CN208768334U - A kind of encapsulating structure, the low-melting-point metal device using it - Google Patents
A kind of encapsulating structure, the low-melting-point metal device using it Download PDFInfo
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- CN208768334U CN208768334U CN201821311688.5U CN201821311688U CN208768334U CN 208768334 U CN208768334 U CN 208768334U CN 201821311688 U CN201821311688 U CN 201821311688U CN 208768334 U CN208768334 U CN 208768334U
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Abstract
The utility model provides a kind of encapsulating structure, the low-melting-point metal device using it, is related to technical field of electronic encapsulation.For encapsulating structure provided by the utility model for being packaged to the low-melting-point metal route on substrate, the encapsulating structure includes: the protective layer being successively covered on the low-melting-point metal route, at least one layer of adhesive layer and one layer of separation layer；Wherein, the protective layer is directly with the low-melting-point metal wiring circuit contact, and described protective layer used in preventing the low-melting-point metal route from deforming, the adhesive layer is for being bonded the protective layer and the separation layer, and the separation layer is for completely cutting off air and water vapour.The technical solution of the utility model can prevent low-melting-point metal route from deforming, and prevent air and water vapour and low-melting-point metal wiring circuit contact.
Description
Technical field
The utility model relates to technical field of electronic encapsulation more particularly to a kind of encapsulating structure, using its low melting point gold
Belong to device.
Background technique
The fusing point of low-melting-point metal at 300 degrees Celsius hereinafter, and with metal electric conductivity, can be used for making eutectic
Point metallic circuit.In recent years, in fields such as education industry, media, the development of smart electronics interaction technique reaches its maturity, realizes
The strategic structural of a variety of interactive modes, low-melting-point metal circuit board may be used as interactive module circuit board.
But the property of low-melting-point metal is active, is easy to react with air and water vapour etc. and causes to fail, is easy to cause mutually
The stability of dynamic model block is poor, and service life is shorter, and therefore, it is necessary to effectively be encapsulated to low-melting-point metal route.
And some packaging methods are also disclosed in the prior art, it is mainly used for encapsulating LED, solar chip etc., specifically,
Chinese patent CN103855277B discloses a kind of LED encapsulation method, is formed on substrate by the way of laser ablation first
Etching groove forms electric pathway by welding LED wafer electrode and metal etch piece, then with fluorescence glue metal etch piece
Be sticked adhesive tape under metal etch piece, finally covers transparent enclosure glue, LED component is encapsulated in inside glue film.Change method only for
LED component encapsulation is not related to large-area circuits encapsulation.And the wherein method of encapsulating transparent enclosure glue, it is unable to satisfy vertical elevation
The encapsulation of substrate.
Chinese patent CN106941123A discloses a kind of solar chip packaging method for solar telephone, the envelope
Dress method is included in chip back sprayed glues, covers cover board in solar chip layer and side carries out protective treatment on the cover board.
The packaging method has done more perfect protection to solar chip, but uses the cover board protection of rigidity, and it is flexible to lack production
A possibility that device.
Chinese patent CN103171222A discloses a kind of flexible electronic package application class high viscosity composite membrane and its processing
Method.Mylar substrate is wherein handled using plasma method, then painting polyethylene imide liquor layer on mylar, poly- again
Olefin resin layer and VAE emulsion layer eventually pass through the means such as heat treatment, ozone treatment, form high viscosity composite membrane, the composite membrane
It is ineffective when surface for package thickness unevenness.And due to the presence of polyethyleneimine, so that the high viscosity of preparation is compound
Film has stronger moisture pick-up properties.
But the encapsulation to low-melting-point metal route is not implemented in various packaged types in the prior art, and exists certain
Problem.
Utility model content
The utility model provides a kind of encapsulating structure, the low-melting-point metal device using it, can prevent low-melting-point metal
Route deformation, and prevent air and water vapour and low-melting-point metal wiring circuit contact.
In a first aspect, the utility model provides a kind of encapsulating structure, adopt the following technical scheme that
The encapsulating structure for being packaged to the low-melting-point metal route on substrate, the encapsulating structure include: according to
The secondary protective layer being covered on the low-melting-point metal route, at least one layer of adhesive layer and one layer of separation layer；Wherein, described
Protective layer is described protective layer used in preventing the low-melting-point metal route from deforming directly with the low-melting-point metal wiring circuit contact,
The adhesive layer is for being bonded the protective layer and the separation layer, and the separation layer is for completely cutting off air and water vapour.
