CN209071310U - A kind of anti-reverse integrated circuit package structure - Google Patents
A kind of anti-reverse integrated circuit package structure Download PDFInfo
- Publication number
- CN209071310U CN209071310U CN201821840295.3U CN201821840295U CN209071310U CN 209071310 U CN209071310 U CN 209071310U CN 201821840295 U CN201821840295 U CN 201821840295U CN 209071310 U CN209071310 U CN 209071310U
- Authority
- CN
- China
- Prior art keywords
- upper cover
- footing
- hamper
- expansion plate
- integrated circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Casings For Electric Apparatus (AREA)
Abstract
The utility model discloses a kind of anti-reverse integrated circuit package structures, including upper sealing assembly and lower sealing assembly, the upper sealing assembly includes upper cover, squeezes spring, expansion plate and footing, the upper cover and the footing are integrally formed, and the footing is located at the lower surface of the upper cover, the expansion plate is fixedly connected on the upper cover, and is located at the inside of the upper cover, the extruding spring is fixedly connected on the expansion plate, and is located inside the expansion plate；When chipset is placed on substrate, hamper can be placed on to the top of equipment, and reduce activity space of the equipment between upper cover and lower cover, simultaneously, it by expansion plate and squeezes spring the offer of power is provided to hamper, enable hamper is stable the equipment being put on substrate such as to be put on substrate, and then enable chip and obtain stable placement, the probability that chip generates damage in transport is reduced, the loss of unnecessary economic cost is reduced.
Description
Technical field
The utility model belongs to circuit package technical field more particularly to a kind of anti-reverse integrated circuit package structure.
Background technique
Encapsulation, just refers to the circuit pin on silicon wafer, is connect and guided at external lug with conducting wire, in order to other devices company
It connects.Packing forms refer to the shell of installation semiconductor integrated circuit chip.It not only plays installation, fixation, sealing, protection core
The effect of piece and enhancing electric heating property etc., but also it is wired to by the contact on chip the pin of package casing
On, these pins are connected further through the conducting wire on printed circuit board with other devices, to realize inside chip and external electrical
The connection on road.Because chip must be isolated from the outside, to prevent the impurity in air from causing to the corrosion of chip circuit electrically
Performance decline.On the other hand, the chip after encapsulation is also more convenient for installing and be transported.Since the quality of encapsulation technology also directly affects
To the performance of chip self performance and designing and manufacturing for PCB (printed circuit board) that is attached thereto, therefore it is most important
's.
After being packaged to chip, during needing to transport it, vibration caused by vehicle will be transmitted
Onto substrate, and then the shake of substrate will lead to the damage of chip thereon, in turn result in the loss of unnecessary economic cost.
Utility model content
The utility model provides a kind of anti-reverse integrated circuit package structure, it is intended to solve to need after chip is packaged
During transporting to it, vibration caused by vehicle will be transmitted on substrate, and then the shake of substrate will cause
The damage of chip thereon in turn results in the loss problem of unnecessary economic cost.
The utility model is realized in this way a kind of anti-reverse integrated circuit package structure, including upper sealing assembly and lower envelope
Component, the upper sealing assembly include upper cover, squeeze spring, expansion plate and footing, and the upper cover and the footing are integrally formed, and
The footing is located at the lower surface of the upper cover, and the expansion plate is fixedly connected on the upper cover, and is located at the interior of the upper cover
Portion, the extruding spring is fixedly connected on the expansion plate, and is located inside the expansion plate,
The lower sealing assembly includes lower cover, hamper, pin and substrate, and the lower cover is adapted with the upper cover, and described
Upper cover is connected in the lower cover by the footing, and the pin is fixedly connected on the lower cover, and is located at the outer of the lower cover
Wall, the substrate are fixedly connected on the lower cover and are located at the inner wall of the lower cover, and the upper surface of the hamper offers docking
Slot, and the hamper is corresponding with the docking groove, and is connected in the docking groove.
Preferably, in a rectangular parallelepiped shape, the docking groove is in rectangular shape for the hamper, and the opening of the hamper and institute
It is corresponding to state docking groove.
Preferably, the junction of the lower cover and the upper cover offers card slot, which is adapted with the footing, and
The footing is contained in inside the card slot.
Preferably, the quantity of the card slot and the footing is equipped with multiple, and each footing and card slot are mutually right
It answers.
Preferably, the inside of the upper cover is in hollow form, and the extruding spring and the expansion plate are contained in this
In empty portion.
