CN208985075U - Host - Google Patents

Abstract

The utility model provides a kind of host, which includes: cabinet, displacement piece and at least one circuit board being arranged in cabinet；Displacement piece connect with cabinet and for supporting circuit board to the heat dissipation inner wall of cabinet, contacts the first radiator on circuit board with the heat dissipation inner wall of cabinet；While the first radiator rejects heat to cabinet inside, it also rejects heat on heat dissipation inner wall, and then it is rejected heat in the air outside cabinet by cabinet, accelerate rate of first radiator to external release heat, heat dissipation effect is preferable, circuit board overheat is avoided, in order to avoid influence host work.

Description

Host

Technical field

The utility model relates to case radiation field more particularly to a kind of hosts.

Background technique

It calculates often with the host for having control other equipment work in equipment, host generally comprises cabinet and is arranged in cabinet Interior circuit board；It is provided with chip on circuit board, multiple cooling fins are provided on chip, for being chip cooling.In routine In heat sink conception, cooling fin in conjunction with the chip on circuit board after be placed in cabinet, and by fan by convection will Heat passes to the external world.

However, the heat that chip generates when running is also more when the number of chips on circuit board is more, only pass through fan Convection current is ineffective come the mode that radiates to cooling fin and circuit board, and circuit board is be easy to cause to overheat, and then influences master Machine work.

Utility model content

The utility model embodiment provides a kind of host, slower to the rate of external release heat to solve cooling fin, dissipates The technical issues of thermal effect is bad, be easy to cause circuit board to overheat, influences host work.

The utility model embodiment provides a kind of host, comprising: cabinet, displacement piece and is arranged in the cabinet extremely A few circuit board；The displacement piece connect with the cabinet and for supporting the circuit to the heat dissipation inner wall of the cabinet Plate contacts the first radiator on the circuit board with the heat dissipation inner wall of the cabinet.

Host as described above, it is preferable that be provided with heat-conducting piece on first radiator；The heat-conducting piece is dissipated with described Hot inner wall contact.

Host as described above, it is preferable that the heat-conducting piece includes heat-conducting plate, the thermal conductive surface on the heat-conducting plate with it is described The inner wall that radiates contacts.

Host as described above, it is preferable that the heat-conducting piece is thermally conductive rubber mat, and the thermally conductive rubber mat is connected to described first Between radiator and the heat dissipation inner wall.

Host as described above, it is preferable that the heat-conducting glue rubber mat is silicagel pad.

Host as described above, it is preferable that the displacement piece includes the first locking bar, in the first installation on the cabinet The first slot is provided on wall, one end of the circuit board has the first plug division being plugged in first slot, described First locking bar is arranged in first slot.

Host as described above, it is preferable that the displacement piece further includes the second locking bar, have on the cabinet with it is described First installation inner wall disposed in parallel second installs inner wall, is provided with the second slot, the circuit on the second installation inner wall The other end of plate has the second plug division being plugged in second slot, and the second locking bar setting is inserted described second In slot.

Host as described above, it is preferable that is be spaced on the outer wall of the cabinet is provided with multiple radiating fins.

Host as described above, it is preferable that the radiating fin and the cabinet are integrally formed.

Host as described above, it is preferable that the second radiator is additionally provided on the circuit board；Second radiator is set It sets on the another side of the circuit board opposite with first radiator.

Host provided by the embodiment of the utility model, displacement piece supports circuit board to the heat dissipation inner wall of cabinet, so that circuit The first radiator on plate is contacted with the heat dissipation inner wall of cabinet；Cabinet is only rejected heat to the first radiator in the prior art Inside is compared, and host provided in this embodiment also releases heat while the first radiator rejects heat to cabinet inside It is put on heat dissipation inner wall, and then is rejected heat in the air outside cabinet by cabinet, it is outside to accelerate the first radiator Portion discharges the rate of heat, and heat dissipation effect is preferable, avoids circuit board overheat, in order to avoid influence host work.

Detailed description of the invention

In order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be to embodiment Or attached drawing needed to be used in the description of the prior art is briefly described, it should be apparent that, the accompanying drawings in the following description is Some embodiments of the utility model, for those of ordinary skill in the art, without creative efforts, It is also possible to obtain other drawings based on these drawings.

Fig. 1 is the structural schematic diagram of host provided in this embodiment；

Fig. 2 is the structural schematic diagram of circuit board in Fig. 1.

