CN212470175U - Inner cavity cooling device of laser processing head machine body - Google Patents
Inner cavity cooling device of laser processing head machine body Download PDFInfo
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- CN212470175U CN212470175U CN202021026122.5U CN202021026122U CN212470175U CN 212470175 U CN212470175 U CN 212470175U CN 202021026122 U CN202021026122 U CN 202021026122U CN 212470175 U CN212470175 U CN 212470175U
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Abstract
The utility model relates to a laser beam machining head organism inner chamber cooling device, including semiconductor refrigeration piece, vacuum force pump, gas filter, first heat exchange block, second heat exchange block and connecting tube, the semiconductor refrigeration piece connect first heat exchange block and second heat exchange block respectively, gas filter's import be connected through the export of pipeline with the vacuum force pump, the import of vacuum pump be connected with the inner chamber of laser beam machining head organism. Adopted the utility model discloses a laser beam machining head housing inner chamber cooling device does the modification with the water-cooling module that current laser beam machining head is simple, will cool off laser beam machining head housing temperature originally and change into cooling laser beam machining head housing inner chamber air to increase gas exchange and filter equipment, do not have any influence to laser beam machining head basic function. Through reducing the heat exchange link, improve the radiating efficiency, the effectual normal work that has protected laser beam machining head optical lens. The device has simple design and simple installation mode.
Description
Technical Field
The utility model relates to a laser beam machining technical field especially relates to laser beam machining head optical lens piece cooling device technical field, specifically indicates a laser beam machining head inner chamber cooling device.
Background
The laser processing head is generally installed on a laser machine tool or various mechanical hands, belongs to a tail end execution mechanism, is used for bearing laser output by a laser, and is mainly used for cutting or welding processing. At present, most large and medium power laser processing heads in the market adopt a machine body for cooling the laser processing heads to reduce the influence of heat generated during working on lenses, and the method is reliable, but has certain defects. When the laser processing head works, heat generated by the lens is firstly diffused into air in an inner cavity of the laser processing head, then the air in the inner cavity is conducted to the machine body, the heat is taken away by cooling water, and the heat exchange efficiency is low through two-way transmission. Therefore, the phenomenon that the optical lens of the laser processing head is damaged due to high temperature can occur due to untimely heat dissipation.
SUMMERY OF THE UTILITY MODEL
The utility model aims at overcoming the shortcomings of the prior art and providing a laser processing head inner cavity cooling device which has simple structure, simple installation mode and wide application range.
The utility model discloses an among the technical scheme of laser beam machining head machine body cavity cooling device, each functional module and the module unit that wherein include all can correspond to specific hardware circuit in the integrated circuit structure, consequently only relate to the improvement of specific hardware circuit, and the hardware part is not only the carrier that carries out control software or computer program, consequently solves corresponding technical problem and obtains corresponding technological effect and also does not relate to the application of any control software or computer program, that is to say, the utility model discloses only utilize the improvement in the hardware circuit structure that these modules and units relate to can solve the technical problem that will solve to obtain corresponding technological effect, and need not assist and can realize corresponding function with specific control software or computer program.
In order to achieve the above object, the utility model discloses a laser beam machining head machine body inner chamber cooling device as follows:
the cooling device for the inner cavity of the laser processing head machine body is mainly characterized by comprising a semiconductor refrigerating sheet, a vacuum pressure pump, a gas filter, a first heat exchange block, a second heat exchange block and a connecting pipeline, wherein the semiconductor refrigerating sheet is respectively connected with the first heat exchange block and the second heat exchange block, the inlet of the gas filter is connected with the outlet of the vacuum pressure pump through a pipeline to filter impurities and water vapor in the gas, the inlet of the vacuum pump is connected with the inner cavity of the laser processing head machine body, the first heat exchange block is arranged on the side surface of the laser processing head machine body, the outlet of the first heat exchange block is connected with the inner cavity of the machine body, the inlet of the first heat exchange block is connected with the outlet of the gas filter through a pipeline, the inlet of the second heat exchange block is connected with the outlet of cooling water through a pipeline, the outlet of the second heat exchange block is connected with the circulation loop of the cooling, the temperature of the hot surface unit of the semiconductor refrigeration sheet (1) is taken away, the temperature of the cold surface unit is reduced, the temperature of gas in the first heat exchange block (4) is reduced, and the temperature in the cavity is further reduced.
Preferably, the semiconductor refrigeration piece comprises a cold surface unit and a hot surface unit, the cold surface unit is connected with the gas passage of the first heat exchange block, and the hot surface unit is connected with the circulating water passage of the second heat exchange block.
