-aggregation aluminum nitride substrate through a substrate layer 1, a connecting layer 2, a radiating layer 3, a circuit layer 4, a reinforcing rib 5, a radiating base 6 and a radiating fan 7, wherein the low-aggregation aluminum nitride substrate can effectively reduce the temperature, avoid the change of the physical property of the low-aggregation aluminum nitride substrate caused by the fact that the temperature cannot be quickly radiated due to the instant rise, is beneficial to prolonging the service life of the low-aggregation aluminum nitride substrate, can be connected and installed with the radiating base 6 through a connecting limiting mechanism, can be detached at the same time, is convenient for cleaning the radiating fan 7 later, can monitor the temperature change in real time to control the start and stop of the radiating fan 7 through a single chip microcomputer controller 16 matched with a temperature sensor 15, can ensure that wind energy generated by the running of the radiating fan 7 can smoothly circulate and take away heat through a radiating air duct and an air inlet hole, and can improve the radiating efficiency.
The device structure and the drawings of the present utility model mainly describe the principle of the present utility model, and in terms of the technology of the design principle, the arrangement of the power mechanism, the power supply system, the control system, etc. of the device is not completely described, but the specific details of the power mechanism, the power supply system, and the control system thereof can be clearly known on the premise that those skilled in the art understand the principle of the present utility model.
The foregoing description is only illustrative of the present utility model and is not intended to limit the scope of the utility model, and all equivalent structures or equivalent processes or direct or indirect application in other related technical fields are included in the scope of the present utility model.
Claims (7)
1. A low-agglomeration aluminum nitride substrate, comprising:
A substrate layer;
the connecting layer is arranged on the substrate layer;
the heat dissipation layer is arranged on the connecting layer;
the circuit layer is arranged on the heat dissipation layer;
The plurality of reinforcing ribs are fixedly arranged at the bottom of the substrate layer;
The heat dissipation base is arranged on the substrate layer;
a plurality of radiating fans which are arranged on the radiating base;
And the connecting limiting mechanism is arranged on the substrate layer and the radiating base.
2. The low-aggregation aluminum nitride substrate according to claim 1, wherein the connection limiting mechanism comprises two runner plates, a mounting block, a sliding rod, a spring, a pull ring and a limiting block, wherein the two runner plates are symmetrically and fixedly mounted at the bottom of the substrate layer, the two runner plates are respectively and slidably mounted on the two runner plates, the bottoms of the two runner plates are fixedly connected with the heat dissipation base, the mounting block is fixedly mounted at the bottom of the substrate layer, the sliding rod is slidably mounted on the mounting block, the spring is sleeved on the sliding rod, the pull ring is fixedly mounted at one end of the sliding rod, the limiting block is fixedly mounted at the other end of the sliding rod, and one end of the limiting block is in clamping connection with the corresponding runner plate.
3. The low-aggregation aluminum nitride substrate according to claim 2, wherein a temperature sensor is fixedly installed at the top of the heat dissipation base, a single-chip microcomputer controller is fixedly installed at one side of the heat dissipation base, and the single-chip microcomputer controller is matched with the temperature sensor and the plurality of heat dissipation fans.
4. The low-agglomeration aluminum nitride substrate according to claim 2, wherein a through hole is formed in one side of the runner plate, the through hole is matched with the limiting block, a limiting groove is formed in one side of the runner plate, and the limiting groove is matched with the limiting block.
5. The low-agglomeration aluminum nitride substrate according to claim 1, wherein the heat dissipation layer is provided with a plurality of heat dissipation air channels, the connection layer and the substrate layer are provided with a plurality of air inlet holes, and the air inlet holes are communicated with the corresponding plurality of heat dissipation air channels.
6. The low-aggregation aluminum nitride substrate according to claim 1, wherein the heat dissipation base is provided with a plurality of mounting holes and through holes, and a plurality of the mounting holes are matched with a plurality of the heat dissipation fans.
7. The low-agglomeration aluminum nitride substrate according to claim 2, wherein the mounting block is provided with a slide hole, and the slide hole is matched with the slide rod.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322660639.XU CN221228071U (en) | 2023-10-06 | 2023-10-06 | Low-agglomeration aluminum nitride substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322660639.XU CN221228071U (en) | 2023-10-06 | 2023-10-06 | Low-agglomeration aluminum nitride substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221228071U true CN221228071U (en) | 2024-06-25 |
Family
ID=91574847
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322660639.XU Active CN221228071U (en) | 2023-10-06 | 2023-10-06 | Low-agglomeration aluminum nitride substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN221228071U (en) |
-
2023
- 2023-10-06 CN CN202322660639.XU patent/CN221228071U/en active Active
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