Description of symbols:

1, host；

10, cabinet；

101, accommodating chamber；

102, side is connected；

103, radiating fin；

1011, radiate inner wall；

1012, the first installation inner wall；

1013, the second installation inner wall；

20, circuit board；

201, the first radiator；

202, the second radiator；

203, the first locking bar；

204, the second locking bar；

2011, heat-conducting piece.

Specific embodiment

It is practical new below in conjunction with this to keep the objectives, technical solutions, and advantages of the embodiments of the present invention clearer Attached drawing in type embodiment, the technical scheme in the utility model embodiment is clearly and completely described, it is clear that is retouched The embodiment stated is the utility model a part of the embodiment, instead of all the embodiments.Based on the implementation in the utility model Example, every other embodiment obtained by those of ordinary skill in the art without making creative efforts belong to The range of the utility model protection.In the absence of conflict, the feature in following embodiment and embodiment can be mutual group It closes.

Fig. 1 is the structural schematic diagram of host provided in this embodiment；Fig. 2 is the structural schematic diagram of circuit board in Fig. 1.

Please refer to Fig. 1 and Fig. 2.The present embodiment provides a kind of hosts 1, comprising: cabinet 10, displacement piece and setting are in cabinet At least one circuit board 20 in 10；Displacement piece connect with cabinet 10 and for supporting electricity to the heat dissipation inner wall 1011 of cabinet 10 Road plate 20 contacts the first radiator 201 on circuit board 20 with the heat dissipation inner wall 1011 of cabinet 10.

In the present embodiment, the shape of cabinet 10 can be cuboid or square.Cabinet 10 has accommodating chamber 101, circuit Plate 20 is arranged in accommodating chamber 101.For ease of description, by cabinet 10 in a rectangular parallelepiped shape for, certain side plate and cabinet 10 Between dismountable mode such as can be bolted or be clamped and connect, in order to by side plate by being dismantled on cabinet 10 under Come, and then installs or replace circuit board 20.

In the present embodiment the heat dissipation inner wall 1011 of cabinet 10 can there are many, as long as guaranteeing heat dissipation inner wall 1011 and circuit board The 20 parallel and inner walls 1011 that radiate are towards the first radiator 201 on circuit board 20.In a rectangular parallelepiped shape with accommodating chamber 101 For, heat dissipation inner wall 1011 can be inner wall parallel with connection side 102 in accommodating chamber 101, or heat dissipation inner wall 1011 is The inner wall vertical with side 102 is connect in accommodating chamber 101.With orientation shown in FIG. 1, the inner wall 1011 that radiates is in accommodating chamber 101 With connect side 102 it is vertical and be located at the rightmost side inner wall.

The first radiator 201 is located between circuit board 20 and heat dissipation inner wall 1011 in the present embodiment.Specifically, displacement piece can Thinking arbitrarily can support circuit board 20 to heat dissipation inner wall 1011, so that the first radiator 201 was contacted with heat dissipation inner wall 1011 Device.Such as: displacement piece includes the first locking bar 203, is provided with the first slot on the first installation inner wall 1012 on cabinet 10, One end of circuit board 20 has the first plug division being plugged in the first slot, and the first locking bar 203 is arranged in the first slot.

Specifically, the first installation inner wall 1012 on cabinet 10 is adjacent with heat dissipation inner wall 1011 on cabinet 10, and vertical For the inner wall of heat dissipation inner wall 1011, the orientation shown in Fig. 1, the first installation inner wall 1012 is in 101 the lowermost of accommodating chamber Wall；For the setting of first slot on the first installation inner wall 1012, the extending direction of the first slot is parallel with heat dissipation inner wall 1011.Accordingly , circuit board 20 is perpendicular to the first installation inner wall 1012 and is parallel to the heat dissipation setting of inner wall 1011, sets in the bottom end of circuit board 20 Be equipped with the first plug division, the first plug division is plugged in the first slot, the first slot away from heat dissipation inner wall 1011 side with There is gap, the first locking bar 203 is arranged in gap, and the first locking bar 203 can be to heat dissipation inner wall between first plug division 1011 support the first plug division, so that circuit board 20 is mobile to heat dissipation inner wall 1011, and then make in the first radiator 201 and heat dissipation Wall 1011 contacts.