Preferably, the first heat exchange block comprises an inlet and an outlet, one end of the inlet is connected with the outlet of the gas filter, and the inlet is connected with the inner cavity of the laser processing head machine body.
Preferably, the second heat exchange block comprises an inlet and an outlet, the inlet is connected with the water outlet end of the cooling water, and the outlet is connected with the cooling water circulation loop.
Preferably, the right side surface of the first heat exchange block is uniformly coated with heat-conducting silicone grease, the cold surface unit of the semiconductor refrigeration piece is attached to the first heat exchange block, the hot surface unit of the semiconductor refrigeration piece is uniformly coated with heat-conducting silicone grease, and the second heat exchange block is attached to the semiconductor refrigeration piece.
Preferably, the semiconductor refrigeration piece and the vacuum pressure pump are both connected with corresponding working power supplies.
Preferably, the first heat exchange block and the second heat exchange block each include an S-shaped flow channel therein.
Adopted the utility model discloses a laser beam machining head housing inner chamber cooling device does the modification with the water-cooling module that current laser beam machining head is simple, will cool off laser beam machining head housing temperature originally and change into cooling laser beam machining head housing inner chamber air to increase gas exchange and filter equipment, do not have any influence to laser beam machining head basic function. Through reducing the heat exchange link, improve the radiating efficiency, the effectual normal work that has protected laser beam machining head optical lens. The device design is simple, and the mounting means is simple, has compromise the life of laser beam machining head again when the function.
Drawings
Fig. 1 is a schematic view of the inner cavity cooling device of the laser processing head machine body of the present invention.
Reference numerals:
1 semiconductor refrigerating sheet
2 vacuum pressure pump (external)
3 gas filter (external)
4 first heat exchange block
5 second heat exchange block
6 connecting pipeline
7 focusing mirror group (Heat source)
8 collimating lens group (Heat source)
9 inner cavity
10 Metal housing
11 cooling water circulation loop
Detailed Description
In order to more clearly describe the technical content of the present invention, the following further description is given with reference to specific embodiments.
The utility model discloses a this laser beam machining head organism inner chamber cooling device, including semiconductor refrigeration piece 1, vacuum force pump 2, gas filter 3, first heat exchange block 4, second heat exchange block 5 and connecting line 6, semiconductor refrigeration piece 1 connect first heat exchange block 4 and second heat exchange block 5 respectively, the import of gas filter 3 be connected with the export of vacuum force pump 2 through the pipeline, filter impurity and steam in the gas, the import of vacuum pump be connected with the inner chamber of laser beam machining head organism, first heat exchange block 4 install in the side of laser beam machining head organism, the export of first heat exchange block 4 connect the organism inner chamber, the import is through the export of pipe connection gas filter 3, the import of second heat exchange block 5 be connected with the cooling water export through the pipeline, the outlet of the second heat exchange block 5 is connected with a circulating loop of cooling water through a pipeline, the temperature of the hot surface unit of the semiconductor refrigerating sheet (1) is taken away, the temperature of the cold surface unit is reduced, the temperature of gas in the first heat exchange block (4) is driven to be reduced, and the temperature in the cavity is further reduced.
As the preferred embodiment of the present invention, the semiconductor refrigeration sheet 1 comprises a cold surface unit and a hot surface unit, the cold surface unit is connected to the gas passage of the first heat exchange block 4, and the hot surface unit is connected to the circulating water passage of the second heat exchange block 5.
As a preferred embodiment of the present invention, the first heat exchange block 4 comprises an inlet and an outlet, one end of the inlet is connected to the outlet of the gas filter 3, and the inlet is connected to the inner cavity of the laser processing head.
As a preferred embodiment of the present invention, the second heat exchange block 5 comprises an inlet and an outlet, the inlet is connected to the water outlet end of the cooling water, and the outlet is connected to the cooling water circulation loop 11.
As the utility model discloses a preferred embodiment, the right flank of first heat exchange piece 4 evenly scribble heat conduction silicone grease, the cold face unit of semiconductor refrigeration piece 1 paste on first heat exchange piece 4, the hot face unit of semiconductor refrigeration piece 1 evenly scribble heat conduction silicone grease, second heat exchange piece 5 pastes on semiconductor refrigeration piece 1.
As the preferred embodiment of the present invention, the semiconductor refrigerating plate 1 and the vacuum pressure pump 2 are both connected to a corresponding working power supply.
