CN208738181U - A kind of die grading mechanism - Google Patents

Abstract

The utility model relates to a kind of die grading mechanisms, including sorting frame, and the adhesive holder set on sorting frame side；Sorting is provided with through-hole；Through-hole is for the fixed wafer film for being pasted with chip；The side that sorting frame is distal to adhesive holder is equipped with sorting thimble；Adhesive holder is equipped with for attaching the empty film for being sorted chip；Wafer film is oppositely arranged with empty film, and opposite face is equipped with the adhered layer of fixed chip.It sorts thimble to reset chip onto empty film, chip can settle at one go, it is not easy to it drops off, puts neatly, avoid picking and placing and expect that suction nozzle scratches chip, it is easy to maintain.The utility model simplifies the internal structure of an organization, and reduces process flow, improves efficiency, and reduces production cost.

Description

A kind of die grading mechanism

Technical field

The utility model relates to LED production equipments, more specifically refer to a kind of die grading mechanism.

Background technique

Currently, die grading equipment when sorting chip, by the suction nozzle on swing arm fetching device, draws the core on diaphragm Piece, swing arm couple with servo motor, then the servo motor by carrying rotates 180 °, and chip is transferred to reset on sky film and is put It sets, completes the movement for picking classification, be as shown in Figure 1 original structure overall construction drawing.In the actual production process, suction nozzle is picked point The process of class, is easy to appear: (1) chip drops off in transfer process on suction nozzle；(2) when resetting onto empty film, occur Chip remains on suction nozzle, puts unsuccessfully；(3) when picking and placing material, suction nozzle or contact or the moment for being detached from chip scratch chip； (4) suction nozzle is prone to wear, and chip volume is small, and the suction nozzle of loss is expanded or reduced as stomata, adsorbs the reduced capability of chip, needs frequency Numerous replacement；(5) every replacement suction nozzle need to be aligned and be surveyed again high debugging to PP1 and PP2, and process is relatively complicated；(6) suction nozzle It need to periodically wipe dirty, be safeguarded.It is necessary to consider that a kind of new mode removes sorting chip.

Utility model content

The purpose of the utility model is to overcome the defects of the prior art, provide a kind of die grading mechanism.

To achieve the above object, the utility model uses following technical scheme:

A kind of die grading mechanism, including sorting frame, and the adhesive holder set on sorting frame side；The sorting is provided with logical Hole；It is bordering on the side installing retaining ring of adhesive holder on the through-hole, expands brilliant ring for fixed；The brilliant ring of the expansion is for expanding and fixing Wafer film to be sorted, wafer film can be described as disk, and it is die bond face, the back side is inviscid, and chip is fixed that disk front, which has viscosity, In disk die bond face；Disk die bond face is oppositely arranged with adhesive holder；The side that the sorting frame is distal to adhesive holder is equipped with top Needle cover, thimble lid center are equipped with sorting thimble；The adhesive holder is equipped with through-hole；The adhesive holder is for pasting empty film；The sky Film front toughness, is die bond face, and the back side is inviscid；The sky film die bond face is for attaching the chip being sorted；The sky film Die bond face is oppositely arranged with sorting frame；The sky film can be referred to as square piece after having attached the chip being sorted.

Its further technical solution are as follows: the retaining ring is equipped with notch, and notch two sides are consolidated with the both ends of the spring being equipped with respectively Fixed connection, so that retaining ring is clamped by spring force expands brilliant ring；The sorting frame is bordering on incision equipped with clamping block.

Its further technical solution are as follows: the sorting thimble is set in the thimble lid center being equipped with；The thimble lid is set There is the through-hole across sorting thimble.

Its further technical solution are as follows: the thimble lid and the vacuum generating device connection being equipped with；The thimble lid direction It sorts frame one end and is equipped with several equally distributed adsorption holes of annular, so that thimble lid adsorbs disk, sorting thimble is carried on the back from disk Face ejects chip.

