CN208917294U - Wafer carrier masking structure - Google Patents
Wafer carrier masking structure Download PDFInfo
- Publication number
- CN208917294U CN208917294U CN201821503169.9U CN201821503169U CN208917294U CN 208917294 U CN208917294 U CN 208917294U CN 201821503169 U CN201821503169 U CN 201821503169U CN 208917294 U CN208917294 U CN 208917294U
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- China
- Prior art keywords
- load plate
- wafer
- cavity
- shielding
- microscope carrier
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Abstract
A kind of wafer carrier masking structure, including a cavity, a load plate, a microscope carrier and a shielding, the top surface of the load plate has several grooves for accommodating wafer, and the cavity can be sent into or sent out by a mechanical arm, the microscope carrier is liftably set among the cavity and for carrying the load plate, the shielding is incorporated in the top among the cavity and being located at the microscope carrier, and with several perforation with wafer opposite position and shape on the load plate, only wafer can only be manifested from the perforation when the microscope carrier jacks the load plate on the downside of the shielding；It can substantially extend load plate service life by above structure, reduce load plate cleaning charge and reduce scrap of the product risk.
Description
Technical field
The utility model relates to a kind of wafer carrier masking structures, are mainly applicable in semiconductor packing process and LED
Encapsulation procedure, it is espespecially a kind of substantially to extend load plate service life, reduce load plate cleaning charge and reduce scrap of the product risk
Wafer carrier masking structure.
Background technique
As shown in Figs.1 and 2, it is indicated that generally in semiconductor packing process, LED seal apparatus journey and panel manufacturing process
Plated film operation in, in order to promote production capacity, it will usually which several wafers 10 of smaller size are placed on a load plate of larger size
11, it is then sent on the microscope carrier 13 in a cavity 12 using a mechanical arm, is filled by a sputter of 12 top of cavity
It sets 14 to come out the atom sputtering of a target 15, it is made to be deposited on the wafer 10 and complete plated film operation.
However, the region put other than wafer 10 when carrying out plated film operation, on the load plate 11 can follow those wafers 10
Deposition plating (hatched example areas of such as Fig. 2) together, and with the increase of the load plate 11 carrying 10 coating times of wafer, the load plate 11
On film can more grow thicker, and easily derive particle (peeling) pollution and decortication (particle) pollution.Although the load
Film on disk 11 can achieve the purpose that be reused by chemical liquid cleaning, however work as wash number the more, should
Load plate 11 the more can become the more thin and make structure tender, just be easy to be pullled by mechanical force generated in processing procedure under subsequent use
The situation for influencing and generating rupture with cooling thermal impact even results in product and is damaged and scraps.Therefore, there is 11 service life of load plate
Short, the disadvantages of cleaning charge is at high cost and product rejection rate is high.
In view of this, this creator be in view of the above-mentioned problems, and deeply conceive, and actively research improvement have a fling at and develop and set
Count out this creation.
Utility model content
The main purpose of the utility model is that being manufactured for known semiconductor encapsulation procedure, LED seal apparatus journey and panel
The problems such as load plate service life in the presence of the plated film operation of process is short, cleaning charge is at high cost and product rejection rate is high, and
A kind of wafer carrier masking structure is provided.
A kind of in order to achieve the above object, the technical scheme adopted by the utility model is: wafer carrier masking structure comprising
The top surface of one cavity, a load plate and a microscope carrier, the load plate has several grooves to accommodate wafer, which can be by a manipulator
The cavity is sent into or is sent out to arm；The microscope carrier is liftably set among the cavity, and for carrying the load plate；It is characterized in that,
It further include a shielding, which is incorporated among the cavity, and is located at the top of the microscope carrier, and has and the wafer on the load plate
Corresponding several perforation only can only manifest crystalline substance among the perforation when the microscope carrier jacks the load plate on the downside of the shielding
Circle.
The structure further includes several mandrils, and the lower end of the mandril is set to the bottom of the cavity, upper end pass through the microscope carrier and
A height can be risen to accept the load plate of external feeding, and the retraction microscope carrier can be declined so that the load plate to be placed in the top of the microscope carrier
Face.
The bottom of the microscope carrier is equipped with a drive rod, which extends downwardly and pass through the cavity, make for lower section
One driving device drives the drive rod to go up and down.
It is described to shield the bottom that the cavity is fastened on using support column.
The speaker hole being gradually expanded from bottom to top is formed at the upper opening of the perforation.
The bottom surface of the shielding sequentially has a kerve corresponding with the microscope carrier and the load plate and single order slot upwards.
It is described shielding be provided on the relative contact of the load plate can be relatively chimeric concave, convex portion, make the shielding and this
The perforation of load plate is opposite when engaging on load plate the wafer energy face shielding.
The concave, convex portion is tapered or hemispherical.
Wafer carrier masking structure provided by the utility model can make to carry out plated film operation by the masking of the shielding
When, the film that sputter goes out is not deposited directly on the load plate, and can only be through the perforation deposition in the shielding on the wafer.
Therefore, it can substantially extend the service life of the load plate, and the cleaning charge of the load plate can be reduced, and scrap of the product wind can be reduced
Danger.
Detailed description of the invention
Fig. 1 is known wafer plated film operation schematic diagram.
Fig. 2 is known load plate solid enlarged diagram.
Fig. 3 is the perspective exploded view after the cavity fragmentary sectional of the utility model.
Three-dimensional combined amplifier schematic diagram after the cavity fragmentary sectional of Fig. 4 the utility model.
The load plate of Fig. 5 the utility model is sent into the intracorporal action schematic diagram of chamber.
The load plate of Fig. 6 the utility model declines the action schematic diagram being placed on microscope carrier.
The microscope carrier of Fig. 7 the utility model, which rises, to be made shielding cover the load plate and carries out the action schematic diagram of plated film operation.
Symbol description:
10 wafer, 11 load plate
12 cavity, 13 microscope carrier
14 sputtering unit, 15 target
20 cavity, 30 load plate
31 groove, 32 wafer
40 microscope carrier, 41 drive rod
50 mandrils
60 61 support columns of shielding
62 63 speaker holes of perforation
64 kerve, 65 rank slot
70 sputtering unit, 71 target.
Specific embodiment
It please refers to shown in Fig. 3-Fig. 7, shows wafer carrier masking structure described in the utility model comprising a cavity
20, a load plate 30, a microscope carrier 40, several mandrils 50 and a shielding 60, in which:
The load plate 30, top surface have several grooves 31 for accommodating several wafers 32 respectively, which can be by a machine
The cavity 20 is sent into or is sent out to tool arm (not shown).
The microscope carrier 40 is liftably set among the cavity 20, and bottom is equipped with a drive rod 41 and extends downwardly and pass through
The cavity 20, the driving device (not shown) for making the drive rod 41 can pass through lower section drive its lifting.
Several mandrils 50, lower end be set to the cavity 20 bottom, upper end pass through the microscope carrier 40 and can rise a height with
The external load plate 30 being sent into is accepted, and the retraction microscope carrier 40 can be declined so that the load plate 30 to be placed in the top surface of the microscope carrier 40.
The shielding 60 is set among the cavity 20, and bottom surface is fastened on the cavity 20 using several support columns 61
Bottom makes the shielding 60 be located at the top of the microscope carrier 40.There is position corresponding with the wafer 32 on the load plate 30 in the shielding 60
It sets and several perforation 62 of shape, making only can only be from the perforation when the microscope carrier 40 is by the load plate 30 jacking to 60 downside of shielding
The wafer 32 is manifested in 62.The speaker hole 63 being gradually expanded from bottom to top is formed at the upper opening of each perforation 62.The screen
Cover 60 bottom surface sequentially has a kerve 64 corresponding with the microscope carrier 40 and the load plate 30 and single order slot 65 upwards.
In this creation, the shielding 60 and concave, convex portion that can be relatively chimeric settable on the relative contact of the load plate 30,
So as to which good location correcting effect can be generated when its opposite engagement, and enable therefore face shielding 60 of wafer 32 on load plate 30
Perforation 62.The concave, convex portion is tapered or hemispherical.
This creation is several grooves 31 that several wafers 32 are first placed in the load plate 30 respectively when carrying out film-plating process
Among, then the load plate 30 is sent into the cavity 20 by the mechanical arm (not shown) outside, makes the mandril 50
The bottom surface of the load plate 30 is withstood in upper end, and the mechanical arm is made to retract external (as shown in Figure 5).Later, the upper end of the mandril 50
Decline the top surface (as shown in Figure 6) for making the load plate 30 be placed in the microscope carrier 40.Then, then the microscope carrier 40 is made to rise to the shielding 60
Downside, manifest the wafer 32 only among the perforation 62, at this time will by a sputtering unit 70 of 20 top of the cavity
When the atom sputtering of one target 71 comes out to carry out plated film operation, the atom of the target 71 will be due to the masking of the shielding 60 only
It can only be deposited on the wafer 32 (as shown in Figure 7).
Wafer carrier masking structure provided by this creation, when can make to carry out plated film operation by the masking of the shielding 60
The film that sputter goes out is not deposited directly on the load plate 30, and can only be deposited on wafer 32 through the perforation 62 in the shielding 60
On.Therefore, it can substantially extend the service life of the load plate 30, and can simultaneously reduce the cleaning charge of the load plate 30 and reduce and produce
Product scrap risk.
Claims (9)
1. a kind of wafer carrier masking structure comprising a cavity, a load plate and a microscope carrier, the top surface of the load plate have several recessed
For slot to accommodate wafer, which can be sent into or send out the cavity by a mechanical arm；The microscope carrier is liftably set to the cavity
Among, and for carrying the load plate；It is characterized in that, further including a shielding, which is incorporated among the cavity, and being located at should
The top of microscope carrier, and there are several perforation corresponding with the wafer on the load plate, when the microscope carrier jacks the load plate to the shielding
When downside only wafer can only be manifested among the perforation.
2. wafer carrier masking structure as described in claim 1, which is characterized in that the structure further includes several mandrils, should
The lower end of mandril is set to the bottom of the cavity, and upper end passes through the microscope carrier and can rise a height to accept the load plate of external feeding,
And the retraction microscope carrier can be declined so that the load plate to be placed in the top surface of the microscope carrier.
3. wafer carrier masking structure as claimed in claim 2, which is characterized in that the bottom of the microscope carrier is equipped with a driving
Bar, the drive rod extend downwardly and pass through the cavity, make the driving device for lower section that the drive rod be driven to go up and down.
4. wafer carrier masking structure as claimed in claim 2, which is characterized in that the shielding is connected and fixed using support column
In the bottom of the cavity.
5. wafer carrier masking structure as claimed in claim 2, which is characterized in that at the upper opening of the perforation formed by
The speaker hole being gradually expanded upwards down.
6. wafer carrier masking structure as claimed in claim 2, which is characterized in that the bottom surface of the shielding sequentially has upwards
A kerve corresponding with the microscope carrier and the load plate and single order slot.
7. wafer carrier masking structure as claimed in claim 2, which is characterized in that the shielding is opposite with the load plate to be contacted
The concave, convex portion that can be fitted into relatively is provided on face, wafer face when enabling the shielding is opposite with the load plate to engage on load plate should
The perforation of shielding.
8. wafer carrier masking structure as claimed in claim 7, which is characterized in that the concave, convex portion is tapered.
9. wafer carrier masking structure as claimed in claim 7, which is characterized in that the concave, convex portion is hemispherical.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821503169.9U CN208917294U (en) | 2018-09-14 | 2018-09-14 | Wafer carrier masking structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821503169.9U CN208917294U (en) | 2018-09-14 | 2018-09-14 | Wafer carrier masking structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208917294U true CN208917294U (en) | 2019-05-31 |
Family
ID=66705453
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821503169.9U Active CN208917294U (en) | 2018-09-14 | 2018-09-14 | Wafer carrier masking structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208917294U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113643955A (en) * | 2021-08-09 | 2021-11-12 | 长鑫存储技术有限公司 | Semiconductor machine |
| CN115537751A (en) * | 2021-06-29 | 2022-12-30 | 鑫天虹(厦门)科技有限公司 | Shielding mechanism and film deposition cavity with same |
-
2018
- 2018-09-14 CN CN201821503169.9U patent/CN208917294U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115537751A (en) * | 2021-06-29 | 2022-12-30 | 鑫天虹(厦门)科技有限公司 | Shielding mechanism and film deposition cavity with same |
| CN113643955A (en) * | 2021-08-09 | 2021-11-12 | 长鑫存储技术有限公司 | Semiconductor machine |
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