CN208781819U - Nozzle component and semiconductor processing equipment for semiconductor processing equipment - Google Patents
Nozzle component and semiconductor processing equipment for semiconductor processing equipment Download PDFInfo
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- CN208781819U CN208781819U CN201821555996.2U CN201821555996U CN208781819U CN 208781819 U CN208781819 U CN 208781819U CN 201821555996 U CN201821555996 U CN 201821555996U CN 208781819 U CN208781819 U CN 208781819U
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- rotary shaft
- spray head
- processing equipment
- semiconductor processing
- nozzle component
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Abstract
The utility model is related to a kind of nozzle component and semiconductor processing equipment for semiconductor processing equipment, wherein the nozzle component for semiconductor processing equipment includes rotary shaft and spray head；The rotary shaft is connect with spray head, the rotary shaft can around the rotary shaft center axis rotation and drive the spray head to rotate；The spray orifice of the spray head is set on the side wall of the spray head, the central axis of the opening direction and the rotary shaft of the spray orifice.The nozzle component for semiconductor processing equipment in the utility model can provide 360 ° of circular spraying effects, broaden the spraying range of spray head.
Description
Technical field
The utility model relates to technical field of semiconductors, and in particular to a kind of nozzle component for semiconductor processing equipment
And semiconductor processing equipment.
Background technique
During the manufacturing of wafer, it is often necessary to be sprayed to wafer, including gas shower and liquid spray
Leaching.In the prior art, it will usually which spray operation is carried out using spray head.
In the prior art, it when carrying out chemical vapor deposition to crystal column surface, is usually sprayed by spray head towards the wafer
Drench process gas.The relative position of wafer and spray head is there are two types of situation, the first is that the spray orifice of wafer and spray head is directly opposite, spray
The opening of the spray orifice of head directly acts on crystal column surface towards the process gas sprayed through spray head for being directed towards vertical direction.Second
Kind is that wafer is placed on levelling bench, and the opening of the spray orifice of spray head is towards horizontal direction is directed towards, at this time, it may be necessary to by wafer
The levelling bench of placement is rotated by 90 °, and makes to be placed with the one of wafer on levelling bench facing towards after the spray orifice of the spray head, then through spraying
Head sprays process gas, acts on crystal column surface.
When being sprayed using second method, other impurities are not had during spray and are fallen on wafer, Ke Yiti
Height is eventually deposited at the quality of the film layer of crystal column surface.But in the second approach, since the opening of the spray orifice of spray head is court
To horizontal direction, therefore when spraying into clean gas into reaction cavity by above-mentioned spray head, clean gas can only be acted on
In plane between the spray orifice and wafer of spray head, it is difficult to each corner for reaching cavity, be easy to cause the cleaning of cavity it is uneven,
It is not thorough, influences the quality of finally formed semiconductor devices and the yield of semiconductor devices.
Utility model content
The purpose of this utility model is to provide a kind of nozzle components and semiconductor processes for semiconductor processing equipment
Equipment can be improved the quality of the semiconductor devices ultimately generated.
In order to solve the above technical problems, providing a kind of nozzle group for semiconductor processing equipment in the utility model
Part, including rotary shaft and spray head；The rotary shaft is connect with spray head, and the rotary shaft can be revolved around the central axis of the rotary shaft
Turn and the spray head is driven to rotate；The spray orifice of the spray head is set on the side wall of the spray head, the opening direction of the spray orifice
With the central axis of the rotary shaft.
Optionally, further include sealing, be set in the rotary shaft, run through by the rotary shaft.
Optionally, the sealing includes at least one of magnetic fluid sealing structure, O-ring seal, lip-shaped sealed ring.
Optionally, the sealing is magnetic fluid sealing structure, comprising: shell, bearing, magnetic fluid and permanent magnet, wherein
The bearing is located at the enclosure interior, is socketed on outside the rotary shaft；The magnetic fluid is filled in the rotary shaft and shell
In gap between body；The permanent magnet is set to the enclosure interior, for providing magnetic field for the magnetic fluid.
Optionally, described rotary shaft one end is connected to a driving motor, drives the rotary shaft to revolve by the driving motor
Turn.
In order to solve the above technical problems, additionally providing a kind of semiconductor processing equipment, including cavity in the utility model, also
Including a nozzle component, the nozzle component includes: rotary shaft and spray head；The rotary shaft is connect with spray head, the rotary shaft
Can around the rotary shaft center axis rotation and drive the spray head to rotate；The spray orifice of the spray head is set to the spray head
On side wall, the central axis of the opening direction and the rotary shaft of the spray orifice；The spray head is located in the cavity, described
Rotary shaft through cavities wall.
Optionally, the nozzle component further includes sealing, is set in the rotary shaft, is passed through by the rotary shaft
It wears.
Optionally, the sealing is magnetic fluid sealing structure, comprising: shell, bearing, magnetic fluid and permanent magnet, wherein
The bearing is located at the enclosure interior, is socketed on outside the rotary shaft；The magnetic fluid is filled in the rotary shaft and shell
In gap between body；The permanent magnet is set to the enclosure interior, for providing magnetic field for the magnetic fluid.
Optionally, further includes: wafer susceptor and runner assembly, the wafer susceptor and runner assembly are all set in the chamber
In body；The wafer susceptor is for placing wafer to be processed；One end of the wafer susceptor is connected to runner assembly, the rotation
Component is for driving the wafer susceptor to move to the final position towards the spray head side wall from initial position.
Optionally, when the wafer susceptor is located at initial position, the opening direction of wafer susceptor surface and the spray orifice is flat
Row；When the wafer susceptor is located at final position, wafer susceptor surface is vertical with the opening of spray orifice direction.
The nozzle component for semiconductor processing equipment in the utility model has rotary shaft, and the rotary shaft can be around institute
The center axis rotation of rotary shaft is stated, and drives the spray head rotation for being connected to the rotary shaft, therefore the spray head can provide
360 ° of circular spraying effects, broaden the spraying range of the spray head, improve cavity cleaning efficiency and cleaning effect.
The spray head of the nozzle component of semiconductor processing equipment in the utility model can follow rotary shaft around the rotary shaft
Center rotation, by the spray head penetrating clean gas when, the spray head can 360 ° of rotations cavity is cleaned, widen
The spraying range of the spray head, improves cavity cleaning efficiency and cleaning effect, to improve the matter of the wafer ultimately generated
Amount and yield.Further, due to being provided with sealing between the rotary shaft and cavity wall, introduced contaminants cannot pass through
Gap between rotary shaft and cavity wall enters the cavity, and the leakproofness of the inside cavity of the semiconductor processing equipment is able to
Guarantee.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the nozzle component in a kind of specific embodiment of the utility model.
Fig. 2 is the schematic diagram of the section structure of the magnetic fluid sealing structure in a kind of specific embodiment of the utility model.
Fig. 3 is the structural schematic diagram of the semiconductor processing equipment in a kind of specific embodiment of the utility model.
Specific embodiment
Below in conjunction with the drawings and specific embodiments to the utility model proposes it is a kind of for semiconductor processing equipment
Nozzle component and semiconductor processing equipment are described in further detail.
Referring to Fig. 1, for the structural schematic diagram of the nozzle component in a kind of specific embodiment of the utility model.At this
In specific embodiment, including rotary shaft 101 and spray head 102；The rotary shaft 101 is connect with spray head 102, the rotary shaft
101 can around the rotary shaft 101 center axis rotation and drive the spray head 102 to rotate；The spray orifice 105 of the spray head 102
It is set on the side wall 104 of the spray head 102, the opening of the spray orifice 105 is hung down towards with the central axis of the rotary shaft 101
Directly.
There is a channel in the rotary shaft 101, be connected to the spray head 102.In other specific embodiments, institute
The size for stating channel is sufficiently wide, and gas or liquid to be sprayed is allow to enter to the spray head 102 by the channel.
In a specific embodiment, the cross section in the channel is circle, and the circular diameter is greater than described
The a quarter of 101 width of rotary shaft, less than 4/5ths of 101 width of rotary shaft.It is described circular straight by controlling
Diameter, make the rotary shaft 101 both with certain thickness rotation axial wall, will not damage easily, gas to be sprayed or
Liquid can also be easily passed into the spray head 102.
In other specific embodiments, the cross section in the channel may be a rectangle, the size of the rectangle
Also it should meet the demand.In fact, those skilled in the art can according to need the shape that the cross section in the channel is arranged
The size in shape and the channel.
In a specific embodiment, described 101 one end of rotary shaft is connected to a driving motor, by the driving motor
The rotary shaft 101 is driven to rotate.In other specific embodiments, described 101 one end of rotary shaft is also connected to other
Driving equipment is driven the rotary shaft 101 to rotate by other driving equipments, and those skilled in the art can select as needed
The type of driving equipment.
The other end of the rotary shaft 101 is arranged in the spray head 102.In a specific embodiment, the spray head
102 further include pressurizing device, is arranged in spray head 102, pressurizes, make through spraying to the gas or liquid that spray through spray orifice 105
The gas or liquid that hole 105 sprays have certain spouting velocity.In the actual use process, those skilled in the art can
To choose specific pressurizing device, such as booster pump as needed.
In a specific embodiment, the nozzle component 300 further includes sealing 103, is set to the rotary shaft
On 101, run through by the rotary shaft 101.The sealing 103 is close including magnetic fluid sealing structure, O-ring seal, lip type
At least one of seal.When will include that the nozzle component 300 of sealing 103 is installed in specific equipment, can pass through by
Sealing 103 is installed in specific equipment the installation for realizing the nozzle component 300.By realizing institute by sealing 103
The installation of nozzle component 300 is stated, therefore the nozzle component 300 will not be to the specific equipment that the nozzle component 300 is installed to
Leakproofness impacts.
Referring to Fig. 2, for the cross-section structure of the magnetic fluid sealing structure in a kind of specific embodiment of the utility model
Schematic diagram.
In this specific embodiment, the sealing is magnetic fluid sealing structure, comprising: shell 201, bearing 203, magnetic
Fluid 206, pole shoe 205 and permanent magnet 202, wherein the bearing 203 is located inside the shell 201, is socketed on the rotation
Outside axis 101；The magnetic fluid 206 is filled in the gap between the rotary shaft 101 and shell 201, tool shown in Fig. 2
In body embodiment, the magnetic fluid 206 is filled between pole shoe 205 and rotary shaft 101；The permanent magnet 202 is set to institute
It states inside shell 201, for providing magnetic field for the magnetic fluid 206；The pole shoe 205 is set to 202 both ends of permanent magnet.
In this specific embodiment, the material of the shell 201 is non-magnetic material.The magnetic fluid sealing structure
It further include O-ring 204, hoop is located on the end face for the pole shoe 205 for being set to 202 both ends of permanent magnet, on the end face of the pole shoe 205
Be arranged it is fluted, for placing the O-ring 204.The O-ring 204 is used to seal the seam between pole shoe 205 and shell 201
Gap guarantees the sealing performance of entire magnetic fluid seal.The permanent magnet 202 can directly act on rotary shaft 101 and shell
The magnetic fluid 206 filled in gap between 201 provides uniform magnetic field to the magnetic fluid 206, makes magnetic fluid 206 equal
Sealing ring is formed under even magnetic field, realizes the sealing function of the magnetic fluid sealing structure.
In specific embodiment shown in Fig. 2, the outside of the rotary shaft 101 is provided with pole tooth at least two, described
Magnetic fluid 206 is filled in the pole between cog, and flows in the pole between cog.Pole tooth is by the rotary shaft 101 and the shell 201
Between gap in the magnetic fluid 206 filled be layered, so that the multilayer being formed between the rotary shaft 101 and shell 201 is close
Seal.In a specific embodiment, three or more pole teeth are provided in the rotary shaft 101, to by magnetic fluid 206
It is divided into more layers, to constitute more layers sealing ring between the rotary shaft 101 and shell 201, realize more preferably sealing effect
Fruit.
The magnetic fluid 206 is made of base load liquid, magnetic particle and surfactant.The partial size of the magnetic particle should
It is sufficiently small, to get stable magnetic fluid 206.In a specific embodiment, the magnetic particle includes four oxidations three
Iron, nitrided iron etc..In a specific embodiment, the surfactant includes the organic matter with amphipathic structure, and one
End is polar group, prevents its reunion for coated magnetic particle, the other end is non-polar group, is protruded into base load liquid, and institute is made
Magnetic particle is stated with hydrophily or lipophilicity.
The nozzle component for semiconductor processing equipment in the utility model has a rotary shaft, and the rotary shaft can be around
The center axis rotation of the rotary shaft, and the spray head rotation for being connected to the rotary shaft is driven, therefore the spray head can provide
360 ° of circular spraying effects, broaden the spraying range of the spray head, improve cavity cleaning efficiency and cleaning effect.
A kind of semiconductor processing equipment is additionally provided in the utility model.Referring to Fig. 3, being a kind of tool of the utility model
The structural schematic diagram of semiconductor processing equipment in body embodiment.In this specific embodiment, the semiconductor processes are set
Standby includes cavity 304 and the nozzle component 300, and the spray head 102 of the nozzle component 300 is located in the cavity 304, institute
State the 101 through cavities wall of rotary shaft of nozzle component 300.
In this specific embodiment, the semiconductor processing equipment further includes sealing 103, is set to the rotary shaft
On 101, run through by the rotary shaft 101；The sealing 103 be located at 304 wall of cavity and the rotary shaft 101 it
Between.
In a specific embodiment, the sealing 103 is close including magnetic fluid sealing structure, O-ring seal, lip type
At least one of seal.In specific embodiment shown in Fig. 3, the sealing 103 is magnetic fluid sealing structure, specifically
Structure please refers to Fig. 2.
In specific embodiment shown in Fig. 3, the semiconductor processing equipment further include: wafer susceptor 305 and rotation
Component 302, the wafer susceptor 305 and runner assembly 302 are all set in the cavity 304；The wafer susceptor 305 is used for
Place wafer to be processed；One end of the wafer susceptor 305 is connected to runner assembly 302, and the runner assembly 302 is for driving
The wafer susceptor 305 moves to the final position of the side wall 104 towards the spray head 102 from initial position.
In specific embodiment shown in Fig. 3, the wafer susceptor 305 includes levelling bench 301 and is set to described
The electrostatic adsorption device 303 of 301 upper surface of levelling bench.The electrostatic adsorption device 303, which can adsorb, is placed into the Electrostatic Absorption
Wafer on device 303 prevents the relatively described electrostatic adsorption device 303 of the wafer from sliding.
In a kind of other specific embodiments, the wafer susceptor 305 can also be by being set to the levelling bench
The negative-pressure air fan of 301 upper surfaces realizes the absorption to wafer.In this kind of specific embodiment, the negative-pressure air fan upper surface is also
It is provided with a glove plane, for placing wafer.Hole is set in the glove plane, for the lower surface of wafer to be exposed to
In wind caused by negative-pressure air fan, makes have different atmospheric pressure values at the upper surface of the wafer and at lower surface, cause wafer
Upper and lower surface has draught head, so that the wafer is crushed on the upper surface of the glove plane, it will not be relative to the wafer
Pedestal 305 slides.
In a specific embodiment, it is provided with pedestal 306 below the wafer susceptor 305, for placing the crystalline substance
Physa seat 305.In a specific embodiment, the wafer susceptor 305 can be separated with the pedestal 306.The wafer
Pedestal 305 is to be detached from the pedestal 306 during the motion.
In a specific embodiment, the runner assembly 302 is rotary cylinder, and the round end of the rotary cylinder
It is connected to the wafer susceptor 305, the wafer susceptor 305 is driven to move to the side towards the spray head 102 from initial position
The final position of wall 104.The range of the rotation angle of the rotary cylinder is 0 ° to 100 °.In fact, those skilled in the art
Member can according to need the setting runner assembly 302, only needs that the wafer susceptor 305 can be driven to rotate and can make the crystalline substance
Physa seat 305 moves to the final position.
In another embodiment specific implementation mode, the runner assembly 302 can also be by driving motor, axle sleeve and hard connecting rod
Composition.In this specific embodiment, the axle sleeve is socketed on the output shaft of the driving motor, and the hard connecting rod is fixed
To the axle sleeve, the hard connecting rod other end is connected to the wafer susceptor 305.It is described when driving motor work
The output shaft of driving motor drives the axle sleeve rotation being socketed on output shaft, and described so that the hard connecting rod be driven to rotate
The wafer susceptor 305 of hard connecting rod one end connection, which also follows, to be rotated.
In this specific embodiment, the direction of rotation of the output shaft of the driving motor is the wafer susceptor 305
The direction of motion.The direction of rotation of the output shaft, which meets, can make the wafer susceptor 305 move to direction from initial position
The demand of the final position of the side wall 104 of the spray head 102.
In a specific embodiment, when the wafer susceptor 305 is located at initial position, 305 surface of wafer susceptor with
The opening direction of the spray orifice 105 is parallel, and the bottom surface of the wafer susceptor 305 is contacted with the pedestal 306, the pedestal
306 provide support to the wafer susceptor 305；When the wafer susceptor 305 is located at final position, 305 surface of wafer susceptor with
The opening direction of the spray orifice 105 is vertical, and is detached from the pedestal 306.
When the wafer susceptor 305 moves to final position, the upper surface for the wafer placed on 305 surface of wafer susceptor with
The opening of spray orifice 105 is towards vertically, and the emission direction of the gas or liquid that gush out from spray head 102 at this time is perpendicular to the crystalline substance
Circular surfaces can reach preferable spraying effect, and impurity is avoided to remain in crystal column surface.
When spraying into clean gas into the cavity 304 by the nozzle component 300, the rotary shaft 101 is controlled
The spray head 102 rotates, and makes the opening of the spray orifice 105 towards constantly changing, so that 102 energy of the spray head
Clean gas is sprayed everywhere towards chamber 304, realizes preferable cleaning effect.In a specific embodiment, the rotation
Axis 101 is 0 ° to 360 ° around the angular range of the center axis rotation of the rotary shaft 101, and the spray head 102 is driven, follows institute
The angular range for stating the rotation of rotary shaft 101 is also 0 ° to 360 °, and the variation range of the opening direction of spray orifice 105 is around the rotation
0 ° to 360 ° of the center axis rotation of axis 101.At this point, the opening of 305 surface of wafer susceptor and the spray orifice 105 is towards mutually
Vertically.In another embodiment specific implementation mode, clean gas is sprayed into cavity 304 to chamber in the control nozzle component 300
When body 304 is cleaned, the runner assembly 302 drives the wafer susceptor 305 to move to initial position, the wafer susceptor
305 surface and the opening direction of the spray orifice 105 are parallel to each other, the cleaning gas that the spray head 105 will not be stopped to spray outward
Body.
The spray head of the nozzle component of semiconductor processing equipment in the utility model can follow rotary shaft around the rotary shaft
Center rotation, by the spray head penetrating clean gas when, the spray head can 360 ° of rotations cavity is cleaned, widen
The spraying range of the spray head, improves cavity cleaning efficiency and cleaning effect, to improve the matter of the wafer ultimately generated
Amount and yield.Further, due to being provided with sealing between the rotary shaft and cavity wall, introduced contaminants cannot pass through
Gap between rotary shaft and cavity wall enters the cavity, and the leakproofness of the inside cavity of the semiconductor processing equipment is able to
Guarantee.
In a specific embodiment, the semiconductor processing equipment is chemical vapor depsotition equipment.The nozzle group
Sealing in part is mounted on the cavity wall of the chemical vapor depsotition equipment, and described rotary shaft one end is connected to process gas
Gas source, the rotary shaft other end is connected to the spray head, and spray head setting portion in the cavity.The rotation
A channel is additionally provided with inside axis, for being connected to the spray head.During carrying out chemical deposition processing to wafer, the spray
Head sprays process gas towards the wafer susceptor that the inside cavity is arranged.The wafer of pending chemical vapor deposition is placed on institute
It states on wafer susceptor.
The nozzle component is also used to spray into clean gas into the cavity of the chemical vapor depsotition equipment, with realization pair
The cavity is cleaned.When spraying into clean gas into the cavity by the nozzle component, the spray head follows institute
The central axis that rotary shaft is stated around the rotary shaft rotates, and the clean gas is sprayed in the cavity
Everywhere, it is sprayed rather than just to the wafer susceptor.
In other specific embodiments, the semiconductor processing equipment may be that other need that head body is arranged
Equipment, such as semiconductor cooling equipment, semiconductor cleaning device.When the semiconductor processing equipment includes cavity and cavity
It is required that can choose sealing of the magnetic fluid sealing structure as the spray head when certain leakproofness.When described
When the sealing requirements of cavity are not high, the sealing as the spray head such as O-ring seal, lip-type packing can choose
Portion influences the final matter of wafer to prevent the impurity such as dust from entering the cavity by the gap between the spray head and cavity
Amount.
The above is only the preferred embodiment of the utility model, it is noted that for the common skill of the art
Art personnel can also make several improvements and modifications without departing from the principle of this utility model, these improvements and modifications
Also it should be regarded as the protection scope of the utility model.
Claims (10)
1. a kind of nozzle component for semiconductor processing equipment characterized by comprising
Rotary shaft and spray head；
The rotary shaft is connect with spray head, the rotary shaft can around the rotary shaft center axis rotation and drive the spray head
Rotation；
The spray orifice of the spray head is set on the side wall of the spray head, the center of the opening direction and the rotary shaft of the spray orifice
Axis is vertical.
2. the nozzle component according to claim 1 for semiconductor processing equipment, which is characterized in that further include sealing
Portion is set in the rotary shaft, is run through by the rotary shaft.
3. the nozzle component according to claim 2 for semiconductor processing equipment, which is characterized in that the sealing packet
Include at least one of magnetic fluid sealing structure, O-ring seal, lip-shaped sealed ring.
4. the nozzle component according to claim 2 for semiconductor processing equipment, which is characterized in that the sealing is
Magnetic fluid sealing structure, comprising: shell, bearing, magnetic fluid and permanent magnet, wherein the bearing is located at the enclosure interior, set
It is connected to outside the rotary shaft；
The magnetic fluid is filled in the gap between the rotary shaft and shell；
The permanent magnet is set to the enclosure interior, for providing magnetic field for the magnetic fluid.
5. the nozzle component according to claim 1 for semiconductor processing equipment, which is characterized in that the rotary shaft one
End is connected to a driving motor, drives the rotary shaft to rotate by the driving motor.
6. a kind of semiconductor processing equipment, including cavity, which is characterized in that it further include a nozzle component, the nozzle component packet
It includes: rotary shaft and spray head；The rotary shaft is connect with spray head, the rotary shaft can around the rotary shaft center axis rotation simultaneously
The spray head is driven to rotate；The spray orifice of the spray head is set on the side wall of the spray head, opening direction and the institute of the spray orifice
State the central axis of rotary shaft；The spray head is located in the cavity, the rotary shaft through cavities wall.
7. semiconductor processing equipment according to claim 6, which is characterized in that the nozzle component further includes sealing,
It is set in the rotary shaft, is run through by the rotary shaft.
8. semiconductor processing equipment according to claim 7, which is characterized in that the sealing is magnet fluid sealing knot
Structure, comprising: shell, bearing, magnetic fluid and permanent magnet, wherein
The bearing is located at the enclosure interior, is socketed on outside the rotary shaft；
The magnetic fluid is filled in the gap between the rotary shaft and shell；
The permanent magnet is set to the enclosure interior, for providing magnetic field for the magnetic fluid.
9. semiconductor processing equipment according to claim 6, which is characterized in that further include: wafer susceptor and runner assembly,
The wafer susceptor and runner assembly are all set in the cavity；The wafer susceptor is for placing wafer to be processed；It is described
One end of wafer susceptor is connected to runner assembly, and the runner assembly is for driving the wafer susceptor to move to from initial position
Towards the final position of the spray head side wall.
10. semiconductor processing equipment according to claim 9, which is characterized in that the wafer susceptor is located at initial position
When, wafer susceptor surface is parallel with the opening of spray orifice direction；When the wafer susceptor is located at final position, wafer susceptor table
Face is vertical with the opening of spray orifice direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821555996.2U CN208781819U (en) | 2018-09-21 | 2018-09-21 | Nozzle component and semiconductor processing equipment for semiconductor processing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821555996.2U CN208781819U (en) | 2018-09-21 | 2018-09-21 | Nozzle component and semiconductor processing equipment for semiconductor processing equipment |
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| Publication Number | Publication Date |
|---|---|
| CN208781819U true CN208781819U (en) | 2019-04-23 |
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ID=66162307
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| Application Number | Title | Priority Date | Filing Date |
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| CN201821555996.2U Active CN208781819U (en) | 2018-09-21 | 2018-09-21 | Nozzle component and semiconductor processing equipment for semiconductor processing equipment |
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| CN (1) | CN208781819U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110524143A (en) * | 2019-08-02 | 2019-12-03 | 西安飞机工业（集团）有限责任公司 | The device and method of weld porosity defect in a kind of elimination aluminum alloy piping welding |
-
2018
- 2018-09-21 CN CN201821555996.2U patent/CN208781819U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110524143A (en) * | 2019-08-02 | 2019-12-03 | 西安飞机工业（集团）有限责任公司 | The device and method of weld porosity defect in a kind of elimination aluminum alloy piping welding |
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