CN208767092U - A kind of PTC device - Google Patents
A kind of PTC device Download PDFInfo
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- CN208767092U CN208767092U CN201821469139.0U CN201821469139U CN208767092U CN 208767092 U CN208767092 U CN 208767092U CN 201821469139 U CN201821469139 U CN 201821469139U CN 208767092 U CN208767092 U CN 208767092U
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Abstract
The utility model relates to a kind of PTC devices, including PTC sheet material, the first pad and the second pad, first pad and the second pad are located at the same side of PTC sheet material, and the other side of PTC sheet material is conductor layer, and conductor layer covers the gap area of the first pad, the second pad and the first pad and the second pad；PTC sheet material is anisotropic material, and the thickness direction along PTC sheet material has posive temperature coefficient thermistor performance, does not transmit electric current along the wide direction and length direction of PTC sheet material and resistance value is infinitely great.This kind of PTC device is two-sided structure, relative to traditional four-layer structure, compact-sized, single layer ptc material plays the role of former technology bilayer ptc material, make the manufacturing process flow of PTC device simply many simultaneously, using the mutual contact mode of traditional four laminates, needs to drill, metal material inside ptc material is very serious to the abrasion of drill bit, the cost that drills is very high, our this structure and technique do not need to drill at all now, at low cost.
Description
Technical field
The utility model relates to technical field of electronic components, and in particular to a kind of PTC device.
Background technique
(PTC is the abbreviation of Positive Temperature Coefficient to polymer positive-temperature-coefficient, is meant just
Temperature coefficient, refer to positive temperature coefficient very big semiconductor material or component；The PTC that usually we mention is to criticize temperature
Coefficient resistance, abbreviation PTC thermistor.) circuit brake typically from two sides with conductive metal
The extruded conductive polymer sheet production of thin layer pressing.
Currently, PTC circuit brake is between the two sides of PTC sheet material setting pad, the pad on two sides in industry
PTC sheet material plays the role of high temperature and increases resistance.Its production technology is to make pad respectively on the two sides of PTC sheet material, then pass through brill
Hole, plating, lamination printed circuit board (PCB) production technology the pad on the two sides of PCT sheet material is led into the circuit diagram to a face
On layer, as shown in Figure 1, being welded, being applied again.In the manufacturing process of the prior art, embedment PTC sheet material is all using traditional
Press carries out under high temperature and high pressure environment, and laminating process is needed at 150 DEG C or more, and lamination 1 hour or more, so just to material
There is the influence of pressure, also there is the influence of temperature, it would be desirable to the influence of pressure be taken into account, because prolonged high pressure can be led
Causing the thickness of material can change, and the variation of this thickness influences whether the variation of PTC resistance value, just influence last precision,
High temperature and pressure has destruction to the material property of PTC sheet material simultaneously, and the high temperature that can reduce PTC sheet material increases resistance effect.
Utility model content
Technical problem to be solved by the utility model is: providing a kind of PTC device, laminating process is not needed, will not be reduced
The high temperature of PTC sheet material increases resistance effect.
A kind of PTC device, including PTC sheet material, the first pad and the second pad, the first pad and the second pad are located at PTC
The same side of sheet material, the other side of PTC sheet material are conductor layer, conductor layer cover the first pad, the second pad and the first pad and
The gap area of second pad；
PTC sheet material is anisotropic material, and the thickness direction along PTC sheet material has posive temperature coefficient thermistor performance,
Electric current is not transmitted along the wide direction and length direction of PTC sheet material and resistance value is infinitely great.
Preferably, the PTC sheet material between the first pad and the second pad is removed；
The conductor of the other side of PTC sheet material is provided with strengthening course layer by layer.
Preferably, strengthening course is epoxy resin, polyimides or BT layer；
Bonding and reinforcing layer, is bonded by low temperature adhesive, and the bonding temp of low temperature adhesive is lower than 149 DEG C.
Preferably, the width of the gap area between the first pad and the second pad is greater than 5 μm；
The PTC sheet material being removed is located at gap area.The sum of the area of pad in PTC device cell is PTC device list
3 times or more of the sum of the area between pad in member.
Preferably, it is provided with welding protective layer on the first pad and the second pad, welding protective layer is scolding tin, chemistry is silver-colored,
Electroplating gold, chemical NiPdAu or nickel layer.
