CN205564713U - LED chip metal coating quality detection device - Google Patents
LED chip metal coating quality detection device Download PDFInfo
- Publication number
- CN205564713U CN205564713U CN201620393660.5U CN201620393660U CN205564713U CN 205564713 U CN205564713 U CN 205564713U CN 201620393660 U CN201620393660 U CN 201620393660U CN 205564713 U CN205564713 U CN 205564713U
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- Prior art keywords
- led chip
- hole
- aperture
- piston
- adsorption hole
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Abstract
The utility model provides a LED chip metal coating quality detection device, include: the air slide, be equipped with air pipe joint on the air slide, the vacuum adsorption platform, the vacuum adsorption platform set up in on the air slide so that form the air flue in the air slide, the vacuum adsorption platform includes the operation panel, takes the bearing plate of gas pocket, piston, it adsorbs the hole to establish the echelonment on the operation panel, big hole mouth that the echelonment adsorbs the hole communicates with each other with the atmosphere, the path drill way with the air flue communicates with each other, the bearing plate of taking the gas pocket set up in the echelonment adsorbs the big hole mouth department in hole, the piston is movably set up in take under the bearing plate of gas pocket, the end area of piston is greater than the echelonment adsorbs the path drill way in hole. Can once only test the viscous force of a plurality of wafers, convenient and fast through this adsorption equipment.
Description
Technical field
The utility model relates to vacuum absorption device technical field, specifically a kind of LED chip coat of metal matter
Amount detecting device.
Background technology
In LED production technology, metal evaporation technique is that metal electrode forms a key technology, specifically gold
Belong to and deposit to semiconductor wafer surface, then through high temperature alloy, make between metal-semiconductor, to form good ohm
Contact, reaches the photo electric requirement of design.
And the quality combined between metal and semiconductor is one of key of LED product quality quality, verify at present
Whether metal and is combined between semiconductor wafer, main is surveyed by routing Bonding and adhesive package adhesive tape
Viscous force verifies judgement.Routing Bonding is to wafer local sampling verification, and it is brilliant to full wafer for surveying viscous force checking
Sheet is verified, the concrete practice surveying viscous force checking is to use package adhesive tape to glue the metal being deposited on semiconductor surface, if
Then explanation product quality can be sticked out abnormal.
Existing by package adhesive tape survey viscous force time, be that wafer is put on the table, wafer entered one by one
Row operation, this binding mode inefficiency.
Utility model content
The technical problems to be solved in the utility model is, it is provided that a kind of LED chip metallic coating mass detection dress
Put, including: airslide, described airslide is provided with air pipe interface；Vacuum absorbing platform, described vacuum suction
Platform is arranged on described airslide so that forming air flue in described airslide, and described vacuum absorbing platform includes behaviour
Station, the support plate of band pore, piston, described operating desk sets stepped adsorption hole, described stepped absorption
The aperture, big footpath in hole communicates with air, path aperture communicates with described air flue, and the support plate of described band pore is arranged
At the aperture, big footpath of described stepped adsorption hole, described piston is movably arranged at the supporting of described band pore
Under plate, the termination area of described piston is more than the path aperture of described stepped adsorption hole.Filled by this absorption
Putting can be convenient and swift with the viscous force of the multiple wafer of disposable test.
In order to reach above-mentioned technique effect, the concrete technical scheme that the utility model provides is:
A kind of LED chip metallic coating mass detection device, including: airslide, described airslide is provided with gas
Interface tube；Vacuum absorbing platform, described vacuum absorbing platform is arranged on described airslide so that described airslide
Middle formation air flue, described vacuum absorbing platform includes operating desk, the support plate of band pore, piston, described operation
Setting stepped adsorption hole on platform, the aperture, big footpath of described stepped adsorption hole communicates with air, path aperture and institute
Stating air flue to communicate, the support plate of described band pore is arranged at the aperture, big footpath of described stepped adsorption hole, described
Piston is movably arranged under the support plate of described band pore, and the termination area of described piston is more than described ladder
The path aperture of shape adsorption hole.
Preferred as such scheme, the support plate of described band pore has stroke cylinder, and described piston includes depending on
Secondary connect guide rod, baffle plate, connecting rod, plug, described guide rod is movably arranged in described stroke cylinder,
It is arranged with spring outside described guide rod, and described spring is arranged between described stroke cylinder and baffle plate.
Preferred as such scheme, the shoulder of described stepped adsorption hole is tapered, and described plug is tapered,
Described taper plug is suitable with described taper shoulder.
Preferred as such scheme, is provided with annular groove at the aperture, big footpath of described stepped adsorption hole, described
Support plate with pore is arranged in described annular groove.
Preferred as such scheme, described baffle plate is rounded, and the diameter of described circular baffle plate is stepped with described
The aperture in the aperture, big footpath of adsorption hole is suitable, and described circular baffle plate is provided with gas port.
Preferred as such scheme, described airslide includes ladder outer, base plate, and described ladder outer is arranged
On the neighboring of described base plate, described air pipe interface is arranged on described base plate.
Accompanying drawing explanation
Fig. 1 is that the overall structure of a kind of LED chip metallic coating mass detection device that the utility model provides is shown
It is intended to；
Fig. 2 is the structural representation that stepped adsorption hole, the support plate of band pore, piston match.
Detailed description of the invention
Of the present utility model embodiment is described below in detail, and the example of described embodiment is shown in the drawings, wherein
The most same or similar label represents same or similar element or has the unit of same or like function
Part.The embodiment described below with reference to accompanying drawing is exemplary, is not only used for explaining the utility model, and not
It is understood that as to restriction of the present utility model.
In description of the present utility model, it is to be understood that term " " center ", " on ", D score,
"front", "rear", "left", "right", " vertically ", " level ", " top ", " end " " interior ",
Orientation or the position relationship of the instruction such as " outward " they are based on orientation shown in the drawings or position relationship, merely to just
Describe in description the utility model and simplification rather than indicate or imply that the device of indication or element must have spy
Fixed orientation, with specific azimuth configuration and operation, therefore it is not intended that to restriction of the present utility model.
In description of the present utility model, it should be noted that unless otherwise clearly defined and limited, term
" install ", " being connected ", " setting " should be interpreted broadly, for example, it may be fixedly linked, arrange,
Can also be to removably connect, arrange, or be integrally connected, arrange.For those of ordinary skill in the art
For, above-mentioned term concrete meaning in the utility model can be understood with concrete condition.
As shown in Figure 1 and Figure 2, the utility model provides a kind of LED chip metallic coating mass detection device,
Including:
(1) airslide 1, described airslide includes ladder outer 101, base plate 102, described ladder outer 101
Being arranged on the neighboring of described base plate 102, described base plate 102 is provided with air pipe interface 2；
(2) vacuum absorbing platform, described vacuum absorbing platform be arranged on the ladder outer of described airslide with
Making to be formed in described airslide air flue 3, described vacuum absorbing platform includes operating desk 4, the support plate of band pore
5, piston 6, described operating desk 4 sets stepped adsorption hole 7, the aperture, big footpath of described stepped adsorption hole 7
Communicate with air, path aperture communicates with described air flue 3, and the support plate 5 of described band pore is arranged at described rank
At the aperture, big footpath of scalariform adsorption hole 7, described piston 6 is movably arranged at the support plate 5 of described band pore
Under, the termination area of described piston is more than the path aperture of described stepped adsorption hole.
Can set on operating desk in multiple adsorption hole in actually used, each adsorption hole is equipped with band pore
Support plate, piston, the present embodiment is to set multiple adsorption hole so that this LED chip coat of metal matter to be described on operating desk
The using method of amount detecting device.Particularly as follows: wafer is placed on the support plate of band pore, if multiple band gas
All place upper wafer on the support plate in hole, then the pore on the support plate of all band pores is blocked, now by wafer
When utilizing vavuum pump connection air pipe interface to vacuumize, piston does not moves, and stepped adsorption hole communicates formation with air flue
Vacuum, the atmospheric pressure of wafer surface is higher than the vacuum pressure at its back side, therefore wafer is firmly adsorbed at band pore
On support plate；If the support plate upper part of multiple band pores is placed wafer, is partially in idle state, then place
Pore on the support plate of the band pore of wafer is plugged, when now vacuumizing, and propping up of the band pore of placement wafer
Piston under board does not moves, and corresponding stepped adsorption hole and air flue are come round formation vacuum, idle band gas
Pore on the support plate in hole is not plugged, and atmospheric pressure is by pore entrance piston upper surface, and piston lower surface
Becoming vacuum with air flue shaped, therefore piston is moved downward by atmospheric pressure and is blocked up in the path aperture of stepped adsorption hole
Living, now atmospheric pressure will not enter air flue, is therefore still vacuum state in air flue, and air flue and placement wafer
Communicate with the stepped adsorption hole under the support plate of pore, therefore do not affect the absorption of Partial wafer.
It follows that use the utility model to provide a kind of LED chip metallic coating mass detection device, permissible
Disposably multiple wafers are tested, and when on the support plate of the multiple band pores in this vacuum absorption device
When the most all placing wafer, also the wafer placed can be played good adsorption effect, hence in so that survey viscous force
The efficiency of test greatly improves.
Further, the support plate 5 of described band pore has stroke cylinder 8, and described piston 6 includes phase successively
The guide rod 601 that connects, baffle plate 602, connecting rod 603, plug 604, described guide rod 601 is movably arranged at
In described stroke cylinder 8, outside described guide rod 601, it is arranged with spring 9, and described spring 9 is arranged at described stroke
Between cylinder 8 and baffle plate 602.This structure makes can effectively extend, when distress resolves during piston pressurized
Can restore to the original state rapidly again.
Further, the shoulder of described stepped adsorption hole 7 is tapered, and described plug is tapered, described taper
Plug is suitable with described taper shoulder.This structure makes piston that the path aperture of stepped adsorption hole is more stifled
Tight.
Further, annular groove 10, described band gas it are provided with at the aperture, big footpath of described stepped adsorption hole 7
The support plate 5 in hole is arranged in described annular groove 10.Annular groove makes the support plate of band pore regularly
More firm.
Further, described baffle plate 602 is rounded, the diameter of described circular baffle plate and described stepped adsorption hole
The aperture in aperture, big footpath suitable, described circular baffle plate is provided with gas port 11.This structure makes baffle plate transport
Deformation it is not susceptible to time dynamic, more stable during motion.
Embodiment the most of the present utility model, those of ordinary skill in the art can manage
Solve: in the case of without departing from principle of the present utility model and objective, these embodiments can be carried out multiple change
Changing, revise, replace and modification, scope of the present utility model is limited by claim and equivalent thereof.
Claims (6)
1. a LED chip metallic coating mass detection device, it is characterised in that including:
Airslide, described airslide is provided with air pipe interface；
Vacuum absorbing platform, described vacuum absorbing platform is arranged on described airslide so that forming gas in described airslide
Road, described vacuum absorbing platform includes operating desk, the support plate of band pore, piston, and described operating desk sets stepped suction
Attached hole, the aperture, big footpath of described stepped adsorption hole communicates with air, path aperture communicates with described air flue, described band gas
The support plate in hole is arranged at the aperture, big footpath of described stepped adsorption hole, and described piston is movably arranged at described band gas
Under the support plate in hole, the termination area of described piston is more than the path aperture of described stepped adsorption hole.
LED chip metallic coating mass the most according to claim 1 detection device, it is characterised in that described band
The support plate of pore has stroke cylinder, guide rod that described piston includes connecting successively, baffle plate, connecting rod, plug, institute
State guide rod to be movably arranged in described stroke cylinder, outside described guide rod, be arranged with spring, and described spring is arranged at described
Between stroke cylinder and baffle plate.
LED chip metallic coating mass the most according to claim 2 detection device, it is characterised in that described rank
The shoulder of scalariform adsorption hole is tapered, and described plug is tapered, and described taper plug is suitable with described taper shoulder.
LED chip metallic coating mass the most according to claim 3 detection device, it is characterised in that described rank
Being provided with annular groove at the aperture, big footpath of scalariform adsorption hole, the support plate of described band pore is arranged in described annular groove.
5. detect device according to the LED chip metallic coating mass described in any one of claim 2-4, it is characterised in that
Described baffle plate is rounded, and the diameter of described circular baffle plate is suitable with the aperture in the aperture, big footpath of described stepped adsorption hole,
Described circular baffle plate is provided with gas port.
6. detect device according to the LED chip metallic coating mass described in any one of claim 1-4, it is characterised in that
Described airslide includes that ladder outer, base plate, described ladder outer are arranged on the neighboring of described base plate, described tracheae
Interface is arranged on described base plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620393660.5U CN205564713U (en) | 2016-05-04 | 2016-05-04 | LED chip metal coating quality detection device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620393660.5U CN205564713U (en) | 2016-05-04 | 2016-05-04 | LED chip metal coating quality detection device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205564713U true CN205564713U (en) | 2016-09-07 |
Family
ID=56804660
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620393660.5U Expired - Fee Related CN205564713U (en) | 2016-05-04 | 2016-05-04 | LED chip metal coating quality detection device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205564713U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106852001A (en) * | 2017-01-25 | 2017-06-13 | 北京德鑫泉物联网科技股份有限公司 | Sunken cord platform plug, sunken cord platform and sheet production method with plug |
| CN110948385A (en) * | 2019-01-08 | 2020-04-03 | 天津华海清科机电科技有限公司 | Elastic membrane for chemical mechanical polishing |
-
2016
- 2016-05-04 CN CN201620393660.5U patent/CN205564713U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106852001A (en) * | 2017-01-25 | 2017-06-13 | 北京德鑫泉物联网科技股份有限公司 | Sunken cord platform plug, sunken cord platform and sheet production method with plug |
| CN106852001B (en) * | 2017-01-25 | 2024-01-19 | 北京德鑫泉物联网科技股份有限公司 | Plug for wire embedding platform, wire embedding platform with plug and sheet production method |
| CN110948385A (en) * | 2019-01-08 | 2020-04-03 | 天津华海清科机电科技有限公司 | Elastic membrane for chemical mechanical polishing |
| CN110948385B (en) * | 2019-01-08 | 2020-08-14 | 华海清科股份有限公司 | Elastic membrane for chemical mechanical polishing |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160907 Termination date: 20180504 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |