CN107302826A - A kind of LED encapsulation PCB substrate and its surface treatment method - Google Patents
A kind of LED encapsulation PCB substrate and its surface treatment method Download PDFInfo
- Publication number
- CN107302826A CN107302826A CN201710652995.3A CN201710652995A CN107302826A CN 107302826 A CN107302826 A CN 107302826A CN 201710652995 A CN201710652995 A CN 201710652995A CN 107302826 A CN107302826 A CN 107302826A
- Authority
- CN
- China
- Prior art keywords
- layer
- copper foil
- substrate
- led
- tin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 52
- 238000000034 method Methods 0.000 title claims abstract description 31
- 238000005538 encapsulation Methods 0.000 title claims abstract description 25
- 238000004381 surface treatment Methods 0.000 title claims abstract description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 35
- 239000011889 copper foil Substances 0.000 claims abstract description 34
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 32
- 239000011347 resin Substances 0.000 claims abstract description 20
- 229920005989 resin Polymers 0.000 claims abstract description 20
- 239000003963 antioxidant agent Substances 0.000 claims abstract description 13
- 230000003078 antioxidant effect Effects 0.000 claims abstract description 13
- 235000006708 antioxidants Nutrition 0.000 claims abstract description 13
- 238000007747 plating Methods 0.000 claims abstract description 13
- 238000011282 treatment Methods 0.000 claims abstract description 12
- 239000007921 spray Substances 0.000 claims abstract description 11
- 241000500881 Lepisma Species 0.000 claims abstract description 3
- 229910000679 solder Inorganic materials 0.000 claims abstract description 3
- 239000010410 layer Substances 0.000 abstract description 64
- 238000009713 electroplating Methods 0.000 abstract description 6
- 239000000463 material Substances 0.000 abstract description 4
- 238000012856 packing Methods 0.000 abstract description 3
- 239000011241 protective layer Substances 0.000 abstract description 3
- 238000003466 welding Methods 0.000 abstract description 3
- 238000011109 contamination Methods 0.000 abstract description 2
- 230000007613 environmental effect Effects 0.000 abstract description 2
- 230000001681 protective effect Effects 0.000 abstract description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 10
- 229910052759 nickel Inorganic materials 0.000 description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 239000010865 sewage Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000002351 wastewater Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention discloses a kind of LED encapsulation PCB substrate and its surface treatment method, the LED encapsulation includes resin substrate with PCB substrate, one layer of copper foil layer is respectively arranged with the upper and lower surface of resin substrate.Copper foil layer surface in resin substrate lower surface is sprayed with one layer of tin layers；Copper foil layer surface in resin substrate upper surface is coated with one layer of OSP anti-oxidant treatments layer, and the tin layers are unleaded tin layers.Substrate surface used in LED-baseplate method for packing of the present invention abandons traditional plating mode, and the copper foil of die bond bonding wire layer uses OSP（Anti-oxidant treatment）It is used as protective layer; bottom land layer copper foil enters protection processing using spray tin to substrate; the shortcoming of conventional substrate electroplating surface processing can be made up completely; and the organic protective film that uses and be entirely a kind of free of contamination environment-friendly materials without slicker solder; the characteristic of LED environmental protection has been adhered to, while LED bottom land is using spray tin method, has made client in using welding process; LED line body can be good at fusing with tin, so that LED has good weldability.
Description
Technical field
The present invention relates to LED encapsulation method, a kind of LED encapsulation PCB substrate and its surface treatment are particularly related to
Method.
Background technology
Circuit is copper foil to the substrate of CHIP class LED encapsulation at this stage, and copper foil surface is oxidizable, while for the ease of weldering
Line, the copper foil surface of substrate is required to be electroplated, such as gold-plated, silver-plated, nickel plating, so as to protect copper foil to be difficult by air oxygen
Change, while easily bonding wire, also LED leg is easy to tin sticky to client when in use.
As shown in figure 1, traditional LED encapsulation method is：
1）, in the upper surface of resin substrate 1 and lower surface plate copper foil layer 2 respectively；
2）, on the surface of two above-mentioned copper foil layers 2 distinguish Gold plated Layer or silver layer or nickel dam 3.
The substrate copper foil of CHIP class LED encapsulation needs plating, and current method is predominantly gold-plated, silver-plated, nickel plating etc.,
Above electro-plating method has the disadvantage that：
1. the metals such as gold, silver are very expensive, cause the cost of product very high；
2. the substrate time used in electroplating process is longer, production efficiency is not high, and whole method energy consumption is high；
3. the waste water environmental pollution of plating out is larger.
The content of the invention
For deficiency of the prior art, the technical problem to be solved in the present invention is the provision of a kind of anti-oxidant places of OSP
PCB substrate surface treatment method is used in reason, the LED encapsulation of spray tin processing.
In order to solve the above technical problems, the present invention is realized by following scheme：
A kind of LED encapsulation PCB substrate, the LED encapsulation includes resin substrate with PCB substrate, in the upper and lower surface of resin substrate
It is respectively arranged with one layer of copper foil layer.Copper foil layer surface in resin substrate lower surface is sprayed with one layer of tin layers；In resin substrate upper end
The copper foil layer surface in face is coated with one layer of OSP anti-oxidant treatments layer.
A kind of LED encapsulation PCB substrate and its surface treatment method, this method comprise the following steps：
1）, in the upper surface of resin substrate and lower surface plate copper foil layer respectively；
2）, by above-mentioned steps 1）In lower copper foil layer surface, spray one layer of tin layers；
3）, by above-mentioned steps 2）In upper copper foil layer surface, plating one layer of OSP anti-oxidant treatment layer.
Further, the tin layers are unleaded tin layers.
Relative to prior art, the beneficial effects of the invention are as follows：Substrate surface used in LED-baseplate method for packing of the present invention
Traditional plating mode is abandoned, the copper foil of die bond bonding wire layer uses OSP（Anti-oxidant treatment）It is used as protective layer, bottom land layer copper
Paper tinsel enters protection processing using spray tin to substrate, and the shortcoming of conventional substrate electroplating surface processing can be made up completely, and uses
Organic protective film and be entirely a kind of free of contamination environment-friendly materials without slicker solder, has adhered to the characteristic of LED environmental protection, while LED bottom
Portion's pad makes client in using welding process using spray tin method, and LED line body can be good at fusing with tin, so that LED
With good weldability.
Lead-free tin spray layer+the OSP that substrate protective layer of the present invention is used, is protected relative to traditional gold-plated, silver-plated and nickel plating etc.
Maintaining method, has the benefit that：
1st, material cost is extremely low；
2nd, production method is simple, and the man-hour consumed greatly reduces relative to traditional plating；
3rd, lead-free tin spray surface spraying is unleaded tin, relative to except traditional electro-plating method, in addition to material environment friendly,
The sewage that plating is produced is greatly reducing, it is great for the Protection significance of environment；
5th, because surface is tin plating, therefore client LED in use soldering effect is good, is very beneficial for welding side
Method.
Brief description of the drawings
Fig. 1 is traditional LED encapsulation PCB substrate surface treatment methods；
Fig. 2 is LED base plate for packaging schematic diagram of the present invention；
Fig. 3 is that LED encapsulation PCB substrate of the present invention is surface-treated flow chart.
Marked in accompanying drawing：Resin substrate 1, copper foil layer 2, layer gold or silver layer or nickel dam 3, tin layers 4, OSP anti-oxidant treatments layer
5。
Embodiment
The preferred embodiments of the present invention are described in detail below in conjunction with the accompanying drawings, so that advantages and features of the invention energy
It is easier to be readily appreciated by one skilled in the art, apparent is clearly defined so as to be made to protection scope of the present invention.
The preferred embodiments of the present invention are described in detail below in conjunction with the accompanying drawings, so that advantages and features of the invention energy
It is easier to be readily appreciated by one skilled in the art, apparent is clearly defined so as to be made to protection scope of the present invention.
Accompanying drawing 2 is refer to, a kind of LED encapsulation PCB substrate, the LED encapsulation includes resin substrate 1 with PCB substrate, in tree
The upper and lower surface of aliphatic radical plate 1 is respectively arranged with one layer of copper foil layer 2.
One layer of tin layers 4 are sprayed with the surface of copper foil layer 2 of the lower surface of resin substrate 1, the tin layers 4 are unleaded tin layers.
One layer of OSP anti-oxidant treatments layer 5 is coated with the surface of copper foil layer 2 of the upper surface of resin substrate 1.
It refer to accompanying drawing 3, a kind of method for packing of LED encapsulation PCB substrate of the invention, this method includes following step
Suddenly：
1）, in the upper surface of resin substrate 1 and lower surface plate copper foil layer 2 respectively；
2）, by above-mentioned steps 1）In the surface of lower copper foil layer 2, spray one layer of tin layers 4；
3）, by above-mentioned steps 2）In the surface of upper copper foil layer 2, one layer of OSP anti-oxidant treatment of plating layer 5.
Copper foil layer 2 of the LED encapsulation in PCB substrate surface treatments, tin layers 4, the OSP anti-oxidant treatments layer of the present invention
5 thickness needs to be surface-treated according to actual product structure requirement.
Copper foil layer 2 of the LED encapsulation in PCB substrate surface treatments, the electricity of OSP anti-oxidant treatments layer 5 of the present invention
Electroplating method can be achieved according to the conventional method, and the spray tin methods of tin layers 4 is that can be achieved by traditional method for paint spraying.