Preferably, the hollow portion is in rectangle, and is adapted with the hamper.
Preferably, the quantity for squeezing spring is equipped with multiple, and is arranged successively along the length direction of the upper cover.
Preferably, the footing is in hook, and the shape of card slot is identical in the shape of the footing.
Compared with prior art, the utility model has the beneficial effects that a kind of anti-reverse integrated circuit of the utility model
Hamper, when chipset is placed on substrate, can be placed on and be set by substrate, hamper, spring and expansion plate by encapsulating structure
Standby top, and activity space of the equipment between upper cover and lower cover is reduced, meanwhile, by expansion plate and spring is squeezed to hamper
The offer of power is provided, enables hamper is stable the equipment being put on substrate such as to be put on substrate, and then enable chip
Stable placement is obtained, the probability that chip generates damage in transport is reduced, reduces the loss of unnecessary economic cost.
It should be understood that the above is preferred embodiments of the present invention, it is noted that this technology is led
For the those of ordinary skill in domain, without departing from the principle of this utility model, several improvements and modifications can also be made,
These improvements and modifications are also considered as the protection scope of the utility model.
Detailed description of the invention
Fig. 1 is the schematic diagram of the utility model；
Fig. 2 is the lower cover schematic diagram of the utility model；
Fig. 3 is the upper cover schematic internal view of the utility model；
In figure: the upper sealing assembly of 1-, 11- upper cover, 12- squeeze sealing assembly, 21- under spring, 13- expansion plate, 14- footing, 2-
Lower cover, 22- pin, 23- hamper, 24- substrate, 25- docking groove.
Specific embodiment
In order to make the purpose of the utility model, technical solutions and advantages more clearly understood, below in conjunction with attached drawing and implementation
Example, the present invention will be further described in detail.It should be appreciated that specific embodiment described herein is only used to explain
The utility model is not used to limit the utility model.
In the description of the present invention, it should be understood that term " length ", " width ", "upper", "lower", " preceding ",
The orientation or positional relationship of the instructions such as " rear ", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outside" be based on
Orientation or positional relationship shown in the drawings, is merely for convenience of describing the present invention and simplifying the description, rather than instruction or dark
Show that signified device or element must have a particular orientation, be constructed and operated in a specific orientation, therefore should not be understood as pair
The limitation of the utility model.In addition, the meaning of " plurality " is two or more in the description of the present invention, unless
Separately there is clearly specific restriction.
Fig. 1-3 is please referred to, the utility model provides a kind of technical solution: a kind of anti-reverse integrated circuit package structure, packet
Sealing assembly 1 and lower sealing assembly 2 are included, upper sealing assembly 1 includes upper cover 11, squeezes spring 12, expansion plate 13 and footing 14, upper cover 11
It is integrally formed with footing 14, and footing 14 is located at the lower surface of upper cover 11, expansion plate 13 is fixedly connected on upper cover 11, and is located at upper
The inside of lid 11 squeezes spring 12 and is fixedly connected on expansion plate 13, and is located inside expansion plate 13,
Lower sealing assembly 2 includes lower cover 21, hamper 23, pin 22 and substrate 24, and lower cover 21 is adapted with upper cover 11, and upper cover
11 are connected in lower cover 21 by footing 14, and pin 22 is fixedly connected on lower cover 21, and is located at the outer wall of lower cover 21, and substrate 24 is fixed
It is connected to lower cover 21 and is located at the inner wall of lower cover 21, the upper surface of hamper 23 offers docking groove 25, and hamper 23 and docking groove
25 is corresponding, and is connected in docking groove 25.
In the present embodiment, when being placed to equipment such as chips, it is necessary first to by the circuit pin of the chip, use
Conducting wire, which connects, to be guided at pin 22, first according to different chip sizes, should select different size of substrate, makes to open on substrate 24
If docking groove 25 be adapted with the size of chip, when chip is put into 24 inside of substrate, the opening of hamper 23 is gone out to be put into pair
Inside access slot 25, and then chip is placed on inside hamper 23, the activity space of chip is limited, and then enabled the chip to steady
Fixed is placed on substrate 24, the probability damaged when reducing chip transportation.
