CN208776870U - A kind of heat-proof device and the MOCVD device equipped with the heat-proof device - Google Patents
A kind of heat-proof device and the MOCVD device equipped with the heat-proof device Download PDFInfo
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- CN208776870U CN208776870U CN201821205931.5U CN201821205931U CN208776870U CN 208776870 U CN208776870 U CN 208776870U CN 201821205931 U CN201821205931 U CN 201821205931U CN 208776870 U CN208776870 U CN 208776870U
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- heat
- reflecting plate
- proof device
- support plate
- water pipe
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Abstract
The utility model relates to heat-insulating technique field more particularly to a kind of heat-proof device and equipped with the MOCVD device of the heat-proof device.The heat-proof device includes support plate, spaced at least one layer of reflecting plate and cooling water pipe from top to bottom in the support plate, the cooling water pipe is arranged between the support plate and the reflecting plate and/or the cooling water pipe is arranged between the reflecting plate of adjacent two layers.Heat-proof device described in the utility model and MOCVD device equipped with the heat-proof device, reflecting plate is combined to carry out layered thermal insulation with cooling water pipe, realize being effectively isolated for high-heat region and non-heated region, improve heat-insulating efficiency, structure is simple, the loss caused by heat when reducing difficulty of processing, while reducing cooling, and then improve heating efficiency.
Description
Technical field
The utility model relates to heat-insulating technique field more particularly to a kind of heat-proof device and equipped with the heat-proof device
MOCVD device.
Background technique
Metal-organic chemical vapor deposition equipment, English name are Metal-organic Chemical Vapor
Deposition is abbreviated as MOCVD, is a kind of chemical vapor deposition to grow up on the basis of vapor phase epitaxial growth (VPE)
Product technique, for growing epitaxial wafer.It is with the hydride of III group, the organic compound of II race element and V, VI race's element
Deng the reaction gas as crystal growth, epitaxial deposition is carried out in Sapphire Substrate or other substrates in a manner of pyrolysis
Technique grows the epitaxial material of various iii-vs, VI compound semiconductor of II- and their multivariate solid solution.Usually
The growth conditions of MOCVD is carried out at low pressure (1000-10000pa), and the carrier gas (usually N2 or H2) used and original are grown
Material gas, which is mixed in a certain ratio, to be passed through in reaction chamber, and underlayer temperature is generally between 700-1500K.
Currently, the heat-proof device in existing MOCVD device, structure type is relatively limited, mainly on chamber wall
Setting water channel cool down heat-insulated, however there are following defects for this heat-insulated mode: 1, cooling while, consume plus
Work power is unable to maintain that normal working power；2, channel structure is complicated, and difficulty of processing is big.
Utility model content
(1) technical problems to be solved
The purpose of the utility model is to provide a kind of heat-proof device and equipped with the MOCVD device of the heat-proof device, Neng Goushi
Existing high-heat region is effectively isolated with non-heated region.
(2) technical solution
In order to solve the above-mentioned technical problem, the utility model provides a kind of heat-proof device, including support plate, in the branch
Spaced at least one layer of reflecting plate and cooling water pipe, the cooling water pipe are arranged in the branch from top to bottom on fagging
Between fagging and the reflecting plate and/or the cooling water pipe is arranged between the reflecting plate of adjacent two layers.
Further, each reflecting plate is connected and fixed by connector and the support plate.
Specifically, the connector includes stud, and one end of the stud is connected with the support plate, and the stud is another
End is connected across each reflecting plate with fixture nut.
Specifically, gap is equipped between the stud and the reflecting plate, between every two layers adjacent of reflecting plate
Equipped with isolation ring, the barrier cuff is located on the stud.
Specifically, the reflecting plate is made of mirror face stainless steel.
Specifically, the S-shaped arrangement of the cooling water pipe.
The utility model provides a kind of MOCVD device, including at least above-mentioned heat-proof device.
Specifically, the heat-proof device setting is in reaction chamber or preheating chamber.
Specifically, heating device and support plate, the heating device, support plate and heat-proof device are additionally provided in the reaction chamber
It is successively arranged at intervals in the reaction chamber from top to bottom.
Specifically, the heating device is heating fluorescent tube.
(3) beneficial effect
The above-mentioned technical proposal of the utility model has the advantages that
Heat-proof device provided by the utility model and MOCVD device equipped with the heat-proof device, by reflecting plate and cooling water
Pipe combines carry out layered thermal insulation, constitutes effective temperature gradient, realizes the effective of high-heat region and non-heated region
Isolation, improves heat-insulating efficiency, in the normal operation for guaranteeing heating region meanwhile, it is capable to which the temperature in non-heated region is effectively ensured
Maintain normal temperature.