Its further technical solution are as follows: the brilliant ring of the expansion includes outer ring and inner ring；The disk is fixed on inner ring and outer ring Between；The inner ring periphery is equipped with groove；The lug boss to match with groove is equipped on the inside of the outer ring；The brilliant ring outer ring of the expansion With inner ring clamping wafer centreless panel region；After the brilliant ring of the expansion expands disk, make the chip chamber on disk away from increase, and make to justify Piece tensioning；The brilliant ring of the expansion is selected according to disk size.

Its further technical solution are as follows: the adhesive holder is distal to sorting frame side and is equipped with apical axis；The apical axis and sorting are pushed up The corresponding setting of needle.

A kind of die grading method, including sorting process: disk to be sorted is fixed on sorting frame, and carrying is sorted core The empty film of piece is pasted on adhesive holder, and is oppositely arranged with disk；It is located at the thimble lid of sorting frame side and is located at adhesive holder one The apical axis of side moves toward one another, and thimble lid just touches disk or squeezes disk, and apical axis squeezes empty film, guarantee on disk currently to Sort region and the smooth no relaxation in region of chip to be lifted on empty film of chip；Thimble lid center is directed at the core being sorted Piece, apical axis and thimble lid are coaxial；Adjust the relative distance of disk and empty film；Thimble lid and vacuum generating device connection, pass through top Disk is sucked in adsorption hole in needle cover, then sorts thimble and moves towards die bottom surface, and chip is ejected and is removed with disk；Core Continue uniform motion forward after piece removing, chip is attached on sky film；Thimble lid and vacuum generating device disconnect, and sort thimble It retracts, completes the sorting movement of single chip；Thimble lid and apical axis are moved to the next chip being sorted, and recycle the above work Sequence sorts the chip on disk.

Its further technical solution are as follows: sorting process further include: sorting thimble is moved towards disk, and quickly pierces through circle Piece；When sorting thimble pierces through disk and touches chip bottom, adjustment sorting thimble is with uniform motion, until chip is attached to On empty film.

Its further technical solution are as follows: further include modeling process: before sorting chip, first passing through vision system and scan circle The each chip of on piece records the information such as physical coordinates, tilt angle and its corresponding mechanical coordinate of each of which chip, and generates Corresponding map；Wafer thickness and chip thickness size are measured by the detection piece being equipped with again, chip is adjusted according to test result At a distance from empty film, distance is between 0.05mm-0.2mm.

Its further technical solution are as follows: further include pour mask process: after sorting because of disk into square piece, the front of chip is attached to Square piece die bond face, and die bottom surface is upward；Pour mask is the bottom surface that chip in square piece is attached to the adhesive surface of a new empty film, is made Die bottom surface and new empty film bond, then by the film stripping of square piece, so that chip is transferred on new empty film, and make chip It just faces outwardly, process is simple and fast；After pour mask, then chip front side is detected.

Its further technical solution are as follows: the installation process of disk: the brilliant ring outer ring of the expansion and inner ring clamping wafer chipless Region；After the brilliant ring of the expansion expands disk, make the chip chamber on disk away from increase, and be tensioned disk；The brilliant ring root of the expansion It is selected according to disk size.

The beneficial effect of the utility model compared with prior art is: the utility model will be on disk by sorting thimble Chip is selected to square piece side, and existing swing arm fetching device is cancelled, and is cancelled suction nozzle absorption chip and is retransferred the side reset and placed Formula directly ejects chip using thimble, so that chip and disk are removed, while the mode of classification is completed in rearrangement to square piece.Point Thimble is selected to reset chip onto empty film, chip can settle at one go, it is not easy to drop off, put neatly, avoid picking and placing and expect that suction nozzle is scraped Hurt chip, it is easy to maintain.The utility model simplifies the internal structure of an organization, and reduces process flow, improves efficiency, and reduces production cost.

The utility model is further described in the following with reference to the drawings and specific embodiments.

Detailed description of the invention

Fig. 1 is the sorting mechanism of the prior art；

Fig. 2 is a kind of three-dimensional structure diagram of die grading mechanism of the utility model；

Fig. 3 is a kind of sorting frame three-dimensional structure diagram of die grading mechanism of the utility model；

Fig. 4 is a kind of front view of the thimble lid of die grading mechanism of the utility model；

Fig. 5 is a kind of operation schematic diagram of die grading mechanism of the utility model；

Fig. 6 is a kind of expansion crystalline substance ring exploded view of die grading mechanism of the utility model；

Fig. 7 is the expansion crystalline substance ring mid section figure and partial enlarged view of a kind of die grading mechanism of the utility model；

Fig. 8 is a kind of process flow chart of die grading method of the utility model；

Fig. 9 is a kind of structure chart of the retaining ring of die grading mechanism of the utility model.

Specific embodiment

In order to more fully understand the technology contents of the utility model, combined with specific embodiments below to the skill of the utility model Art scheme is further described and illustrates, but not limited to this.

Such as the drawing that Fig. 1 to Fig. 9 is the utility model embodiment.

A kind of die grading mechanism, as shown in Figure 2 and Figure 5, including sorting frame 10, and set on the viscous of sorting 10 side of frame Post rack 20.It sorts frame 10 and is equipped with through-hole 11, the side installing retaining ring 111 of adhesive holder 20 is bordering on through-hole 11, it is brilliant for fixed expansion Ring 15.Expand brilliant ring 15 for expanding and fixing wafer film to be sorted, wafer film can be described as disk 12；12 front of disk has viscous Property, it is die bond face, the back side is inviscid, and chip is fixed on disk die bond face；12 die bond face of disk is oppositely arranged with adhesive holder 20.Point The side for selecting frame 10 to be distal to adhesive holder 20 is equipped with thimble lid 14, and 14 center of thimble lid is equipped with sorting thimble 13.Adhesive holder 20 is equipped with Through-hole, adhesive holder is for pasting empty film 22.Empty 22 front toughness of film, is die bond face, and the back side is inviscid.It uses in empty 22 die bond face of film In the chip that attaching is sorted.Empty 22 die bond face of film is oppositely arranged with sorting frame 10.After empty film 22 has attached the chip being sorted It can be referred to as square piece.

Disk 12 is uniformly attached to several chips, and chip is attached on disk 12 and forms border circular areas.

Blowpit 112 is provided on through-hole 11, convenient for brilliant ring 15 will be expanded from through-hole loading and unloading material.In the present embodiment, discharging Slot 112 is the elongated hole of 11 two sides of through-hole.

As shown in Figure 4 and Figure 5, sorting thimble 13 is set in the thimble lid 14 being equipped with.Thimble lid 14 is equipped with across sorting The through-hole 141 of thimble 13.Through-hole 141 and sorting thimble 13 are coaxially disposed, and are sorted thimble 13 and passed through under the action of force piece Through-hole 141.

Thimble lid 14 and the vacuum generating device connection being equipped with.Thimble lid 14 is towards sorting 10 one end of frame equipped with several suctions Attached hole 142.In the assorting room of chip, disk 12 is ejected about 0-2mm of distance by thimble lid 14, guarantees current carrying chip The smooth no relaxation of 12 region area of disk.Preferably, disk 12 is ejected distance about 1mm by thimble lid 14.

Preferably, in order to which thimble lid 14 adsorbs uniformly disk 12, adsorption hole 142 is distributed in the periphery of through-hole 141.

As shown in figure 3, the edge of through-hole 11 is equipped with retaining ring 111.Disk 12 is fixed on the expansion crystalline substance ring 15 being equipped with.Expand brilliant Ring 15 is fixedly clamped in retaining ring 111.

As shown in Figure 6 and Figure 7, expanding brilliant ring 15 includes outer ring 151 and inner ring 152.Disk 12 is fixed on inner ring 152 and outer Between ring 151.

Wherein, 152 periphery of inner ring is equipped with groove 1521.The lug boss to match with groove 1521 is equipped on the inside of outer ring 151 1511.The outer rim of disk 12 is fixed between groove 1521 and lug boss 1511.

As shown in figure 9, retaining ring 111 is equipped with notch 113, and 113 two sides of notch are consolidated with 114 both ends of spring being equipped with respectively Fixed connection, so that retaining ring 111 expands brilliant ring 15 by the way that spring force is fixed, while convenient for expanding brilliant ring installation and removal；The sorting Frame 10, which is bordering at notch 113, is equipped with clamping block 115.Clamping block 115 is covered in the outside of notch 113, extends in through-hole 11, with Clamping is set to expand brilliant ring 15.

As shown in figure 5, adhesive holder 20, which is distal to sorting 10 side of frame, is equipped with apical axis 21.Apical axis 21 is corresponding with sorting thimble 13 Setting.After sorting thimble 13 ejects chip, the sorting continuation of thimble 13 is moved forward, and then chip is attached on sky film 22, In order to which chip bonds with empty film 22 stronger, sorting thimble 13 squeezes chip and sky film 22.In order to be sorted chip not Thimble 13 damages by pressure, sorts thimble 13 and 21 end of apical axis is equipped with buffer unit, to protect chip.

Preferably, the tip diameter for sorting thimble 13 is 15-25 μm.

It wherein, as indicated with 2, further include apart from detection piece 30.Detection piece 30 for detect sorting frame 10 and adhesive holder 20 it Between distance.Chip on disk 12 cannot be too close or too far at a distance from empty film 22, needs to keep suitable distance that can just have Effect by die grading to empty film 22, distance is 0.05mm-0.2mm.

Wherein, empty film 22 is equipped with adhered layer towards sorting 10 one side of frame, and adhered layer is greater than disk to the viscous force of chip 12 viscous force to chip.

During die grading, the problematic chip of quality of 12 side of disk can be selected to empty film 22, High-quality chip can also be selected to empty film 22.Equally, the chip of same class can also be selected to empty film 22, Divide good class, is easy to use.

A kind of die grading method, including sorting process: disk 12 to be sorted is fixed on sorting frame 10, carries quilt The empty film 22 of sorting chip is pasted on adhesive holder 20, and is oppositely arranged with disk 12；It is located at the thimble lid of sorting 10 side of frame 14 move toward one another with the apical axis 21 for being located at 20 side of adhesive holder, and thimble lid 14 just touches disk 12 or squeezes disk 12, just Disk 12 is sucked in thimble lid 14, guarantees the currently smooth no relaxation in region of chip to be sorted on disk 12, convenient for determining for chip Position and removing；Apical axis 21 also squeezes empty film 22 and is tensioned, and guarantees the smooth no relaxation in region of chip to be lifted on empty film 22, is convenient for The attaching and guarantee positioning accuracy of chip.14 center of thimble lid is directed at the chip being sorted, and apical axis 21 and thimble lid 14 are coaxial；It adjusts The relative distance of chip and empty film 22 on full circle piece 12, distance is 0.05mm-0.2mm.Thimble lid 14 is filled with vacuum Connection is set, disk 12 is sucked by the adsorption hole 142 on thimble lid 14, is fixed, prevents from shifting, then sorts 13 court of thimble It moves to die bottom surface, chip is ejected and is removed with disk 12；Continue uniform motion forward after chip removing, in sorting thimble 13, under the action of apical axis 21, chip are attached on the die bond face of sky film 22；Thimble lid 14 and vacuum generating device disconnect, point It selects thimble 13 to retract, completes the sorting movement of single chip；Thimble lid 14 and apical axis 21 are moved to the next chip being sorted, The above process is recycled, the chip on disk is sorted.

Specifically, for the ease of adjusting the position of disk 12 and square piece 22, adhesive holder 20 is arranged to live with sorting frame 10 Dynamic form.Wherein, sorting frame 10 can move on X, Y, and adhesive holder 20 can be to move on X, Y, Z, rotate, so that adjustment is justified The position of piece 12 and empty film 22.