In a preferred embodiment of the present invention, the first heat exchange block 4 and the second heat exchange block 5 both include S-shaped flow channels inside.
The utility model discloses an among the concrete embodiment, the utility model relates to a laser beam machining head engine body cavity cooling device. The design comprises a semiconductor refrigeration piece 1, a vacuum pressure pump 2, a gas filter 3, a first heat exchange block 4, a second heat exchange block 5 and a connecting pipeline 6.
The semiconductor refrigeration piece 1 is connected with the heat exchange block (the inside is provided with an S-shaped flow passage to increase the contact area) up and down respectively, and the semiconductor refrigeration piece 1 is provided with a cold surface and a hot surface. The first heat exchange block 4 connected with the cold surface is used as a gas passage, and the semiconductor refrigerating sheet 1 cools the ventilated first heat exchange block 4; the second heat exchange block 5 connected with the hot surface is used as a passage of circulating water, and the second heat exchange block 5 through which the water flows takes away heat generated by the work of the semiconductor refrigerating sheet 1.
The first heat exchange block 4 has an inlet connected to the outlet of the gas filter 3 and an outlet connected to the interior of the laser machining head.
The inlet of the gas filter 3 is connected with the outlet of the vacuum pump, and the inlet of the vacuum pump is connected with the inner cavity of the laser processing head body.
The second heat exchange block 5 also has an inlet and an outlet, the inlet is connected with the water outlet end of the cooling water, and the outlet is connected with the cooling water loop.
The laser processing head laser can take place a series of optical changes through the lens in the course of the work, and optical lens self also can produce partly heat simultaneously, if the lens is overheated, can cause its surperficial optical coating to change, influences the lens life-span, can cause the lens to damage even to influence the normal work of laser processing head. This design is through leading out the cooling back with laser beam machining head inner chamber gas, and it is leading-in with clean cooling gas again, forms cold and hot gas circulation exchange, has reduced the temperature of laser beam machining head inner chamber, takes away the heat that produces in the lens work to indirectly realized cooling the lens, solved the heat dissipation problem of high-power laser beam machining head optical lens.
The utility model discloses the main technical problem who solves is: the temperature of the lens during working is reduced by reducing the air temperature of the inner cavity of the laser processing head machine body, so that the influence of the lens on laser transmission due to overhigh temperature is avoided, and the normal work of the laser processing head is further influenced.
The design comprises the following steps: the device comprises a semiconductor refrigeration sheet 1, a vacuum pressure pump 2, a gas filter 3, a first heat exchange block 4, a second heat exchange block 5 and a connecting pipeline 6.
The first heat exchange block 4 is arranged on the side surface of a laser processing head machine body, the outlet of the first heat exchange block is connected with the inner cavity of the machine body, the inlet of the first heat exchange block is connected with the outlet of a gas filter 3 through a pipeline, the inlet of the gas filter 3 is connected with the outlet of a vacuum pump through a pipeline, and the inlet of the vacuum pump is connected with the inner cavity of the machine body through a pipeline;
uniformly coating heat-conducting silicone grease on the right side surface of the first heat exchange block 4, attaching the cold surface of the semiconductor refrigeration piece 1 to the first heat exchange block 4, uniformly coating heat-conducting silicone grease on the hot surface, attaching the second heat exchange block 5 to the semiconductor refrigeration piece 1, connecting the inlet of the second heat exchange block 5 with a cooling water outlet through a pipeline, and connecting the outlet of the second heat exchange block 5 with a cooling water circulation loop through a pipeline; the semiconductor refrigerating plate 1 and the vacuum pump are connected with corresponding working power supplies.
The utility model relates to a solved the untimely problem of laser beam machining head lens heat dissipation, the cavity air at direct cooling lens place has reduced thermal transmission one, and the cooling effect is more high-efficient, has avoided the phenomenon that the laser beam machining head lens influences normal work often because of the heat dissipation is not too late to a great extent, and the design is simple, and the practicality is strong.
Adopted the utility model discloses a laser beam machining head housing inner chamber cooling device does the modification with the water-cooling module that current laser beam machining head is simple, will cool off laser beam machining head housing temperature originally and change into cooling laser beam machining head housing inner chamber air to increase gas exchange and filter equipment, do not have any influence to laser beam machining head basic function. Through reducing the heat exchange link, improve the radiating efficiency, the effectual normal work that has protected laser beam machining head optical lens. The device design is simple, and the mounting means is simple, has compromise the life of laser beam machining head again when the function.
In this specification, the invention has been described with reference to specific embodiments thereof. It will, however, be evident that various modifications and changes may be made thereto without departing from the broader spirit and scope of the invention. The specification and drawings are, accordingly, to be regarded in an illustrative rather than a restrictive sense.
Claims (7)
1. The utility model provides a laser beam machining head organism inner chamber cooling device, its characterized in that, the device include semiconductor refrigeration piece (1), vacuum force pump (2), gas filter (3), first heat exchange block (4), second heat exchange block (5) and connecting line (6), semiconductor refrigeration piece (1) connect first heat exchange block (4) and second heat exchange block (5) respectively, the import of gas filter (3) be connected through the export of pipeline with vacuum force pump (2), filter impurity and steam in the gas, the import of vacuum force pump (2) be connected with the inner chamber of laser beam machining head organism, first heat exchange block (4) install in the side of laser beam machining head organism, the exit linkage organism inner chamber of first heat exchange block (4), the export of import through tube coupling gas filter (3), the inlet of the second heat exchange block (5) is connected with the cooling water outlet through a pipeline, the outlet of the second heat exchange block (5) is connected with a circulating loop of cooling water through a pipeline, the temperature of the hot surface unit of the semiconductor refrigeration sheet (1) is taken away, the temperature of the cold surface unit is reduced, the temperature of gas in the first heat exchange block (4) is reduced, and the temperature in the cavity is further reduced.
2. The laser processing head body interior cooling device according to claim 1, characterized in that the semiconductor chilling plate (1) comprises a cold surface unit and a hot surface unit, the cold surface unit is connected with the gas passage of the first heat exchange block (4), and the hot surface unit is connected with the circulating water passage of the second heat exchange block (5).
3. The apparatus for cooling the interior of a laser machining head body as claimed in claim 1, characterized in that the first heat exchanger block (4) comprises an inlet and an outlet, the inlet being connected at one end to the outlet of the gas filter (3) and the inlet being connected to the interior of the laser machining head body.
4. The device for cooling the interior of a laser machining head body as claimed in claim 1, characterized in that the second heat exchanger block (5) comprises an inlet and an outlet, the inlet being connected to the outlet end of the cooling water and the outlet being connected to the cooling water circuit (11).
5. The cooling device for the inner cavity of the laser processing head machine body as claimed in claim 2, wherein the right side surface of the first heat exchange block (4) is uniformly coated with heat-conducting silicone grease, the cold surface unit of the semiconductor chilling plate (1) is attached to the first heat exchange block (4), the hot surface unit of the semiconductor chilling plate (1) is uniformly coated with heat-conducting silicone grease, and the second heat exchange block (5) is attached to the semiconductor chilling plate (1).
6. The laser processing head body cavity cooling device as claimed in claim 1, characterized in that the semiconductor chilling plate (1) and the vacuum pressure pump (2) are connected to respective operating power sources.
7. The laser processing head body cavity cooling arrangement as claimed in claim 1, characterized in that the first heat exchange block (4) and the second heat exchange block (5) each contain an S-shaped flow channel inside.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021026122.5U CN212470175U (en) | 2020-06-05 | 2020-06-05 | Inner cavity cooling device of laser processing head machine body |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021026122.5U CN212470175U (en) | 2020-06-05 | 2020-06-05 | Inner cavity cooling device of laser processing head machine body |
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| CN212470175U true CN212470175U (en) | 2021-02-05 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202021026122.5U Active CN212470175U (en) | 2020-06-05 | 2020-06-05 | Inner cavity cooling device of laser processing head machine body |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113523607A (en) * | 2021-08-04 | 2021-10-22 | 广东宏石激光技术股份有限公司 | Optical temperature control device, laser cutting head and laser processing method |
| CN116689949A (en) * | 2023-08-04 | 2023-09-05 | 济南森峰激光科技股份有限公司 | Self-adaptive focusing cutting head for laser cutting machine |
-
2020
- 2020-06-05 CN CN202021026122.5U patent/CN212470175U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113523607A (en) * | 2021-08-04 | 2021-10-22 | 广东宏石激光技术股份有限公司 | Optical temperature control device, laser cutting head and laser processing method |
| CN116689949A (en) * | 2023-08-04 | 2023-09-05 | 济南森峰激光科技股份有限公司 | Self-adaptive focusing cutting head for laser cutting machine |
| CN116689949B (en) * | 2023-08-04 | 2023-11-07 | 济南森峰激光科技股份有限公司 | Self-adaptive focusing cutting head for laser cutting machine |
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