CN108036284B

CN108036284B - Self-adaptive heat dissipation equipment

Info

Publication number: CN108036284B
Application number: CN201711243225.XA
Authority: CN
Inventors: 叶伟炳
Original assignee: Dongguan Wenyu Industrial Co Ltd
Current assignee: Dongguan Wenyu Industrial Co Ltd
Priority date: 2017-11-30
Filing date: 2017-11-30
Publication date: 2020-03-24
Anticipated expiration: 2037-11-30
Also published as: CN108036284A

Abstract

An adaptive heat dissipation device, comprising: the shell covers the radiating component, the radiating component is connected with the heat conducting plate, and the mounting plate is arranged on the heat conducting plate; the heat conducting plate is of a rectangular structure; the heat conducting plate is provided with a regular installation surface with a plane structure, and the installation surface is back to the heat radiating assembly; the mounting plate is provided with a plurality of sliding grooves; the side wall of the sliding groove is provided with a limiting clamping groove, and the plurality of sliding grooves and the limiting clamping grooves are jointly used for connecting and installing the LED lamp. The self-adaptive heat dissipation equipment is simple and reasonable in structure. The efficiency of rapidly installing and replacing the LED lamp can be realized, the heat dissipation assembly does not need to be disassembled in the installation process, and the heat dissipation assembly is not easy to damage; meanwhile, the radiating requirement of the high-power LED lamp can be met under the action of the shell, the radiating assembly, the heat conducting plate and the like, heat generated by the LED lamp core can be quickly radiated to the outside, and the radiating efficiency is improved.

Description

Self-adaptive heat dissipation equipment

Technical Field

The invention relates to the technical field of household appliance heat dissipation, in particular to self-adaptive heat dissipation equipment.

Background

With the development of science and technology and social economy, the progress of science and technology is affecting social economy and changing the life style of people. Especially, under the rapid development of Light Emitting Diodes (LEDs), the LEDs are applicable to a wider and wider environment, and the heat generated during the operation thereof not only affects the lighting effect of the LEDs, but also affects the service life of the LEDs.

However, the conventional heat sink and LED lamp are connected in an integrated manner, for example, the LED circuit board is directly attached to the heat sink, and this manner often requires replacing the LED lamp when the LED lamp is damaged, but it is difficult to replace the LED lamp quickly in this mounting manner, and the heat sink is easily damaged.

Disclosure of Invention

Therefore, it is necessary to provide an adaptive heat dissipation apparatus for solving the technical problems of low efficiency of replacing LED lamps and easy damage to heat sinks.

An adaptive heat dissipation device, comprising: the heat dissipation device comprises a shell, a heat dissipation assembly, a heat conduction plate and a mounting plate, wherein the shell covers the heat dissipation assembly, the heat dissipation assembly is connected with the heat conduction plate, and the mounting plate is arranged on the heat conduction plate; the heat conducting plate is of a rectangular structure; the heat conducting plate is provided with a regular plane structure mounting surface, and the mounting surface faces away from the heat radiating assembly; the mounting plate is provided with a plurality of sliding grooves; the side wall of the sliding groove is provided with a limiting clamping groove, and the plurality of sliding grooves and the limiting clamping grooves are jointly used for connecting and installing the LED lamp.

In one embodiment, the sliding grooves are arranged in a row and are arranged on the mounting plate in parallel.

In one embodiment, the sliding slot is a rectangular structure.

In one embodiment, the number of the sliding grooves is five.

In one embodiment, five sliding grooves are uniformly arranged on the mounting plate in a row.

In one embodiment, the two side walls of the sliding groove in the middle area of the mounting plate in the five sliding grooves are provided with the limiting clamping grooves.

In one embodiment, the limiting clamping groove is of a semi-arc structure.

In one embodiment, the limiting clamping groove is of a rectangular structure.

In one embodiment, the length of the limiting clamping groove is smaller than that of the sliding groove.

In one embodiment, at least one of the two side walls of the sliding groove is provided with the limiting clamping groove.

The self-adaptive heat dissipation equipment is simple and reasonable in structure, the mounting plate is provided with the plurality of sliding grooves, the side walls of the sliding grooves are provided with the limiting clamping grooves, and the sliding grooves are used for being connected and mounted with the LED lamp together, so that the LED lamp can be quickly mounted and replaced, the heat dissipation assembly is not required to be dismounted in the mounting process, and the heat dissipation assembly is not easy to damage; meanwhile, the radiating requirement of the high-power LED lamp can be met under the action of the shell, the radiating assembly, the heat conducting plate and the like, heat generated by the LED lamp core can be quickly radiated to the outside, and the radiating efficiency is improved.

Drawings

FIG. 1 is a schematic structural diagram of an adaptive heat dissipation apparatus according to an embodiment;

FIG. 2 is a schematic structural diagram of another view of the adaptive heat dissipation apparatus in the embodiment of FIG. 1;

FIG. 3 is a schematic diagram illustrating another perspective view of an adaptive heat dissipation apparatus according to an embodiment;

FIG. 4 is a schematic cross-sectional view of the adaptive heat dissipation device A-A in the embodiment shown in FIG. 3;

FIG. 5 is a schematic cross-sectional view of an adaptive heat dissipation apparatus in another embodiment;

FIG. 6 is an enlarged schematic structural diagram of a portion A of the adaptive heat dissipation apparatus in the heated state in the embodiment shown in FIG. 5;

fig. 7-1 and 7-2 are a schematic structural diagram of a thermal bimetal at normal temperature and a schematic structural diagram at a heated state, respectively, according to an embodiment;

FIG. 8 is a schematic view of an embodiment of a lighting device;

FIG. 9 is a schematic view of an embodiment of a disassembled lighting device;

FIG. 10 is a schematic diagram of an LED lamp assembly according to one embodiment.

Detailed Description

In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.

In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the invention and to simplify the description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting of the invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

In the present invention, unless otherwise expressly stated or limited, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through an intermediate. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein are for illustrative purposes only and do not denote a unique embodiment.

Referring to fig. 1, the adaptive heat dissipation apparatus 10 includes: the heat dissipation device comprises a shell 100, a heat dissipation assembly 200, a heat conduction plate 300 and a mounting plate 400, wherein the shell 100 covers the heat dissipation assembly 200, the heat dissipation assembly 200 is connected with the heat conduction plate 300, and the mounting plate 400 is arranged on the heat conduction plate 300; the heat conducting plate 300 is of a rectangular structure; the heat conducting plate 300 has a regular planar structure of the mounting surface 310, and the mounting surface 310 faces away from the heat dissipating assembly 200.

The housing 100 serves to perform the functions of mounting to the outside, dust prevention, and uniform appearance. For example, the housing 100 is an aluminum profile. For example, the housing has a receiving cavity in which the heat dissipation assembly is embedded. For example, the heat dissipation assembly is fixed in the accommodating cavity by welding with the shell; for another example, the heat dissipation assembly is fixed in the accommodating cavity by screwing the housing with a screw.

The heat sink assembly 200 is used for absorbing heat, conducting heat and dissipating heat, so as to absorb and conduct the heat transferred from the heat conducting plate 300 to the outside, thereby dissipating the heat to the air outside the heat sink assembly 200, and then dissipating the heat out of the heat sink completely by the flow of the air. For example, the heat dissipation assembly is an aluminum profile.

The heat conductive plate 300 serves to rapidly conduct heat. For example, the contact surfaces of the heat conducting plate and the heat dissipation assembly are completely attached after the heat conducting plate and the heat dissipation assembly are connected. For example, the heat conductive plate 300 is an aluminum profile. For another example, the heat conducting plate is connected with the heat radiating assembly through heat conducting glue with a large heat conducting coefficient, so that the heat conducting efficiency is improved. The heat-conducting glue can be one or more of ultra-high temperature heat-conducting glue, organic silicon heat-conducting glue, epoxy resin AB glue, polyurethane heat-conducting and electric-conducting glue, heat-conducting silicone grease and the like.

The mounting board 400 serves to connect and mount the LED lamp. That is, the LED lamp is mounted on the heat sink by the mounting assembly, and particularly, the LED lamp is stably and firmly brought into sufficient contact with the mounting surface 310 of the heat conductive plate 300 after being mounted. For example, the mounting plate 400 is an aluminum profile.

The mounting plate 400 is provided with a plurality of sliding grooves 410; the side wall of the sliding groove 410 is provided with a limit clamping groove 411, and the sliding groove 410 and the limit clamping groove 411 are used for connecting and installing an LED lamp. That is, the sliding grooves 410 and the limit slots 411 disposed on the side walls of the sliding grooves 410 are used together to mount LED lamps.

The self-adaptive heat dissipation device 10 is simple and reasonable in structure. The mounting plate 400 is provided with the plurality of sliding grooves 410, and the side walls of the sliding grooves 410 are provided with the limiting clamping grooves 411 which are used for connecting and mounting the LED lamps together, so that the LED lamps can be rapidly mounted and replaced, and the heat dissipation assembly 200 does not need to be detached in the mounting process, so that the heat dissipation assembly 200 is not easy to damage; meanwhile, the heat dissipation requirement of the high-power LED lamp can be met under the effects of the shell 100, the heat dissipation assembly 200, the heat conduction plate 300 and the like, heat generated by the LED lamp core can be quickly dissipated to the outside, and the heat dissipation efficiency is improved.

For example, the plurality of sliding grooves 410 are provided in parallel in a row on the mounting plate 400. For example, the sliding slot 410 has a rectangular structure. For example, the number of the sliding grooves 410 is five. For example, five sliding grooves 410 are uniformly formed in the mounting plate 400 in a row. For example, the two side walls of the sliding groove 410 located in the middle region of the mounting plate 400 in the five sliding grooves 410 are all provided with the limiting clamping groove 411. For example, the limiting slot 411 has a semi-arc structure. For example, the limiting slot 411 has a rectangular structure. For example, the length of the limit slot 411 is smaller than the length of the sliding slot 410. For example, at least one of the two side walls of the sliding groove 410 is provided with the limit slot 411. In this way, the plurality of sliding grooves 410 arranged in parallel in a row can better complete the installation and connection with the LED lamp.

Referring to fig. 3 and 4, for example, the housing 100 is a hollow rectangular body with one side open for improving heat dissipation efficiency. A plurality of vent holes 101 are opened in four side walls of the casing 100. For example, a plurality of ventilation holes 101 are opened in the middle regions of the four side walls of the housing 100, respectively. For example, the plurality of vent holes 101 are arranged in a matrix. As another example, the plurality of vent holes 101 of the opposite sidewalls of the housing 100 correspond to each other. The ventilation hole 101 is a circular hole or a square hole. Thus, air outside the casing 100 can enter the inside of the casing 100 through the plurality of ventilation holes 101, so that relatively flowing air is formed inside the casing 100, thereby better dissipating heat inside the casing 100 to the outside.

In order to accelerate the outflow of air from the inside of the casing 100 to the outside, for example, an air passage 102 having a cross-shaped structure is provided in the casing 100. The air passage 102 has four ports, which communicate with the vent holes 101 of the four side walls of the casing 100, respectively. In this way, since the air passage 102 is not blocked by an obstacle, the air flow is not blocked, and a certain air flow speed is ensured, thereby accelerating the outflow of the air inside the case 100 to the outside. Further, in conjunction with fig. 4 and 5, for example, the interior of the housing 100 is divided into four heat dissipation areas 103 by the air passage 102. A plurality of heat dissipation fins 201 are arranged in each heat dissipation area 103. For example, the heat dissipation assembly 200 includes a heat dissipation plate 201 and four heat dissipation plate groups 202, and each heat dissipation plate group 202 is correspondingly disposed in one heat dissipation region 103. The heat sink 201 is connected to a side of the case 100. For example, the heat sink 201 is welded to the side of the housing 100. For example, the heat sink 201 is connected to the side of the housing 100 by heat dissipation reinforcing columns. For example, the heat sink 201 is welded to the side of the housing 100 via heat dissipation reinforcing columns. Fin group 202 includes a plurality of first fins 212 and a plurality of second fins 222. The first heat radiation fins 212 and the second heat radiation fins 222 are arranged on the heat radiation plate 201. For example, the plurality of first heat sinks 212 and the plurality of second heat sinks 222 are alternately arranged. For another example, after the plurality of first heat dissipation fins 212 are uniformly arranged in a row on the heat dissipation plate 201, every three second heat dissipation fins 222 of the plurality of second heat dissipation fins 222 are arranged between two first heat dissipation fins 212 in a group. In this embodiment, the height of the first heat sink 212 is greater than the height of the second heat sink 222. For example, the first and

second heat sinks

212 and 222 are both aluminum profiles. For example, the first and

second fins

212 and 222 are each a plate-shaped aluminum profile. In this way, the air inside the housing 100 can be rapidly discharged to the outside through the air passages 102 in the cross-shaped structure while taking away the heat from the first and second

heat dissipation fins

212 and 222.

To further improve the heat dissipation efficiency, as shown in fig. 4, 5 and 6, for example, the heat dissipation assembly 200 further includes a plurality of thermal bimetal sets 203, and each thermal bimetal set 203 is correspondingly disposed in two opposite heat dissipation regions 103. For example, the thermal bimetal strip set 203 includes a plurality of thermal bimetal strips 213, the plurality of thermal bimetal strips 213 are distributed in a row in the two opposite heat dissipation areas 103, and two ends of each thermal bimetal strip 213 are respectively connected to the plurality of second heat dissipation fins 222 in the two heat dissipation areas 103. In this embodiment, two ends of each thermal bimetal 213 are correspondingly connected to three second heat sinks 222, respectively. For example, the heat dissipation plate 201 is provided with a plurality of through slots 250, and each through slot 250 is correspondingly penetrated by one of the second heat dissipation fins 222. Further, the heat conducting plate 300 is provided with a plurality of heat conducting holes 350, the heat conducting holes 350 correspond to the through slots 250, each heat conducting hole 350 corresponds to one through slot 250, and the second heat sink 222 is inserted into the through slot 250 after penetrating through the through slot 250. In this embodiment, the heat conducting plate 300 is a hollow rectangular structure. The heat conducting plate 300 is provided with a containing cavity filled with tightly arranged graphene particles, wherein the graphene particles are plastic particles coated with a graphene coating. The heat conduction hole 350 is communicated with the accommodating cavity, and the second heat dissipation sheet 222 is embedded in the through groove 250 and then contacts with the graphene particles filled in the accommodating cavity. In this way, the heat accumulated on the heat conducting plate 300 can be partially and rapidly conducted from the second heat sink 222 to the inside of the casing 100, and then taken out to the outside by the air.

Fig. 7-1 and 7-2 are a schematic structural diagram of a thermal bimetal at normal temperature and a schematic structural diagram at a heated state, respectively, according to an embodiment. As shown in fig. 7-1, in the present embodiment, each thermal bimetal 213 is connected to three second heat sinks 222. For example, the middle portion of the thermal bimetal 213 is fixed to the heat dissipation plate 201 at the bottom of the air passage 102. For example, the middle part of the thermal bimetal 213 is welded on the heat dissipation plate 201 at the bottom of the air passage 102; for another example, the middle portion of the thermal bimetal 213 is screwed to the heat sink 201 at the bottom of the air passage 102. Two ends of the thermal bimetal 213 extend into the two opposite heat dissipation areas 103, and two ends of the thermal bimetal 213 are respectively and correspondingly connected with the three second heat dissipation fins 222 in the two heat dissipation areas 103. For example, the ends of the thermal bimetal 213 are welded to the three second heat sinks 222, respectively; for another example, the three second heat dissipation fins 222 are connected to the connection bar. The end of the thermal bimetal 213 is connected to the connecting rod. As shown in fig. 7-2, for example, when the thermal bimetal 213 is deformed by heat, both ends of the thermal bimetal 213 are curved upward. Thus, when the thermal bimetal 213 is deformed by heat, the three second heat sinks 222 at the end of the thermal bimetal 213 are all forced to be lifted. At this time, the second heat radiation fins 222 are separated from the through grooves 250 and the heat conduction holes 350 to partially expose the heat conduction plate 300, thereby rapidly transferring the heat in the heat conduction plate 300 into the case 100 by the flow of the air, thereby improving the heat radiation efficiency of the heat conduction plate 300.

It should be noted that the present invention also provides an illumination device, please refer to fig. 8 to 10, the illumination device includes: an adaptive heat sink device and LED light assembly 500; the adaptive heat dissipation apparatus includes: the heat dissipation device comprises a shell 100, a heat dissipation assembly 200, a heat conduction plate 300 and a mounting plate 400, wherein the shell 100 covers the heat dissipation assembly 200, the heat dissipation assembly 200 is connected with the heat conduction plate 300, and the mounting plate 400 is arranged on the heat conduction plate 300; the heat conducting plate 300 is of a rectangular structure; the heat conducting plate 300 has a regular planar structure of the mounting surface 310, and the mounting surface 310 faces away from the heat dissipating assembly 200.

As shown in fig. 9 and 10, the LED lamp assembly 500 includes a plate 510 and an LED lamp core 520. The plate body 510 is a rectangular structure. The plate body 510 is provided with a light emitting surface 511 and a heat radiating surface 512 which are arranged oppositely, the light emitting surface 511 and the heat radiating surface 512 are both regular planar structures, and the LED lamp wick 520 is arranged on the light emitting surface 511. The plate body 510 is provided with a plurality of sliding blocks 530 on the heat dissipation surface 512, the side walls of the sliding blocks 530 are provided with limiting strips 531, each sliding block 530 is correspondingly connected with one sliding groove 410 in a sliding manner, each limiting strip 531 is correspondingly embedded into one limiting clamping groove 411, and the heat dissipation surface 512 is abutted to the mounting surface 310.

In the lighting device, the mounting plate is provided with the plurality of sliding grooves, the side walls of the sliding grooves are provided with the limiting clamping grooves, correspondingly, the plate body 510 of the LED lamp assembly 500 is provided with the plurality of sliding blocks 530, the side walls of the sliding blocks 530 are provided with the limiting strips 531, and the sliding grooves and the sliding blocks 530 are jointly connected with the LED lamp assembly 500, so that the efficiency of rapidly mounting and replacing the LED lamp assembly 500 can be realized, the heat dissipation assembly is not required to be detached in the mounting process, and the heat dissipation assembly is not easily damaged; meanwhile, the heat dissipation requirement of the high-power LED lamp assembly 500 can be met under the action of the shell, the heat dissipation assembly, the heat conduction plate and the like, heat generated by the LED lamp core 520 can be quickly dissipated to the outside, and the heat dissipation efficiency is improved.

Correspondingly, for example, a plurality of the sliding blocks 530 are arranged in parallel on the heat dissipation surface 512 in a row. For example, the sliding block 530 has a rectangular structure. For example, five of the sliding blocks 530 are provided. For example, five sliding blocks 530 are uniformly arranged on the heat dissipation surface 512 in a row. For example, the limiting strips 531 are disposed on two side walls of the sliding block 530 located in the middle region of the heat dissipation surface 512 in the five sliding blocks 530. For example, the position-limiting strips 531 are semi-cylindrical structures. For example, the position limiting strips 531 are rectangular structures. For example, the length of the stopper 531 is smaller than the length of the sliding block 530. For example, at least one of the two sidewalls of the sliding block 530 is provided with the position-limiting strip 531. In this way, the mounting plate 400 is provided with the plurality of sliding grooves 410, and the side walls of the sliding grooves 410 are provided with the limiting clamping grooves 411 which are used for connecting and mounting the LED lamps together, so that the efficiency of rapidly mounting and replacing the LED lamps can be realized, the heat dissipation assembly 200 does not need to be disassembled in the mounting process, and the heat dissipation assembly 200 is not easy to damage; meanwhile, the heat dissipation requirement of the high-power LED lamp can be met under the effects of the shell 100, the heat dissipation assembly 200, the heat conduction plate 300 and the like, heat generated by the LED lamp core can be quickly dissipated to the outside, and the heat dissipation efficiency is improved.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims

1. An adaptive heat dissipation device, comprising: the heat dissipation device comprises a shell, a heat dissipation assembly, a heat conduction plate and a mounting plate, wherein the shell covers the heat dissipation assembly, the heat dissipation assembly is connected with the heat conduction plate, and the mounting plate is arranged on the heat conduction plate;

the heat conducting plate is of a rectangular structure;

the heat conducting plate is provided with a regular plane structure mounting surface, and the mounting surface faces away from the heat radiating assembly;

the mounting plate is provided with a plurality of sliding grooves;

the side wall of the sliding groove is provided with a limiting clamping groove, and the plurality of sliding grooves and the limiting clamping grooves are jointly used for connecting and mounting LED lamps;

the shell is a hollow rectangular body with an opening at one side, a plurality of vent holes are respectively formed in the middle areas of four side walls of the shell, the vent holes are arranged in a matrix manner, and the vent holes of two back side walls of the shell are mutually corresponding; an air channel in a cross structure is arranged in the shell, the air channel is provided with four ports, and the four ports are respectively communicated with the vent holes on the four side walls of the shell;

the shell is inside by air passage divides into four radiating areas, radiator unit includes heating panel and four fin groups, each fin group corresponds and sets up in one in the radiating area, the heating panel with the side of shell is connected, fin group includes a plurality of first fin and a plurality of second fin, and is a plurality of first fin and a plurality of the second fin all sets up on the heating panel.

2. The adaptive heat dissipating apparatus of claim 1, wherein a plurality of the runners run parallel in a row on the mounting plate.

3. The adaptive heat dissipation apparatus of claim 1, wherein the sliding slot is a rectangular structure.

4. The adaptive heat dissipation apparatus of claim 1, wherein the number of skid grooves is five.

5. The adaptive heat dissipating apparatus of claim 4, wherein five of the runners open in a row uniformly in the mounting plate.

6. The adaptive heat dissipation device of claim 5, wherein the limiting slots are formed in two side walls of the sliding groove located in the middle region of the mounting plate in the five sliding grooves.

7. The adaptive heat dissipation device of claim 1, wherein the limiting slot has a semi-circular arc structure.

8. The adaptive heat dissipation device of claim 1, wherein the limiting slot has a rectangular configuration.

9. The adaptive heat dissipation apparatus of claim 1, wherein a length of the retaining slot is less than a length of the sliding slot.

10. The adaptive heat dissipation device of claim 1, wherein at least one of the two side walls of the sliding groove is provided with the limiting slot.