Preferably, the partial region of the first pad and the second pad is coated with green oil, between the first pad and the second pad
Gap area be filled with green oil.
Preferred first pad, the second pad, conductor layer are made by metal foil layer.
Preferably, metal foil layer is copper, aluminium, nickel, silver or other conductor layers.
The utility model additionally provides another PTC device.
A kind of PTC device, including PTC sheet material, the first pad and the second pad, the first pad and the second pad are located at PTC
The same side of sheet material, the other side of PTC sheet material are conductor layer, conductor layer cover the first pad, the second pad and the first pad and
The gap area of second pad；
PTC sheet material between first pad and the second pad is removed；
The other side of PTC sheet material is conductor layer, and conductor layer covers the first pad, the second pad and the first pad and the second weldering
The gap area of disk；
PTC sheet material is isotropic material, has positive temperature system along the thickness direction of PTC sheet material, wide direction and length direction
Number thermistor performance.
Preferably, the conductor layer of the other side of PTC sheet material is provided with strengthening course.
Preferably, strengthening course is epoxy resin, polyimides or BT layer；
Bonding and reinforcing layer, is bonded by low temperature adhesive, and the bonding temp of low temperature adhesive is lower than 149 DEG C；First pad
And the width of the second gap area between pad is greater than 5 μm；
The PTC sheet material being removed is located at gap area.
The sum of the area of pad in PTC device cell is 3 times of the sum of area between the pad in PTC device cell
More than.
Preferably, the partial region of the first pad and the second pad is coated with green oil, between the first pad and the second pad
Gap area be filled with green oil.
Preferably, it is provided with welding protective layer on the first pad and the second pad, welding protective layer is scolding tin, chemistry is silver-colored,
Electroplating gold, chemical NiPdAu or nickel layer.
Preferably, the quantity of the pad in each PTC device cell is 2.
The utility model additionally provides the manufacturing method of above-mentioned PTC device.
A kind of manufacturing method of PTC device, comprising:
A. it is etched on the two sides that two sides is the PTC sheet material of metal foil；
Wherein, the first face metal foil only etches the metal foil between each PTC device cell；Second face metal foil, etching
The metal foil between pad in each PTC device cell；
PTC sheet material is anisotropic material, and the thickness direction along PTC sheet material has posive temperature coefficient thermistor performance,
Electric current is not transmitted along the wide direction and length direction of PTC sheet material and resistance value is infinitely great.
Preferably, after step A further include:
B. in the side bonding and reinforcing layer of the first face metal foil；
C. from the second face metal foil side, the ptc material between the pad in PTC device cell unless each is removed.
The accuracy of the resistance between pad can be improved by step C, thoroughly prevent electric current and passed along the transverse direction of PTC sheet material
It broadcasts, so that electric current can only be passed to the PTC sheet layer of the pad bottom from a pad, is reaching the first face metal foil layer, then pass
To the PTC sheet layer of another pad bottom, the pad at this is being reached, control precision is being substantially increased, reduces to material
Anisotropic performance requirement.
Preferably, strengthening course is epoxy resin, polyimides or BT layer；
Bonding and reinforcing layer, is bonded by low temperature adhesive, and the bonding temp of low temperature adhesive is lower than 149 DEG C.
Preferably, the width for etching the metal foil between the pad in each PTC device cell is greater than 5 μm；
The sum of the area of pad in PTC device cell is 3 times of the sum of area between the pad in PTC device cell
More than.
Preferably, after step C further include:
D. to the second face metal foil, one of the part pad or pad in each PTC device cell is covered using green oil
Point；
Filled by green oil between the pad in each PTC device cell due to remove ptc material bring gap.
Preferably, after step C further include:
E. by lamination, drilling blind hole and electroplating technology, by the pad and pcb board of the second face metal foil of PTC device cell
The circuit connection of material.
The sequencing of above-mentioned steps D and step E, which can according to need, to be adjusted.
The utility model additionally provides, a kind of another outer manufacturing method of PTC device.
A kind of manufacturing method of PTC device, comprising:
A. it is etched on the two sides that two sides is the PTC sheet material of metal foil；
Wherein, the first face metal foil only etches the metal foil between each PTC device cell；Second face metal foil, etching
The metal foil between pad in each PTC device cell；
B. in the side bonding and reinforcing layer of the first face metal foil；
C. from the second face metal foil side, the ptc material between the pad in PTC device cell unless each is removed；
PTC sheet material is isotropic material, has positive temperature system along the thickness direction of PTC sheet material, wide direction and length direction
Number thermistor performance.