In the present embodiment, firstly, the chip placed will be needed to be put on substrate 24, since the upper surface of substrate 24 is opened
Equipped with docking groove 25, at the center that needs for chip to be placed on docking groove 25, then the opening of hamper 23 is gone out and is put into docking groove
Inside 25, and then chip is placed on inside hamper 23, the activity space of chip is limited, and then enables the chip to stable
It being placed on substrate 24, upper cover 11 is then placed on the upper surface of lower cover 21 by the probability damaged when reducing chip transportation, meanwhile,
The inner hollow of upper cover 11, and the hollow portion is adapted with hamper 23, after upper cover 11 is connected to each other with lower cover 21, footing 14 just blocks
Inside the card slot for entering lower cover 21, and then upper cover 11 is fixed on lower cover 21, while the hamper 23 on lower cover 21 is just hollow with this
Portion is connected to each other, meanwhile, expansion plate 13 is equipped in the inside of the hollow portion and squeezes spring 12, when expansion plate 13 connects with hamper 23
When touching, under the action of 13 Inner extrusion of expansion plate, expansion plate 13 is suitably started to shrink, while utilizing the elastic force for squeezing spring 12
Support, squeeze expansion plate 13 to hamper 23, placement that can be stable on substrate 24, after installation,
It is attached by pin 22 with external device (ED).
Further, in a rectangular parallelepiped shape, docking groove 25 is in rectangular shape for hamper 23, and the opening and docking groove of hamper 23
25 is corresponding.
In the present embodiment, when chip is put into 24 inside of substrate, the opening of hamper 23 is gone out to be put into docking groove 25
Portion, and then chip is placed on inside hamper 23, the activity space of chip is limited, and then enable the chip to stable placement
In the probability on substrate 24, damaged when reducing chip transportation.
Further, the junction of lower cover 21 and upper cover 11 offers card slot, which is adapted with footing 14, and footing
14 are contained in inside the card slot；The quantity of card slot and footing 14 is equipped with multiple, and each footing 14 and card slot correspond to each other.
In the present embodiment, after upper cover 11 and lower cover 21 are connected to each other, footing 14 is just caught in inside the card slot of lower cover 21,
And then upper cover 11 is fixed on lower cover 21, and footing 14 and card slot be equipped with it is multiple, can make upper cover 11 and lower cover 21 it
Between fixation it is more stable.
Further, the inside of upper cover 11 is in hollow form, and extruding spring 12 and expansion plate 13 are contained in the hollow portion
It is interior；Hollow portion is in rectangle, and is adapted with hamper 23；Squeeze spring 12 quantity be equipped with it is multiple, and along the length side of upper cover 11
To being arranged successively.
In the present embodiment, the inside of the hollow portion is equipped with expansion plate 13 and squeezes spring 12, when expansion plate 13 and lid
When box 23 is in contact, under the action of 13 Inner extrusion of expansion plate, expansion plate 13 is suitably started to shrink, while utilizing extruding spring
12 resilient support squeezes expansion plate 13 to hamper 23, placement that can be stable on substrate 24, multiple extruding
The setting of spring 12 is capable of providing maximum support to expansion plate 13.
Further, footing 14 is in hook, and the shape of card slot is identical in the shape of footing 14.
In the present embodiment, footing 14 is in hook, when footing 14 is caught in inside card slot, using the setting of the hook,
It can stablize and be caught in inside card slot, and make, the connection between upper cover 11 and lower cover 21 is more stable.
The above is only the preferred embodiment of the utility model only, is not intended to limit the utility model, all at this
Made any modifications, equivalent replacements, and improvements etc., should be included in the utility model within the spirit and principle of utility model
Protection scope within.
Claims (8)
1. a kind of anti-reverse integrated circuit package structure, which is characterized in that described including upper sealing assembly (1) and lower sealing assembly (2)
Upper sealing assembly (1) includes upper cover (11), squeezes spring (12), expansion plate (13) and footing (14), the upper cover (11) with it is described
Footing (14) is integrally formed, and the footing (14) is located at the lower surface of the upper cover (11), and the expansion plate (13) is fixed to be connected
It is connected to the upper cover (11), and is located at the inside of the upper cover (11), the extruding spring (12) is fixedly connected on described flexible
Plate (13), and it is located at the expansion plate (13) inside,
The lower sealing assembly (2) includes lower cover (21), hamper (23), pin (22) and substrate (24), the lower cover (21) and institute
It states upper cover (11) to be adapted, and the upper cover (11) is connected in the lower cover (21), the pin by the footing (14)
(22) it is fixedly connected on the lower cover (21), and is located at the outer wall of the lower cover (21), the substrate (24) is fixedly connected on institute
It states lower cover (21) and is located at the inner wall of the lower cover (21), the upper surface of the hamper (23) offers docking groove (25), and institute
It is corresponding with the docking groove (25) to state hamper (23), and is connected in the docking groove (25).