Heat-proof device provided by the utility model and MOCVD device equipped with the heat-proof device, structure is simple, reduce plus
Work difficulty, while the loss caused by heat when reducing cooling, and then improve heating efficiency.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of one heat-proof device of the utility model embodiment；
Fig. 2 is the structural schematic diagram of five MOCVD device of the utility model embodiment.
In figure: 1: support plate；2: the first reflecting plates；3: the second reflecting plates；4: third reflecting plate；5: fixing piece；6: cooling
Water pipe；7: stud；8: fixture nut；9: isolation ring；10: heat-proof device；11: reaction chamber；12: heating device；13: support plate.
Specific embodiment
It is practical new below in conjunction with this to keep the objectives, technical solutions, and advantages of the embodiments of the present invention clearer
Attached drawing in type embodiment, the technical scheme in the utility model embodiment is clearly and completely described, it is clear that is retouched
The embodiment stated is a part of the embodiment of the utility model, instead of all the embodiments.Based on the reality in the utility model
Apply example, those of ordinary skill in the art's every other embodiment obtained without making creative work, all
Belong to the range of the utility model protection.
The utility model provides a kind of heat-proof device, including support plate, the interval setting from top to bottom in the support plate
At least one layer of reflecting plate and cooling water pipe, the cooling water pipe is arranged between the support plate and the reflecting plate,
And/or the cooling water pipe is arranged between the reflecting plate of adjacent two layers.
Reflecting plate, is combined carry out layered thermal insulation by heat-proof device described in the utility model with cooling water pipe, and composition has
The temperature gradient of effect realizes being effectively isolated for high-heat region and non-heated region, improves heat-insulating efficiency, guaranteeing plus
The normal operation of thermal region is meanwhile, it is capable to which the temperature that non-heated region is effectively ensured maintains normal temperature.
It wherein, can be specific according to carrying board structure, chamber structure feature, heating temperature requirement etc. in specific actual application environment
Factor, arbitrarily change the shape and structure of the reflecting plate, the gap size of reflecting plate, the number of plies of reflecting plate, reflecting plate material,
The type etc. of coolant liquid in fit system and cooling water pipe between the fixed form of reflecting plate, reflecting plate and cooling water pipe
Factor is effectively isolated heating zone in actual application environment and unheated zone to realize.Below by several specific implementations
Example illustrates heat-proof device described in the utility model.
Embodiment one
As shown in Figure 1, heat-proof device described in the utility model embodiment, including support plate 1, in the support plate 1
Three layers of reflecting plate are arranged at intervals with, three layers of reflecting plate are respectively the first reflecting plate 2,3 and of the second reflecting plate from top to bottom
Third reflecting plate 4, wherein the third reflecting plate 4 is arranged on the upper surface of the support plate 1, the third reflecting plate 4 with
Fixation is attached by fixing piece 5 between the support plate 1.Between the third reflecting plate 4 and second reflecting plate 3
Equipped with cooling water pipe 6.
Wherein, first reflecting plate 2, the second reflecting plate 3 and third reflecting plate 4 pass through connector and the branch respectively
Fagging 1 is connected and fixed.
In the present embodiment, the connector includes stud 7, one end of the stud 7 and the fixed company of the support plate 1
It connects, 7 other end of stud is each passed through each first reflecting plate 2, the second reflecting plate 3 and the third reflecting plate 4 and fixes
Nut 8 is connected.
Wherein, be equipped with isolation ring 9 between every two layers adjacent of reflecting plate, namely first reflecting plate 2 with
Described be isolated is respectively equipped between second reflecting plate 3 and between second reflecting plate 3 and the third reflecting plate 4
Ring 9 carries out positioning isolation to adjacent two layers reflecting plate by the isolation ring 9.Each isolation ring 9 is set in the stud
On 7, it can be realized by locking the fixture nut 8 to the support plate 1, each layer reflecting plate and each isolation ring
Fixation between 9.
In the present embodiment, by be arranged three layers of reflecting plate carry out layering isolation, be effectively ensured heating zone with it is non-heated
The mutual independence of area's temperature, while by the way that the cooling is arranged between the third reflecting plate 4 and second reflecting plate 3
The inside stream of water pipe 6, the cooling water pipe 6 is connected with cooling water, is furthermore achieved in bottom and is effectively isolated to heat, passes through
Combination between three layers of reflecting plate and cooling water pipe 6, has levels, have gradient to heating zone and unheated zone realize effectively every
From.
Embodiment two
Heat-proof device described in the utility model embodiment, it is essentially identical with the structure of embodiment one, it is only reflecting plate
It is different that the number of plies is set.
In the present embodiment, it is arranged at intervals with two layers of reflecting plate in the support plate 1, between two layers of reflecting plate
The cooling water pipe 6 is set.
