CN109192422A - A kind of manufacturing method and PTC device of PTC device - Google Patents
A kind of manufacturing method and PTC device of PTC device Download PDFInfo
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- CN109192422A CN109192422A CN201811048086.XA CN201811048086A CN109192422A CN 109192422 A CN109192422 A CN 109192422A CN 201811048086 A CN201811048086 A CN 201811048086A CN 109192422 A CN109192422 A CN 109192422A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 32
- 239000000463 material Substances 0.000 claims abstract description 201
- 239000004020 conductor Substances 0.000 claims abstract description 31
- 239000011888 foil Substances 0.000 claims description 83
- 239000002184 metal Substances 0.000 claims description 83
- 229910052751 metal Inorganic materials 0.000 claims description 83
- 238000005516 engineering process Methods 0.000 claims description 24
- 239000000853 adhesive Substances 0.000 claims description 19
- 230000001070 adhesive effect Effects 0.000 claims description 19
- 230000003014 reinforcing effect Effects 0.000 claims description 16
- 238000005530 etching Methods 0.000 claims description 15
- 238000005728 strengthening Methods 0.000 claims description 14
- 238000005553 drilling Methods 0.000 claims description 12
- 238000003475 lamination Methods 0.000 claims description 11
- 238000009713 electroplating Methods 0.000 claims description 9
- 239000003822 epoxy resin Substances 0.000 claims description 9
- 229920000647 polyepoxide Polymers 0.000 claims description 9
- 239000004952 Polyamide Substances 0.000 claims 1
- 150000001412 amines Chemical class 0.000 claims 1
- 229920002647 polyamide Polymers 0.000 claims 1
- 239000010410 layer Substances 0.000 abstract description 69
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- 239000002356 single layer Substances 0.000 abstract description 6
- 238000005299 abrasion Methods 0.000 abstract description 3
- 239000007769 metal material Substances 0.000 abstract description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 19
- 239000011889 copper foil Substances 0.000 description 12
- 238000010030 laminating Methods 0.000 description 10
- 229920005989 resin Polymers 0.000 description 9
- 239000011347 resin Substances 0.000 description 9
- 239000004642 Polyimide Substances 0.000 description 8
- 230000000694 effects Effects 0.000 description 8
- 229920001721 polyimide Polymers 0.000 description 8
- 229910052802 copper Inorganic materials 0.000 description 7
- 239000010949 copper Substances 0.000 description 7
- 238000012163 sequencing technique Methods 0.000 description 5
- 238000005520 cutting process Methods 0.000 description 4
- 238000002955 isolation Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 2
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- 238000007747 plating Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 1
- 241001074085 Scophthalmus aquosus Species 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
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- 229920003192 poly(bis maleimide) Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/28—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
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- Thermistors And Varistors (AREA)
Abstract
The present invention relates to a kind of PTC devices, including PTC sheet material, the first pad and the second pad, first pad and the second pad are located at the same side of PTC sheet material, and the other side of PTC sheet material is conductor layer, and conductor layer covers the gap area of the first pad, the second pad and the first pad and the second pad；PTC sheet material is anisotropic material, and the thickness direction along PTC sheet material has posive temperature coefficient thermistor performance, does not transmit electric current along the wide direction and length direction of PTC sheet material and resistance value is infinitely great.This kind of PTC device is two-sided structure, and relative to traditional four-layer structure, compact-sized, single layer ptc material plays the role of double-deck, accuracy height.The present invention also provides the manufacturing methods of above-mentioned PTC device, process flow is simply very much, using the mutual contact mode of traditional four laminates, it needs to drill, metal material inside ptc material is very serious to the abrasion of drill bit, the cost that drills is very high, this technique does not need to drill at all, is a breakthrough innovation in structure and manufacturing process.
Description
Technical field
The present invention relates to technical field of electronic components, and in particular to a kind of manufacturing method and PTC device of PTC device.
Background technique
(PTC is the abbreviation of Positive Temperature Coefficient to polymer positive-temperature-coefficient, is meant just
Temperature coefficient, refer to positive temperature coefficient very big semiconductor material or component；The PTC that usually we mention is to criticize temperature
Coefficient resistance, abbreviation PTC thermistor.) circuit brake typically from two sides with conductive metal
The extruded conductive polymer sheet production of thin layer pressing.
Currently, PTC circuit brake is between the two sides of PTC sheet material setting pad, the pad on two sides in industry
PTC sheet material plays the role of high temperature and increases resistance.Its production technology is to make pad respectively on the two sides of PTC sheet material, then pass through brill
Hole, plating, lamination printed circuit board (PCB) production technology the pad on the two sides of PCT sheet material is led into the circuit diagram to a face
On layer, as shown in Figure 1, being welded, being applied again.In the manufacturing process of the prior art, embedment PTC sheet material is all using traditional
Press carries out under high temperature and high pressure environment, and laminating process is needed at 150 DEG C or more, and lamination 1 hour or more, so just to material
There is the influence of pressure, also there is the influence of temperature, it would be desirable to the influence of pressure be taken into account, because prolonged high pressure can be led
Causing the thickness of material can change, and the variation of this thickness influences whether the variation of PTC resistance value, just influence last precision,
High temperature and pressure has destruction to the material property of PTC sheet material simultaneously, and the high temperature that can reduce PTC sheet material increases resistance effect.