Further, locking bar may include the first latch segment, the second latch segment and slipping block, and slipping block setting is the Between one latch segment and the second latch segment, offer locking hole on the first latch segment, locking hole through the first latch segment and Slipping block, has locking screw pit on the second latch segment, and lock-screw is threaded through in locking hole and is screwed into locking screw pit； It is provided with the first sliding inclined-plane on first latch segment, the second sliding with the first sliding inclined-plane cooperation is provided on the second latch segment Inclined-plane；In use, locking bar is arranged in the first slot and sets the center line of locking hole along the extending direction of the first slot It sets, screws lock-screw later, so that the first clamping block and second piece of inside extruding slipping block, and then keep slipping block sliding along first Inclined-plane and the second sliding inclined-plane sliding are moved, so that slipping block is mobile to the direction perpendicular to locking centerline hole, and then slipping block Circuit board 20 is supported to heat dissipation inner wall 1011.Alternatively, the first locking bar 203 includes elastic body, lock is provided in elastic body Tieholen, lock-screw are threaded through in locking hole by one end of elastic body, are provided with and locking screw in the other end of elastic body Follow closely the locking nut of cooperation；In use, being arranged elastic body in the first slot, and make the center line of lock-screw along first The extending direction of slot is arranged, and screws lock-screw later, and locking nut and lock-screw clamp elastic body, so that elasticity is originally Body is expanded to two sides, and then supports circuit board 20 to heat dissipation inner wall 1011.Certainly the first locking bar 203 in other implementations There can also be other structures.

In the present embodiment, the first plug division can be in the protrusion with the cooperation of the first slot of one end of circuit board 20 formation Portion.

Further, displacement piece further includes the second locking bar 204, is had on cabinet 10 and the first installation inner wall 1012 Disposed in parallel second installs inner wall 1013, is provided with the second slot, the other end of circuit board 20 on the second installation inner wall 1013 With the second plug division being plugged in the second slot, the second locking bar 204 is arranged in the second slot.20 one end of circuit board First plug division is plugged in the first slot, and the second plug division of the other end of circuit board 20 is plugged in the second slot, can be with The bonding strength between circuit board 20 and cabinet 10 is further increased, in case circuit board 20 is shaken when in use；In addition, the One locking bar 203 and the second locking bar 204 can support circuit board to heat dissipation inner wall 1011 simultaneously, and 20 stress of circuit board is more equal It is even, in order to avoid 20 run-off the straight of circuit board.

Specifically, the structure of the second plug division and the first plug division is substantially the same, and the structure of the second locking bar 204 with The structure of first locking bar 203 is substantially the same.First locking bar 203 and the second locking bar 204 can be arranged on cabinet 10； Certain first locking bar 203 and the second locking bar 204 can also be arranged on circuit board 20, with continued reference to Fig. 2, the first locking The bottom end of circuit board 20 is arranged in item 203, and the top of circuit board 20 is arranged in the second locking bar 204.

In other implementations, displacement piece can also have other structures, such as: displacement piece includes supporting bolt, Plate is supported in setting on the first installation inner wall 1012, is supported to be provided on plate and is supported threaded hole, and the center line for supporting threaded hole hangs down Directly it is arranged in heat dissipation inner wall 1011；It supports in circuit board 20 end supported bolt to be screwed into screw hole, and support bolt On, supporting bolt by torsion can be to support circuit board 20 to heat dissipation inner wall 1011, so that first on circuit board 20 is radiated Device 201 is contacted with heat dissipation inner wall 1011.

In the present embodiment, the structure of the first radiator 201 can there are many, as long as the chip on circuit board 20 can be produced Raw heat transfer is into the heat dissipation inner wall 1011 and air of cabinet 10；Such as: the first radiator 201 includes multiple flat Row setting cooling fin, one end of cooling fin are connect with circuit board 20, the other end of cooling fin and the heat dissipation inner wall 1011 of cabinet 10 Contact.Certain first radiator 201 can also include heat sink, and a side of heat sink is connect with circuit board 20, heat sink In the another side opposite with the side contacted with heat dissipation inner wall 1011；The multiple heat release holes of the setting being spaced on heat sink, to increase Add the contact area of heat sink and air；It the section of heat release hole specifically can the regular shape such as rounded, rectangle, regular hexagon The section of shape or heat release hole is in other irregular shapes.

It is worth noting that, host 1 provided in this embodiment can also include fan, accordingly on the side wall of cabinet 10 Offer air outlet, fan is arranged in air outlet, and when fan work can be by the higher air delivery of 10 internal temperature of cabinet To the outside of cabinet 10, with to being cooled down in cabinet 10.

The course of work of host 1 provided in this embodiment are as follows: when host 1 works, the chip on circuit board 20 generates heat A part of heat is discharged into the air inside cabinet 10 by amount, heat transfer to the first radiator 201, the first radiator 201, At the same time, the first radiator 201 is by the heat dissipation inner wall 1011 of a part of heat transfer to cabinet 10, and then passes through cabinet 10 It rejects heat in the air outside cabinet 10, to realize the cooling to chip on circuit board 20.

Host 1 provided in this embodiment, displacement piece supports circuit board 20 to the heat dissipation inner wall 1011 of cabinet 10, so that circuit The first radiator 201 on plate 20 is contacted with the heat dissipation inner wall 1011 of cabinet 10；It will with 201, the first radiator in the prior art Heat is discharged into inside cabinet 10 and compares, and host 1 provided in this embodiment rejects heat to cabinet 10 in the first radiator 201 While internal, also reject heat on heat dissipation inner wall 1011, and then rejected heat to outside cabinet 10 by cabinet 10 Air in, accelerate the first radiator 201 to the rate of external release heat, heat dissipation effect is preferable, avoids circuit board 20 Overheat works in order to avoid influencing host 1.

In the present embodiment, heat-conducting piece 2011 is provided on the first radiator 201；Heat-conducting piece 2011 connects with heat dissipation inner wall 1011 Touching.By heat-conducting piece 2011 by the heat transfer in the first radiator 201 to heat dissipation inner wall 1011, heat transfer speed is accelerated Rate.

In a kind of embodiment, heat-conducting piece 2011 can be heat-conducting plate, thermal conductive surface and heat dissipation inner wall 1011 on heat-conducting plate Contact.Thermal conductive surface on heat-conducting plate is contacted with heat dissipation inner wall 1011, in scraggly structure on heat-conducting piece 2011 and heat dissipation The contact of wall 1011 is compared, and contact area between heat-conducting piece 2011 and heat dissipation inner wall 1011 is increased, to further speed up heat-conducting piece Heat transfer rate between 2011 and the heat dissipation inner wall 1011 of cabinet 10.

Specifically, heat-conducting plate can be the copper sheet that the first radiator 201 is arranged in and is arranged towards heat dissipation inner wall 1011.Certainly The plate that heat-conducting plate can also be constituted for the faster material of other heat conduction rates.

In another embodiment, heat-conducting piece 2011 can also be thermally conductive rubber mat.The heat transfer rate of thermally conductive rubber mat compared with Fastly, the heat transfer rate that can be further improved the first radiator 201 between the inner wall 1011 that radiates；In addition, thermally conductive rubber mat Stickiness it is preferable, can be further improved the bonding strength between circuit board 20 and cabinet 10.

Further, thermally conductive rubber mat can be the silicagel pad being mainly made of silica gel；The thermally conductive rubber mat being made of silica gel Heat transfer rate is very fast, and stickiness is higher.Certainly, thermally conductive rubber mat can also be by other faster materials of heat transfer rate Texture at.

In the present embodiment, multiple radiating fins 103 are provided on the outer wall of cabinet 10.It is arranged in more on 10 outer wall of cabinet A radiating fin 103, can increase the contact area of cabinet 10 outer wall and outside air, to accelerate cabinet 10 and outside air Heat transfer rate.

Specifically, radiating fin 103 can be set on the side wall where heat dissipation inner wall 1011, so that heat dissipation inner wall 1011 On heat can be quickly discharged into air through radiating fin 103.Certain radiating fin 103 can also be uniformly arranged in On all side walls of cabinet 10；A kind of heat dissipation on 10 side wall of cabinet in achievable mode, where heat dissipation inner wall 1011 The distribution density of fin 103 is greater than the distribution density of radiating fin 103 on other side walls of cabinet 10.

Further, radiating fin 103 and cabinet 10 are integrally formed.The side that radiating fin 103 passes through casting or injection molding Formula and cabinet 10 are integrally formed, and simplify the process of radiating fin 103.

Certainly in other implementations, the modes such as radiating fin 103 can also be bolted or be clamped with The side wall of cabinet 10 connects.

In the present embodiment, the second radiator 202 is additionally provided on circuit board 20；The first heat dissipation of second radiator 202 setting On the another side of the opposite circuit board 20 of device 201.First radiator 201 and the second radiator 202 are separately positioned on circuit board 20 Two sides on, can be further improved the cooling effect to circuit board 20.

Further, the structure of the second radiator 202 and the first radiator 201 can be identical, and details are not described herein.

When in the application, although term " first ", " second " etc. may be used in this application to describe respectively Element, but these elements should not be limited by these terms.These terms are only used to by an element and another element region It does not open.For example, in the case where not changing the meaning of description, first element can be called second element, and same, second Element can be called first element, as long as " second yuan that " first element " occurred is unanimously renamed and occurred Part " unanimously renames.First element and second element are all elements, but can not be identical element.

Word used herein is only used for description embodiment and is not used in limitation claim.Such as embodiment with And used in the description of claim, unless context clearly illustrates, otherwise "one" (a) of singular, "one" (an) and " described " (the) is intended to include equally plural form.Similarly, term "and/or" as used in this specification Refer to comprising one or more associated any and all possible combinations listed.In addition, when being used for the application When middle, term " includes " (comprise) and its modification " comprising " (comprises) and/or refer to including (comprising) etc. old The presence of feature, entirety, step, operation, element and/or the component stated, but be not excluded for one or more other features, Entirety, step, operation, element, component and/or these grouping presence or addition.

Above-mentioned technical description can refer to attached drawing, these attached drawings form a part of the application, and by description attached The embodiment according to described embodiment is shown in figure.Although the description of these embodiments is enough in detail so that this field Technical staff can be realized these embodiments, but these embodiments are non-limiting；Other implementations thus can be used Example, and variation can also be made in the case where not departing from the range of described embodiment.For example, described in flow chart Operation order be non-limiting, therefore in flow charts illustrate and according to flow chart description two or more behaviour The sequence of work can be changed according to several embodiments.As another example, in several embodiments, it explains in flow charts It releases and is optional or deletable according to one or more operations that flow chart describes.In addition, certain steps or Function can be added in the disclosed embodiments or more than two sequence of steps are replaced.All these variations are considered Included in the disclosed embodiments and claim.

In addition, using term to provide the thorough understanding of described embodiment in above-mentioned technical description.However, and being not required to Will excessively detailed details to realize described embodiment.Therefore, the foregoing description of embodiment be in order to illustrate and describe and It presents.The embodiment and example disclosed according to these embodiments presented in foregoing description is provided separately, with Addition context simultaneously helps to understand described embodiment.Description above, which is not used in, accomplishes exhaustive or by described reality Apply the precise forms that example is restricted to the disclosure.According to the above instruction, it is several modification, selection be applicable in and variation be feasible.? In some cases, processing step well known is not described in avoid described embodiment is unnecessarily influenced.

Claims (10)

1. a kind of host characterized by comprising cabinet, displacement piece and at least one circuit being arranged in the cabinet Plate；The displacement piece connect with the cabinet and for supporting the circuit board to the heat dissipation inner wall of the cabinet, makes the electricity The first radiator on the plate of road is contacted with the heat dissipation inner wall of the cabinet.

2. host according to claim 1, which is characterized in that be provided with heat-conducting piece on first radiator；It is described to lead Warmware is contacted with the heat dissipation inner wall.

3. host according to claim 2, which is characterized in that the heat-conducting piece includes heat-conducting plate, on the heat-conducting plate Thermal conductive surface is contacted with the heat dissipation inner wall.

4. host according to claim 2, which is characterized in that the heat-conducting piece is thermally conductive rubber mat, and the thermally conductive rubber mat connects It connects between first radiator and the heat dissipation inner wall.

5. host according to claim 4, which is characterized in that the heat-conducting glue rubber mat is silicagel pad.

6. host according to claim 1-5, which is characterized in that the displacement piece includes the first locking bar, institute It states and is provided with the first slot on the first installation inner wall on cabinet, one end of the circuit board, which has, is plugged in first slot The first interior plug division, first locking bar are arranged in first slot.

7. host according to claim 6, which is characterized in that the displacement piece further includes the second locking bar, the cabinet Above have and inner wall is installed with the first installation inner wall disposed in parallel second, it is slotting to be provided with second on the second installation inner wall Slot, the other end of the circuit board have the second plug division being plugged in second slot, the second locking bar setting In second slot.

8. host according to claim 1-5, which is characterized in that be provided with multiple dissipate on the outer wall of the cabinet Hot fin.

9. host according to claim 8, which is characterized in that the radiating fin and the cabinet are integrally formed.

10. host according to claim 1-5, which is characterized in that be additionally provided with second on the circuit board and dissipate Hot device；

Second radiator is arranged on the another side of the circuit board opposite with first radiator.