The preferred embodiment of the present invention is the foregoing is only, is not intended to limit the scope of the invention, every profit
The equivalent structure or equivalent flow conversion made with description of the invention and accompanying drawing content, or directly or indirectly it is used in other phases
The technical field of pass, is included within the scope of the present invention.
Claims (4)
1. a kind of LED encapsulation PCB substrate, the LED encapsulation includes resin substrate with PCB substrate（1）, in resin substrate（1）'s
Upper and lower surface is respectively arranged with one layer of copper foil layer（2）, it is characterised in that：
In resin substrate（1）The copper foil layer of lower surface（2）Surface is sprayed with one layer of tin layers（4）；
In resin substrate（1）The copper foil layer of upper surface（2）Surface is coated with one layer of OSP anti-oxidant treatments layer（5）.
2. a kind of LED encapsulation PCB substrate according to claim 1, it is characterised in that：The tin layers（4）For without slicker solder
Layer.
3. a kind of LED encapsulation PCB substrate surface treatment method with described in any one of claim 1 or 2, its feature exists
In this method comprises the following steps：
1）, in resin substrate（1）Upper surface and lower surface plate copper foil layer respectively（2）；
2）, by above-mentioned steps 1）In lower copper foil layer（2）Surface, sprays one layer of tin layers（4）；
3）, by above-mentioned steps 2）In upper copper foil layer（2）Surface, one layer of OSP anti-oxidant treatments layer of plating（5）.
4. a kind of LED encapsulation PCB substrate according to claim 3 and its surface treatment method, it is characterised in that：It is described
Tin layers（4）For unleaded tin layers.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710652995.3A CN107302826A (en) | 2017-08-02 | 2017-08-02 | A kind of LED encapsulation PCB substrate and its surface treatment method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710652995.3A CN107302826A (en) | 2017-08-02 | 2017-08-02 | A kind of LED encapsulation PCB substrate and its surface treatment method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107302826A true CN107302826A (en) | 2017-10-27 |
Family
ID=60133227
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710652995.3A Pending CN107302826A (en) | 2017-08-02 | 2017-08-02 | A kind of LED encapsulation PCB substrate and its surface treatment method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107302826A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113630975A (en) * | 2021-07-07 | 2021-11-09 | 湖北金禄科技有限公司 | MINI LED packaging substrate and surface treatment method thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040161626A1 (en) * | 2002-12-02 | 2004-08-19 | Kwon Soon Bog | Tape substrate and method for fabricating the same |
| CN101528981A (en) * | 2006-10-31 | 2009-09-09 | 三井金属矿业株式会社 | Surface treated copper foil, surface treated copper foil with very thin primer resin layer, method for manufacturing the surface treated copper foil, and method for manufacturing the surface treated c |
| CN102802348A (en) * | 2012-07-17 | 2012-11-28 | 昆山生隆科技发展有限公司 | High-pressure-resistant aluminum-based printed circuit board for LED (Light Emitting Diode) and manufacturing method of high-pressure-resistant aluminum-based printed circuit board |
| CN202679796U (en) * | 2012-06-13 | 2013-01-16 | 田茂福 | FPC with tin-coating solder joints and LED lamp strip |
| CN103579011A (en) * | 2012-08-08 | 2014-02-12 | 旭德科技股份有限公司 | Package carrier and method for manufacturing the same |
-
2017
- 2017-08-02 CN CN201710652995.3A patent/CN107302826A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040161626A1 (en) * | 2002-12-02 | 2004-08-19 | Kwon Soon Bog | Tape substrate and method for fabricating the same |
| CN101528981A (en) * | 2006-10-31 | 2009-09-09 | 三井金属矿业株式会社 | Surface treated copper foil, surface treated copper foil with very thin primer resin layer, method for manufacturing the surface treated copper foil, and method for manufacturing the surface treated c |
| CN202679796U (en) * | 2012-06-13 | 2013-01-16 | 田茂福 | FPC with tin-coating solder joints and LED lamp strip |
| CN102802348A (en) * | 2012-07-17 | 2012-11-28 | 昆山生隆科技发展有限公司 | High-pressure-resistant aluminum-based printed circuit board for LED (Light Emitting Diode) and manufacturing method of high-pressure-resistant aluminum-based printed circuit board |
| CN103579011A (en) * | 2012-08-08 | 2014-02-12 | 旭德科技股份有限公司 | Package carrier and method for manufacturing the same |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113630975A (en) * | 2021-07-07 | 2021-11-09 | 湖北金禄科技有限公司 | MINI LED packaging substrate and surface treatment method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20171027 |
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| WD01 | Invention patent application deemed withdrawn after publication |