Summary of the invention
The technical problem to be solved by the present invention is providing the manufacturing method and PTC device of a kind of PTC device, layer is not needed
Process is pressed, the high temperature that will not reduce PTC sheet material increases resistance effect.
A kind of manufacturing method of PTC device, comprising:
A. it is etched on the two sides that two sides is the PTC sheet material of metal foil；
Wherein, the first face metal foil only etches the metal foil between each PTC device cell；Second face metal foil, etching
The metal foil between pad in each PTC device cell；
PTC sheet material is anisotropic material, and the thickness direction along PTC sheet material has posive temperature coefficient thermistor performance,
Electric current is not transmitted along the wide direction and length direction of PTC sheet material and resistance value is infinitely great.
Preferably, after step A further include:
B. in the side bonding and reinforcing layer of the first face metal foil；
C. from the second face metal foil side, the ptc material between the pad in PTC device cell unless each is removed.
The accuracy of the resistance between pad can be improved by step C, thoroughly prevent electric current and passed along the transverse direction of PTC sheet material
It broadcasts, so that electric current can only be passed to the PTC sheet layer of the pad bottom from a pad, is reaching the first face metal foil layer, then pass
To the PTC sheet layer of another pad bottom, the pad at this is being reached, control precision is being substantially increased, reduces to material
Anisotropic performance requirement.
Preferably, strengthening course is epoxy resin, polyimides or BT layer；
Bonding and reinforcing layer, is bonded by low temperature adhesive, and the bonding temp of low temperature adhesive is lower than 149.℃
Preferably, the width for etching the metal foil between the pad in each PTC device cell is greater than 5 μm；
The sum of the area of pad in PTC device cell is 3 times of the sum of area between the pad in PTC device cell
More than.
Preferably, after step C further include:
D. to the second face metal foil, one of the part pad or pad in each PTC device cell is covered using green oil
Point；
Filled by green oil between the pad in each PTC device cell due to remove ptc material bring gap.
Preferably, after step C further include:
E. by lamination, drilling blind hole and electroplating technology, by the pad and pcb board of the second face metal foil of PTC device cell
The circuit connection of material.
The sequencing of above-mentioned steps D and step E, which can according to need, to be adjusted.
The present invention also provides, a kind of another outer manufacturing method of PTC device,
A kind of manufacturing method of PTC device, comprising:
A. it is etched on the two sides that two sides is the PTC sheet material of metal foil；
Wherein, the first face metal foil only etches the metal foil between each PTC device cell；Second face metal foil, etching
The metal foil between pad in each PTC device cell；
B. in the side bonding and reinforcing layer of the first face metal foil；
C. from the second face metal foil side, the ptc material between the pad in PTC device cell unless each is removed；
PTC sheet material is isotropic material, has positive temperature system along the thickness direction of PTC sheet material, wide direction and length direction
Number thermistor performance.
Preferably, strengthening course is epoxy resin, polyimides or BT layer；
Bonding and reinforcing layer, is bonded by low temperature adhesive, and the bonding temp of low temperature adhesive is lower than 149.℃
Preferably, the width for etching the metal foil between the pad in each PTC device cell is greater than 5 μm；
The sum of the area of pad in PTC device cell is 3 times of the sum of area between the pad in PTC device cell
More than.
Preferably, after step C further include:
D. to the second face metal foil, one of the part pad or pad in each PTC device cell is covered using green oil
Point；
Filled by green oil between the pad in each PTC device cell due to remove ptc material bring gap.
Preferably, after step C further include:
E. by lamination, drilling blind hole and electroplating technology, by the pad and pcb board of the second face metal foil of PTC device cell
The circuit connection of material.
The sequencing of above-mentioned steps D and step E, which can according to need, to be adjusted.
The present invention also provides a kind of PTC devices.
A kind of PTC device, including PTC sheet material, the first pad and the second pad, the first pad and the second pad are located at PTC
The same side of sheet material, the other side of PTC sheet material are conductor layer, conductor layer cover the first pad, the second pad and the first pad and
The gap area of second pad；
PTC sheet material is anisotropic material, and the thickness direction along PTC sheet material has posive temperature coefficient thermistor performance,
Electric current is not transmitted along the wide direction and length direction of PTC sheet material and resistance value is infinitely great.
Preferably, the PTC sheet material between the first pad and the second pad is removed；
The conductor layer of the other side of PTC sheet material is provided with strengthening course.
