CN211788950U

CN211788950U - Semiconductor chip separating device

Info

Publication number: CN211788950U
Application number: CN201922492483.2U
Authority: CN
Inventors: 王文学; 宋杰
Original assignee: Sanji Technology Tianjin Co ltd
Current assignee: Sanji Technology Tianjin Co ltd
Priority date: 2019-12-31
Filing date: 2019-12-31
Publication date: 2020-10-27
Anticipated expiration: 2029-12-31

Abstract

The utility model relates to a semiconductor chip splitter technical field just discloses a semiconductor chip separator, including the separating station, the inner chamber fixed mounting of separating station has hydraulic motor down, hydraulic motor's the fixed cover in top has connect the jacking rod down, the top fixed mounting of jacking rod has soft jacking board. The utility model discloses a negative pressure generator is set up in the inside of separating platform, make and to utilize negative pressure generator to take out the negative pressure, then set up the negative pressure mouth in the both sides on viscose layer, and install the sealing opening under it, make can link to each other with negative pressure generator through the exhaust tube of sealing opening bottom take out the negative pressure, thereby supplementary viscose layer adsorbs, improve the adhesive force, make the device under long-term use, still have stronger adsorption affinity, the life of the device is prolonged, and can not appear because the adsorption affinity undersize leads to the condition appearance of separation failure, the practicality of the device is improved.

Description

Semiconductor chip separating device

Technical Field

The utility model relates to a semiconductor chip splitter technical field specifically is a semiconductor chip separator.

Background

In a semiconductor packaging process, a semiconductor wafer adhesive layer containing a plurality of dies, for example, mylar, is disposed on a wafer ring to facilitate a subsequent dicing process, after the dicing process, the dies are picked up one by one from the adhesive layer and can be placed on other dies, lead frames, layered substrates, or other carriers according to different applications, in order to automatically pick up the diced dies, a die separating system is required, in order to avoid the risk of die popping, the dies are partially separated from the adhesive layer before the dies are entirely removed by a pick-up head, the dies are lifted from the opposite side of the adhesive surface where the adhesive layer is attached to the dies to at least partially separate the adhesive layer and the dies from each other, and thereafter, the dies are completely separated from the adhesive layer by the pick-up head, the separation of the dies is completed, but when the existing apparatus further performs die separation, the purpose of separation is achieved by utilizing the fact that the adsorption force between the adhesive layer and the adhesive layer is larger than the adsorption force between the adhesive layer and the bare chip, but the adhesion of the adhesive layer is enabled to be utilized, and after the adhesive layer is used for a period of time, the adhesion is gradually weakened, so that the situation that separation fails possibly occurs in subsequent separation is caused, and the long-term use of the device is not facilitated.

SUMMERY OF THE UTILITY MODEL

Not enough to prior art, the utility model provides a semiconductor chip separator possesses the supplementary viscidity of negative pressure and adsorbs, can use for a long time, and the problem that above-mentioned background art provided has been solved to the effectual advantage of separation.

The utility model provides a following technical scheme: a semiconductor chip separating device comprises a separating table, wherein a lower hydraulic motor is fixedly installed in an inner cavity of the separating table, a jacking rod is fixedly sleeved at the top end of the lower hydraulic motor, a soft jacking plate is fixedly installed at the top end of the jacking rod, an adhesive layer is fixedly installed at the top end of the soft jacking plate, negative pressure ports are formed in two sides of the adhesive layer, a sealing port is movably installed at the bottom of the negative pressure port, an exhaust pipe is fixedly sleeved at the bottom end of the sealing port, a negative pressure generator is fixedly sleeved at the bottom end of the exhaust pipe, a semiconductor chip is placed on the adhesive layer, a supporting frame is fixedly installed at one side of the separating table, a driving motor is fixedly installed at the top end of the supporting frame, a pressing push rod is movably sleeved at the bottom end of the supporting frame, a side separating plate is fixedly sleeved at the bottom end of the pressing push rod, connecting rods are fixedly, the bottom end of the connecting rod is fixedly sleeved with a pickup head.

Carefully selecting, the inside fixed mounting of negative pressure mouth has the filter screen, the shape of filter screen is for agreeing with the circular of negative pressure mouth.

The top of the sealing opening is closely attached to the bottom of the adhesive layer, the sealing opening is of an extensible structure, and two sides of the sealing opening are fixedly provided with return springs.

And the bottom end of the negative pressure generator is fixedly arranged in the inner cavity of the separating table, and four exhaust pipes are fixedly sleeved on the negative pressure generator.

Carefully selecting, the bottom end of the pushing rod penetrates through the middle part of the side plate and is fixedly installed in the middle part of the upper surface of the picking head, and the bottom of the pushing rod is movably sleeved with a buffer spring.

Compared with the prior art, the utility model discloses possess following beneficial effect:

1. the utility model discloses a negative pressure generator is set up in the inside of separating platform, make and to utilize negative pressure generator to take out the negative pressure, then set up the negative pressure mouth in the both sides on viscose layer, and install the sealing opening under it, make can link to each other with negative pressure generator through the exhaust tube of sealing opening bottom take out the negative pressure, thereby supplementary viscose layer adsorbs, improve the adhesive force, make the device under long-term use, still have stronger adsorption affinity, the life of the device is prolonged, and can not appear because the adsorption affinity undersize leads to the condition appearance of separation failure, the practicality of the device is improved.

2. The utility model discloses a set up a driving motor on the top of support frame for can utilize driving motor drive to push down the push rod and slide in the bottom of support frame, thereby can accomplish and get the piece, the separation, the step of putting the piece has improved the automatic process of device, sets up a negative pressure generator simultaneously and can carry out the blowback, thereby takes off the adhesion coating that comes off with separating more easily, has improved the use travelling comfort of device.

Drawings

FIG. 1 is a schematic structural view of the present invention;

fig. 2 is a schematic view of the adhesive layer of the structure of the present invention.

In the figure: 1. a separating station; 2. a lower hydraulic motor; 3. a jacking rod; 4. a flexible jacking plate; 5. an adhesive layer; 6. a negative pressure port; 7. filtering with a screen; 8. sealing the opening; 9. a return spring; 10. an air exhaust pipe; 11. a negative pressure generator; 12. a semiconductor chip; 13. a support frame; 14. a drive motor; 15. the push rod is pressed downwards; 16. laterally dividing the plate; 17. a connecting rod; 18. a pick-up head.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-2, a semiconductor chip separating device comprises a separating table 1, a lower hydraulic motor 2 is fixedly installed in an inner cavity of the separating table 1, a lifting rod 3 is fixedly sleeved at the top end of the lower hydraulic motor 2, a soft lifting plate 4 is fixedly installed at the top end of the lifting rod 3, an adhesive layer 5 is fixedly installed at the top end of the soft lifting plate 4, negative pressure ports 6 are formed in two sides of the adhesive layer 5, a filter screen 7 is fixedly installed inside the negative pressure ports 6, the filter screen 7 is in a circular shape matched with the negative pressure ports 6, the filter screen 7 is arranged inside the negative pressure ports 6, so that dust cannot be pumped into the negative pressure generator 11 when the negative pressure generator 11 is used, the device is damaged, the safety of the device is improved, meanwhile, the filter screen 7 is arranged in a circular shape matched with the negative pressure ports 6, the uniformity of the structure is ensured, a sealing port 8 is movably installed at the bottom of the negative pressure ports 6, the top of the sealing port 8 is tightly attached to the bottom of the adhesive layer 5, the sealing port 8 is of an extensible structure, reset springs 9 are fixedly mounted on two sides of the sealing port 8, the top of the sealing port 8 is tightly attached to the bottom of the adhesive layer 5, so that air exhaust cannot be affected by air leakage, the practicability of the device is guaranteed, meanwhile, two reset springs 9 are fixedly mounted on two sides of the sealing port 8, so that the position of the sealing port 8 can be fixed by the reset springs 9, the stability of the device is guaranteed, an exhaust pipe 10 is fixedly sleeved at the bottom of the sealing port 8, a negative pressure generator 11 is fixedly sleeved at the bottom of the exhaust pipe 10, the bottom of the negative pressure generator 11 is fixedly mounted in an inner cavity of the separating table 1, four exhaust pipes 10 are fixedly sleeved on the negative pressure generator 11, the bottom of the negative pressure generator 11 is mounted in the inner cavity of the separating table 1, so that the position of the negative pressure generator 11 is fixed, the stability of the device is improved, and four exhaust pipes 10 are arranged around the negative pressure generator 11, so that when negative pressure is pumped, the device is more stable, and the safety of the device is improved, a semiconductor chip 12 is placed on the adhesive layer 5, a support frame 13 is fixedly installed on one side of the separating table 1, a driving motor 14 is fixedly installed on the top end of the support frame 13, a pushing rod 15 is movably sleeved at the bottom end of the support frame 13, the bottom end of the pushing rod 15 penetrates through the middle part of the side sub-plate 16 and is fixedly installed in the middle part of the upper surface of the picking head 18, a buffer spring is movably sleeved at the bottom of the pushing rod 15, the bottom end of the pushing rod 15 penetrates through the middle part of the side sub-plate 16, so that the device is connected to the middle part of the picking head 18, a buffer spring is sleeved at the bottom of the pushing rod 15, so that when the picking head 18 is pressed on the semiconductor chip 12, the semiconductor chip 12 can not be damaged, the reliability of the device is improved, the bottom end of the downward pressing push rod 15 is fixedly sleeved with a side branch plate 16, two sides of the side branch plate 16 are fixedly sleeved with connecting rods 17, and the bottom end of each connecting rod 17 is fixedly sleeved with a pickup head 18.

The working principle is as follows: when the semiconductor chip sucking device is used, the driving motor 14 is used for driving the downward-pressing push rod 15 to transversely move to drive the pickup head 18 to move to the position above the support for placing the semiconductor chip 12, then the downward pressing is carried out for sucking, so that the semiconductor chip 12 is sucked, then the pickup head is placed on the adhesive layer 5, the negative pressure generator 11 is started to begin to exhaust air to form negative pressure, so that the adhesive layer at the bottom of the semiconductor chip 12 is firmly sucked, meanwhile, the lower hydraulic motor 2 is started to enable the lifting rod 3 to start to lift upwards, and the pickup head 18 rises synchronously, so that the middle part of the adhesive layer 5 protrudes to form an arc, as the hardness of the semiconductor chip 12 is different from that of the adhesive layer at the bottom, the semiconductor chip 12 is separated from the adhesive layer at the bottom, after the semiconductor chip is separated to a certain degree, the lifting rod 3 starts to fall, the position of the pickup head 18 is unchanged, so that the semiconductor chip, finally, the driving motor 14 drives the push-down rod 15 to move laterally again to place the separated semiconductor chip 12 at a predetermined position.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Simultaneously in the utility model discloses an in the drawing, fill the pattern and just do not do any other injecions for distinguishing the picture layer.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A semiconductor chip separation apparatus comprising a separation stage (1), characterized in that: the inner chamber fixed mounting of separation platform (1) has hydraulic motor (2) down, the fixed cover in top of hydraulic motor (2) has connect lifting rod (3) down, the top fixed mounting of lifting rod (3) has soft jacking board (4), the top fixed mounting of soft jacking board (4) has viscose layer (5), negative pressure mouth (6) have been seted up to the both sides of viscose layer (5), the bottom movable mounting of negative pressure mouth (6) has seal (8), the fixed cover in bottom of seal (8) has been connected exhaust tube (10), the fixed cover in bottom of exhaust tube (10) has been connected negative pressure generator (11), semiconductor chip (12) have been placed on viscose layer (5), one side fixed mounting of separation platform (1) has support frame (13), the top fixed mounting of support frame (13) has driving motor (14), the bottom activity of support frame (13) has cup jointed push rod (15) down, the fixed cover in bottom of push rod (15) down has connect side branch board (16), the fixed connecting rod (17) that has cup jointed in both sides of side branch board (16), the fixed cover in bottom of connecting rod (17) has connect and has picked up head (18).

2. The semiconductor chip detachment apparatus according to claim 1, wherein: the inside fixed mounting of negative pressure mouth (6) has filter screen (7), the shape of filter screen (7) is for agreeing with the circular of negative pressure mouth (6).

3. The semiconductor chip detachment apparatus according to claim 1, wherein: the top of sealing port (8) is hugged closely together with the bottom of viscose layer (5), and sealing port (8) are extensible structure, reset spring (9) are fixed mounting to the both sides of sealing port (8).

4. The semiconductor chip detachment apparatus according to claim 1, wherein: the bottom end of the negative pressure generator (11) is fixedly arranged in the inner cavity of the separating table (1), and the negative pressure generator (11) is fixedly sleeved with four exhaust pipes (10).

5. The semiconductor chip detachment apparatus according to claim 1, wherein: the bottom end of the downward pressing push rod (15) penetrates through the middle of the side dividing plate (16) and is fixedly installed in the middle of the upper surface of the picking head (18), and a buffer spring is movably sleeved at the bottom of the downward pressing push rod (15).