CN210200715U - SOT26 packaging element and packaging frame - Google Patents
SOT26 packaging element and packaging frame Download PDFInfo
- Publication number
- CN210200715U CN210200715U CN201921225096.6U CN201921225096U CN210200715U CN 210200715 U CN210200715 U CN 210200715U CN 201921225096 U CN201921225096 U CN 201921225096U CN 210200715 U CN210200715 U CN 210200715U
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- chip mounting
- sot26
- chip
- frame
- groove
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Abstract
The utility model discloses a SOT26 packaging element, including the frame that is used for holding the rectangle of dress chip, its characterized in that set up a plurality of chip installation departments that suit with SOT26 packaging form on the frame, the chip installation department includes that pin weld zone, chip settle district, pin groove, connects the pin groove with be provided with on the extension muscle in chip settle district and hinder the cistern. A V-shaped groove is designed at the junction of the bonding pad and the plastic package body and serves as a liquid blocking groove, external environment water can be effectively prevented from entering the plastic package body, layering is reduced, the probability of experimental data layering is reduced from 10% to about 2%, the moisture sensitivity and adaptability of products are enhanced, and the product quality is guaranteed.
Description
Technical Field
The present invention relates to a semiconductor package manufacturing technology, and more particularly to an SOT26 package device and a package frame.
Background
The lead frame has the main functions of providing a carrier for mechanically supporting a chip, simultaneously serving as a conductive medium for connecting a chip circuit inside and outside to form an electric signal path, and outwards dissipating heat generated during the operation of the chip together with a packaging shell to form a heat dissipation channel.
SOT26 is a chip packaging unit model for small electronic components. The SOT26 packaging frame on the market at present has low utilization rate of frame materials and high production cost. Furthermore, current SOT26 packages are prone to delamination leading to device failure and reliability problems.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a: the SOT26 packaging element and the packaging frame are provided for solving the problem of easy layering in the prior art.
In order to realize the purpose, the utility model discloses a technical scheme be:
the utility model provides a SOT26 packaging element, includes the frame that is used for holding the rectangle of dress chip set up a plurality of chip mounting portions that suit with SOT26 encapsulation form on the frame, the chip mounting portion includes pin bonding area, chip settling area, pin groove, connects the pin groove with be provided with on the extension muscle in chip settling area and hinder the cistern.
Preferably, the chip mounting part comprises 4 pin welding areas and 1 chip mounting area, and 1 liquid-resisting groove is arranged on the extending rib for connecting the pin grooves and the chip mounting area.
Preferably, the chip mounting part comprises 5 pin welding areas and 1 chip mounting area, 1 liquid-resisting groove is arranged on the extending rib of the pin groove and the chip mounting area, and 1 liquid-resisting groove is arranged on the extending rib of the pin groove and the extending rib of the pin welding area.
Preferably, the chip mounting part comprises 4 pin welding areas and 2 chip mounting areas, 1 liquid-resistant groove is respectively arranged on the front surface and the back surface of the extending rib for connecting the pin grooves and the chip mounting areas, and 1 liquid-resistant groove is respectively arranged on the front surface and the back surface of the extending rib for connecting the pin grooves and the pin welding areas.
Preferably, the chip mounting part comprises 4 pin welding areas and 2 chip arrangement areas, 1 liquid resistance groove is arranged on the extending rib of the pin groove and the chip arrangement area, and 1 liquid resistance groove is arranged on the extending rib of the pin groove and the extending rib of the pin welding area.
An SOT26 chip frame of SOT26 packaged component that has adopted any one above, includes the rectangular frame that is used for holding the chip on the frame, be provided with a plurality of chip installation units, the chip installation unit is the rectangle, arrange into 3 in the chip installation unit the chip installation department is side by side.
Preferably, the long side of the chip mounting portion is arranged in parallel with the long side of the frame.
Preferably, the length of the frame is 299.6 +/-0.1 mm, and the width of the frame is 93 +/-0.04 mm.
Preferably, 18 rows and 24 columns of the chip mounting units are arranged on the frame.
Preferably, the two rows of the chip mounting units are arranged in a group of mirror image arrangement, the two groups of the chip mounting units are arranged in a unit, and a unit separation groove is arranged between the adjacent units.
Preferably, a plurality of package positioning holes are further formed between two sets of chip mounting units in the same unit, and the package positioning holes are arranged in a row.
To sum up, owing to adopted above-mentioned technical scheme, the beneficial effects of the utility model are that:
1. a V-shaped groove is designed at the junction of the bonding pad and the plastic package body and serves as a liquid blocking groove, external environment water can be effectively prevented from entering the plastic package body, layering is reduced, the probability of experimental data layering is reduced from 10% to about 2%, the moisture sensitivity and adaptability of products are enhanced, and the product quality is guaranteed.
2. The front and back surfaces of the extending rib are respectively provided with a liquid resistance groove, so that the stress of the front and back surfaces is mutually counteracted, and the purpose of stress balance is achieved.
Drawings
Fig. 1 is a schematic structural diagram of an SOT26 package component in example 1.
Fig. 2 is a schematic cross-sectional view of a V-groove.
Fig. 3 is a schematic structural view of a chip mounting unit in embodiment 1.
Fig. 4 is a schematic structural view of a frame in embodiment 1.
Fig. 5 is a schematic structural diagram of an SOT26 package component in embodiment 2.
Fig. 6 is a schematic structural view of a chip mounting unit in embodiment 2.
Fig. 7 is a schematic structural diagram of an SOT26 package component in embodiment 3.
Fig. 8 is a schematic structural view of a chip mounting unit in embodiment 3.
Fig. 9 is a schematic cross-sectional view of a double V-groove.
Fig. 10 is a schematic structural view of a chip mounting unit in embodiment 4.
Fig. 11 is a schematic structural diagram of an SOT26 package component in embodiment 4.
The labels in the figure are: 1-frame, 2-chip mounting unit, 21-chip mounting unit, 211-chip mounting area, 212-pin welding area, 22-reinforcing rib, 23-extending rib, 231-liquid resistance groove, 24-pin groove, 3-unit separation groove and 4-positioning hole.
Detailed Description
The present invention will be described in detail with reference to the accompanying drawings.
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the invention.
Example 1
Referring to fig. 1, an SOT26 package component includes a rectangular frame 1 for holding a chip, a plurality of chip mounting portions 21 adapted to the package form of SOT26 are disposed on the frame 1, the chip mounting portions 21 include lead bonding pads 212, chip mounting regions 211, and lead slots 24, and liquid blocking slots 231 are disposed on extending ribs 23 connecting the lead slots 24 and the chip mounting regions 211.
The chip mounting portion 21 includes 4 pin lands 212 and 1 chip mounting region 211, and 1 liquid-blocking groove 231 is provided on the extending rib 23 connecting the pin groove 24 and the chip mounting region 211. As shown in fig. 2, the liquid blocking groove 231 is a V-shaped groove, and the V-shaped groove is designed at the junction of the pad and the plastic package body as the liquid blocking groove 231, so that external environment water can be effectively blocked from entering the plastic package body, delamination is reduced, the probability of experimental data delamination is reduced from 10% to about 2%, the moisture sensitivity and adaptability of the product are enhanced, and the product quality is ensured.
Referring to fig. 4, an SOT26 chip frame 1 employing the SOT26 package component described in any one of the above embodiments includes a rectangular frame 1 for carrying a chip, on the frame 1, a plurality of chip mounting units 2 (see fig. 3) are disposed, the chip mounting units 2 are rectangular, and 3 chip mounting portions 21 are arranged side by side in the chip mounting units 2.
The long side of the chip mounting portion 21 is arranged in parallel with the long side of the frame 1.
The length of the frame 1 is 299.6 +/-0.1 mm, and the width of the frame 1 is 93 +/-0.04 mm.
18 rows and 24 columns of the chip mounting units 2 are arranged on the frame 1.
The two rows of the chip mounting units 2 are arranged in a group of mirror image arrangement, the two groups are arranged in a unit, and a unit separation groove 3 is arranged between the adjacent units.
A plurality of package positioning holes 4 are further formed between the two sets of chip mounting units 2 in the same unit, and the plurality of package positioning holes 4 are arranged in a row.
Example 2
Referring to fig. 5 and 6, an SOT26 package component includes a rectangular frame 1 for holding a chip, a plurality of chip mounting portions 21 adapted to the package form of SOT26 are disposed on the frame 1, the chip mounting portions 21 include lead bonding pads 212, chip mounting regions 211, and lead slots 24, and liquid blocking slots 231 are disposed on extending ribs 23 connecting the lead slots 24 and the chip mounting regions 211. The chip mounting portion 21 includes 5 pin lands 212 and 1 chip mounting area 211, and 1 liquid-blocking groove 231 is provided on the extension rib 23 connecting the pin groove 24 and the pin land 212. The liquid resistance groove 231 is a V-shaped groove, the V-shaped groove is designed at the junction of the bonding pad and the plastic package body and serves as the liquid resistance groove 231, external environment water can be effectively prevented from entering the plastic package body, layering is reduced, the probability of experimental data layering is reduced from 10% to about 2%, the humidity sensitivity and adaptability of products are enhanced, and the product quality is guaranteed.
Example 3
Referring to fig. 7 and 8, an SOT26 package component includes a rectangular frame 1 for holding a chip, a plurality of chip mounting portions 21 adapted to the package form of SOT26 are disposed on the frame 1, the chip mounting portions 21 include lead bonding pads 212, chip mounting regions 211, and lead slots 24, and liquid blocking slots 231 are disposed on extending ribs 23 connecting the lead slots 24 and the chip mounting regions 211.
The chip mounting portion 21 includes 4 pin lands 212 and 2 chip mounting areas 211, 1 liquid-blocking groove 231 is respectively disposed on the front and back surfaces of the extending rib 23 connecting the pin grooves 24 and the chip mounting areas 211 (as shown in fig. 9), and 1 liquid-blocking groove 231 is respectively disposed on the front and back surfaces of the extending rib 23 connecting the pin grooves 24 and the pin lands 212. The liquid resistance groove 231 is a V-shaped groove, the V-shaped groove is designed at the junction of the bonding pad and the plastic package body to serve as the liquid resistance groove 231, external environment water can be effectively prevented from entering the plastic package body, layering is reduced, the probability of experimental data layering is reduced from 10% to about 2%, the moisture sensitivity and adaptability of products are enhanced, and the product quality is guaranteed; the front and back surfaces of the extending rib 23 are respectively provided with a liquid blocking groove 231 to offset the front and back stresses, thereby achieving the purpose of stress balance.
Example 4
Referring to fig. 10 and 11, an SOT26 package component includes a rectangular frame 1 for holding a chip, a plurality of chip mounting portions 21 adapted to the package form of SOT26 are disposed on the frame 1, the chip mounting portions 21 include lead bonding pads 212, chip mounting regions 211, and lead slots 24, and liquid blocking slots 231 are disposed on extending ribs 23 connecting the lead slots 24 and the chip mounting regions 211. The chip mounting portion 21 includes 4 pin lands 212 and 2 chip mounting areas 211, and 1 liquid-blocking groove 231 is provided on the extension rib 23 connecting the pin groove 24 and the chip mounting area 211, and 1 liquid-blocking groove 231 is provided on the extension rib 23 connecting the pin groove 24 and the pin land 212. The liquid resistance groove 231 is a V-shaped groove, the V-shaped groove is designed at the junction of the bonding pad and the plastic package body and serves as the liquid resistance groove 231, external environment water can be effectively prevented from entering the plastic package body, layering is reduced, the probability of experimental data layering is reduced from 10% to about 2%, the humidity sensitivity and adaptability of products are enhanced, and the product quality is guaranteed.
The above description is only exemplary of the present invention and should not be taken as limiting the scope of the present invention, as any modifications, equivalents, improvements and the like made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.
Claims (10)
1. The SOT26 packaging component comprises a rectangular frame for holding a chip, and is characterized in that a plurality of chip mounting parts adapted to SOT26 packaging forms are arranged on the frame, each chip mounting part comprises a pin welding area, a chip mounting area and a pin groove, and the pin grooves are connected with extending ribs of the chip mounting area.
2. The SOT26 package of claim 1, wherein the chip mounting portion comprises 4 lead bonding areas and 1 chip mounting area, and 1 liquid blocking groove is disposed on the extending rib connecting the lead grooves and the chip mounting area.
3. The SOT26 package of claim 1, wherein the chip mounting portion comprises 5 pin pads and 1 chip mounting area, 1 liquid-blocking groove is provided on the extending rib connecting the pin grooves and the chip mounting area, and 1 liquid-blocking groove is provided on the extending rib connecting the pin grooves and the pin pads.
4. The SOT26 package of claim 1, wherein the chip mounting portion comprises 4 lead bonding areas and 2 chip mounting areas, wherein 1 liquid blocking groove is respectively disposed on the front and back surfaces of the extending rib connecting the lead grooves and the chip mounting areas, and 1 liquid blocking groove is respectively disposed on the front and back surfaces of the extending rib connecting the lead grooves and the lead bonding areas.
5. The SOT26 package of claim 1, wherein the chip mounting portion comprises 4 lead bonding areas and 2 chip mounting areas, 1 liquid-blocking groove is formed on the extending rib connecting the lead groove and the chip mounting area, and 1 liquid-blocking groove is formed on the extending rib connecting the lead groove and the lead bonding area.
6. An SOT26 chip frame using the SOT26 package component of any one of claims 1-5, comprising a rectangular frame for holding chips, wherein a plurality of chip mounting units are provided on the frame, and the chip mounting units are rectangular and are arranged with 3 chip mounting portions side by side.
7. The SOT26 chip frame of claim 6, wherein a long side of the chip mounting portion is arranged parallel to the frame long side.
8. The SOT26 chip frame of any of claims 6-7, wherein the frame has a length of 299.6 ± 0.1mm and a width of 93 ± 0.04 mm.
9. The SOT26 chip frame of claim 8, wherein 18 rows and 24 columns of the chip mounting units are arranged on the frame.
10. The SOT26 chip frame of claim 9, wherein the chip mounting units are arranged in two rows as a set of mirror image arrangement and two sets as a unit, and a unit separation groove is provided between adjacent units; and a plurality of packaging positioning holes are also arranged between the two groups of chip mounting units in the same unit and are arranged in a row.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921225096.6U CN210200715U (en) | 2019-07-31 | 2019-07-31 | SOT26 packaging element and packaging frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921225096.6U CN210200715U (en) | 2019-07-31 | 2019-07-31 | SOT26 packaging element and packaging frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210200715U true CN210200715U (en) | 2020-03-27 |
Family
ID=69865887
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921225096.6U Expired - Fee Related CN210200715U (en) | 2019-07-31 | 2019-07-31 | SOT26 packaging element and packaging frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210200715U (en) |
-
2019
- 2019-07-31 CN CN201921225096.6U patent/CN210200715U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200327 |