Preferably, strengthening course is epoxy resin, polyimides or BT layer；
Bonding and reinforcing layer, is bonded by low temperature adhesive, and the bonding temp of low temperature adhesive is lower than 149 DEG C.
Preferably, the width for etching the metal foil between the pad in each PTC device cell is greater than 5 μm；
The sum of the area of pad in PTC device cell is 3 times of the sum of area between the pad in PTC device cell
More than.
Preferably, after step C further include:
D. to the second face metal foil, one of the part pad or pad in each PTC device cell is covered using green oil
Point；
Filled by green oil between the pad in each PTC device cell due to remove ptc material bring gap.
Preferably, after step C further include:
E. by lamination, drilling blind hole and electroplating technology, by the pad and pcb board of the second face metal foil of PTC device cell
The circuit connection of material.
The sequencing of above-mentioned steps D and step E, which can according to need, to be adjusted.
The existing PTC product in market at present, mostly uses ptc material to be embedded into resin material greatly, and resin material includes BT
Equal materials, this technique are generally wrapped up ptc material by two copper foils, are then re-used as sandwich of layers and are passed through BT above-mentioned
Equal resin materials are wrapped up again, ultimately form the structure that ptc material is wrapped in resin as sandwich of layers, which can be with
It is realized by many techniques, including but not limited to wiring board laminating technology, semiconductor plastic package technique.It is described below a kind of typical
The processing technology of PTC device
Routine techniques:
When processing PTC device by circuit board technique, first have to lose the copper foil that PTC plate upper and lower surface wraps up
It carves, removes part copper foil, retain the copper foil (PTC device bonding pad) that part needs；Then it will be lost by wiring board laminating technology again
The PTC plate for carving route is laminated in a certain layer of circuit board, and laminated plate material includes that (BT substrate mainly uses day to BT substrate
The BT resin of gas company, this Mitsubishi exploitation, is mainly polymerized with B (Bismaleimide) and T (Triazine).) etc. lines
Road plate common used material.After laminating process, then (the mechanical or laser) processing that drilled, expose internal PTC device bonding pad, so
Afterwards by way of plating, the copper foil of PTC device bonding pad and outer layer is connected, finally reuses wiring board or semiconductor
Figure route processing technology makes pad (pin, weld pad, end) required for PTC device
It is that PTC sheet material is considered as to a kind of PCB sheet material in the processing technology of above-mentioned routine PTC device, uses PCB substantially
General processing technology is produced, and is used traditional laminating technology as ptc material in this process and is wrapped up (embedment)
Mode, laminating technology time length, temperature are high, and 150 degrees Celsius of high-temperature time reaches 1-2 hours, to the characteristic of ptc material itself
There is destruction, the high temperature that will lead to ptc material increases resistance reduced performance.
On the other hand, the performance parameter of PTC device additionally depends on the relative area of PTC device upper and lower surface copper foil.It is conventional
The product of technique processing, the needs in another face are conducted to due to the needs of drilling, by the pad in a face of PTC sheet material, are carved
A large amount of copper foil is lost, the PTC for having etched away copper foil region cannot generate the performance of PTC, practical without PTC's
Performance, this generates great wastes.By measuring and calculating, the practical utilization rate for utilizing PTC of this technique is less than 60%, for high
It is a kind of greatly waste for expensive ptc material, as shown in Figure 1.
The utility model is changed mainly for the structure of PTC existing product, can greatly simplify processing technology, and
The utilization rate of material is promoted, the utilization rate of PTC is 90% or more.
The beneficial effects of the utility model are: a kind of PTC device, including PTC sheet material, the first pad and the second pad, the
One pad and the second pad are located at the same side of PTC sheet material, and the other side of PTC sheet material is conductor layer, the first weldering of conductor layer covering
The gap area of disk, the second pad and the first pad and the second pad；PTC sheet material is anisotropic material, along the thickness of PTC sheet material
Spend direction have posive temperature coefficient thermistor performance, do not transmit electric current along the wide direction and length direction of PTC sheet material and resistance value without
It is poor big.This kind of PTC device is two-sided structure, and relative to traditional four-layer structure, compact-sized, single layer ptc material plays original
The effect of technology bilayer ptc material, while making the manufacturing process flow of PTC device simply very much, using traditional four laminates
Mutual contact mode needs to drill, and the metal material inside ptc material is very serious to the abrasion of drill bit, and drilling cost is very high, existing
It does not need to drill at all in our structures and technique, in PTC devices field, one very in structure and manufacturing process for this
Big innovation.Corresponding, the utility model additionally provides a kind of manufacturing method of PTC device, comprising: A. is metal on two sides
The two sides of the PTC sheet material of foil is etched；Wherein, the first face metal foil only etches the metal between each PTC device cell
Foil；Second face metal foil etches the metal foil between the pad in each PTC device cell；PTC sheet material is anisotropy material
Material, along PTC sheet material thickness direction have posive temperature coefficient thermistor performance, along PTC sheet material wide direction and length direction not
It transmits electric current and resistance value is infinitely great.The inertial thinking for breaking through those skilled in the art, two pads of PTC device is accomplished same
On a face, by electrical isolation between two pads, the anisotropic properties of PTC sheet material, the metal of the another side of PTC sheet material are utilized
Foil plays the role of electrical connection and physical connection, and the thickness of a PTC device plays 2 times of thickness of conventional PTC device, will
2 pads of PTC device accomplish that, without laminating process on the same face, the high temperature that will not reduce PTC sheet material increases resistance effect.
Detailed description of the invention
The manufacturing method and PTC device of the PTC device of the utility model are described further with reference to the accompanying drawing.
Fig. 1 is the structural schematic diagram of the PTC device of the prior art.
Fig. 2 is the manufacturing method flow chart of the PTC device of the utility model.
Fig. 3 is a kind of schematic perspective view of one embodiment of PTC device of the utility model.
Fig. 4 is a kind of cross-sectional view of one embodiment of PTC device of the utility model.
Fig. 5 is a kind of schematic perspective view of another embodiment of PTC device of the utility model.
Fig. 6 is a kind of cross-sectional view of another embodiment of PTC device of the utility model.
In figure:
1-PTC sheet material；The first pad of 2-；The second pad of 3-；4- conductor layer；5- strengthening course；6- green oil.
Specific embodiment
1~6 and the technical solution of the utility model is further illustrated by specific embodiment with reference to the accompanying drawing.
Be seen everywhere in we live using battery powered equipment: low power battery supply set such as mobile phone is put down
Plate computer, electric shaver etc., powerful battery supply set such as electric vehicle, automobile, electri forklift etc..These products
Or the rechargeable battery of equipment use needs to be configured when being charged the protection of corresponding overcurrent, over-voltage, overheat,
The battery explosion as caused by electric current is excessive, overtension, heat are excessive is prevented, this just needs largely to apply PTC device
Part plays the role of high temperature and increases resistance.
The utility model additionally provides a kind of PTC device.
A kind of PTC device, including PTC sheet material 1, the first pad 2 and the second pad 3, the first pad 2 and the second pad 3
In the same side of PTC sheet material 1, the other side of PTC sheet material 1 is conductor layer 4, conductor layer 4 cover the first pad 2, the second pad 3 and
The gap area of first pad 2 and the second pad 3；
PTC sheet material 1 is anisotropic material, and the thickness direction along PTC sheet material 1 has posive temperature coefficient thermistor
Can, electric current is not transmitted along the wide direction and length direction of PTC sheet material 1 and resistance value is infinitely great.
This kind of PTC device is two-sided structure, relative to traditional four-layer structure (shown in Fig. 1), compact-sized, single layer PTC
Material plays the role of the double-deck ptc material, and (current direction is the ptc layer (PTC of 2 → the first pad bottom of the first pad
Sheet material 1) → conductor layer 4 → the second pad bottom ptc layer (PTC sheet material 1) → second pad 3)；Material manufacture craft pair
Material does not wear, injures, and manufactured product accuracy is high；Meanwhile so that the manufacturing process flow of PTC device is simply very much,
Using the mutual contact mode of traditional four laminates, needing to drill, the metal material inside ptc material is very serious to the abrasion of drill bit,
The cost that drills is very high, our this structure and technique do not need to drill at all now, this is either tied in PTC devices field
Structure design or manufacturing process, are all a very big innovations.
In the present embodiment, the PTC sheet material 1 between the first pad 2 and the second pad 3 is removed；
4 layers of conductor layer of the other side of PTC sheet material 1 are provided with strengthening course 5.
In the present embodiment, strengthening course 5 is epoxy resin, polyimides or BT layer；Bonding and reinforcing layer 5, passes through low-temperature adhesion
The bonding temp of agent bonding, low temperature adhesive is lower than 149 DEG C.The bonding temp of low temperature adhesive can be 20 DEG C, 30 DEG C, 40
DEG C, 50 DEG C, 60 DEG C, 70 DEG C, 80 DEG C, 90 DEG C, 100 DEG C, 110 DEG C, 120 DEG C, 130 DEG C or 140 DEG C etc..
In the present embodiment, PTC device constitutes a PTC device cell.
In the present embodiment, the gap between pad (the first pad 2 and the second pad 3) in each PTC device cell
Width is greater than 5 μm；
The sum of the area of pad in PTC device cell is 3 times of the sum of area between the pad in PTC device cell
More than.
In the present embodiment, pad (the first pad 2 and the second pad 3 or adjacent in each PTC device cell are etched
Pad) between metal foil width (gap width) be 15 μm, processing throughput can be reached, also meet performance and want
It asks；As needed, the width in the gap between the pad in PTC device cell may be 10 μm, 20 μm, 40 μm, 50 μm, 60
μm, 70 μm, 80 μm, 90 μm or 100 μm.
As needed, the pad in PTC device cell (refers to the first pad and the second pad, it is also possible to include multiple welderings
Disk) the sum of area be the sum of interval area between pad in PTC device cell 3 times, 5 times, 7 times, 9 times, 30 times, 50
Times, 70 times, 90 times, 300 times, 500 times, 800 times, 3000 times, 5000 times, 8000 times, 10000 times, 30000 times, 50000 times,
80000 times, 300,000 times, 500,000 times, 700,000 times, 3,000,000 times, 5,000,000 times, 7,000,000 times or 9,000,000 times etc., PTC device list in a word
The area of pad in member can be infinitely close to the entire area of PTC device cell.
In the present embodiment, to the second face metal foil, using green oil 6 cover part pad in each PTC device cell or
A part of pad；
Filled by green oil 6 between the pad in each PTC device cell due to remove ptc material bring gap.
In the present embodiment, by lamination, drilling blind hole and electroplating technology, by the weldering of the second face metal foil of PTC device cell
The circuit connection of disk and pcb board material.
In the present embodiment, the quantity of the pad in each PTC device cell is 2.
The utility model additionally provides another PTC device.
A kind of PTC device, including PTC sheet material 1, the first pad 2 and the second pad 3, in the present embodiment, 2 He of the first pad
Second pad 3 is located at the same side of PTC sheet material 1, and the other side of PTC sheet material 1 is conductor layer 4, conductor layer 4 cover the first pad 2,
The gap area of second pad 3 and the first pad 2 and the second pad 3；
PTC sheet material 1 between first pad 2 and the second pad 3 is removed；
The other side of PTC sheet material 1 is conductor layer 4, and conductor layer 4 covers the first pad 2,2 and of the second pad 3 and the first pad
The gap area of second pad 3；
PTC sheet material 1 is isotropic material, has positive temperature along the thickness direction of PTC sheet material 1, wide direction and length direction
Coefficient resistance performance.
In the present embodiment, strengthening course 5 is epoxy resin, polyimides or BT layer；Bonding and reinforcing layer 5, passes through low-temperature adhesion
The bonding temp of agent bonding, low temperature adhesive is lower than 149 DEG C.
In the present embodiment, the width of the metal foil between pad in each PTC device cell is greater than 5 μm；
The sum of the area of pad in PTC device cell is 3 times of the sum of area between the pad in PTC device cell
More than.
In the present embodiment, to the second face metal foil, using green oil 6 cover part pad in each PTC device cell or
A part of pad；
Filled by green oil 6 between the pad in each PTC device cell due to remove ptc material bring gap.
In the present embodiment, by lamination, drilling blind hole and electroplating technology, by the weldering of the second face metal foil of PTC device cell
The circuit connection of disk and pcb board material.
In the present embodiment, the quantity of the pad in each PTC device cell is 2.
The existing PTC product in market at present, mostly uses ptc material to be embedded into resin material greatly, and resin material includes BT
Equal materials, this technique are generally wrapped up ptc material by two copper foils, are then re-used as sandwich of layers and are passed through BT above-mentioned
Equal resin materials are wrapped up again, ultimately form the structure that ptc material is wrapped in resin as sandwich of layers, which can be with
It is realized by many techniques, including but not limited to wiring board laminating technology, semiconductor plastic package technique.It is described below a kind of typical
The processing technology of PTC device
The utility model is changed mainly for the structure of PTC existing product, can greatly simplify processing technology, and
The utilization rate of material is promoted, the utilization rate of PTC is 90% or more.
The utility model additionally provides a kind of manufacturing method of PTC device.
A kind of manufacturing method of PTC device, comprising:
A. it is etched on the two sides that two sides is the PTC sheet material 1 of metal foil；
Wherein, the first face metal foil only etches the metal foil between each PTC device cell；Second face metal foil, etching
The metal foil between pad in each PTC device cell；
PTC sheet material 1 is anisotropic material, and the thickness direction along PTC sheet material 1 has posive temperature coefficient thermistor
Can, electric current is not transmitted along the wide direction and length direction of PTC sheet material 1 and resistance value is infinitely great.
The inertial thinking for breaking through those skilled in the art, two pads of PTC device are accomplished on the same face, two welderings
By electrical isolation between disk, using the anisotropic properties of PTC sheet material 1, the metal foil of the another side of PTC sheet material 1, which plays, to be electrically connected
It connects and is acted on physical connection, the thickness of a PTC device plays the role of 2 times of thickness of conventional PTC device, by the 2 of PTC device
A pad accomplishes that, without laminating process on the same face, the high temperature that will not reduce PTC sheet material 1 increases resistance effect.
In the present embodiment, after step A further include:
B. in the side bonding and reinforcing layer 5 of the first face metal foil；
C. from the second face metal foil side, the ptc material between the pad in PTC device cell unless each is removed.
The accuracy of the resistance between pad can be improved by step C, thoroughly prevent electric current along the transverse direction of PTC sheet material 1
It propagates, so that electric current can only be passed to 1 layer of PTC sheet material of the pad bottom from a pad, is reaching the first face metal foil layer, then
1 layer of PTC sheet material of another pad bottom is reached, the pad at this is being reached, is substantially increasing control precision, reduce to material
Expect anisotropic performance requirement.
In the present embodiment, strengthening course 5 is epoxy resin, polyimides or BT layer；
Bonding and reinforcing layer 5, is bonded by low temperature adhesive, and the bonding temp of low temperature adhesive is lower than 149 DEG C.
In the present embodiment, the width for etching the metal foil between the pad in each PTC device cell is greater than 5 μm；
The sum of the area of pad in PTC device cell is 3 times of the sum of area between the pad in PTC device cell
More than.
In the present embodiment, after step C further include:
D. to the second face metal foil, one of the part pad or pad in each PTC device cell is covered using green oil 6
Point；
Filled by green oil 6 between the pad in each PTC device cell due to remove ptc material bring gap.
In the present embodiment, after step C further include:
E. by lamination, drilling blind hole and electroplating technology, by the pad and pcb board of the second face metal foil of PTC device cell
The circuit connection of material.
The sequencing of above-mentioned steps D and step E, which can according to need, to be adjusted.
The utility model additionally provides, the manufacturing method of another PTC device,
A kind of manufacturing method of PTC device, comprising:
A. it is etched on the two sides that two sides is the PTC sheet material 1 of metal foil；
Wherein, the first face metal foil only etches the metal foil between each PTC device cell；Second face metal foil, etching
The metal foil between pad in each PTC device cell；
B. in the side bonding and reinforcing layer 5 of the first face metal foil；
C. from the second face metal foil side, the ptc material between the pad in PTC device cell unless each is removed；
PTC sheet material 1 is isotropic material, has positive temperature along the thickness direction of PTC sheet material 1, wide direction and length direction
Coefficient resistance performance.
The inertial thinking for breaching those skilled in the art is accomplished two pads of PTC device on the same face, two
Realize that the physical isolation of ptc material, the metal foil of the another side of PTC sheet material play electrical connection and physics between pad by gap
The effect of connection, the thickness of a PTC device of the utility model plays the role of 2 times of thickness of conventional PTC device, by PTC
2 pads of device accomplish that, without laminating process on the same face, the high temperature that will not reduce PTC sheet material increases resistance effect.It can
Greatly to simplify processing technology, and promote the utilization rate of material.
In the present embodiment, strengthening course 5 is epoxy resin, polyimides or BT layer；
Bonding and reinforcing layer 5, is bonded by low temperature adhesive, and the bonding temp of low temperature adhesive is lower than 149 DEG C.
Bonding and reinforcing layer, is bonded by low temperature adhesive, and the bonding temp of low temperature adhesive is lower than 149 DEG C.Regular situation
Under, the bonding temp of low temperature adhesive can be room temperature, such as 30 DEG C or so.
In the present embodiment, the width for etching the metal foil between the pad in each PTC device cell is greater than 5 μm；
The sum of the area of pad in PTC device cell is 3 times of the sum of area between the pad in PTC device cell
More than.
The width for etching the metal foil between the pad in each PTC device cell is greater than 5 μm, such as 10~100 μ
m；The sum of the area of pad in PTC device cell be 1000 times of the sum of area between the pad in PTC device cell with
On.
For example, the width for etching the metal foil between the pad in each PTC device cell be also possible to 10 μm, 20 μm,
30μm、40μm、50μm、60μm、70μm、80μm、90μm、100μm、110μm、120μm、130μm、140μm、150μm、160μm、
170 μm, 180 μm, 190 μm, 200 μm, 300 μm, 400 μm, 500 μm, 600 μm, 700 μm, 800 μm, 900 μm or 1000 μm.
The utility model uses novel PTC device architecture, upper and lower surface is etched with the PTC sheet material 1 of two copper foils, one
The etching in face is the copper foil material between each PTC device unit (pcs) of etching, and all or most is retained inside unit
Copper foil (conductor layer 4), another side etching is that two big copper pads (the first welderings are formed in each PTC device unit (pcs)
Disk 2 and the second pad 3), the area that two copper pads are added together is approximately equal to the base area of PTC device, and (bottom surface is entirely copper
Foil), 10 μm or more of gap is etched between two copper pads, it is subsequent to can choose in the exposing of the gap of two copper pads
It carries out controlling deep cutting operation on ptc material, realizes the physical isolation of the ptc material between two copper pads.Control the depth profoundly cut
Degree, which is subject to, cuts off ptc material；Most narrow width including cutting fine crack is 19 μm.
As needed, the width for cutting fine crack can also be smaller, and for example, 10 μm or 5 μm.In two big brazing disks
Green oil printing 6 controls the exposing area of copper pad by way of exposure development, while green oil 6 also fills two welderings
PTC exposed area between disk；Groove caused by profoundly cutting to control is filled also by green oil 6.
In the present embodiment, after step C further include:
D. to the second face metal foil, one of the part pad or pad in each PTC device cell is covered using green oil 6
Point；
Filled by green oil 6 between the pad in each PTC device cell due to remove ptc material bring gap.
In the present embodiment, after step C further include:
E. by lamination, drilling blind hole and electroplating technology, by the pad and pcb board of the second face metal foil of PTC device cell
The circuit connection of material.
The sequencing of above-mentioned steps D and step E, which can according to need, to be adjusted.
It will be apparent to those skilled in the art that can make various other according to the above description of the technical scheme and ideas
Corresponding change and deformation, and all these changes and deformation all should belong to the protection of the utility model claims
Within the scope of.
It should be understood that above embodiment is only the utility model a part of the embodiment, rather than whole realities
Apply example." first " of embodiment and singular used in the attached claims, " second ", "an", " " and "the"
It is also intended to including most forms, unless the context clearly indicates other meaning." first " and " second " simply to illustrate that
It is convenient, point of sequencing is not indicated.
The utility model is not limited to the above embodiment, the technical solution of above-mentioned each embodiment of the utility model that
This can form new technical solution with combined crosswise, and in addition all technical solutions formed using equivalent replacement, are all fallen within practical
In the protection scope of novel requirement.
Claims (10)
1. a kind of PTC device, including PTC sheet material, the first pad and the second pad, which is characterized in that first pad and
Two pads are located at the same side of PTC sheet material, and the other side of the PTC sheet material is conductor layer, the conductor layer covering described first
The gap area of pad, the second pad and the first pad and the second pad；
The PTC sheet material is anisotropic material, and the thickness direction along the PTC sheet material has posive temperature coefficient thermistor
Can, electric current is not transmitted along the wide direction and length direction of the PTC sheet material and resistance value is infinitely great.
2. PTC device as described in claim 1, which is characterized in that the PTC sheet material quilt between first pad and the second pad
Removal；
The conductor layer of the other side of the PTC sheet material is provided with strengthening course.
3. PTC device as claimed in claim 2, which is characterized in that the strengthening course is epoxy resin, polyimides or BT layer；
Bonding and reinforcing layer, is bonded by low temperature adhesive, and the bonding temp of the low temperature adhesive is lower than 149 DEG C.
4. PTC device as claimed in claim 2, which is characterized in that the gap area between first pad and the second pad
Width be greater than 5 μm；
The PTC sheet material being removed is located at the gap area.
5. PTC device as claimed in claim 3, which is characterized in that be provided with welding on first pad and the second pad and protect
Sheath, the welding protective layer are scolding tin, chemical silver, electroplating gold, chemical NiPdAu or nickel layer.
6. PTC device as claimed in claim 3, which is characterized in that the coating of the partial region of first pad and the second pad
There is green oil, the gap area between first pad and the second pad is filled with green oil.
7. a kind of PTC device, including PTC sheet material, the first pad and the second pad, which is characterized in that first pad and
Two pads are located at the same side of PTC sheet material, and the other side of the PTC sheet material is conductor layer, the conductor layer covering described first
The gap area of pad, the second pad and the first pad and the second pad；
PTC sheet material between first pad and the second pad is removed；
The other side of the PTC sheet material is conductor layer, and the conductor layer covers first pad, the second pad and the first pad
With the gap area of the second pad；
The PTC sheet material is isotropic material, has positive temperature along thickness direction, wide direction and the length direction of the PTC sheet material
Spend coefficient resistance performance.
8. PTC device as claimed in claim 7, which is characterized in that the conductor layer of the other side of the PTC sheet material is provided with reinforcement
Layer.
9. PTC device as claimed in claim 8, which is characterized in that the strengthening course is epoxy resin, polyimides or BT layer；
Bonding and reinforcing layer, is bonded by low temperature adhesive, and the bonding temp of the low temperature adhesive is lower than 149 DEG C；Described first
The width of gap area between pad and the second pad is greater than 5 μm；
The PTC sheet material being removed is located at the gap area.
10. PTC device as claimed in claim 7, which is characterized in that the coating of the partial region of first pad and the second pad
There is green oil, the gap area between first pad and the second pad is filled with green oil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821469139.0U CN208767092U (en) | 2018-09-10 | 2018-09-10 | A kind of PTC device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821469139.0U CN208767092U (en) | 2018-09-10 | 2018-09-10 | A kind of PTC device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208767092U true CN208767092U (en) | 2019-04-19 |
Family
ID=66134499
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821469139.0U Active CN208767092U (en) | 2018-09-10 | 2018-09-10 | A kind of PTC device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208767092U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109192422A (en) * | 2018-09-10 | 2019-01-11 | 深圳中科四合科技有限公司 | A kind of manufacturing method and PTC device of PTC device |
| CN114999754A (en) * | 2021-03-01 | 2022-09-02 | 天芯互联科技有限公司 | Thermistor manufacturing method and thermistor |
-
2018
- 2018-09-10 CN CN201821469139.0U patent/CN208767092U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109192422A (en) * | 2018-09-10 | 2019-01-11 | 深圳中科四合科技有限公司 | A kind of manufacturing method and PTC device of PTC device |
| CN109192422B (en) * | 2018-09-10 | 2024-08-02 | 深圳中科四合科技有限公司 | Manufacturing method of PTC device and PTC device |
| CN114999754A (en) * | 2021-03-01 | 2022-09-02 | 天芯互联科技有限公司 | Thermistor manufacturing method and thermistor |
| CN114999754B (en) * | 2021-03-01 | 2023-06-02 | 天芯互联科技有限公司 | Manufacturing method of thermistor and thermistor |
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