CN209133283U - A kind of high power precise chip resistor - Google Patents
A kind of high power precise chip resistor Download PDFInfo
- Publication number
- CN209133283U CN209133283U CN201920044508.XU CN201920044508U CN209133283U CN 209133283 U CN209133283 U CN 209133283U CN 201920044508 U CN201920044508 U CN 201920044508U CN 209133283 U CN209133283 U CN 209133283U
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- CN
- China
- Prior art keywords
- thermally conductive
- chip
- main body
- heat
- support arm
- Prior art date
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- Expired - Fee Related
Links
- 238000005476 soldering Methods 0.000 claims abstract description 6
- 230000017525 heat dissipation Effects 0.000 abstract description 4
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 238000010438 heat treatment Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 230000005611 electricity Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model relates to Chip-R technical fields, specially a kind of high power precise chip resistor, including Chip-R main body, the upper and lower end face of Chip-R main body is closely fitted with the first thermally conductive sheet, the left and right end face of Chip-R main body fits closely the second thermally conductive sheet, the left end of Chip-R main body is provided with heat-conducting plate, the right end of Chip-R main body is provided with support arm, have the beneficial effect that the utility model wraps up Chip-R main body by setting thermally conductive sheet, so that the radiating efficiency of Chip-R main body increases；The utility model connects heat-conducting plate by setting heat conducting bar and heat is timely outwardly scattered and disappeared；It is extraneous that heat conducting pipe connection is set simultaneously, so that support arm inner cavity and outside air circulate, convenient for heat dissipation；The utility model realizes that soldering position far from heating main body, prevents the desoldering phenomenon as caused by high temperature by the cooperation of the connected unit of setting connection terminal and circuit board.
Description
Technical field
The utility model relates to Chip-R technical field, specially a kind of high power precise chip resistor.
Background technique
Chip-R is one of metal glaze resistor, is to mix metal powder and glass glaze powder, using silk screen
Print process is imprinted on manufactured resistor on substrate.Humidity and high temperature, temperature coefficient are small.Circuit space cost can be greatlyd save,
Refine design more.
When Chip-R is larger using power, biggish heat can be generated, and due to Chip-R and circuit board it
Between fitting, cause heat is more difficult to scatter and disappear, so as to cause even circuit board, and Chip-R and circuit can be damaged when generating heat serious
Connection between plate is that soldering is easy to cause tin to melt when temperature is higher, to fall off.
A kind of high power precise chip resistor is provided thus, it is efficient when relatively high power uses to solve Chip-R
Heat dissipation problem.
Utility model content
The purpose of this utility model is to provide a kind of high power precise chip resistors, to solve to mention in above-mentioned background technique
Out the problem of.
To achieve the above object, the utility model provides the following technical solutions:
The upper and lower end face of a kind of high power precise chip resistor, including Chip-R main body, the Chip-R main body is equal
It is closely fitted with the first thermally conductive sheet, the left and right end face of Chip-R main body fits closely the second thermally conductive sheet, Chip-R main body
Left end is provided with heat-conducting plate, and the right end of Chip-R main body is provided with support arm, and the front end face of first thermally conductive sheet offers
Several T shape sliding slots of linear distribution, the first thermally conductive sheet of Chip-R main body upper surface vertically connect heat conducting pipe, patch electricity
First thermally conductive sheet in resistance lower body face vertically connects lower heat conducting bar, and the lower end of the upper heat conducting pipe is mounted on inside T shape sliding slot,
The upper end of upper heat conducting pipe is fixedly welded on the lower end surface of thermally conductive transverse slat, and the left end of the heat-conducting plate is set as arc heat-conducting plate,
The right side upper and lower ends of heat-conducting plate connect the left side of support arm by lock-screw fixed vertical, on the right side of heat-conducting plate
Lower end, which is respectively perpendicular, is provided with thermally conductive transverse slat thermally conductive transverse slat under, and the right side middle position of heat-conducting plate is provided with linear vertical
Three thermally conductive connecting rods of distribution, the upper thermally conductive transverse slat thermally conductive transverse slat under are plugged in the inner cavity of support arm, and upper thermally conductive
The outer end face of transverse slat is bonded with the upper end inner wall of support arm, and the lower end surface of upper thermally conductive transverse slat vertically connects the upper end of heat conducting pipe,
The outer end face of thermally conductive transverse slat is bonded with the lower end inner wall of support arm under described, under thermally conductive transverse slat lower end surface vertically connect under it is thermally conductive
The lower end of bar, the right side middle position of the support arm extend to the right and connect vertically downward circuit board, the upper end of support arm
Face position corresponding with upper heat conducting pipe offers gas vent, and the right end of support arm is internally provided with connection terminal, the connecting pin
The lower end of son is electrically connected circuit board by connected unit, and the lower end surface of support arm is mounted on the upper surface of circuit board.
Preferably, the connecting hole there are three linear distribution, and second is arranged in the end face middle position of second thermally conductive sheet
Thermally conductive sheet connects thermally conductive connecting rod by connecting hole fixed vertical.
Preferably, the intermediate inner cavity of the upper heat conducting pipe is provided with exhaust cavity, and the upper end of the exhaust cavity is connected to row
Stomata, the lower end inner wall of exhaust cavity are provided with multiple through-holes, which is connected to the inner cavity of support arm.
Preferably, one end of the connection terminal is electrically connected Chip-R main body, and the other end of connection terminal passes through tin
Weldering is fixedly mounted in the upper surface inner cavity of connected unit, and the lower end of the connected unit is electrically connected circuit board.
Compared with prior art, the utility model has the beneficial effects that
1. the utility model wraps up Chip-R main body by setting thermally conductive sheet, so that the radiating efficiency of Chip-R main body
Increase；
2. the utility model connects heat-conducting plate by setting heat conducting bar heat is timely outwardly scattered and disappeared；It is arranged simultaneously
Heat conducting pipe connection is extraneous, so that support arm inner cavity and outside air circulate, convenient for heat dissipation；
3. the utility model realizes soldering position far from hair by the cooperation of the connected unit of setting connection terminal and circuit board
Hot main body prevents the desoldering phenomenon as caused by high temperature.
Detailed description of the invention
Fig. 1 is the end face structure cross-sectional view of the utility model；
Fig. 2 is the Chip-R main body side view of the utility model；
Fig. 3 is enlarged drawing at the A of the utility model.
In figure: 1 Chip-R main body, 2 first thermally conductive sheets, 3 second thermally conductive sheets, 4T shape sliding slot, thermally conductive under heat conducting pipe, 6 on 5
Bar, 7 support arms, 8 heat-conducting plates, 9 circuit boards, 10 connected units, 11 connection terminals, 12 thermally conductive connecting rods, 13 lock-screws, 14 exhausts
Hole, thermally conductive transverse slat under thermally conductive transverse slat, 16 connecting holes, 17 through-holes, 18 exhaust cavities, 19 on 15.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
Every other embodiment obtained, fall within the protection scope of the utility model.
It please refers to Fig.1 to Fig.3, the utility model provides a kind of technical solution:
A kind of high power precise chip resistor, including Chip-R main body 1, the upper and lower end face of Chip-R main body 1 are tight
Close to be fitted with the first thermally conductive sheet 2, the left and right end face of Chip-R main body 1 fits closely the second thermally conductive sheet 3, Chip-R main body 1
Left end be provided with heat-conducting plate 8, the right end of Chip-R main body 1 is provided with support arm 7, and the front end face of the first thermally conductive sheet 2 opens up
First thermally conductive sheet 2 of several T shape sliding slots 4 of linear distribution, 1 upper surface of Chip-R main body vertically connects upper heat conducting pipe 5,
First thermally conductive sheet 2 of 1 lower end surface of Chip-R main body vertically connects lower heat conducting bar 6, and the end face interposition of the second thermally conductive sheet 3 installs
The connecting hole 16 there are three linear distribution is set, and the second thermally conductive sheet 3 connects thermally conductive connecting rod 12 by 16 fixed vertical of connecting hole.
The lower end of upper heat conducting pipe 5 is mounted on inside T shape sliding slot 4, and the upper end of upper heat conducting pipe 5 is fixedly welded on thermally conductive transverse slat
15 lower end surface, the intermediate inner cavity of upper heat conducting pipe 5 are provided with exhaust cavity 18, and the upper end of exhaust cavity 18 is connected to gas vent 14,
The lower end inner wall of exhaust cavity 18 is provided with multiple through-holes 17, which is connected to the inner cavity of support arm 7.
The left end of heat-conducting plate 8 is set as arc heat-conducting plate, and the right side upper and lower ends of heat-conducting plate 8 are solid by lock-screw 13
The left side of fixed vertical connection support arm 7, the right side upper and lower side of heat-conducting plate 8, which is respectively perpendicular, is provided with thermally conductive transverse slat 15 under
Thermally conductive transverse slat 19, the right side middle position of heat-conducting plate 8 are provided with three thermally conductive connecting rods 12 of linear vertical distribution, upper thermally conductive cross
The thermally conductive transverse slat 19 under of plate 15 is plugged in the inner cavity of support arm 7, and the upper end of the outer end face of upper thermally conductive transverse slat 15 and support arm 7
Inner wall fitting, the lower end surface of upper thermally conductive transverse slat 15 vertically connect the upper end of heat conducting pipe 5, under thermally conductive transverse slat 19 outer end face with outside
The lower end inner wall of bracket 7 is bonded, under the lower end surface of thermally conductive transverse slat 19 vertically connect the lower end of time heat conducting bar 6.
The right side middle position of support arm 7 extends to the right and connects circuit board 9, the upper surface of support arm 7 vertically downward
Position corresponding with upper heat conducting pipe 5 offers gas vent 14, and the right end of support arm 7 is internally provided with connection terminal 11, the company
The lower end of connecting terminal 11 is electrically connected circuit board 9 by connected unit 10, and one end of connection terminal 11 is electrically connected Chip-R master
The other end of body 1, connection terminal 11 is fixedly mounted in the upper surface inner cavity of connected unit 10 by soldering, the lower end of connected unit 10
It is electrically connected circuit board 9, the lower end surface of support arm 7 is mounted on the upper surface of circuit board 9.
Working principle: the connection terminal 11 of 1 right end of Chip-R main body and the connected unit 10 of 9 upper end of circuit board are consolidated first
Determine soldering connection, then utilizes the cooperation of T shape sliding slot 4 and upper 5 lower end T-shaped boss of heat conducting pipe, heat-conducting plate 8 is plugged on support arm
In 7 inner cavity, and it is fixedly connected by lock-screw 13.
When Chip-R 1 operational heat of main body, heat is distributed by the first thermally conductive sheet 2 and the second thermally conductive sheet 3 to outer branch
In 7 inner cavity of frame and heat-conducting plate 8, using the arc heat-conducting plate of the larger area of 8 left end of heat-conducting plate, efficient radiated is realized
Journey, while using the cooperation between upper heat conducting pipe 5 and through-hole 17, so that the hot-air inside support arm 7 is by through-hole 17 and row
The transport of gas cavity 18 achievees the purpose that heat dissipation to circulate with outside air to gas vent 14.
While there has been shown and described that the embodiments of the present invention, for the ordinary skill in the art,
It is understood that these embodiments can be carried out with a variety of variations in the case where not departing from the principles of the present invention and spirit, repaired
Change, replacement and variant, the scope of the utility model is limited by the following claims and their equivalents.
