CN208904060U

CN208904060U - A kind of flip LED bracket

Info

Publication number: CN208904060U
Application number: CN201822011371.6U
Authority: CN
Inventors: 龚亨超
Original assignee: Jiujiang Kesheng Electronic Technology Co Ltd
Current assignee: Jiujiang Kesheng Electronic Technology Co Ltd
Priority date: 2018-11-30
Filing date: 2018-11-30
Publication date: 2019-05-24
Anticipated expiration: 2028-11-30

Abstract

The utility model relates to a kind of flip LED brackets, including substrate, the substrate is equipped with rack body, and the rack body is mutually made of the No.1 electrode being oppositely arranged with No. two electrodes, and it is separated by among the No.1 electrode and No. two electrodes by ceramics bracket, by being equipped with ceramics bracket, insulating layer, overflow launder, the utility model can effectively avoid No.1 electrode and No. two electrode conductions, short circuit problem occurs, by being equipped with barb-like zigzag slot, the utility model can effectively ensure that the being tightly combined property of encapsulation glue-line and rack body, it is in simultaneously king's font structure by the cross section of the ceramics bracket, so that the combination dynamics of ceramics bracket and rack body can also be effectively ensured in the utility model, and same horizontal line is located at by the bottom surface of the ceramics bracket and the bottom surface of substrate, and the cooling fin is set It sets, the utility model can also effectively radiate to LED chip, prolong its service life, be suitble to be widely popularized.

Description

A kind of flip LED bracket

Technical field

The utility model relates to a kind of flip LED brackets, belong to LED technology field.

Background technique

Current flip LED device includes substrate, rack body, metallic support, chip and encapsulated layer, and metallic support is set to On substrate, and including spaced No.1 electrode and No. two electrodes, rack body is wrapped in above metallic support, rack body Cavity is inside opened up, chip is set in cavity bottom and is connected to metallic support, and encapsulated layer is filled in cavity and plays chip package Come, realize sealing, chip is electrically connected by tin cream in No.1 electrode and No. two electrodes, however, the flowing side of flowing tin cream To uncontrollable, it is possible to flow to the position between No.1 electrode and No. two electrodes, conducting No.1 electrode and No. two electrodes, appearance is short Road problem, while after prolonged periods use, encapsulated layer is easy to be detached from rack body due to frequently expanding with heat and contract with cold, this When the blue light that is issued of chip escaped from from the gap of encapsulated layer and rack body, to change original color of light mixed proportion (blue light increases), at the same to chip using when not can be carried out effective heat dissipation, service life is short, and therefore, it is necessary to be further improved.

Utility model content

Utility model technical problems to be solved overcome existing defect, provide a kind of flip LED bracket, the utility model No.1 electrode and No. two electrode conductions can be effectively avoided, short circuit problem occurs, the utility model can effectively ensure that packaging plastic The being tightly combined property of layer and rack body, while the combination dynamics of ceramics bracket and rack body can also be effectively ensured, and The utility model can also effectively radiate to LED chip, prolong its service life, be suitble to be widely popularized, can effectively solve Certainly the problems in background technique.

In order to solve the above-mentioned technical problem, the utility model provides the following technical solution:

A kind of flip LED bracket, including substrate, the substrate is equipped with rack body, and the rack body is by opposite The No.1 electrode of setting is mutually constituted with No. two electrodes, and passes through ceramics bracket phase among the No.1 electrode and No. two electrodes Every, and the cross section of the ceramics bracket is in king's font structure, the ceramics bracket be combined with each other with No.1 electrode, No. two electrodes The recess portion being flared upwards is formed, and the recess portion middle section is equipped with chip placement rack protruding upward, and the chip is placed LED chip is placed on seat, and the side wall of the recess portion is equipped with barb-like zigzag slot, and sets on the outside of the chip placement rack There is inner groovy, the ceramics bracket top surface is higher than the top surface of chip placement rack, and the frame body two sides on the ceramics bracket top are equal Equipped with insulating layer, and the bottom surface of the ceramics bracket and the bottom surface of substrate are located at same horizontal line, and the LED chip bottom with It is equipped with cooling fin between the frame body of ceramics bracket bottom end, and symmetrically offers on the No.1 electrode and No. two electrodes for radiating The perforative through hole of piece.

Furthermore, the No.1 electrode, No. two tin cream, and the insulation are respectively equipped between electrode and LED chip It is opposite on layer to offer the overflow launder flowed into for tin cream.

Furthermore, filled with encapsulation glue-line in the recess portion.

Furthermore, the cooling fin is an integral structure with ceramics bracket, and the cooling fin is ceramic material.

Furthermore, the area of the chip placement rack is greater than the area of LED chip.

Furthermore, the chip, which is placed, is coated with heat-conducting glue layer on seating face.

The utility model is the utility model has the advantages that a kind of flip LED bracket, due to being equipped with ceramics bracket, insulating layer, overflow launder, this Utility model can effectively avoid No.1 electrode and No. two electrode conductions, and short circuit problem occurs, due to being equipped with barb-like zigzag Slot, the utility model can effectively ensure that the being tightly combined property of encapsulation glue-line and rack body, simultaneously because the ceramics bracket Cross section be in king's font structure, additionally it is possible to the combination dynamics of ceramics bracket and rack body is effectively ensured, and due to described The bottom surface of ceramics bracket and the bottom surface of substrate are located at the setting of same horizontal line and the cooling fin, and the utility model can also It is enough effectively to be radiated to LED chip, it prolongs its service life, is suitble to be widely popularized.

Detailed description of the invention

Attached drawing is used to provide a further understanding of the present invention, and constitutes part of specification, practical with this Novel specific embodiment is used to explain the utility model together, does not constitute limitations of the present invention.

Fig. 1 is a kind of cross-sectional view of flip LED bracket of the utility model.

Fig. 2 is a kind of top view of flip LED bracket of the utility model.

Fig. 3 is a kind of enlarged section of flip LED bracket of the utility model.

Figure label: 1, substrate；2, rack body；3, No.1 electrode；4, No. two electrodes；5, ceramics bracket；6, recess portion；7, Chip placement rack；8, LED chip；9, barb-like zigzag slot；10, inner groovy；11, insulating layer；12, cooling fin；13, run through Hole；14, tin cream；15, overflow launder；16, glue-line is encapsulated；17, heat-conducting glue layer.

Specific embodiment

Below in conjunction with the attached drawing in specific embodiment of the present utility model, to specific embodiment of the present utility model Technical solution be clearly and completely described, it is clear that described specific embodiment be only the utility model a part Specific embodiment, rather than whole specific embodiment, based on the specific embodiment in the utility model, this field Those of ordinary skill's every other specific embodiment obtained without making creative work, belongs to this reality With novel protected range.

As shown in Figure 1-3, a kind of flip LED bracket, including substrate 1, the substrate 1 are equipped with rack body 2, and described Rack body 2 is mutually made of the No.1 electrode 3 being oppositely arranged with No. two electrodes 4, and the No.1 electrode 3 and No. two electrodes 4 Centre is separated by by ceramics bracket 5, can effectively avoid No.1 electrode 3 and No. two electrodes 4 from being connected, short circuit problem, and institute occurs The cross section of ceramics bracket 5 is stated in king's font structure, can effectively ensure that the combination dynamics of ceramics bracket 5 and rack body 2, institute It states ceramics bracket 5 and 3, No. two electrodes 4 of No.1 electrode is bound to each other to form the recess portion 6 being flared upwards, and 6 middle part of the recess portion It is arranged with chip placement rack 7 protruding upward, and is placed with LED chip 8, and the side of the recess portion 6 on the chip placement rack 7 Wall is equipped with barb-like zigzag slot 9, can effectively ensure that the being tightly combined property of encapsulation glue-line 16 and rack body 2, and described It is equipped with inner groovy 10 on the outside of chip placement rack 7, further increases being tightly combined property, 5 top surface of ceramics bracket is put higher than chip The top surface of seat 7 is set, and the frame body two sides on 5 top of the ceramics bracket are equipped with insulating layer 11, and the bottom surface of the ceramics bracket 5 It is located at same horizontal line with the bottom surface of substrate 1, and is equipped with and dissipates between the frame body of 5 bottom end of 8 bottom of the LED chip and ceramics bracket Backing 12 can effectively be radiated the heat in the LED chip 8 by the ceramics bracket 5, and the No.1 electrode 3 and No. two electrodes 4 on symmetrically offer for the perforative through hole 13 of cooling fin 12.

More specifically, the No.1 electrode 3, two is respectively equipped with tin cream 14 between electrode 4 and LED chip 8, and described The opposite overflow launder 15 flowed into for tin cream 14 that offers can effectively avoid one after flowing into the tin cream 14 on insulating layer 11 Number electrode 3 and No. two electrodes 4 are connected, and occur short circuit problem, filled with encapsulation glue-line 16, the cooling fin 12 and pottery in recess portion 6 Porcelain bracket 5 is an integral structure, and the cooling fin 12 is ceramic material, and the area of the chip placement rack 7 is greater than LED chip 8 area can be coated on 7 surface of chip placement rack and be led to avoid the color temperature shift after lamp bead long-time use in this way Hot glue layer 17 prolongs its service life further convenient for the heat dissipation to the LED chip 8.

The utility model improve in: a kind of flip LED bracket passes through the ceramics bracket 5, insulating layer 11, overflow launder 15 Be equipped with, the utility model can effectively avoid No.1 electrode 3 and No. two electrodes 4 from being connected, and short circuit problem occurs, passes through institute State the setting of barb-like zigzag slot 9, the utility model can effectively ensure that being tightly combined for encapsulation glue-line 16 and rack body 2 Property, while the cross section of the ceramics bracket 5 is in king's font structure, additionally it is possible to ceramics bracket 5 and rack body 2 is effectively ensured It is located at same horizontal line and the heat dissipation in conjunction with dynamics, and by the bottom surface of the bottom surface of the ceramics bracket 5 and substrate 1 Piece 12 is equipped with, and the utility model can also effectively radiate to LED chip 8, is prolonged its service life, and is suitble to extensive It promotes.

The above are the preferable embodiment of the utility model, the utility model those skilled in the art can also be to upper It states embodiment to change and modify, therefore, the utility model is not limited to above-mentioned specific embodiment, all abilities Field technique personnel made any conspicuous improvement, replacement or modification on the basis of the utility model belong to practical Novel protection scope.

Claims

1. a kind of flip LED bracket, including substrate (1), it is characterised in that: the substrate (1) is equipped with rack body (2), and The rack body (2) is mutually made of the No.1 electrode (3) being oppositely arranged with No. two electrodes (4), and the No.1 electrode (3) It is separated by among No. two electrodes (4) by ceramics bracket (5), and the cross section of the ceramics bracket (5) is in king's font structure, institute It states ceramics bracket (5) and No.1 electrode (3), No. two electrodes (4) is bound to each other to form the recess portion (6) being flared upwards, and is described recessed Portion (6) middle section is equipped with chip placement rack (7) protruding upward, and is placed with LED chip on the chip placement rack (7) (8), and the side wall of the recess portion (6) is equipped with barb-like zigzag slot (9), and is equipped on the outside of the chip placement rack (7) interior Groove (10), ceramics bracket (5) top surface are higher than the top surface of chip placement rack (7), and the frame on the ceramics bracket (5) top Body two sides are equipped with insulating layer (11), and the bottom surface of the bottom surface of the ceramics bracket (5) and substrate (1) is located at same horizontal line, And cooling fin (12) are equipped between LED chip (8) bottom and the frame body of ceramics bracket (5) bottom end, and the No.1 electrode (3) it and symmetrically offers on No. two electrodes (4) for cooling fin (12) perforative through hole (13).

2. a kind of flip LED bracket according to claim 1, it is characterised in that: the No.1 electrode (3), No. two electrodes (4) it is respectively equipped between LED chip (8) tin cream (14), and is offered relatively for tin cream (14) on the insulating layer (11) The overflow launder (15) of inflow.

3. a kind of flip LED bracket according to claim 1, it is characterised in that: be filled with packaging plastic in the recess portion (6) Layer (16).

4. a kind of flip LED bracket according to claim 1, it is characterised in that: the cooling fin (12) and ceramics bracket (5) it is an integral structure, and the cooling fin (12) is ceramic material.

5. a kind of flip LED bracket according to claim 1, it is characterised in that: the area of the chip placement rack (7) is big Area in LED chip (8).

6. a kind of flip LED bracket according to claim 1, it is characterised in that: applied on chip placement rack (7) surface It is covered with heat-conducting glue layer (17).