Optionally, by weight percentage, the protective layer is by 85%~99% sizing material, 0%~15% diluent, 0%
~10% drier and 0%~1% defoaming agent composition；By weight percentage, the adhesive layer by 85%~99% sizing material,
0%~15% diluent, 0%~10% drier and 0%~1% defoaming agent composition；By weight percentage, the separation layer
It is made of 85%~99% sizing material, 0%~15% diluent, 0%~10% drier and 0%~1% defoaming agent.
Illustratively, the sizing material in the protective layer is polyurethane or acrylic compounds adhesive.
Illustratively, the sizing material in the adhesive layer is epoxy resin, polyurethane or polyureas adhesive.
Illustratively, the sizing material in the separation layer is polyurethane lacquer, organic silicon potting adhesive or emulsion paint.
Optionally, the thickness of the protective layer, the adhesive layer and the separation layer is 10-3Mm~100mm.
Further, the protective layer with a thickness of 0.01mm~0.4mm；The adhesive layer with a thickness of 0.05mm~
0.4mm；The separation layer with a thickness of 0.01mm~0.4mm.
Optionally, the number of plies of the adhesive layer is 1 layer~10 layers.
Further, the number of plies of the adhesive layer is 1 layer~6 layers.
Optionally, the encapsulating structure further includes at least one between the substrate and the low-melting-point metal route
Layer primer layer, the primer layer is for adhering to the low-melting-point metal route and completely cutting off air and water vapour.
Illustratively, by weight percentage, the primer layer by 85%~99% sizing material, 0%~15% diluent,
0%~10% drier and 0%~1% defoaming agent composition.
Further, the sizing material in the primer layer is polyvinyl dichloride, VAE lotion or emulsion paint.
Illustratively, the primer layer with a thickness of 10-3Mm~10-1mm。
Second aspect, the utility model provide a kind of low-melting-point metal device, adopt the following technical scheme that
The low-melting-point metal device includes substrate, the low-melting-point metal route on the substrate, and to take up an official post
Encapsulating structure described in one.
Optionally, the low-melting-point metal device further includes the electronic component with the low-melting-point metal connection, institute
There is the overall thickness of the adhesive layer to be greater than the height of the electronic component.
Optionally, the substrate is rigid substrate or flexible parent metal, and the rigid substrate includes plank, metal plate, water
Mud plate, polymer sheet, construction wall or carrier shell；The flexible parent metal includes clothes, tent or luggage.
Further, the substrate is cement plate, and the sizing material in primer layer is polyvinyl dichloride；The substrate is terylene
Cloth, the sizing material in primer layer are printing adhesive；The substrate is poly (methyl methacrylate) plate, and the sizing material in primer layer is aqueous polyurethane
Lotion, the substrate are plank, and the sizing material in primer layer is VAE lotion.
The third aspect, the utility model provide a kind of packaging method, adopt the following technical scheme that
The packaging method includes:
Step S1, a substrate is provided, is formed with low-melting-point metal route on the substrate；
Step S2, spraying protective layer respective material on the substrate, makes it be fully cured to form the protective layer；
Step S3, on the protective layer, spraying, brushing or roller coating adhesive layer respective material, make it be fully cured to form one
The layer adhesive layer, executes above procedure at least once, to form at least one layer of adhesive layer；
Step S4, spray separation layer respective material at least one layer of adhesive layer, make its be fully cured to be formed it is described
Separation layer.
Optionally, the packaging method further include:
It is formed before the low-melting-point metal route on the substrate, on the substrate spraying, brushing or roller coating bottom
Glue-line respective material makes it be fully cured to form the primer layer.
The utility model provides a kind of encapsulating structure, low-melting-point metal device and its packaging method using it, wherein
The encapsulating structure includes the protective layer being successively covered on low-melting-point metal route, at least one layer of adhesive layer and one layer of isolation
Layer, due to protective layer directly with low-melting-point metal wiring circuit contact, it is protective layer used in prevent low-melting-point metal route deform, adhesive layer
For being bonded protective layer and separation layer, separation layer is for completely cutting off air and water vapour, so as to effectively prevent low-melting-point metal
Route deformation, and prevent air and water vapour and low-melting-point metal wiring circuit contact so that the stability of low-melting-point metal device compared with
Good, service life is longer.
Detailed description of the invention
In order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be to embodiment
Or attached drawing needed to be used in the description of the prior art is briefly described, it should be apparent that, the accompanying drawings in the following description is
Some embodiments of the utility model, for those of ordinary skill in the art, in the premise of not making the creative labor property
Under, it is also possible to obtain other drawings based on these drawings.