In addition, the isolation method between two layers of reflecting plate and the fixed form and embodiment between the support plate 1
One is identical, is no longer repeated herein.
Embodiment three
Heat-proof device described in the utility model embodiment, it is essentially identical with the structure of embodiment one, it is only reflecting plate
The set-up mode that the number of plies and cooling water pipe is arranged is different.
In the present embodiment, the support plate 1 is equipped with one layer of reflecting plate, between the reflecting plate and the support plate 1
It is isolated by the isolation ring 9, the cooling water pipe 6 is set between the support plate 1 and the reflecting plate.
In addition, the fixed form between the reflecting plate and the support plate 1 is the same as example 1, no longer carry out herein
It repeats.
Example IV
Heat-proof device described in the utility model embodiment, it is essentially identical with the structure of embodiment one, it is only reflecting plate
The set-up mode that the number of plies and cooling water pipe is arranged is different.
In the present embodiment, four layers of reflecting plate are arranged at intervals in the support plate 1, per two layers adjacent of reflecting plate it
Between and the radial shield positioned at the bottom and the support plate 1 between be isolated by the isolation ring 9, every
It is respectively provided between two layers adjacent of reflecting plate and between the radial shield and the support plate 1 of the bottom described cold
But water pipe 6.
In addition, the fixed form between the reflecting plate and the support plate 1 is the same as example 1, no longer carry out herein
It repeats.
In the above embodiments, the reflecting plate is made of mirror face stainless steel, can effectively be stopped heating light
It reflects back, while meeting heat-insulated, effectively improves heating efficiency.
In the above embodiments, the cooling water pipe 6 is preferably set as S-shaped, arranges the cooling water pipe by S-shaped
6, heat insulation can be increased to greatest extent.
In the above embodiments, gap is equipped between the stud 7 and the reflecting plate, it, can by the way that gap is arranged
Make for heat-proof device in the thermal histories of working condition, avoids the reflecting plate heated and be subjected to displacement or expand to the spiral shell
Column 7 generates extruding.
In addition, heat-proof device described in the various embodiments described above, any need to heating zone and non-heated can be suitable for
In the device and equipment that area is isolated.
Embodiment five
As shown in Fig. 2, the utility model embodiment provides a kind of MOCVD device, include at least heat-proof device 10, it is described every
Thermal 10 is using heat-proof device 10 described in any of the above-described embodiment.
Furthermore, it is understood that the MOCVD device includes reaction chamber 11 and preheating chamber, the heat-proof device 10 is arranged
In the reaction chamber 11 or the preheating chamber.
More specifically, in the present embodiment, heating device 12 and support plate 13, institute are additionally provided in the reaction chamber 11
Heating device 12, support plate 13 and the heat-proof device 10 stated successively are arranged at intervals on from top to bottom in the reaction chamber 11.
In the present embodiment, the heating device 10 is using heating fluorescent tube.
In the present embodiment, the heating function in the MOCVD device is realized by the heating fluorescent tube, the heating lamp
Pipe carries chip below to need the support plate 13 that is preheated on the support plate 13, the support plate 13 be below it is described every
Thermal 10.It is described heating fluorescent tube heating temperature it is higher, substantially 400 DEG C~500 DEG C, the heating fluorescent tube with it is described heat-insulated
Region among device 10 is heating zone.
By the heat-proof device 10, effectively heating region and other unheated zone domain separations can be separated, it is described heat-insulated
On the one hand reflecting plate in device 10 can reflect back the light of the heating fluorescent tube, promotion heating efficiency, another side,
Can imitate prevents perimeter to be heated, and causes temperature higher, High Temperature occurs.
In conclusion heat-proof device described in the utility model embodiment and the MOCVD device equipped with the heat-proof device, it will
Reflecting plate combines carry out layered thermal insulation with cooling water pipe, constitutes effective temperature gradient, realize high-heat region with it is non-
Being effectively isolated for heating region, improves heat-insulating efficiency, is guaranteeing the normal operation of heating region meanwhile, it is capable to be effectively ensured non-
The temperature of heating region maintains normal temperature.
Heat-proof device described in the utility model embodiment and the MOCVD device equipped with the heat-proof device, structure is simple, drop
Low difficulty of processing, while the loss caused by heat when reducing cooling, and then improve heating efficiency.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " phase
Even ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or be integrally connected；It can
To be mechanical connection, it is also possible to be electrically connected；It can be directly connected, it can also be indirectly connected through an intermediary.For this
For the those of ordinary skill in field, the concrete meaning of above-mentioned term in the present invention can be understood with concrete condition.