2. a kind of anti-reverse integrated circuit package structure as described in claim 1, which is characterized in that the hamper (23) is in length
Cube shape, the docking groove (25) is in rectangular shape, and the opening of the hamper (23) is corresponding with the docking groove (25).
3. a kind of anti-reverse integrated circuit package structure as described in claim 1, which is characterized in that the lower cover (21) and institute
The junction for stating upper cover (11) offers card slot, which is adapted with the footing (14), and the footing (14) is contained in
Inside the card slot.
4. a kind of anti-reverse integrated circuit package structure as claimed in claim 3, which is characterized in that the card slot and the bottom
The quantity of foot (14) is equipped with multiple, and each footing (14) and card slot correspond to each other.
5. a kind of anti-reverse integrated circuit package structure as described in claim 1, which is characterized in that the upper cover (11) it is interior
Portion is in hollow form, and the extruding spring (12) and the expansion plate (13) are contained in the hollow portion.
6. a kind of anti-reverse integrated circuit package structure as claimed in claim 5, which is characterized in that the hollow portion is in square
Shape, and be adapted with the hamper (23).
7. a kind of anti-reverse integrated circuit package structure as described in claim 1, which is characterized in that the extruding spring (12)
Quantity be equipped with multiple, and be arranged successively along the length direction of the upper cover (11).
8. a kind of anti-reverse integrated circuit package structure as claimed in claim 3, which is characterized in that the footing (14) is in hook
Shape, and the shape of card slot is identical in the shape of the footing (14).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821840295.3U CN209071310U (en) | 2018-11-09 | 2018-11-09 | A kind of anti-reverse integrated circuit package structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821840295.3U CN209071310U (en) | 2018-11-09 | 2018-11-09 | A kind of anti-reverse integrated circuit package structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209071310U true CN209071310U (en) | 2019-07-05 |
Family
ID=67098270
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821840295.3U Expired - Fee Related CN209071310U (en) | 2018-11-09 | 2018-11-09 | A kind of anti-reverse integrated circuit package structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209071310U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113035605A (en) * | 2021-02-26 | 2021-06-25 | 联合汽车电子有限公司 | Fixing structure of switch device and mounting method thereof |
-
2018
- 2018-11-09 CN CN201821840295.3U patent/CN209071310U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113035605A (en) * | 2021-02-26 | 2021-06-25 | 联合汽车电子有限公司 | Fixing structure of switch device and mounting method thereof |
| CN113035605B (en) * | 2021-02-26 | 2024-04-16 | 联合汽车电子有限公司 | Fixing structure of switching device and mounting method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US8471381B2 (en) | Complete power management system implemented in a single surface mount package | |
| US8633579B2 (en) | Multi-chip package and method of manufacturing the same | |
| US8097956B2 (en) | Flexible packaging for chip-on-chip and package-on-package technologies | |
| TW200527563A (en) | Inverted J-lead package for power devices | |
| TW447059B (en) | Multi-chip module integrated circuit package | |
| CN209071310U (en) | A kind of anti-reverse integrated circuit package structure | |
| CN106358411B (en) | Convertor device and convertor device manufacturing method | |
| KR101133054B1 (en) | Battery pack with nfc antenna | |
| JP2819433B2 (en) | Apparatus for mounting an integrated circuit on a base | |
| CN207973013U (en) | A kind of placement stable type LED light box for transport | |
| CN103348471B (en) | Semiconductor chip, memory device | |
| KR101219086B1 (en) | Package module | |
| CN212461690U (en) | TVS suppression protection and follow current protection type rectifier bridge integrated packaging module | |
| CN216528885U (en) | Novel integrated IC and display touch device | |
| US11533819B2 (en) | Method for manufacturing a stack structure | |
| CN205984972U (en) | Lead frame structure | |
| CN218022974U (en) | Storage device for integrated circuit chip transportation | |
| CN214898435U (en) | Dual in-line integrated circuit packaging shell | |
| CN204633435U (en) | A kind of wireless charging device | |
| CN216902922U (en) | Lead frame and semiconductor device | |
| CN208336206U (en) | Patch encapsulating structure and electronic equipment | |
| US20080303130A1 (en) | Package on package structure | |
| CN206584929U (en) | Semiconductor package | |
| JPS5821180Y2 (en) | semiconductor equipment | |
| CN208706639U (en) | Inline package structure and electronic equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190705 Termination date: 20211109 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |