CN209087853U - A kind of ceramic cartridge structure and its encapsulating structure - Google Patents
A kind of ceramic cartridge structure and its encapsulating structure Download PDFInfo
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- CN209087853U CN209087853U CN201821937592.XU CN201821937592U CN209087853U CN 209087853 U CN209087853 U CN 209087853U CN 201821937592 U CN201821937592 U CN 201821937592U CN 209087853 U CN209087853 U CN 209087853U
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- groove
- ceramic cartridge
- cartridge structure
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Abstract
This patent belongs to encapsulation technology field, and specially a kind of ceramic cartridge structure and its encapsulating structure, the ceramic cartridge structure includes ceramic base, and the upper surface middle part of the ceramic base has the first groove, has the second groove in the middle part of the lower surface of the ceramic base；There is part to be connected between first groove and second groove, multiple pads are installed on the second groove；The ceramic cartridge structure that this patent proposes, is particularly suitable for the structure of double-faced packaging, multiple chips can be encapsulated in a shell simultaneously, realize the modularization integration packaging of detector；Large chip and small chip are attached by bonding wire in the connected region of the first groove and the second groove by the ceramic cartridge structure of this patent, to realize the small chip of reverse side and being electrically connected for the front large chip shortest distance.
Description
Technical field
This patent belongs to encapsulation technology field, specially a kind of ceramic cartridge structure and its encapsulating structure.
Background technique
Charge coupled device ccd (Charge Coupled Device), APD (Avalanche Photoelectron
Diode), the detectors such as SDD (Silicon Drift Device), can be by photoelectric process, and realization is not to sharing the same light
The detection of son.The application range of different type detector is different, but requires for detector chip to be packaged, then in driving electricity
Under the cooperation of road module, realize to photoelectronic detection.
The encapsulation of detector chip, needs shell as carrier, plays the role of support or protection to packed chip.
The case package of chip is indispensable important link.
Patent content
Based on problem of the existing technology, this patent proposes a kind of ceramic cartridge structure and its encapsulating structure, in pipe
The front bonding large chip of shell, shortest bonding wire can be passed through by connected component therein by welding small chip in reverse side
Size chip is attached；
Specifically, a kind of ceramic cartridge structure of this patent includes ceramic base, the upper surface middle part of the ceramic base
There is the first groove, has the second groove in the middle part of the lower surface of the ceramic base；First groove and second groove it
Between have part connection, multiple pads are installed on the second groove.
Preferably, the shape of the ceramic cartridge structure includes n-shaped, rectangle or circle, and N is whole more than or equal to 3
Number；It will be appreciated that the shape of the ceramic cartridge structure of this patent can also be not limited to foregoing description.
Preferably, the depth of first groove is 0.15mm~0.25mm, the depth of the second groove be 1.1mm~
1.3mm.The depth of its groove of the ceramic cartridge structure of this patent is not limited to foregoing description.
Preferably, second groove extends gap to shell structure side edge direction.
On the basis of a kind of ceramic cartridge structure of this patent, this patent also proposed a kind of envelope of ceramic cartridge structure
Assembling structure encapsulates large chip on the first groove of the ceramic cartridge structure using the ceramic cartridge structure, described
Multiple small chips are encapsulated on the pad of two grooves, it, will by the connected region between the first groove of bonding wire and the second groove
Large chip is attached with small chip.
Preferably, the large chip include detector, it is one or more in CCD, SDD chip, particularly, be suitable for two-sided
The chip of encapsulation；The small chip includes temperature sensor, one or more in preamplifier.
This patent the utility model has the advantages that
1, the ceramic cartridge structure that this patent proposes, is particularly suitable for the structure of double-faced packaging, can be same by multiple chips
When be encapsulated in a shell, realize the modularization integration packaging of detector；
2, the ceramic cartridge structure of this patent by bonding wire the connected region of the first groove and the second groove will be big
Chip and small chip are attached, to realize the small chip of reverse side and being electrically connected for the front large chip shortest distance；
3, the packaged type of this patent is very suitable for back side illuminaton detector, such as CCD, APD, SDD.
Detailed description of the invention
Fig. 1 is the ceramic cartridge surface structure figure of this patent；
Fig. 2 is the ceramic cartridge lower surface configuration figure of this patent；
In figure, 1, ceramic cartridge structure, the 11, first groove, 12, connected region, 20, gap, 21, pad, 22, second is recessed
Slot.
Specific embodiment
In order to which the objects, technical solutions and advantages of this patent are more clearly understood, below in conjunction with attached drawing to this patent reality
The technical solution applied in example is clearly and completely described, it is clear that described embodiment is only that this patent a part is implemented
Example, instead of all the embodiments.
As shown in Fig. 1~2, a kind of ceramic cartridge structure of this patent, including ceramic base 1, the ceramic base 1 it is upper
Surface middle part has the first groove 11, has the second groove 22 in the middle part of the lower surface of the ceramic base；First groove 11 and institute
Stating between the second groove 22 has part connection, then forms connected region 12, and multiple pads 21 are equipped on the second groove.The
Two grooves extend gap 20 to shell structure side edge direction.The gap can be used for extraction wire connecting line etc..
On the basis of the ceramic cartridge structure of this patent, a kind of encapsulating structure of ceramic cartridge structure of this patent,
Large chip is encapsulated on first groove of the ceramic cartridge structure, multiple small chips are encapsulated on the pad of second groove,
By bonding wire, large chip and small chip are attached by connected region between the first groove and the second groove.
The large chip includes detector, charge coupled device ccd, one or more, the small chip packet in SDD chip
Include temperature sensor, one or more in preamplifier.The large chip of this patent and small chip can be not limited to foregoing description.
Be two-sided structure in order to make it easy to understand, the ceramic cartridge structure that this patent is related to, be divided into obverse and reverse (namely
It is upper and lower surfaces hereinbefore), by positive large chip adhesion zone, front groove area (the first groove), hollowed out area
The structure compositions such as (connected region), negative grooves area (the second groove), the small chip bonding pad of reverse side.
The detectors such as CCD, APD, SDD due to back side illuminaton, need double-sided bonding to encapsulate, special, extraordinary spy
Device is surveyed, needs multiple chips while being encapsulated in a shell, realizes modularization integration packaging.The ceramic tube that this patent is related to
Shell structure provides the solution of achievable modularization integration packaging.
In this patent unless specifically defined or limited otherwise, term " installation ", " setting ", " connection ", " fixation ",
Equal terms shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or integral；It can be machinery
Connection, is also possible to be electrically connected；It can be directly connected, two elements can also be can be indirectly connected through an intermediary
The interaction relationship of internal connection or two elements, unless otherwise restricted clearly, for the ordinary skill people of this field
For member, the concrete meaning of above-mentioned term in this patent can be understood as the case may be.
In addition, term " first ", " second " are used for descriptive purposes only and cannot be understood as indicating or suggesting relative importance
Perhaps the quantity for implicitly indicating indicated technical characteristic defines " first " as a result, the feature of " second " can be expressed or
Implicitly include at least one this feature.
It is understood that embodiment provided above, has carried out further the purposes, technical schemes and advantages of this patent
Detailed description, it should be understood that embodiment provided above is only the preferred embodiment of this patent, not to limit
It, should all to this patent any modification, equivalent replacement, improvement and so within patent processed, all spirit in this patent and principle
Within the protection scope of this patent.
Claims (6)
1. a kind of ceramic cartridge structure, which is characterized in that the ceramic cartridge structure includes ceramic base, the ceramic base
Upper surface middle part has the first groove, has the second groove in the middle part of the lower surface of the ceramic base；First groove and described the
There is part connection between two grooves, multiple pads are installed on the second groove.
2. a kind of ceramic cartridge structure according to claim 1, the shape of the ceramic cartridge structure include n-shaped,
Rectangle or circle.
3. a kind of ceramic cartridge structure according to claim 1, which is characterized in that the depth of first groove is
0.15mm~0.25mm, the depth of the second groove are 1.1mm~1.3mm.
4. a kind of ceramic cartridge structure according to claim 1, second groove is to the shell structure side edge side
To extending gap.
5. a kind of encapsulating structure of ceramic cartridge structure, which is characterized in that including the ceramics as described in Claims 1 to 4 is any
Shell structure is bonded large chip on the first groove of the ceramic cartridge structure, encapsulates on the pad of second groove
Multiple small chips are carried out large chip and small chip by the connected region between the first groove of bonding wire and the second groove
Connection.
6. a kind of encapsulating structure of ceramic cartridge structure according to claim 5, which is characterized in that the large chip includes
Detector, charge coupled device ccd, one or more in SDD chip, the small chip includes temperature sensor, preposition amplification
It is one or more in device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821937592.XU CN209087853U (en) | 2018-11-23 | 2018-11-23 | A kind of ceramic cartridge structure and its encapsulating structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821937592.XU CN209087853U (en) | 2018-11-23 | 2018-11-23 | A kind of ceramic cartridge structure and its encapsulating structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209087853U true CN209087853U (en) | 2019-07-09 |
Family
ID=67125270
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821937592.XU Active CN209087853U (en) | 2018-11-23 | 2018-11-23 | A kind of ceramic cartridge structure and its encapsulating structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209087853U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109346534A (en) * | 2018-11-23 | 2019-02-15 | 中国电子科技集团公司第四十四研究所 | A kind of ceramic cartridge structure and its encapsulating structure |
-
2018
- 2018-11-23 CN CN201821937592.XU patent/CN209087853U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109346534A (en) * | 2018-11-23 | 2019-02-15 | 中国电子科技集团公司第四十四研究所 | A kind of ceramic cartridge structure and its encapsulating structure |
| CN109346534B (en) * | 2018-11-23 | 2024-05-07 | 中国电子科技集团公司第四十四研究所 | Ceramic tube shell structure and packaging structure thereof |
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