CN209117813U - Grabbing device and electronic chip test equipment with the grabbing device - Google Patents

Grabbing device and electronic chip test equipment with the grabbing device Download PDF

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Publication number
CN209117813U
CN209117813U CN201821464336.3U CN201821464336U CN209117813U CN 209117813 U CN209117813 U CN 209117813U CN 201821464336 U CN201821464336 U CN 201821464336U CN 209117813 U CN209117813 U CN 209117813U
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China
Prior art keywords
sucker
electronic chip
grabbing device
inner cavity
locating slot
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CN201821464336.3U
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Chinese (zh)
Inventor
陆天辰
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Changxin Memory Technologies Inc
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Changxin Memory Technologies Inc
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Abstract

The disclosure proposes a kind of grabbing device and the electronic chip test equipment with the grabbing device, and grabbing device includes barre, sucker and extraction sector.Barre has inner cavity, and inner cavity forms lower port in barre lower end.Sucker is connected to the lower port of barre, and sucker bottom surface offers locating slot, and the shape of locating slot and electronic chip matches, and the slot bottom of locating slot offers the air inlet of vertical perforation sucker, and air inlet is connected to inner cavity, and sucker, which is adopted, to be made from an insulative material.Extraction sector is set to inner cavity, and extraction sector is configured as the air below sucker being evacuated to inner cavity by air inlet and makes to be formed negative pressure sucker below, so that electronic chip passes through negative-pressure adsorption in locating slot.