Preferably, strengthening course is epoxy resin, polyimides or BT layer；Bonding and reinforcing layer, is bonded by low temperature adhesive,
The bonding temp of low temperature adhesive is lower than 149.℃
Preferably, the width of the metal foil between the pad in each PTC device cell is greater than 5 μm；
The sum of the area of pad in PTC device cell is 3 times of the sum of area between the pad in PTC device cell
More than.
Preferably, to the second face metal foil, part pad in each PTC device cell or pad are covered using green oil
A part；
Filled by green oil between the pad in each PTC device cell due to remove ptc material bring gap.
Preferably, by lamination, drilling blind hole and electroplating technology, by the pad of the second face metal foil of PTC device cell with
The circuit connection of pcb board material.
Preferably, the quantity of the pad in each PTC device cell is 2.
The present invention also provides a kind of PTC devices.
A kind of PTC device, including PTC sheet material, the first pad and the second pad, it is preferred that the first pad and the second pad
Positioned at the same side of PTC sheet material, the other side of PTC sheet material is conductor layer, and conductor layer covers the first pad, the second pad and first
The gap area of pad and the second pad；
PTC sheet material between first pad and the second pad is removed；
The other side of PTC sheet material is conductor layer, and conductor layer covers the first pad, the second pad and the first pad and the second weldering
The gap area of disk；
PTC sheet material is isotropic material, has positive temperature system along the thickness direction of PTC sheet material, wide direction and length direction
Number thermistor performance.
Preferably, strengthening course is epoxy resin, polyimides or BT layer；Bonding and reinforcing layer, is bonded by low temperature adhesive,
The bonding temp of low temperature adhesive is lower than 149.℃
Preferably, the width of the metal foil between the pad in each PTC device cell is greater than 5 μm；
The sum of the area of pad in PTC device cell is 3 times of the sum of area between the pad in PTC device cell
More than.
Preferably, to the second face metal foil, part pad in each PTC device cell or pad are covered using green oil
A part；
Filled by green oil between the pad in each PTC device cell due to remove ptc material bring gap.
Preferably, by lamination, drilling blind hole and electroplating technology, by the pad of the second face metal foil of PTC device cell with
The circuit connection of pcb board material.
Preferably, the quantity of the pad in each PTC device cell is 2.
The existing PTC product in market at present, mostly uses ptc material to be embedded into resin material greatly, and resin material includes BT
Equal materials, this technique are generally wrapped up ptc material by two copper foils, are then re-used as sandwich of layers and are passed through BT above-mentioned
Equal resin materials are wrapped up again, ultimately form the structure that ptc material is wrapped in resin as sandwich of layers, which can be with
It is realized by many techniques, including but not limited to wiring board laminating technology, semiconductor plastic package technique.It is described below a kind of typical
The processing technology of PTC device
Routine techniques:
When processing PTC device by circuit board technique, first have to lose the copper foil that PTC plate upper and lower surface wraps up
It carves, removes part copper foil, retain the copper foil (PTC device bonding pad) that part needs；Then it will be lost by wiring board laminating technology again
The PTC plate for carving route is laminated in a certain layer of circuit board, and laminated plate material includes that (BT substrate mainly uses day to BT substrate
The BT resin of gas company of this Mitsubishi exploitation, is mainly polymerized with B (Bismaleimide) and T (Triazine).) etc. lines
Road plate common used material.After laminating process, then (the mechanical or laser) processing that drilled, expose internal PTC device bonding pad, so
Afterwards by way of plating, the copper foil of PTC device bonding pad and outer layer is connected, finally reuses wiring board or semiconductor
Figure route processing technology production PTC device required for pad (pin, weld pad, end)
It is that PTC sheet material is considered as to a kind of PCB sheet material in the processing technology of above-mentioned routine PTC device, uses PCB substantially
General processing technology is produced, and is used traditional laminating technology as ptc material in this process and is wrapped up (embedment)
Mode, laminating technology time length, temperature are high, and 150 degrees Celsius of high-temperature time reaches 1-2 hours, to the characteristic of ptc material itself
There is destruction, the high temperature that will lead to ptc material increases resistance reduced performance.
On the other hand, the performance parameter of PTC device additionally depends on the relative area of PTC device upper and lower surface copper foil.It is conventional
The product of technique processing, the needs in another face are conducted to due to the needs of drilling, by the pad in a face of PTC sheet material, are carved
A large amount of copper foil is lost, the PTC for having etched away copper foil region cannot generate the performance of PTC, practical without PTC's
Performance, this generates great wastes.By measuring and calculating, the practical utilization rate for utilizing PTC of this technique is less than 60%, for high
It is a kind of greatly waste for expensive ptc material, as shown in Figure 1.
Present invention is generally directed to the structures of PTC existing product to change, and can greatly simplify processing technology, and promoted
The utilization rate of material, the utilization rate of PTC is 90% or more.