Fig. 1 is the structural schematic diagram one of low-melting-point metal device provided by the embodiment of the utility model；
Fig. 2 is the structural schematic diagram two of low-melting-point metal device provided by the embodiment of the utility model；
Fig. 3 is the structural schematic diagram three of low-melting-point metal device provided by the embodiment of the utility model；
Fig. 4 is the flow chart of packaging method provided by the embodiment of the utility model.
Specific embodiment
It is practical new below in conjunction with this to keep the objectives, technical solutions, and advantages of the embodiments of the present invention clearer
Attached drawing in type embodiment, the technical scheme in the utility model embodiment is clearly and completely described, it is clear that is retouched
The embodiment stated is the utility model a part of the embodiment, instead of all the embodiments.Based on the implementation in the utility model
Example, every other embodiment obtained by those of ordinary skill in the art without making creative efforts belong to
The range of the utility model protection.
It should be noted that each technical characteristic in the utility model embodiment can be mutual in the absence of conflict
In conjunction with.
The utility model embodiment provides a kind of encapsulating structure, and specifically, as depicted in figs. 1 and 2, Fig. 1 is that this is practical
The structural schematic diagram one for the low-melting-point metal device that new embodiment provides, Fig. 2 are eutectic provided by the embodiment of the utility model
The structural schematic diagram two of point metal device, which includes substrate 1, low-melting-point metal route 2 and encapsulating structure
3, encapsulating structure is for being packaged the low-melting-point metal route on substrate.As shown in Figure 1, encapsulating structure 3 includes: successively to cover
It is placed on a protective layer 31 on low-melting-point metal route 2, at least one layer of adhesive layer 32 (in figure only for one layer) and one layer
Separation layer 33；Wherein, protective layer 31 is directly contacted with low-melting-point metal route 2, and protective layer 31 is for preventing low-melting-point metal line
Road 2 deforms, and adhesive layer 32 is for being bonded protective layer 31 and separation layer 33, and separation layer 33 is for completely cutting off air and water vapour.
Those skilled in the art are necessarily appreciated that each film layer that encapsulating structure 3 includes necessarily insulate.
The above encapsulating structure 3 has the following beneficial effects:
(1) above-described protective layer 31 is mainly used for preventing the low-melting-point metal flowing because being in a liquid state, alternatively, subsequent
The adhesive layer 32 of formation and/or the deformation that low-melting-point metal route 2 caused by heat is discharged in 33 solidification process of separation layer, and
Prevent air and water vapour from contacting with low-melting-point metal route 2, so that the stability of low-melting-point metal device is preferable, service life
It is longer；
(2) protective layer 31, adhesive layer 32 and separation layer 33 all have preferable flexibility, can be suitable for substrate flexible
On low-melting-point metal route be packaged；
(3) can be adapted for being packaged the low-melting-point metal route on vertical elevation substrate.
(4) thickness that encapsulating structure can be adjusted by the selection of the number of plies to adhesive layer 32, when making the formation of separation layer 33
Surface is more even curface, is packaged suitable for the surface to uneven thickness.
By the above it is found that each packaging method in the prior art fails to reach provided by the embodiment of the utility model
The attainable beneficial effect of encapsulating structure institute.
Optionally, as shown in Fig. 2, encapsulating structure 3 further includes being located at substrate 1 and low melting point gold in the utility model embodiment
Belong at least one layer of primer layer 34 between route 2, primer layer 34 is for adhering to low-melting-point metal route 2 and completely cutting off air and water steaming
Vapour, so that the optional range of the substrate of low-melting-point metal device is wider, so that the application range of low-melting-point metal device is more
Extensively, and air and water vapour can also be effectively prevent from 1 one side contacts low-melting-point metal route 2 of substrate, is more conducive to maintaining
The stability of low-melting-point metal device.
Below the utility model embodiment to protective layer 31, adhesive layer 32, separation layer 33 and primer layer 34 particular content
It is illustrated.
Optionally, by weight percentage, protective layer 31 by 85%~99% sizing material, 0%~15% diluent, 0%~
10% drier and 0%~1% defoaming agent composition.By weight percentage, adhesive layer 32 by 85%~99% sizing material, 0%~
15% diluent, 0%~10% drier and 0%~1% defoaming agent composition.By weight percentage, separation layer 33 is by 85%
~99% sizing material, 0%~15% diluent, 0%~10% drier and 0%~1% defoaming agent composition.By weight percentage
Meter, primer layer 34 is by 85%~99% sizing material, 0%~15% diluent, 0%~10% drier and 0%~1% defoaming agent group
At.