In the description of the present invention, unless otherwise indicated, " several " are meant that one or more；" multiples' " contains
Justice is two or more；The orientation or positional relationship of the instructions such as term " on ", "lower", "left", "right", "inner", "outside" is
It is based on the orientation or positional relationship shown in the drawings, is merely for convenience of describing the present invention and simplifying the description, rather than indicate
Or imply that signified machine or element must have a particular orientation, be constructed and operated in a specific orientation, therefore should not be understood as
Limitations of the present invention.
Finally, it should be noted that above embodiments are only to illustrate the technical solution of the utility model, rather than its limitations；
Although the utility model is described in detail with reference to the foregoing embodiments, those skilled in the art should understand that:
It is still possible to modify the technical solutions described in the foregoing embodiments, or part of technical characteristic is carried out etc.
With replacement；And these are modified or replaceed, various embodiments of the utility model technology that it does not separate the essence of the corresponding technical solution
The spirit and scope of scheme.
Claims (10)
1. a kind of heat-proof device, it is characterised in that: including support plate, in the support plate from top to bottom it is spaced at least
One layer of reflecting plate and cooling water pipe, the cooling water pipe is arranged between the support plate and the reflecting plate and/or institute
Cooling water pipe is stated to be arranged between the reflecting plate of adjacent two layers.
2. heat-proof device according to claim 1, it is characterised in that: each reflecting plate passes through connector and the support
Plate is connected and fixed.
3. heat-proof device according to claim 2, it is characterised in that: the connector includes stud, and the one of the stud
End is connected with the support plate, and the stud other end passes through each reflecting plate and is connected with fixture nut.
4. heat-proof device according to claim 3, it is characterised in that: between being equipped between the stud and the reflecting plate
Gap, is equipped with isolation ring between every two layers adjacent of reflecting plate, and the barrier cuff is located on the stud.
5. heat-proof device according to claim 1, it is characterised in that: the reflecting plate is made of mirror face stainless steel.
6. heat-proof device according to claim 1, it is characterised in that: the S-shaped arrangement of cooling water pipe.
7. a kind of MOCVD device, it is characterised in that: include at least heat-proof device as claimed in any one of claims 1 to 6.
8. MOCVD device according to claim 7, it is characterised in that: the heat-proof device setting is in reaction chamber or in advance
In heating chamber.
9. MOCVD device according to claim 8, it is characterised in that: be additionally provided in the reaction chamber heating device and
Support plate, the heating device, support plate and heat-proof device are successively arranged at intervals in the reaction chamber from top to bottom.
10. MOCVD device according to claim 9, it is characterised in that: the heating device is heating fluorescent tube.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821205931.5U CN208776870U (en) | 2018-07-27 | 2018-07-27 | A kind of heat-proof device and the MOCVD device equipped with the heat-proof device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821205931.5U CN208776870U (en) | 2018-07-27 | 2018-07-27 | A kind of heat-proof device and the MOCVD device equipped with the heat-proof device |
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| Publication Number | Publication Date |
|---|---|
| CN208776870U true CN208776870U (en) | 2019-04-23 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201821205931.5U Active CN208776870U (en) | 2018-07-27 | 2018-07-27 | A kind of heat-proof device and the MOCVD device equipped with the heat-proof device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115161764A (en) * | 2022-06-23 | 2022-10-11 | 江苏天芯微半导体设备有限公司 | Temperature control device and epitaxial equipment thereof |
-
2018
- 2018-07-27 CN CN201821205931.5U patent/CN208776870U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115161764A (en) * | 2022-06-23 | 2022-10-11 | 江苏天芯微半导体设备有限公司 | Temperature control device and epitaxial equipment thereof |
| CN115161764B (en) * | 2022-06-23 | 2024-02-06 | 江苏天芯微半导体设备有限公司 | Temperature control device and epitaxial equipment thereof |
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Legal Events
| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 102209 Beijing City, Changping District Beiqijia Town, Tivoli Park No. 15 Patentee after: DONGTAI HI-TECH EQUIPMENT TECHNOLOGY Co.,Ltd. Address before: 102209 Beijing City, Changping District Beiqijia Town, Tivoli Park No. 15 Patentee before: DONGTAI HI-TECH EQUIPMENT TECHNOLOGY (BEIJING) Co.,Ltd. |
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| CP01 | Change in the name or title of a patent holder | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20211101 Address after: Unit 611, unit 3, 6 / F, building 1, yard 30, Yuzhi East Road, Changping District, Beijing 102208 Patentee after: Zishi Energy Co.,Ltd. Address before: 102209 Beijing City, Changping District Beiqijia Town, Tivoli Park No. 15 Patentee before: DONGTAI HI-TECH EQUIPMENT TECHNOLOGY Co.,Ltd. |
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| TR01 | Transfer of patent right |