The beneficial effects of the present invention are: a kind of PTC device, including PTC sheet material, the first pad and the second pad, the first weldering
Disk and the second pad are located at the same side of PTC sheet material, and the other side of PTC sheet material is conductor layer, and conductor layer covers the first pad, the
The gap area of two pads and the first pad and the second pad；PTC sheet material is anisotropic material, along the thickness side of PTC sheet material
To with posive temperature coefficient thermistor performance, electric current is not transmitted along the wide direction and length direction of PTC sheet material and resistance value is infinitely great.
This kind of PTC device is two-sided structure, and relative to traditional four-layer structure, compact-sized, single layer ptc material plays the role of double-deck
((shown in Fig. 1), compact-sized, single layer ptc material plays the role of the double-deck ptc material, and (current direction is the first pad → the
Ptc layer (PTC sheet material) → the of ptc layer (PTC sheet material) → conductor layer → second pad bottom of one pad bottom
Two pads)；), accuracy is high, while making the manufacturing process flow of PTC device simply very much, using the interconnection of traditional four laminates
Mode needs to drill, and the metal material inside ptc material is very serious to the abrasion of drill bit, drilling cost it is very high, now I
This structure and technique do not need to drill at all, this is one very big in structure and manufacturing process in PTC devices field
Innovation.Corresponding, the present invention also provides a kind of manufacturing methods of PTC device, comprising: A. is in the PTC that two sides is metal foil
The two sides of sheet material is etched；Wherein, the first face metal foil only etches the metal foil between each PTC device cell；Second face
Metal foil etches the metal foil between the pad in each PTC device cell；PTC sheet material is anisotropic material, along PTC piece
The thickness direction of material have posive temperature coefficient thermistor performance, along the wide direction and length direction of PTC sheet material do not transmit electric current and
Resistance value is infinitely great.The inertial thinking for breaking through those skilled in the art, two pads of PTC device is accomplished on the same face, two
By electrical isolation between a pad, using the anisotropic properties of PTC sheet material, the metal foil of the another side of PTC sheet material plays electricity
Connection and physical connection effect, the thickness of a PTC device plays the role of 2 times of thickness of conventional PTC device, by PTC device
2 pads accomplish that the high temperature that will not reduce PTC sheet material on the same face without laminating process increases resistance effect.
Detailed description of the invention
The manufacturing method and PTC device of PTC device of the invention are described further with reference to the accompanying drawing.
Fig. 1 is the structural schematic diagram of the PTC device of the prior art.
Fig. 2 is a kind of manufacturing method flow chart of PTC device of the present invention.
Fig. 3 is a kind of schematic perspective view of one embodiment of PTC device of the present invention.
Fig. 4 is a kind of cross-sectional view of one embodiment of PTC device of the present invention.
Fig. 5 is a kind of schematic perspective view of another embodiment of PTC device of the present invention.
Fig. 6 is a kind of cross-sectional view of another embodiment of PTC device of the present invention.
In figure:
1-PTC sheet material；The first pad of 2-；The second pad of 3-；4- conductor layer；5- strengthening course；6- green oil.
Specific embodiment
With reference to the accompanying drawing 1~6 and pass through specific embodiment to further illustrate the technical scheme of the present invention.
Be seen everywhere in we live using battery powered equipment: low power battery supply set such as mobile phone is put down
Plate computer, electric shaver etc., powerful battery supply set such as electric vehicle, automobile, electri forklift etc..These products
Or the rechargeable battery of equipment use needs to be configured when being charged the protection of corresponding overcurrent, over-voltage, overheat,
The battery explosion as caused by electric current is excessive, overtension, heat are excessive is prevented, this just needs largely to apply PTC device
Part plays the role of high temperature and increases resistance.
The present invention provides a kind of manufacturing methods of PTC device.
A kind of manufacturing method of PTC device, comprising:
A. it is etched on the two sides that two sides is the PTC sheet material 1 of metal foil；
Wherein, the first face metal foil only etches the metal foil between each PTC device cell；Second face metal foil, etching
The metal foil between pad in each PTC device cell；
PTC sheet material 1 is anisotropic material, and the thickness direction along PTC sheet material 1 has posive temperature coefficient thermistor
Can, electric current is not transmitted along the wide direction and length direction of PTC sheet material 1 and resistance value is infinitely great.
The inertial thinking for breaking through those skilled in the art, two pads of PTC device are accomplished on the same face, two welderings
By electrical isolation between disk, using the anisotropic properties of PTC sheet material 1, the metal foil of the another side of PTC sheet material 1, which plays, to be electrically connected
It connects and is acted on physical connection, the thickness of a PTC device plays the role of 2 times of thickness of conventional PTC device, by the 2 of PTC device
A pad accomplishes that, without laminating process on the same face, the high temperature that will not reduce PTC sheet material 1 increases resistance effect.