Illustratively, in protective layer 31, the weight percent of sizing material can for 87%, 89%, 91%, 93%, 95%,
97%, the weight percent of diluent can be 1%, 3%, 5%, 7%, 9%, 11%, 13%, the weight percent of drier
Can be 1%, 3%, 5%, 7%, 9%, the weight percent of defoaming agent can for 0.1%, 0.3%, 0.5%, 0.7%,
0.9%.Similarly, in adhesive layer 32, separation layer 33 and primer layer 34, sizing material, diluent, drier and defoaming agent can also be adopted
With with weight percent selection mode identical in protective layer 31, no longer repeated herein.
Wherein, diluent is mainly used for reducing the viscosity of sizing material and being convenient for further processing；Drier is primarily adapted for use in water
Property glue, accelerate its film forming solidification；Defoaming agent is mainly used for reducing surface tension, inhibits foam to generate or eliminate and has generated foam.
It should be noted that if the above numberical range general of specific amount deviation of sizing material, diluent, drier and defoaming agent
Will lead to one or more appearance in following problems: the film layer of formation is excessively thin or blocked up, forms the technology difficulty of film layer greatly, film
Layer solidified more, material waste of bubble etc. in slow, film layer.In the above weight percentage ranges, the concrete content of diluent is urged
Concrete content, the concrete content of defoaming agent of dry agent should all be determined according to the property of sizing material, to avoid material waste is caused,
And make the film layer to be formed that there is optimal performance.
Optionally, the sizing material in protective layer 31 is polyurethane or acrylic compounds adhesive, so that protective layer 31 has
Preferable insulation performance, and cure shrinkage is low, good with the adhesion of low-melting-point metal route 2.Sizing material in adhesive layer 32 is
Epoxy resin, polyurethane or polyureas adhesive, so that adhesive layer 32 has preferable adhesive property, and curing exotherm
It is low.Sizing material in separation layer 33 is polyurethane lacquer, organic silicon potting adhesive or emulsion paint, so that separation layer 33 has preferably
Wearability, preferable weatherability and the preferable insulating to air and water vapour.Sizing material in primer layer 34 is poly- dichloro
Ethylene, VAE lotion or emulsion paint, so that primer layer 34 and substrate 1 and low-melting-point metal route 2 all have preferable attachment
Power, and there is preferable insulating properties, to the preferable insulating of air and water vapour.
Optionally, the thickness of protective layer 31, adhesive layer 32 and separation layer 33 is 10-3Mm~1mm.It should be noted that
The referred to herein as thickness of single layer adhesive layer 32.The overall thickness of protective layer 31, all adhesive layers 32 and separation layer 33 is 10-2Mm~
5mm.Further, if the thickness of protective layer 31, adhesive layer 32 and separation layer 33 is excessive, it can be made to be applied to vertical elevation
When on substrate, being easy sagging influences the service life of surface smoothness and low-melting-point metal device, and flexible bad, if thickness mistake
It is small, its corresponding effect cannot be functioned well as, is based on this, the thickness of protective layer 31 is preferably in the utility model embodiment
0.01mm~0.4mm, the thickness of adhesive layer 32 are preferably 0.05mm~0.4mm, the thickness of separation layer 33 be preferably 0.01mm~
0.4mm。
In addition, when as shown in figure 3, Fig. 3 is the structural representation of low-melting-point metal device provided by the embodiment of the utility model
Figure three, when low-melting-point metal device further includes the electronic component 4 connecting with low-melting-point metal route 2, all adhesive layers 32 it is total
Thickness should be set according to the thickness of electronic component 4, i.e., the number of plies of adhesive layer 32 should according to the thickness of electronic component 4 into
Row setting, so that adhesive layer 32 can cover electronic component 4 completely.Optionally, the number of plies of adhesive layer 32 is 1 layer~10 layers,
1 layer~6 layers may further be selected as.
Optionally, primer layer 34 with a thickness of 10-3Mm~10-1Mm, so that can to function well as its right for primer layer 34
The effect answered, and it is not easy sagging, and flexible preferable.
In addition, the utility model embodiment additionally provides a kind of low-melting-point metal device, and specifically, as shown in Figure 1, Figure 2 and Fig. 3
Shown, which includes substrate 1, the low-melting-point metal route 2 on substrate 1 and any of the above item institute
The encapsulating structure 3 stated, encapsulating structure 3 is for being packaged the low-melting-point metal route on substrate.The encapsulation knot of the foregoing description
All the elements of structure 3 are suitable for this, are no longer repeated herein.Above-mentioned low-melting-point metal device can be electronic interactive mould
Block, such as interactive electronic wall etc..
Optionally, as shown in figure 3, low-melting-point metal device further includes the electronic component connecting with low-melting-point metal route 2
4, so that the function of low-melting-point metal device is more comprehensive, the application range of low-melting-point metal device is wider.On this basis,
The overall thickness of all adhesive layers 32 in the utility model embodiment is greater than the height of electronic component 4, so that encapsulating structure 3
Electronic component 4 can effectively be encapsulated.
Optionally, substrate 1 can be rigid substrate or flexible parent metal, wherein rigid substrate include plank, metal plate,
Cement plate, polymer sheet, construction wall or carrier shell etc.；Flexible parent metal includes clothes, tent or luggage etc..
It in actual application, can be with inventors have found that when as shown in Fig. 2, encapsulating structure 3 includes primer layer 34
The sizing material in primer layer 34 is selected according to the specific selection of substrate 1, so that primer layer 34 has most between substrate 1
Good adhesive ability.Illustratively, substrate 1 is cement plate, and the sizing material in primer layer is polyvinyl dichloride；Substrate 1 is woven dacron,
Sizing material in primer layer is printing adhesive；Substrate 1 is poly (methyl methacrylate) plate, and the sizing material in primer layer is aqueous polyurethane emulsion,
Substrate 1 is plank, and the sizing material in primer layer is VAE lotion.
In addition, in order to promote the aesthetic measure of low-melting-point metal device, low-melting-point metal device can also include being located at bottom
Drafting priming paint between glue-line 34 and low-melting-point metal route 2, certainly, drawing priming paint should select and low-melting-point metal route 2
The material that can preferably adhere to.
The fusing point of low-melting-point metal in low-melting-point metal route 2 is within 300 degrees Celsius, specifically, low-melting-point metal
Fusing point can be in room temperature hereinafter, or in room temperature between 300 degrees Celsius, the fusing point of low-melting-point metal is below room temperature
When, low-melting-point metal is liquid at room temperature, be easy to make low-melting-point metal route 2, and low-melting-point metal route 2 have compared with
High conductivity and preferable flexible, the fusing point of low-melting-point metal is when room temperature is between 300 degrees Celsius, the choosing of low-melting-point metal
Material is relatively broad, and low-melting-point metal is solid-state at room temperature, low-melting-point metal can be made to be molten into liquid by heating.
The specific implementation of low-melting-point metal can there are many, in the first instance, low-melting-point metal be fusing point exist
300 degrees Celsius of simple substance below；In second example, low-melting-point metal is fusing point in 300 degrees Celsius of alloys below；?
In three examples, low-melting-point metal is to include fusing point in 300 degrees Celsius of simple substance below, and/or, fusing point 300 degrees Celsius with
Under alloy conductive mixture, such as it is below at 300 degrees Celsius in 300 degrees Celsius of simple substance or fusing point below by fusing point
The electrical-conductive nanometer fluid that alloy and metal nanoparticle and fluid dispersion are mixed to form.
When selecting the electrical-conductive nanometer fluid, fluid dispersion is preferably ethyl alcohol, propylene glycol, glycerine, polyethylene pyrrole
One of pyrrolidone, dimethyl silicone polymer, polyethylene glycol, polymethyl methacrylate.
In some embodiments, the ingredient of low-melting-point metal may include gallium, indium, tin, zinc, bismuth, lead, cadmium, mercury, silver, copper,
One of sodium, potassium, magnesium, aluminium, iron, nickel, cobalt, manganese, titanium, vanadium, boron, carbon, silicon etc. are a variety of.Illustratively, low-melting-point metal has
The range of choice of body includes: mercury simple substance, gallium simple substance, indium simple substance, tin simple substance, gallium-indium alloy, gallium-indium-tin alloy, gallium tin alloy, gallium
Kirsite, gallium indium kirsite, gallium red brass, gallium indium red brass, gallium tin cadmium alloy, gallium Zn-Cd alloy, bismuth indium alloy, bismuth tin
Alloy, bismuth indium stannum alloy, bismuth indium kirsite, bismuth red brass, bismuth indium red brass, leypewter, gun-metal, tin zinc-copper close
One or more of gold, Tin Silver Copper Alloy, bismuth terne metal.
In addition, the utility model embodiment also provides a kind of packaging method, specifically, as shown in figure 4, Fig. 4 is that this is practical
The flow chart for the packaging method that new embodiment provides, the packaging method include:
Step S1, a substrate is provided, is formed with low-melting-point metal route on substrate；
Step S2, the spraying protective layer respective material on substrate, makes it be fully cured to form protective layer；
Step S3, spray, brush or roller coating adhesive layer respective material on the protection layer, make its be fully cured to be formed one layer it is viscous
Layer is connect, above procedure is executed at least once, to form at least one layer of adhesive layer；
Step S4, separation layer respective material is sprayed at least one layer of adhesive layer, it is made to be fully cured to form separation layer.
Wherein, in above each step, if a upper film layer, which is not fully cured, makes next film layer, different type can be made
Sizing material may be incompatible, will appear ripple in solidification process, fall off etc. bad, the sizing material of same type may dissolve each other,
Cause not solidify.
Optionally, when as shown in Fig. 2, encapsulating structure 3 further includes primer layer 34, packaging method further include: on substrate
It is formed before low-melting-point metal route, spraying, brushing or roller coating primer layer respective material, make it be fully cured to be formed on substrate
Primer layer.
It should be noted that the encapsulating structure of the foregoing description and the related content of low-melting-point metal device are suitable for this,
It is no longer repeated herein.
The utility model embodiment provides a kind of encapsulating structure, using its low-melting-point metal device and its encapsulation side
Method, wherein the encapsulating structure include the protective layer being successively covered on low-melting-point metal route, at least one layer of adhesive layer and
One layer of separation layer, due to protective layer directly with low-melting-point metal wiring circuit contact, it is protective layer used in prevent low-melting-point metal route become
Shape, for adhesive layer for being bonded protective layer and separation layer, separation layer is low so as to effectively prevent for completely cutting off air and water vapour
The deformation of melting point metals route, and air and water vapour and low-melting-point metal wiring circuit contact are prevented, so that low-melting-point metal device
Stability is preferable, and service life is longer.
The utility model embodiment illustrates to the particular content of encapsulating structure by taking multiple specific embodiments as an example below
Description.Wherein, the summation of primer layer is referred to as primary coat part, and the summation of protective layer, adhesive layer and separation layer is referred to as finishing coat part.
Embodiment 1:
Embodiment 2:
Embodiment 3:
Embodiment 4:
Embodiment 5:
Embodiment 6:
Finally, it should be noted that the above various embodiments is only to illustrate the technical solution of the utility model, rather than it is limited
System；Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should
Understand: it is still possible to modify the technical solutions described in the foregoing embodiments, or to some or all of
Technical characteristic is equivalently replaced；And these are modified or replaceed, it does not separate the essence of the corresponding technical solution, and this is practical new
The range of each embodiment technical solution of type.
Claims (2)
1. a kind of encapsulating structure, for being packaged to the low-melting-point metal route on substrate, which is characterized in that the encapsulation knot
Structure includes: the protective layer being successively covered on the low-melting-point metal route, at least one layer of adhesive layer and one layer of separation layer；
Wherein, the protective layer is described protective layer used in preventing the low-melting-point metal directly with the low-melting-point metal wiring circuit contact
Route deformation, the adhesive layer is for being bonded the protective layer and the separation layer, and the separation layer is for completely cutting off air and water
Steam.
2. a kind of low-melting-point metal device, which is characterized in that the low-melting-point metal route including substrate, on the substrate,
And encapsulating structure as described in claim 1.
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| CN201821311688.5U CN208768334U (en) | 2018-08-14 | 2018-08-14 | A kind of encapsulating structure, the low-melting-point metal device using it |
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| CN201821311688.5U CN208768334U (en) | 2018-08-14 | 2018-08-14 | A kind of encapsulating structure, the low-melting-point metal device using it |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108777914A (en) * | 2018-08-14 | 2018-11-09 | 北京梦之墨科技有限公司 | A kind of encapsulating structure, low-melting-point metal device and its packaging method using it |
-
2018
- 2018-08-14 CN CN201821311688.5U patent/CN208768334U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108777914A (en) * | 2018-08-14 | 2018-11-09 | 北京梦之墨科技有限公司 | A kind of encapsulating structure, low-melting-point metal device and its packaging method using it |
| CN108777914B (en) * | 2018-08-14 | 2024-05-31 | 北京梦之墨科技有限公司 | Packaging structure, low-melting-point metal device using same and packaging method of low-melting-point metal device |
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