Description

Grabbing device and electronic chip test equipment with the grabbing device
Technical field
This disclosure relates to electronic chip test equipment technical field more particularly to a kind of grabbing device and have the crawl dress The electronic chip test equipment set.
Background technique
When testing currently with existing chip testing machine electronic chip, such as utilize ADVANTEST chip testing When machine tests memory grain, all it is memory grain of being taken by manpower, memory grain is then placed on test machine again Test board on.However, since memory grain size is smaller (usually 1.6cm × 0.8cm or so), it is more difficult by memory Grain is taken, also more difficult that memory grain is accurately placed in the chip particle test slot of test board.In addition, since human body has Electrostatic, it is above-mentioned directly to be taken the grasp mode of memory grain with manpower, it is easy to cause electrostatic damage to memory grain.
Furthermore in order to solve the problems, such as above-mentioned electrostatic damage, existing test is grabbed using tweezers made of insulating materials Memory grain.However, although tweezers can be realized the crawl to memory grain, but since the stress point of tweezers is smaller, crawl Memory grain is easily destroyed surface and the test board of memory grain, and more difficult is accurately placed into memory grain In grain test trough.
Summary of the invention
One main purpose of the disclosure is to overcome at least one defect of the above-mentioned prior art, provides one kind and be convenient for grabbing Take and be hardly damaged the grabbing device of electronic chip.
Another main purpose of the disclosure is to overcome at least one defect of the above-mentioned prior art, and providing one kind has The electronic chip test equipment of above-mentioned grabbing device.
To achieve the above object, the disclosure adopts the following technical scheme that
According to one aspect of the disclosure, a kind of grabbing device is provided, to grab electronic chip.Wherein, the crawl Device includes barre, sucker and extraction sector.The barre has inner cavity, and the inner cavity forms lower end in the barre lower end Mouthful.The sucker is connected to the lower port of the barre, and the sucker bottom surface offers locating slot, the locating slot and the electricity The shape of sub- chip matches, and the slot bottom of the locating slot offers the air inlet for penetrating through the sucker vertically, the air inlet It is connected to the inner cavity, the sucker, which is adopted, to be made from an insulative material.The extraction sector is set to the inner cavity, the extraction sector It is configured as being evacuated to the inner cavity by the air inlet and making to form negative pressure below the sucker air below the sucker, So that the electronic chip is by the negative-pressure adsorption in the locating slot.
According to one of embodiment of the disclosure, the locating slot and the shape of the electronic chip in the horizontal direction Shape is identical.
According to one of embodiment of the disclosure, the groove depth of the locating slot is the thickness of the electronic chip 0.5 times~1 times.
According to one of embodiment of the disclosure, the extraction sector includes fan, motor and battery.The wind Fan is set to the inner cavity.The motor is set to the inner cavity and transmission connection in the fan, and the motor is configured as driving The fan rotation, and control the revolving speed and rotation direction of the fan.The battery is set to the inner cavity and is electrically connected to institute Motor is stated, the battery is configured as powering to the motor.
According to one of embodiment of the disclosure, the upper surface of the electronic chip is equipped with first identifier, the suction The upper surface of disk is equipped with second identifier, relative position and first mark of the second identifier relative to the sucker upper surface The sensible relative position for the electronic chip upper surface matches.
According to one of embodiment of the disclosure, casing, described sleeve pipe and the air draught are equipped at the top of the sucker Mouth connection, described sleeve pipe are liftably sheathed in the lower port of the barre.
According to another aspect of the disclosure, a kind of electronic chip test equipment, including test board and test dress are provided It sets.The test board is for carrying electronic chip, and the test device is for testing the electronic chip.Wherein, institute State grabbing device that is that the electronic chip test equipment also disclosure proposes and illustrating in the above-described embodiment.
According to one of embodiment of the disclosure, the test board is equipped with the chip slot for accommodating the electronic chip, The slot bottom of the chip slot is identified equipped with third.Wherein, the upper surface of the electronic chip is equipped with first identifier, the sucker Upper surface is equipped with second identifier.Relative position of the second identifier relative to the sucker upper surface, the first identifier phase Match for the relative position of the electronic chip upper surface and the third identifies opposite position relative to the chip slot It sets and matches.
According to one of embodiment of the disclosure, the test board is equipped with positioning cell wall, the positioning cell wall and The test board defines a positioning outer groove jointly.Wherein, the shape of the sucker bottom of the grabbing device and the positioning The shape of outer groove is identical.
According to one of embodiment of the disclosure, the test board is equipped with positioning cell wall, the positioning cell wall and The test board defines a positioning outer groove jointly.Wherein, the sucker periphery of the grabbing device is equipped with locating fastener, described Locating fastener is configured as being clasped with the positioning cell wall.
As shown from the above technical solution, the grabbing device that the disclosure proposes and the electronic chip test with the grabbing device It the advantages of equipment and has the active effect that
The grabbing device that the disclosure proposes and the electronic chip test equipment with the grabbing device, pass through " grabbing device Including barre, sucker and extraction sector.Sucker is connected to the lower port of barre, and sucker bottom surface offers locating slot, locating slot Match with the shape of electronic chip, the slot bottom of locating slot offers the air inlet of vertical perforation sucker, and air inlet and inner cavity connect Logical, sucker, which is adopted, to be made from an insulative material.Air below sucker is evacuated to inner cavity by air inlet and made below sucker by extraction sector The design of formation negative pressure, so that electronic chip is by negative-pressure adsorption in locating slot ", can be realized using grabbing device to electronics core Piece accurately, easily grabs.Meanwhile the grabbing device that the disclosure proposes is not easy to cause electronic chip structural damage or quiet Electricity damage.
Detailed description of the invention
The detailed description of the following preferred embodiment to the disclosure, the various mesh of the disclosure are considered in conjunction with the accompanying drawings Mark, feature and advantage will become apparent.Attached drawing is only the exemplary diagram of the disclosure, is not necessarily to draw in proportion System.In the accompanying drawings, same appended drawing reference always shows same or similar component.Wherein:
Fig. 1 is a kind of structural schematic diagram of grabbing device shown according to an illustrative embodiments;
Fig. 2 is the cross-sectional view of grabbing device shown in fig. 1;
Fig. 4 is the bottom view of the sucker of grabbing device shown in fig. 1;
Fig. 3 is the top view of the sucker of grabbing device shown in fig. 1.
The reference numerals are as follows:
110. barre;
111. inner cavity;
112. lower port;
120. sucker;
121. locating slot;
1211. tilting cell wall;
122. air inlet;
123. casing;
1231. bearing;
124. second identifier;
125. locating fastener;
131. fan;
132. motor;
133. battery.
Specific embodiment
The exemplary embodiments for embodying disclosure features and advantages will describe in detail in the following description.It should be understood that this Open can have various variations in different embodiments, all not depart from the scope of the present disclosure, and it is therein illustrate and Attached drawing is inherently illustrative, rather than to limit the disclosure.
It in being described below the different illustrative embodiments to the disclosure, is carried out referring to attached drawing, the attached drawing is formed A part of this disclosure, and the exemplary knot of difference of many aspects of the achievable disclosure is wherein shown by way of example Structure, system and step.It should be understood that other certain parties of component, structure, exemplary means, system and step can be used Case, and structural and functional modification can be carried out without departing from disclosure range.Although moreover, can in this specification Using term " on ", " between ", " within " etc. the different example features and element of the disclosure are described, but these terms With in this article merely for convenient, for example, with reference to the accompanying drawings described in exemplary direction.Any content in this specification is not The specific three dimensional direction for being interpreted as Structure of need is just fallen within the scope of the disclosure.
Grabbing device embodiment
Refering to fig. 1, the structural schematic diagram of the grabbing device of disclosure proposition is representatively illustrated.In the exemplary reality It applies in mode, the grabbing device that the disclosure proposes is to be applied to crawl electronic chip, especially to be applied to crawl memory It is illustrated for the grabbing device of grain.It will be readily appreciated by those skilled in the art that for the relevant design of the disclosure is answered For the crawl of other kinds of electronic chip, and following specific embodiments is made and a variety of retrofit, add, substitute, delete It removes or other changes, these variations are still in the range of the principle of the grabbing device of disclosure proposition.
As shown in Figure 1, in the present embodiment, the grabbing device that the disclosure proposes can be used in grabbing such as memory grain Electronic chip, which mainly includes barre, sucker and extraction sector.Cooperation is represented in Fig. 2 refering to Fig. 2 to Fig. 3 Show the cross-sectional view that can embody the grabbing device of disclosure principle to property;This can be embodied by representatively illustrating in Fig. 4 The bottom view of the sucker of the grabbing device of open principle;The crawl that can embody disclosure principle is representatively illustrated in Fig. 3 The top view of the sucker of device.Below in conjunction with above-mentioned attached drawing, each chief component for the grabbing device that the disclosure is proposed Structure, connection type and functional relationship are described in detail.
As depicted in figs. 1 and 2, in the present embodiment, barre 110 is in hollow rod shape structure, with inner cavity 111, and Inner cavity 111 is formed with lower port 112 in the lower end of barre 110.Accordingly, barre 110 can manually be held for operator, or can be with It is connect with other displacement mechanisms of such as mechanical arm.
As shown in Figures 1 to 4, in the present embodiment, sucker 120 is connected to the lower port 112 of barre 110.Wherein, it inhales The bottom surface of disk 120 offers locating slot 121, and locating slot 121 and the shape of electronic chip match.The slot bottom of locating slot 121 is opened Air inlet 122 equipped with vertical perforation sucker 120, air inlet 122 is connected with the inner cavity 111 of barre 110.Furthermore sucker 120 It adopts and is made from an insulative material, since sucker 120 directly contacts during grabbing with electronic chip, to realize to electronic chip Insulation protection avoids causing electrostatic damage to electronic chip during crawl.
As shown in Fig. 2, in the present embodiment, extraction sector is arranged in the inner cavity 111 of barre 110, and air exhauster can The air of 120 lower section of sucker is evacuated in inner cavity 111 by air inlet 122, so that 120 lower section of sucker, especially locating slot 121 Position forms negative pressure, to make electronic chip by above-mentioned negative-pressure adsorption in locating slot 121.
By the above-mentioned design of the disclosure, the grabbing device that the disclosure proposes can be to electronic chip accurately, easily Crawl.Meanwhile the grabbing device that the disclosure proposes is not easy to cause electronic chip structural damage or electrostatic damage.In addition, this public affairs The grabbing device for opening proposition also has many advantages, such as that structure is simple, easily manufactured, easy to repair.
Specifically, as shown in Fig. 2, in the present embodiment, extraction sector mainly include fan 131, motor 132 and Battery 133.Wherein, fan 131 is arranged in the inner cavity 111 of barre 110.Motor 132 is arranged in the inner cavity 111 of barre 110 And be sequentially connected in fan 131, it is rotated for driving fan 131, and control the revolving speed and rotation direction of fan 131.Battery 133 It is arranged in the inner cavity 111 of barre 110 and is electrically connected to motor 132, for powering to motor 132.
It holds, the crawl of electronic chip and release can adjust air inlet 122 and extraneous (such as sucker by extraction sector 120 bottoms) between pressure difference realize.Air pressure (i.e. handle when needing to grab electronic chip, at the air inlet 122 of sucker 120 Air pressure in 110 inner cavity 111 of bar, that is, the air pressure inside of grabbing device) need to overcome the acceleration of gravity of electronic chip itself G, while needing acceleration a when electronic chip being overcome to be drawn or put down, then needed for suction F=mg+ma, wherein m is electronics The weight of chip.By taking existing memory grain as an example, above-mentioned suction can about be calculated as 0.1N.Therefore, in a standard atmospheric pressure It is pressure according to F=ps, p when lower work, s is the forced area (i.e. the area of air inlet 122) of memory grain, then is drawing When with mobile memory grain, the internal pressure of grabbing device is preferably held in 1.007 × 10 by extraction sector work5Pa~ 1.008×105Pa.When needing to put down electronic chip, extraction sector is closed, and grabbing device air pressure inside is made to restore to one to mark Quasi- atmospheric pressure realizes the placement of electronic chip.
As shown in Fig. 2, in the present embodiment, the top of sucker 120 is provided with casing 123, casing 123 and sucker 120 Air inlet 122 be connected to.Wherein, which is set in the lower port 112 of barre 110, and can be relative on barre 110 Lower lifting.For example, bearing 1231 and elevating mechanism (not shown) can be set between casing 123 and barre 110, To realize the driving gone up and down to casing 123.Accordingly, the disclosure can be gone up and down by adjusting sleeve pipe 123 with respect to barre 110, thus The pumping stroke being arranged between the extraction sector in barre 110 and sucker 120 is adjusted, and then adjusts the air inlet of sucker 120 Vacuum magnitude (i.e. suction) at 122.In other embodiments, the top of sucker 120 can also be not provided with casing 123, and incite somebody to action The lower end of barre 110 is directly connected in the upper surface of sucker 120, is not limited with present embodiment.
Further, in the present embodiment, barre 110 can be adopted preferably and is made from an insulative material.Accordingly, the disclosure The insulation performance that grabbing device can be advanced optimized further ensures that grabbing device in the process of grasping will not be to electronic chip Cause electrostatic damage.
Further, as shown in Figure 2 and Figure 4, in the present embodiment, locating slot 121 and electronic chip be in the horizontal direction On be preferably shaped to it is identical.Accordingly, the disclosure can be further ensured that grabbing device during grabbing electronic chip Accurate positionin.
Further, as shown in Figure 2 and Figure 4, in the present embodiment, the cell wall of locating slot 121 preferably uses inclined-plane Structure, to form inclination cell wall 1211.Accordingly, the disclosure can tilt cell wall using these when drawing electronic chip 1211 pairs of electronic chips provide guide function.
Further, in the present embodiment, the groove depth of locating slot 121 is preferably 0.5 times~the 1 of the thickness of electronic chip Times.Further, by taking the Commonly Used Size of existing memory grain as an example, the groove depth of locating slot 121 is using memory grain thickness On the basis of 0.5 times~1 times, the groove depth of locating slot 121 can specifically choose 1mm.
Further, as shown in figure 3, in the present embodiment, the upper surface of electronic chip is equipped with first identifier, sucker 120 upper surface is equipped with second identifier 124, relative position and first identifier of the second identifier 124 relative to 120 upper surface of sucker Relative position relative to electronic chip upper surface matches.It accordingly, can be by second when using disclosure crawl electronic chip Mark 124 is aligned in first identifier, to realize the foolproof function of crawl process.
It should be noted here that being shown in attached drawing and the grabbing device that describes in the present specification is only can use this public affairs Several examples in many kinds of grabbing devices of Kaiyuan reason.It should be clearly understood that the principle of the disclosure is only limitted to absolutely not attached drawing In show or any part of any details of grabbing device described in this specification or grabbing device.
Electronic chip test equipment embodiment
In the illustrative embodiments, the electronic chip test equipment that the disclosure proposes is to be applied to such as memory It is illustrated for the test equipment that the electronic chip of particle is tested.It will be readily appreciated by those skilled in the art that being The relevant design of the disclosure is applied in the test or other techniques of other kinds of electronic component, and to following specific realities The mode of applying makes a variety of remodeling, addition, substitution, deletion or other variations, the electronic chip that these variations are still proposed in the disclosure In the range of the principle of test equipment.
In the present embodiment, the disclosure propose electronic chip test equipment mainly include test board, test device with And grabbing device that the disclosure proposes and being described in detail in the above-described embodiment.Wherein, electronic chip test equipment can be with It is arranged on a base station, test board is for carrying electronic chip, and test device is for testing electronic chip.Accordingly, originally Open to be grabbed electronic chip to be tested using grabbing device, movement is simultaneously placed on test board, and utilizes test dress It sets and electronic chip is tested.
Further, in the present embodiment, test board is provided with the chip slot for accommodating electronic chip, the slot bottom of chip slot It is identified equipped with third.Wherein, the upper surface based on electronic chip is equipped with first identifier and the upper surface of sucker is equipped with second identifier Design basis, second identifier is relative to the relative position of sucker upper surface, first identifier relative to electronic chip upper surface Relative position matches and third mark matches relative to the relative position of chip slot.Accordingly, when grabbing electronic chip, Second identifier can be aligned in first identifier, when placing electronic chip, second identifier can be aligned in third mark, thus real Now grab the foolproof function of process and placement process.
Further, in the present embodiment, test board is equipped with positioning cell wall, and positioning cell wall defines jointly with test board One positioning outer groove, chip slot are the slot bottom that the positioning outer groove is arranged in.Wherein, the shape and positioning of the sucker bottom of grabbing device The shape of outer groove is identical.Accordingly, during electronic chip is placed into test board by grabbing device, sucker is at least partly to hold It is contained in the positioning outer groove of test board, to further promote the locating effect of placement process.
Further, positioning cell wall is equipped with based on the test board in present embodiment, and it is total with test board to position cell wall With the design for defining a positioning outer groove, as shown in Figures 1 to 4, the periphery of the sucker 120 of grabbing device is preferably provided with positioning Buckle 125.Wherein, which is used in the placement process of electronic chip be clasped with positioning cell wall, further Promote the stability of placement process.
Further, in the present embodiment, electronic chip test equipment can also include the moving machine of such as mechanical arm Structure.Wherein, mechanical arm is connected to grabbing device, for moving grabbing device.In other embodiments, other knots can also be utilized Structure substitutes mobile mechanism, such as guide rail, linear motor etc. of the mechanical arm as mobile grabbing device.In addition, also can directly hold Grabbing device is not limited with present embodiment.
It should be noted here that shown in attached drawing and the electronic chip test equipment that describes in the present specification be only can Using several examples in many kinds of electronic chip test equipments of disclosure principle.It should be clearly understood that the original of the disclosure Reason is only limitted to show in attached drawing absolutely not or any details or electronic chip of electronic chip test equipment described in this specification Any part of test equipment.
In conclusion the grabbing device that the disclosure proposes and the electronic chip test equipment with the grabbing device, pass through " grabbing device includes barre, sucker and extraction sector.Sucker is connected to the lower port of barre, and sucker bottom surface offers positioning The shape of slot, locating slot and electronic chip matches, and the slot bottom of locating slot offers the air inlet of vertical perforation sucker, air inlet It is connected to inner cavity, sucker, which is adopted, to be made from an insulative material.Air below sucker is evacuated to inner cavity by air inlet and made by extraction sector The design of formation negative pressure below sucker, so that electronic chip is by negative-pressure adsorption in locating slot ", can be realized and utilize grabbing device To accurately, easily grabbing for electronic chip.Meanwhile the grabbing device that the disclosure proposes is not easy to cause structure to electronic chip Damage or electrostatic damage.
It is described in detail above and/or illustrates the grabbing device of disclosure proposition and the electronics core with the grabbing device The illustrative embodiments of built-in testing equipment.But embodiment of the present disclosure is not limited to particular implementation as described herein, On the contrary, the component part and/or step of each embodiment can be independent with other component parts as described herein and/or step Be used separately.Each component part of one embodiment and/or each step can also be with other groups of other embodiment It is used in combination at part and/or step.Introduce it is described here and/or diagram element/component part/wait whens, term " one It is a ", " one " and " above-mentioned " etc. to indicate there are one or more elements/component part/etc..Term "comprising", " comprising " and " having " is to indicate the open meaning being included and refer to that the element/component part/in addition to listing is gone back other than waiting May be present other element/component part/etc..In addition, term " first " and " second " etc. in claims and specification It is only used as label, is not the numerical limit to its object.
Although the grabbing device that has been proposed according to different specific embodiments to the disclosure and with the electricity of the grabbing device Sub- chip testing devices are described, but it will be recognized by those skilled in the art can be in the spirit and scope of the claims The implementation of the disclosure is modified.

Claims (10)

1. a kind of grabbing device, to grab electronic chip, which is characterized in that the grabbing device includes:
Barre, has inner cavity, and the inner cavity forms lower port in the barre lower end;
Sucker, is connected to the lower port of the barre, and the sucker bottom surface offers locating slot, the locating slot and the electronics The shape of chip matches, and the slot bottom of the locating slot offers the air inlet for penetrating through the sucker vertically, the air inlet with The inner cavity connection, the sucker, which is adopted, to be made from an insulative material;And
Extraction sector, is set to the inner cavity, and the extraction sector is configured as the air below the sucker by the air draught Mouth is evacuated to the inner cavity and makes to form negative pressure below the sucker, so that the electronic chip is by the negative-pressure adsorption in described Locating slot.
2. grabbing device according to claim 1, which is characterized in that the locating slot and the electronic chip are in level side Upward shape is identical.
3. grabbing device according to claim 1, which is characterized in that the groove depth of the locating slot is the electronic chip 0.5 times of thickness~1 times.
4. grabbing device according to claim 1, which is characterized in that the extraction sector includes:
Fan is set to the inner cavity;
Motor is set to the inner cavity and transmission connection in the fan, and the motor is configured as that the fan is driven to rotate, and Control the revolving speed and rotation direction of the fan;And
Battery set on the inner cavity and is electrically connected to the motor, and the battery is configured as powering to the motor.
5. grabbing device according to claim 1, which is characterized in that the upper surface of the electronic chip is equipped with the first mark Know, the upper surface of the sucker is equipped with second identifier, the second identifier relative to the sucker upper surface relative position with The first identifier matches relative to the relative position of the electronic chip upper surface.
6. grabbing device according to claim 1, which is characterized in that be equipped with casing at the top of the sucker, described sleeve pipe with The air inlet connection, described sleeve pipe is liftably sheathed in the lower port of the barre, so that the sucker is liftably It is connected to the lower port of the barre.
7. a kind of electronic chip test equipment, including test board and test device, the test board is used to carry electronic chip, The test device is for testing the electronic chip, which is characterized in that the electronic chip test equipment further includes The described in any item grabbing devices of claim 1~6.
8. electronic chip test equipment according to claim 7, which is characterized in that the test board, which is equipped with, accommodates the electricity The slot bottom of the chip slot of sub- chip, the chip slot is identified equipped with third;Wherein, the upper surface of the electronic chip is equipped with first Mark, the upper surface of the sucker are equipped with second identifier, the second identifier relative to the sucker upper surface relative position, The first identifier matches relative to the relative position of the electronic chip upper surface and third mark is relative to described The relative position of chip slot matches.
9. electronic chip test equipment according to claim 7, which is characterized in that the test board is equipped with locating slot Wall, the positioning cell wall and the test board define a positioning outer groove jointly;Wherein, the sucker bottom of the grabbing device Shape it is identical as the positioning shape of outer groove.
10. electronic chip test equipment according to claim 7, which is characterized in that the test board is equipped with locating slot Wall, the positioning cell wall and the test board define a positioning outer groove jointly;Wherein, the sucker periphery of the grabbing device Equipped with locating fastener, the locating fastener is configured as being clasped with the positioning cell wall.
CN201821464336.3U 2018-09-07 2018-09-07 Grabbing device and electronic chip test equipment with the grabbing device Active CN209117813U (en)

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CN201821464336.3U CN209117813U (en) 2018-09-07 2018-09-07 Grabbing device and electronic chip test equipment with the grabbing device

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Application Number Priority Date Filing Date Title
CN201821464336.3U CN209117813U (en) 2018-09-07 2018-09-07 Grabbing device and electronic chip test equipment with the grabbing device

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CN209117813U true CN209117813U (en) 2019-07-16

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109116218A (en) * 2018-09-07 2019-01-01 长鑫存储技术有限公司 Grabbing device and electronic chip test equipment with the grabbing device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109116218A (en) * 2018-09-07 2019-01-01 长鑫存储技术有限公司 Grabbing device and electronic chip test equipment with the grabbing device

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