Claims (4)
1. a kind of high power precise chip resistor, including Chip-R main body (1), it is characterised in that: the Chip-R main body
(1) upper and lower end face fits closely the first thermally conductive sheet (2), and the left and right end face of Chip-R main body (1) fits closely second and leads
Backing (3), the left end of Chip-R main body (1) are provided with heat-conducting plate (8), and the right end of Chip-R main body (1) is provided with outer branch
Frame (7), the front end face of first thermally conductive sheet (2) offer several T shape sliding slots (4) of linear distribution, Chip-R main body
(1) the first thermally conductive sheet (2) internal vertical of upper surface connects upper heat conducting pipe (5), and the first of Chip-R main body (1) lower end surface is led
Backing (2) internal vertical connects lower heat conducting bar (6), and the lower end of the upper heat conducting pipe (5) is mounted on T shape sliding slot (4) inside, above leads
The upper end of heat pipe (5) is fixedly welded on the lower end surface of thermally conductive transverse slat (15), and the left end of the heat-conducting plate (8) is set as arc and leads
Hot plate, left side of the upper and lower ends of heat-conducting plate (8) by lock-screw (13) fixed vertical connection support arm (7), heat-conducting plate
(8) right side upper and lower side be respectively perpendicular be provided with thermally conductive transverse slat (15) and under thermally conductive transverse slat (19), the right end of heat-conducting plate (8)
Face middle position be provided with linear vertical distribution three thermally conductive connecting rods (12), the upper thermally conductive transverse slat (15) and under thermally conductive transverse slat
(19) it is plugged in the inner cavity of support arm (7), and the outer end face of upper thermally conductive transverse slat (15) and the upper end inner wall of support arm (7) paste
It closes, the lower end surface of upper thermally conductive transverse slat (15) vertically connects the upper end of heat conducting pipe (5), the outer end face of thermally conductive transverse slat (19) under described
Be bonded with the lower end inner wall of support arm (7), under the upper surface of thermally conductive transverse slat (19) vertically connect the lower end of lower heat conducting bar (6), institute
The right side middle position for stating support arm (7) extends to the right and connects circuit board (9) vertically downward, the upper surface of support arm (7)
Position corresponding with upper heat conducting pipe (5) offers gas vent (14), and the right end of support arm (7) is internally provided with connection terminal
(11), the lower end of the connection terminal (11) is electrically connected circuit board (9) by connected unit (10), the lower end surface peace of support arm (7)
Mounted in the upper surface of circuit board (9).
2. a kind of high power precise chip resistor according to claim 1, it is characterised in that: second thermally conductive sheet (3)
End face middle position setting there are three linear distribution connecting hole (16), and the second thermally conductive sheet (3) by connecting hole (16) consolidate
It is fixed vertically to connect thermally conductive connecting rod (12).
3. a kind of high power precise chip resistor according to claim 1, it is characterised in that: the upper heat conducting pipe (5)
Intermediate inner cavity is provided with exhaust cavity (18), and the upper end of the exhaust cavity (18) is connected to gas vent (14), exhaust cavity (18)
Lower end inner wall be provided with multiple through-holes (17), the through-hole (17) be connected to support arm (7) inner cavity.
4. a kind of high power precise chip resistor according to claim 1, it is characterised in that: the connection terminal (11)
One end is electrically connected Chip-R main body (1), and the other end of connection terminal (11) is fixedly mounted on connected unit (10) by soldering
Upper surface inner cavity in, the lower end of the connected unit (10) is electrically connected circuit board (9).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920044508.XU CN209133283U (en) | 2019-01-11 | 2019-01-11 | A kind of high power precise chip resistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920044508.XU CN209133283U (en) | 2019-01-11 | 2019-01-11 | A kind of high power precise chip resistor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209133283U true CN209133283U (en) | 2019-07-19 |
Family
ID=67249922
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920044508.XU Expired - Fee Related CN209133283U (en) | 2019-01-11 | 2019-01-11 | A kind of high power precise chip resistor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209133283U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112397265A (en) * | 2020-11-09 | 2021-02-23 | 扬州永星电子有限公司 | High-power precise chip resistor |
-
2019
- 2019-01-11 CN CN201920044508.XU patent/CN209133283U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112397265A (en) * | 2020-11-09 | 2021-02-23 | 扬州永星电子有限公司 | High-power precise chip resistor |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190719 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |