CN208903984U - Processing chamber and semiconductor processing equipment - Google Patents
Processing chamber and semiconductor processing equipment Download PDFInfo
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- CN208903984U CN208903984U CN201821932849.2U CN201821932849U CN208903984U CN 208903984 U CN208903984 U CN 208903984U CN 201821932849 U CN201821932849 U CN 201821932849U CN 208903984 U CN208903984 U CN 208903984U
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- chamber
- main body
- hoisting
- process chamber
- chamber body
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- 238000012545 processing Methods 0.000 title claims abstract description 14
- 239000004065 semiconductor Substances 0.000 title claims abstract description 11
- 238000000034 method Methods 0.000 claims abstract description 88
- 230000008569 process Effects 0.000 claims abstract description 88
- 239000007921 spray Substances 0.000 claims abstract description 24
- 238000005507 spraying Methods 0.000 claims description 61
- 238000007789 sealing Methods 0.000 claims description 27
- 238000004891 communication Methods 0.000 claims description 5
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 230000002093 peripheral effect Effects 0.000 claims description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 238000004904 shortening Methods 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
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- Cleaning Or Drying Semiconductors (AREA)
Abstract
The utility model discloses a kind of processing chamber and semiconductor processing equipments.Spray part including chamber body and in chamber body, it further include at least one hanging apparatus, each hanging apparatus includes lifting main body and several adjustment parts, the first end of lifting main body is pierced by chamber body and is movably tightly connected with the chamber body, and second end and spray part are tightly connected.Each adjustment part is selectively folded between the first end and chamber body of lifting main body, to adjust the spray distance of spray part.In this way, it is only necessary to which external in chamber body carries out, and adjustment spray distance, so as to effectively simplify adjustment process, shortens adjustment time without beginning to speak to operate every time.
Description
Technical Field
The utility model relates to a microelectronics processing technology field, concretely relates to process cavity and a semiconductor processing equipment.
Background
Generally, the internal structure of a process chamber of a semiconductor processing apparatus is complex and compact. The process chamber generally includes a chamber body, a spray device, and a process stage, both of which are disposed within the chamber body. The process carrying platform is used for carrying a silicon wafer to be processed, the spraying device is used for carrying out uniform flow on process gas, and in order to enable the thickness of a thin film formed on the surface of the silicon wafer to be uniform, the spraying distance between the spraying device and the process carrying platform needs to be adjusted so as to enable the spraying device to have the optimal spraying distance.
In order to realize the adjustment and spray the distance, traditionally design a plurality of kinds of hoist device that have not unidimensional, hoist device installs inside the cavity body, when the distance is sprayed in the adjustment of needs at every turn, opens the chamber operation to the cavity body to can change not unidimensional hoist device, realize adjusting spray device's spraying distance, obviously, this extravagant installation time and extravagant manpower are unfavorable for carrying out many times contrast test in the short time.
SUMMERY OF THE UTILITY MODEL
The utility model discloses aim at solving one of the technical problem that exists among the prior art at least, provide a process chamber and a semiconductor processing equipment.
In order to achieve the above object, a first aspect of the present invention provides a process chamber, including a chamber body and a spraying member located in the chamber body, wherein the process chamber further includes at least one hoisting device, and each hoisting device includes a hoisting main body and a plurality of adjusting members; wherein,
the first end of the hoisting main body penetrates out of the chamber body and is movably and hermetically connected with the chamber body, the second end of the hoisting main body is hermetically connected with the spraying piece,
each adjusting piece is selectively clamped between the first end of the hoisting main body and the chamber body so as to adjust the spraying distance of the spraying piece.
Optionally, the hoisting device further comprises an elastic sealing assembly sleeved on the hoisting main body, and two ends of the elastic sealing assembly are respectively connected with the chamber body and the second end of the hoisting main body in a sealing manner.
Optionally, the elastic sealing assembly comprises a corrugated pipe and mounting flanges respectively located at two ends of the corrugated pipe, and the corrugated pipe is connected with the chamber body and the second end of the hoisting main body in a sealing mode through the mounting flanges.
Optionally, a process gas channel is further arranged in the hoisting main body, and the process gas channel is communicated with the spraying holes in the spraying piece in a sealing manner.
Optionally, the hoisting device further comprises a sealing element, and the sealing element is clamped between the second end of the hoisting main body and the spraying piece, so that the process gas channel is in closed communication with the spraying hole.
Optionally, a mounting hole penetrating through the wall thickness of the chamber body is formed in the chamber body, the first end of the hoisting main body penetrates through the mounting hole, and a gap is formed between the peripheral side wall of the first end and the mounting hole.
Optionally, a flange protruding outwards is arranged at the first end of the hoisting main body, and the adjusting member is clamped between the flange and the chamber body.
Optionally, the end of the first end of the hoisting body is further provided with a hoisting ring.
Optionally, the process chamber comprises two hoisting devices, and the two hoisting devices are symmetrically arranged relative to the center of the chamber body.
Optionally, the adjustment member is an adjustment shim.
Optionally, the lifting device further comprises a fastener, and the adjusting member is detachably connected to the lifting main body and the chamber body through the fastener.
Optionally, the hoisting device further comprises a vertical guide structure located in the chamber body, and the vertical guide structure can limit the hoisting device to lift along the vertical direction.
In a second aspect of the present invention, a semiconductor processing apparatus is provided, comprising the process chamber described above.
The utility model discloses a process chamber and semiconductor processing equipment, it includes the cavity body and is located this internal piece that sprays of cavity, and process chamber still includes at least one hoist device, and every hoist device is including hoist and mount main part and a plurality of adjusting part. The first end of hoist and mount main part is worn out the cavity body and with the movably sealing connection of cavity body, the second end of hoist and mount main part with spray a sealing connection. Each adjusting piece is selectively clamped between the first end of the hoisting main body and the chamber cover so as to adjust the spraying distance of the spraying piece. Like this, when adjusting the distance that sprays, only need go on in the outside of cavity body, adjust at every turn and spray the distance and need not open the chamber operation to can effectively simplify the adjustment flow, shorten the adjustment time. In addition, still be provided with the process gas passageway in the hoist and mount main part, this process gas passageway and the hole intercommunication that sprays on the spraying piece. Thus, when the spraying distance between the spraying piece and the process carrying platform is adjusted, the process gas channel does not interfere or influence the adjusting process, thereby further shortening the adjusting time.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention. In the drawings:
FIG. 1 is a schematic structural view of a process chamber according to a first embodiment of the present invention;
fig. 2 is a partial schematic view of a lifting device of a process chamber according to a second embodiment of the present invention.
Description of the reference numerals
100: a process chamber;
110: a chamber body;
111: mounting holes;
120: a spraying member;
121: spraying holes;
130: a process carrying platform;
140: hoisting the device;
141: hoisting the main body;
141 a: a process gas channel;
141 b: a flange;
142: an adjustment member;
143: an elastomeric seal assembly;
143 a: a bellows;
143 b: installing a flange;
143b 1: a first knife edge flange;
143b 2: welding a flange;
143b 3: a second knife-edge flange;
144: a seal member;
145: a hoisting ring;
150: a heater.
Detailed Description
The following detailed description of the embodiments of the present invention will be made with reference to the accompanying drawings. It is to be understood that the description of the embodiments herein is for purposes of illustration and explanation only and is not intended to limit the invention.
As shown in fig. 1 and fig. 2, a first aspect of the present invention relates to a process chamber 100, the process chamber 100 generally includes a chamber body 110, a spraying member 120, a process carrying platform 130 and two hoisting devices 140, it should be understood that the number of the hoisting devices 140 is only for illustration and is not understood as a limitation to the protection scope of the present invention, and in practical applications, one hoisting device 140, three hoisting devices 140, etc. may be provided according to practical needs.
As shown in fig. 1 and fig. 2, the spray part 120 and the process carrier 130 are both located in the chamber body 110, the process carrier 130 is used for carrying a silicon wafer to be processed, and the spray part 120 is used for uniformly flowing process gas, so that the film thickness of the surface of the silicon wafer after the process is completed is uniform. Each lifting device 140 comprises a lifting body 141 and a number of adjustment members 142. The first end of the hoisting main body 141 (e.g., the upper end of the hoisting main body 141 in fig. 1) penetrates through the chamber body 110 and is movably and hermetically connected with the chamber body 110, and the second end of the hoisting main body 141 (e.g., the lower end of the hoisting main body 141 in fig. 1) is hermetically connected with the spray piece 120, so that the inside of the chamber body 110 can be isolated from the atmosphere, and the inside of the chamber body 110 is kept in a vacuum environment. Each adjusting member 142 is selectively clamped between the first end of the hoisting main body 141 and the chamber body 110 to adjust the spraying distance between the spraying member 120 and the process stage 130, for example, one adjusting member 142, two adjusting members 142, or a plurality of adjusting members 142 may be disposed between the chamber body 110 and the hoisting main body 141, so as to adjust the spraying distance between the spraying member 120 and the process stage 130.
Specifically, as shown in fig. 1 and fig. 2, when a process is actually performed, if the spraying distance between the current spraying part 120 and the process carrier 130 is too short, an adjusting part 142 may be further added between the first end of the hoisting main body 141 and the chamber body 110, so that, with the addition of the adjusting part 142, the first end of the hoisting main body 141 is far away from the chamber body 110, that is, the hoisting main body 141 moves upward, and since the second end of the hoisting main body 141 is connected to the spraying part 120, the hoisting main body 141 may drive the spraying part 120 to move upward, so that the spraying distance between the spraying part 120 and the process carrier 130 may be increased until the spraying distance between the spraying part 120 and the process carrier 130 meets a predetermined requirement.
In the process chamber 100 with the structure of this embodiment, the first end of the hoisting main body 141 penetrates through the chamber body 110 and is movably and hermetically connected with the chamber body 110, the other end of the hoisting main body is hermetically connected with the spraying member 120, and each adjusting member 142 is selectively clamped between the first end of the hoisting main body 141 and the chamber body 110, so that when the spraying distance between the spraying member 120 and the process carrying platform 130 is adjusted, the spraying distance is adjusted only outside the chamber body 110, and the cavity opening operation is not needed for adjusting the spraying distance every time, thereby effectively simplifying the adjustment process and shortening the adjustment time.
As a specific structure for realizing the sealing connection between the hoisting main body 141 and the chamber body 110, as shown in fig. 1 and fig. 2, the hoisting device 140 further includes an elastic sealing assembly 143 disposed on the hoisting main body 141, and two ends of the elastic sealing assembly 143 are respectively connected to the second ends of the chamber body 110 and the hoisting main body 141 in a sealing manner.
Specifically, as shown in fig. 2, the elastic sealing assembly 143 includes a bellows 143a and mounting flanges 143b respectively disposed at both ends of the bellows 143a, and the bellows 143a is sealingly connected to the chamber body 110 and the second end of the lifting body 141 through the mounting flanges 143 b.
The process chamber 100 of the present embodiment can effectively isolate the vacuum environment inside the chamber body 110 from the atmosphere by using the elastic sealing assembly 143, and when adjusting the spraying distance between the spraying member 120 and the process stage 130, for example, when lifting the lifting main body 141, the length of the bellows 143a is compressed along with the lifting height, and by means of the compression deformation of the bellows 143a, the acting force applied to the lifting main body 141 can be buffered, thereby preventing the lifting device 140 from generating rigid collision.
Specifically, as shown in fig. 2, the mounting flange 143b may include a first knife-edge flange 143b1 at a top end of the bellows 143a, a welding flange 143b2, and a second knife-edge flange 143b3 at a bottom end of the bellows 143 a. The welding flange 143b2 is welded and fixed on the chamber body 110, the top end of the corrugated tube 143a is connected with the welding flange 143b2 through the first knife-edge flange 143b1 in a sealing manner, and the bottom end of the corrugated tube 143a is connected with the second end (which can also be processed into a shape similar to a knife-edge flange) of the hoisting body 141 through the second knife-edge flange 143b3 in a sealing manner.
As shown in fig. 1 and 2, a process gas channel 141a is further disposed in the hoisting main body 141, the process gas channel 141a is in sealed communication with the spray holes 121 of the spray piece 120, for example, a sealing member 144 may be disposed between the second end of the hoisting main body 141 and the spray piece 120, and the sealing member 144 may be a sealing structure such as an O-ring that can achieve a sealing function, so as to achieve sealed communication between the process gas channel 141a and the spray holes 121.
In the process chamber 100 with the structure of this embodiment, the process gas channel 141a is disposed inside the hoisting main body 141, and the process gas channel 141a is hermetically communicated with the spraying holes 121, so that when the spraying distance between the spraying member 120 and the process carrier 130 is adjusted, the process gas channel 141a does not interfere with or affect the adjusting process, thereby further shortening the adjusting time.
As shown in fig. 1 and 2, the chamber body 110 is provided with a mounting hole 111 penetrating through the wall thickness thereof, the first end of the hoisting main body 141 penetrates through the mounting hole 111, and a gap is formed between the outer peripheral side wall of the first end of the hoisting main body 141 and the mounting hole 111, so that the hoisting main body 141 can move in the mounting hole 111 conveniently, and the spraying distance between the spraying part 120 and the process stage 130 can be adjusted.
As shown in fig. 2, in order to facilitate the installation of the adjustment member 142, the first end of the hoisting main body 141 is provided with a flange 141b protruding outward, so that the adjustment member 142 may be interposed between the flange 141b and the chamber body 110. In addition, in order to facilitate lifting the lifting device 140, as shown in fig. 2, the end of the first end of the lifting main body 141 is further provided with a lifting ring 145, so that when the spraying distance needs to be adjusted, the lifting ring 145 can be hooked by a lifting mechanism such as a crane, so that the lifting main body 141 can be lifted, and at this time, the adjusting member 142 can be added or removed between the flange 141b and the chamber body 110, so that the spraying distance between the spraying member 120 and the process stage 130 can be adjusted.
As shown in fig. 1, the two lifting devices 140 may be symmetrically disposed with respect to the center of the chamber body 110, and the two lifting devices 140 symmetrically disposed may uniformly apply an acting force to the spraying member 120, so as to prevent the spraying member 120 from being twisted and deformed.
Alternatively, the adjusting member 142 may be an adjusting shim, and the thickness of each adjusting shim may be the same or different. In addition to the adjustment washer, the adjustment member 142 may also be other adjustment structures, such as an adjustment nut, etc.
In order to prevent the lifting body 141 from moving up and down, the lifting device 140 may further include a fastener (not shown), such as a screw or a pin. The adjustment member 142 may be detachably coupled to the lifting main body 141 and the chamber body 110 by a fastener, respectively.
In order to avoid horizontal deviation of the lifting device 140 during the process of lifting the lifting device 140, the lifting device 140 may further include a vertical guide structure (not shown) located inside the chamber body 110, wherein the vertical guide structure can limit the lifting device 140 to be lifted in a vertical direction, so that the horizontal deviation of the lifting device 140 can be avoided.
It should be noted that, the specific structure of the vertical guide structure is not limited, for example, the vertical guide structure may be a structure in which a guide hole is fitted with a guide pin, and the guide pin is inserted into the guide hole. Of course, besides the above, the vertical guiding structure may be some other specific structures capable of realizing vertical guiding.
In addition, in order to heat the process stage 130 during the process, as shown in fig. 1, the process chamber 100 may further include a heater 150, for example, the heater 150 may be a device capable of performing a heating function, such as a heating lamp.
In a second aspect of the present invention, a semiconductor processing apparatus (not shown in the figures) is provided, which includes the process chamber 100 described above, and the detailed structure of the process chamber 100 can refer to the related description above, which is not repeated herein.
The semiconductor processing apparatus of the present embodiment has the process chamber 100 described above, and when adjusting the spraying distance between the spraying device 120 and the process stage 130, the spraying distance is only required to be adjusted outside the chamber body 110, and no open-cavity operation is required for adjusting the spraying distance each time, so that the adjustment process can be effectively simplified, and the adjustment time can be shortened. In addition, the process gas channel 141a is further disposed in the hoisting main body 141, so that when the spraying distance between the spraying member 120 and the process carrying table 130 is adjusted, the process gas channel 141a does not interfere with or affect the adjusting process, thereby further shortening the adjusting time.
It is to be understood that the above embodiments are merely exemplary embodiments that have been employed to illustrate the principles of the present invention, and that the present invention is not limited thereto. It will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the spirit and substance of the invention, and these modifications and improvements are also considered to be within the scope of the invention.
Claims (13)
1. A process chamber comprises a chamber body and a spraying piece positioned in the chamber body, and is characterized by further comprising at least one hoisting device, wherein each hoisting device comprises a hoisting main body and a plurality of adjusting pieces; wherein,
the first end of the hoisting main body penetrates out of the chamber body and is movably and hermetically connected with the chamber body, the second end of the hoisting main body is hermetically connected with the spraying piece,
each adjusting piece is selectively clamped between the first end of the hoisting main body and the chamber body so as to adjust the spraying distance of the spraying piece.
2. The process chamber of claim 1, wherein the hoisting device further comprises an elastic sealing assembly sleeved on the hoisting main body, and two ends of the elastic sealing assembly are respectively connected with the chamber body and the second end of the hoisting main body in a sealing manner.
3. The process chamber of claim 2, wherein the elastic sealing assembly comprises a bellows and mounting flanges respectively located at two ends of the bellows, and the bellows is respectively connected with the chamber body and the second end of the hoisting main body in a sealing manner through the mounting flanges.
4. The process chamber of claim 1, wherein a process gas channel is further disposed in the hoisting main body, and the process gas channel is in sealed communication with the spray holes of the spray member.
5. The process chamber of claim 4, wherein the lifting device further comprises a seal interposed between the second end of the lifting body and the spray member to place the process gas passage in sealed communication with the spray holes.
6. The process chamber of any one of claims 1 to 5, wherein the chamber body is provided with a mounting hole penetrating through the wall thickness of the chamber body, the first end of the hoisting main body passes through the mounting hole, and a gap is formed between the peripheral side wall of the first end and the mounting hole.
7. The process chamber of any one of claims 1 to 5, wherein the first end of the hoisting main body is provided with an outwardly protruding flange, and the adjusting member is sandwiched between the flange and the chamber body.
8. The process chamber of any one of claims 1 to 5, wherein the end of the first end of the hoisting body is further provided with a hoisting ring.
9. The process chamber of any one of claims 1 to 5, wherein the process chamber comprises two lifting devices, and the two lifting devices are symmetrically arranged relative to the center of the chamber body.
10. The process chamber of any of claims 1 to 5, wherein the tuning member is a tuning shim.
11. The process chamber of any one of claims 1 to 5, wherein the lifting device further comprises a fastener, and the adjusting member is detachably connected to the lifting main body and the chamber body through the fastener.
12. The process chamber of any one of claims 1 to 5, wherein the lifting device further comprises a vertical guide structure located within the chamber body, the vertical guide structure being capable of limiting the lifting device to be raised and lowered in a vertical direction.
13. A semiconductor processing apparatus comprising the process chamber of any of claims 1-12.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821932849.2U CN208903984U (en) | 2018-11-22 | 2018-11-22 | Processing chamber and semiconductor processing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821932849.2U CN208903984U (en) | 2018-11-22 | 2018-11-22 | Processing chamber and semiconductor processing equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208903984U true CN208903984U (en) | 2019-05-24 |
Family
ID=66578060
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821932849.2U Active CN208903984U (en) | 2018-11-22 | 2018-11-22 | Processing chamber and semiconductor processing equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208903984U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111081523A (en) * | 2019-12-26 | 2020-04-28 | 长江存储科技有限责任公司 | Spacing adjusting device, semiconductor equipment and etching process chamber |
| CN111211067A (en) * | 2018-11-22 | 2020-05-29 | 东泰高科装备科技有限公司 | Process chamber and semiconductor processing equipment |
-
2018
- 2018-11-22 CN CN201821932849.2U patent/CN208903984U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111211067A (en) * | 2018-11-22 | 2020-05-29 | 东泰高科装备科技有限公司 | Process chamber and semiconductor processing equipment |
| CN111081523A (en) * | 2019-12-26 | 2020-04-28 | 长江存储科技有限责任公司 | Spacing adjusting device, semiconductor equipment and etching process chamber |
| CN111081523B (en) * | 2019-12-26 | 2022-12-16 | 长江存储科技有限责任公司 | Spacing adjusting device, semiconductor equipment and etching process chamber |
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| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20210119 Address after: Unit 611, unit 3, 6 / F, building 1, yard 30, Yuzhi East Road, Changping District, Beijing 102208 Patentee after: Zishi Energy Co.,Ltd. Address before: Room A129-1, No. 10 Zhongxing Road, Changping District Science and Technology Park, Beijing 102200 Patentee before: DONGTAI HI-TECH EQUIPMENT TECHNOLOGY Co.,Ltd. |