In the present embodiment, after step A further include:
B. in the side bonding and reinforcing layer 5 of the first face metal foil；
C. from the second face metal foil side, the ptc material between the pad in PTC device cell unless each is removed.
The accuracy of the resistance between pad can be improved by step C, thoroughly prevent electric current along the transverse direction of PTC sheet material 1
It propagates, so that electric current can only be passed to 1 layer of PTC sheet material of the pad bottom from a pad, is reaching the first face metal foil layer, then
1 layer of PTC sheet material of another pad bottom is reached, the pad at this is being reached, is substantially increasing control precision, reduce to material
Expect anisotropic performance requirement.
In the present embodiment, compact-sized, single layer ptc material plays the role of the double-deck ptc material (current direction first
The ptc layer of 4 → the second pad bottom of ptc layer (PTC sheet material 1) → conductor layer of 2 → the first pad bottom of pad
(PTC sheet material 1) → second pad 3).
In the present embodiment, strengthening course 5 is epoxy resin, polyimides or BT layer；
Bonding and reinforcing layer 5, is bonded by low temperature adhesive, and the bonding temp of low temperature adhesive is lower than 149.℃
In the present embodiment, the width for etching the metal foil between the pad in each PTC device cell is greater than 5 μm；
The sum of the area of pad in PTC device cell is 3 times of the sum of area between the pad in PTC device cell
More than.
In the present embodiment, after step C further include:
D. to the second face metal foil, one of the part pad or pad in each PTC device cell is covered using green oil 6
Point；
Filled by green oil 6 between the pad in each PTC device cell due to remove ptc material bring gap.
In the present embodiment, after step C further include:
E. by lamination, drilling blind hole and electroplating technology, by the pad and pcb board of the second face metal foil of PTC device cell
The circuit connection of material.
The sequencing of above-mentioned steps D and step E, which can according to need, to be adjusted.
The present invention also provides, the manufacturing method of another PTC device,
A kind of manufacturing method of PTC device, comprising:
A. it is etched on the two sides that two sides is the PTC sheet material 1 of metal foil；
Wherein, the first face metal foil only etches the metal foil between each PTC device cell；Second face metal foil, etching
The metal foil between pad in each PTC device cell；
B. in the side bonding and reinforcing layer 5 of the first face metal foil；
C. from the second face metal foil side, the ptc material between the pad in PTC device cell unless each is removed；
PTC sheet material 1 is isotropic material, has positive temperature along the thickness direction of PTC sheet material 1, wide direction and length direction
Coefficient resistance performance.
The inertial thinking for breaching those skilled in the art is accomplished two pads of PTC device on the same face, two
Realize that the physical isolation of ptc material, the metal foil of the another side of PTC sheet material play electrical connection and physics between pad by gap
The effect of connection, the thickness of a PTC device of the invention play the role of 2 times of thickness of conventional PTC device (it is compact-sized,
Single layer ptc material plays the role of the double-deck ptc material, and (current direction is the ptc material of 2 → the first pad bottom of the first pad
Ptc layer (PTC sheet material 1) → second pad 3 of 4 → the second pad bottom of layer (PTC sheet material 1) → conductor layer), by PTC device
2 pads of part accomplish that, without laminating process on the same face, the high temperature that will not reduce PTC sheet material increases resistance effect.It can be with
Greatly simplify processing technology, and promotes the utilization rate of material.
In the present embodiment, strengthening course 5 is epoxy resin, polyimides or BT layer；
Bonding and reinforcing layer 5, is bonded by low temperature adhesive, and the bonding temp of low temperature adhesive is lower than 149.℃
Bonding and reinforcing layer, is bonded by low temperature adhesive, and the bonding temp of low temperature adhesive is lower than 149.DEG C regular situation
Under, the bonding temp of low temperature adhesive can be room temperature, such as 30 DEG C or so.
In the present embodiment, the width for etching the metal foil between the pad in each PTC device cell is greater than 5 μm；
The sum of the area of pad in PTC device cell is 3 times of the sum of area between the pad in PTC device cell
More than.
The width for etching the metal foil between the pad in each PTC device cell is greater than 5 μm, such as 10~100 μ
m；The sum of the area of pad in PTC device cell be 1000 times of the sum of area between the pad in PTC device cell with
On.
For example, the width for etching the metal foil between the pad in each PTC device cell be also possible to 10 μm, 20 μm,
30μm、40μm、50μm、60μm、70μm、80μm、90μm、100μm、110μm、120μm、130μm、140μm、150μm、160μm、
170 μm, 180 μm, 190 μm, 200 μm, 300 μm, 400 μm, 500 μm, 600 μm, 700 μm, 800 μm, 900 μm or 1000 μm.
The present invention uses novel PTC device architecture, upper and lower surface is etched with the PTC sheet material 1 of two copper foils, on one side
Etching is the copper foil material between each PTC device unit (pcs) of etching, and the copper of all or most is retained inside unit
Foil (conductor layer 4), another side etching are that two big copper pad (the first pads 2 are formed in each PTC device unit (pcs)
With the second pad 3), the area that two copper pads are added together is approximately equal to the base area (bottom surface is entirely copper foil) of PTC device,
10 μm or more of gap is etched between two copper pads, it is subsequent to can choose the PTC material exposed in the gap of two copper pads
It carries out controlling deep cutting operation on material, realizes the physical isolation of the ptc material between two copper pads.The depth profoundly cut is controlled to cut
Subject to disconnected ptc material；Most narrow width including cutting fine crack is 19 μm.
As needed, the width for cutting fine crack can also be smaller, and for example, 10 μm or 5 μm.In two big brazing disks
Green oil printing 6 controls the exposing area of copper pad by way of exposure development, while green oil 6 also fills two welderings
PTC exposed area between disk；Groove caused by profoundly cutting to control is filled also by green oil 6.
In the present embodiment, after step C further include:
D. to the second face metal foil, one of the part pad or pad in each PTC device cell is covered using green oil 6
Point；
Filled by green oil 6 between the pad in each PTC device cell due to remove ptc material bring gap.
In the present embodiment, after step C further include:
E. by lamination, drilling blind hole and electroplating technology, by the pad and pcb board of the second face metal foil of PTC device cell
The circuit connection of material.
The sequencing of above-mentioned steps D and step E, which can according to need, to be adjusted.
The present invention also provides a kind of PTC devices.
A kind of PTC device, including PTC sheet material 1, the first pad 2 and the second pad 3, the first pad 2 and the second pad 3
In the same side of PTC sheet material 1, the other side of PTC sheet material 1 is conductor layer 4, conductor layer 4 cover the first pad 2, the second pad 3 and
The gap area of first pad 2 and the second pad 3；
PTC sheet material 1 is anisotropic material, and the thickness direction along PTC sheet material 1 has posive temperature coefficient thermistor
Can, electric current is not transmitted along the wide direction and length direction of PTC sheet material 1 and resistance value is infinitely great.
This kind of PTC device is two-sided structure, and relative to traditional four-layer structure, compact-sized, single layer ptc material is played
Bilayer effect, accuracy is high, while making the manufacturing process flow of PTC device simply very much, using the interconnection of traditional four laminates
Mode needs to drill, and the metal material inside ptc material is very serious to the abrasion of drill bit, drilling cost it is very high, now I
This structure and technique do not need to drill at all, this is one very big in structure and manufacturing process in PTC devices field
Innovation.
In the present embodiment, the PTC sheet material 1 between the first pad 2 and the second pad 3 is removed；
4 layers of conductor layer of the other side of PTC sheet material 1 are provided with strengthening course 5.
In the present embodiment, strengthening course 5 is epoxy resin, polyimides or BT layer；Bonding and reinforcing layer 5, passes through low-temperature adhesion
The bonding temp of agent bonding, low temperature adhesive is lower than 149.℃
In the present embodiment, the width of the metal foil between pad in each PTC device cell is greater than 5 μm；
The sum of the area of pad in PTC device cell is 3 times of the sum of area between the pad in PTC device cell
More than.
In the present embodiment, the width (gap width) for etching the metal foil between the pad in each PTC device cell is
30μm；As needed, the width in the gap between the pad in PTC device cell may be 10 μm, 20 μm, 40 μm, 50 μm,
60 μm, 70 μm, 80 μm, 90 μm or 100 μm.
As needed, the sum of the area of pad in PTC device cell is the area between the pad in PTC device cell
The sum of 3 times, 5 times, 7 times, 9 times, 30 times, 50 times, 70 times, 90 times, 300 times, 500 times, 800 times, 3000 times, 5000 times,
8000 times, 10000 times, 30000 times, 50000 times, 80000 times, 300,000 times, 500,000 times, 700,000 times, 3,000,000 times, 5,000,000 times,
7000000 times or 9,000,000 times etc., the area of the pad in PTC device cell can be infinitely close to the whole of PTC device cell in a word
Bulk area.
In the present embodiment, to the second face metal foil, using green oil 6 cover part pad in each PTC device cell or
A part of pad；
Filled by green oil 6 between the pad in each PTC device cell due to remove ptc material bring gap.
In the present embodiment, by lamination, drilling blind hole and electroplating technology, by the weldering of the second face metal foil of PTC device cell
The circuit connection of disk and pcb board material.
In the present embodiment, the quantity of the pad in each PTC device cell is 2.
The present invention also provides a kind of PTC devices.
A kind of PTC device, including PTC sheet material 1, the first pad 2 and the second pad 3, in the present embodiment, 2 He of the first pad
Second pad 3 is located at the same side of PTC sheet material 1, and the other side of PTC sheet material 1 is conductor layer 4, conductor layer 4 cover the first pad 2,
The gap area of second pad 3 and the first pad 2 and the second pad 3；
PTC sheet material 1 between first pad 2 and the second pad 3 is removed；
The other side of PTC sheet material 1 is conductor layer 4, and conductor layer 4 covers the first pad 2,2 and of the second pad 3 and the first pad
The gap area of second pad 3；
PTC sheet material 1 is isotropic material, has positive temperature along the thickness direction of PTC sheet material 1, wide direction and length direction
Coefficient resistance performance.
In the present embodiment, strengthening course 5 is epoxy resin, polyimides or BT layer；Bonding and reinforcing layer 5, passes through low-temperature adhesion
The bonding temp of agent bonding, low temperature adhesive is lower than 149.℃
In the present embodiment, the width of the metal foil between pad in each PTC device cell is greater than 5 μm；
The sum of the area of pad in PTC device cell is 3 times of the sum of area between the pad in PTC device cell
More than.
In the present embodiment, to the second face metal foil, using green oil 6 cover part pad in each PTC device cell or
A part of pad；
Filled by green oil 6 between the pad in each PTC device cell due to remove ptc material bring gap.
In the present embodiment, by lamination, drilling blind hole and electroplating technology, by the weldering of the second face metal foil of PTC device cell
The circuit connection of disk and pcb board material.
In the present embodiment, the quantity of the pad in each PTC device cell is 2.
The existing PTC product in market at present, mostly uses ptc material to be embedded into resin material greatly, and resin material includes BT
Equal materials, this technique are generally wrapped up ptc material by two copper foils, are then re-used as sandwich of layers and are passed through BT above-mentioned
Equal resin materials are wrapped up again, ultimately form the structure that ptc material is wrapped in resin as sandwich of layers, which can be with
It is realized by many techniques, including but not limited to wiring board laminating technology, semiconductor plastic package technique.It is described below a kind of typical
The processing technology of PTC device
Present invention is generally directed to the structures of PTC existing product to change, and can greatly simplify processing technology, and promoted
The utilization rate of material, the utilization rate of PTC is 90% or more.
It will be apparent to those skilled in the art that can make various other according to the above description of the technical scheme and ideas
Corresponding change and deformation, and all these changes and deformation all should belong to the protection scope of the claims in the present invention
Within.
It should be understood that above embodiment is only a part of the embodiment of the present invention, instead of all the embodiments.
" first " of embodiment and singular used in the attached claims, " second ", "an", " " and "the" are also intended to
Including most forms, unless the context clearly indicates other meaning." first " and " second " simply to illustrate that convenience, no
Indicate point of sequencing.
Of the invention is not limited to the above embodiment, and the technical solution of above-mentioned each embodiment of the invention can be handed over each other
Fork combination form new technical solution, in addition it is all using equivalent replacement formed technical solution, all fall within the present invention claims guarantor
It protects in range.
Claims (12)
1. a kind of manufacturing method of PTC device characterized by comprising
A. it is etched on the two sides that two sides is the PTC sheet material of metal foil；
Wherein, the first face metal foil only etches the metal foil between each PTC device cell；Second face metal foil etches each
The metal foil between pad in PTC device cell；
The PTC sheet material is anisotropic material, and the thickness direction along the PTC sheet material has posive temperature coefficient thermistor
Can, electric current is not transmitted along the wide direction and length direction of the PTC sheet material and resistance value is infinitely great.
2. the manufacturing method of PTC device as described in claim 1, which is characterized in that after the step A further include:
B. in the side bonding and reinforcing layer of first face metal foil；
C. from the second face metal foil side, the ptc material between the pad in PTC device cell unless each is removed.
3. the manufacturing method of PTC device as claimed in claim 2, which is characterized in that the strengthening course is epoxy resin, polyamides Asia
Amine or BT layers；
The bonding and reinforcing layer, is bonded by low temperature adhesive, and the bonding temp of the low temperature adhesive is lower than 149 DEG C.
4. the manufacturing method of PTC device as claimed in claim 2, which is characterized in that in each PTC device cell of etching
The width of metal foil between pad is greater than 5 μm；
The sum of the area of pad in PTC device cell be 3 times of the sum of area between the pad in PTC device cell with
On.
5. the manufacturing method of PTC device as claimed in claim 2, which is characterized in that after the step C further include:
D. to second face metal foil, one of the part pad or pad in each PTC device cell is covered using green oil
Point；
Filled by green oil between the pad in each PTC device cell due to remove ptc material bring gap.
6. the manufacturing method of PTC device as claimed in claim 2, which is characterized in that after the step C further include:
E. by lamination, drilling blind hole and electroplating technology, by the pad and pcb board of the second face metal foil of the PTC device cell
The circuit connection of material.
7. a kind of manufacturing method of PTC device characterized by comprising
A. it is etched on the two sides that two sides is the PTC sheet material of metal foil；
Wherein, the first face metal foil only etches the metal foil between each PTC device cell；Second face metal foil etches each
The metal foil between pad in PTC device cell；
B. in the side bonding and reinforcing layer of first face metal foil；
C. from the second face metal foil side, the ptc material between the pad in PTC device cell unless each is removed；
The PTC sheet material is isotropic material, has positive temperature along thickness direction, wide direction and the length direction of the PTC sheet material
Spend coefficient resistance performance.
8. a kind of PTC device, including PTC sheet material, the first pad and the second pad, which is characterized in that first pad and
Two pads are located at the same side of PTC sheet material, and the other side of the PTC sheet material is conductor layer, the conductor layer covering described first
The gap area of pad, the second pad and the first pad and the second pad；
The PTC sheet material is anisotropic material, and the thickness direction along the PTC sheet material has posive temperature coefficient thermistor
Can, electric current is not transmitted along the wide direction and length direction of the PTC sheet material and resistance value is infinitely great.
9. PTC device as claimed in claim 8, which is characterized in that the PTC sheet material quilt between first pad and the second pad
Removal；
The conductor of the other side of the PTC sheet material is provided with strengthening course layer by layer.
10. a kind of PTC device, including PTC sheet material, the first pad and the second pad, which is characterized in that first pad and
Two pads are located at the same side of PTC sheet material, and the other side of the PTC sheet material is conductor layer, the conductor layer covering described first
The gap area of pad, the second pad and the first pad and the second pad；
PTC sheet material between first pad and the second pad is removed；
The other side of the PTC sheet material is conductor layer, and the conductor layer covers first pad, the second pad and the first pad
With the gap area of the second pad；
The PTC sheet material is isotropic material, has positive temperature along thickness direction, wide direction and the length direction of the PTC sheet material
Spend coefficient resistance performance.
11. PTC device as claimed in claim 10, which is characterized in that the conductor of the other side of the PTC sheet material is provided with layer by layer
Strengthening course.
12. PTC device as claimed in claim 10, which is characterized in that the partial region of first pad and the second pad applies
It is furnished with green oil, the gap area between first pad and the second pad is filled with green oil.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201811048086.XA CN109192422B (en) | 2018-09-10 | 2018-09-10 | Manufacturing method of PTC device and PTC device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811048086.XA CN109192422B (en) | 2018-09-10 | 2018-09-10 | Manufacturing method of PTC device and PTC device |
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| CN109192422A true CN109192422A (en) | 2019-01-11 |
| CN109192422B CN109192422B (en) | 2024-08-02 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114999754A (en) * | 2021-03-01 | 2022-09-02 | 天芯互联科技有限公司 | Thermistor manufacturing method and thermistor |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20040046879A (en) * | 2002-11-28 | 2004-06-05 | 엘지전선 주식회사 | PTC thermistor having electrodes on the same surface and method thereof |
| CN101299362A (en) * | 2008-06-13 | 2008-11-05 | 上海神沃电子有限公司 | Surface labeling type polymer PTC overflow over-temperature protection element and method for manufacturing the same |
| CN101740188A (en) * | 2009-12-31 | 2010-06-16 | 上海长园维安电子线路保护股份有限公司 | Surface attaching type PTC (positive temperature coefficient) thermosensitive resistor and manufacture method thereof |
| CN207075118U (en) * | 2017-07-03 | 2018-03-06 | 瑞声科技(新加坡)有限公司 | Flexible PCB |
| CN208767092U (en) * | 2018-09-10 | 2019-04-19 | 深圳中科四合科技有限公司 | A kind of PTC device |
-
2018
- 2018-09-10 CN CN201811048086.XA patent/CN109192422B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20040046879A (en) * | 2002-11-28 | 2004-06-05 | 엘지전선 주식회사 | PTC thermistor having electrodes on the same surface and method thereof |
| CN101299362A (en) * | 2008-06-13 | 2008-11-05 | 上海神沃电子有限公司 | Surface labeling type polymer PTC overflow over-temperature protection element and method for manufacturing the same |
| CN101740188A (en) * | 2009-12-31 | 2010-06-16 | 上海长园维安电子线路保护股份有限公司 | Surface attaching type PTC (positive temperature coefficient) thermosensitive resistor and manufacture method thereof |
| CN207075118U (en) * | 2017-07-03 | 2018-03-06 | 瑞声科技(新加坡)有限公司 | Flexible PCB |
| CN208767092U (en) * | 2018-09-10 | 2019-04-19 | 深圳中科四合科技有限公司 | A kind of PTC device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114999754A (en) * | 2021-03-01 | 2022-09-02 | 天芯互联科技有限公司 | Thermistor manufacturing method and thermistor |
| CN114999754B (en) * | 2021-03-01 | 2023-06-02 | 天芯互联科技有限公司 | Manufacturing method of thermistor and thermistor |
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|---|---|
| CN109192422B (en) | 2024-08-02 |
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