Specifically, thimble lid 14 touches the trailing flank of disk 12 in chip sorting procedures, apical axis 21 touches sky film 22 trailing flank, and the empty about 1mm of film 22 is ejected, guarantee the smooth no relaxation of 12 region area of disk of current carrying chip.Sorting Frame 10 moves under the action of force piece, and the chip center chosen is aligned to the center of sorting thimble 13 and thimble lid 14, meanwhile, It is adjusted under the action of corresponding adhesive holder 20 is in another force piece, the coordinate points of the empty film 22 carried in advance are moved on to and sorts top The concentric position of needle 13.Then, vacuum sending device is opened, and circle is uniformly sucked by the stomata of the annular spread on thimble lid 14 Piece 12, the sorting jack-up moment of thimble 13 pierced disk 12, and sorting 13 impact force of thimble greatly reduces after piercing through disk 12, and adjusts Whole 13 speed of sorting thimble is with uniform motion.Thimble moves forward, and touches die bottom surface, and chip stress is ejected, stripping From disk 12.Meanwhile chip front side touches 22 die bond upper surface of sky film, empty 22 die bond mask toughness of film, chip is touched. It being returned in thimble lid 14 after sorting thimble 13, closes the vacuum of thimble lid, force piece drives sorting frame 10 to be moved to next, Another force piece drives adhesive holder 20 to be moved to next die bond position, completes the sorting movement of single chip, recycles with upstream Journey sorts the chip on wafer.

Sort process further include: sorting thimble 13 is moved towards disk 12, and quickly pierces through disk 12；Thimble 13 is sorted to pierce When wearing disk 12 and touching chip bottom, 13 uniform motion of thimble is sorted, until chip is attached on sky film 22.

Method for separating further includes modeling process: before sorting chip, first passing through vision system and scans on disk 12 each Chip records the information such as physical coordinates, tilt angle and its corresponding mechanical coordinate of each of which chip, and generates corresponding figure Spectrum；12 thickness of disk and chip thickness size are measured by the detection piece being equipped with again, chip and empty film are adjusted according to test result 22 distance, distance is between 0.05mm-0.2mm.

It is impacted to avoid chip from being sorted thimble 13 and push up to 21 moment of apical axis at 20 end of adhesive holder, sorts 13 He of thimble Apical axis 21 increases flexible buffer device.

Method for separating further includes pour mask process: after sorting because of disk 12 into square piece, the front of chip is attached to square piece die bond Face, and die bottom surface is upward；Pour mask is the bottom surface that chip in square piece is attached to the adhesive surface of a new empty film, makes die bottom surface It is bonded with new empty film, then by the film stripping of square piece, so that chip is transferred on new empty film, and makes just facing for chip Outside, process is simple and fast；After pour mask, then chip front side is detected.

More specifically, it as shown in figure 8, sorting mechanism is applied on sorting machine, (is needed point according to requiring to establish Bin table That class chip is selected, can be that quality is defective or quality is intact, is also possible to a certain class), it is tested further according to test machine As a result, then automatic stepping, generates Bin archives and mapping figure such as photoelectric properties parameter.After the data preparation of early period, Disk (the i.e. disk 12) expansion of chip will be carried, so that disk 12 is tensioned, it is then solid by expanding brilliant ring (expanding brilliant ring 15) It is scheduled on sorting frame 10, square piece is that empty film 22 is fixed on attaching frame 20.Frame 10 will be sorted and attaching frame 20 is put into the material lock of board, Conveying loader mechanism takes sorting frame 10 automatically, attaches frame 20, and surface sweeping bar code, and the information is sent and stored in sorting machine Central control system, then sorting machine automatic charging.Scanning system is scanned disk, is distributed in conjunction with dividing Bin archives to generate Figure, and generate mapping figure.Detection piece is to information such as the thickness of measurement disk, the thickness of crystal grain, and then setting sorts 10 end of frame With the distance for attaching 20 end of frame.Confirm the conjunction figure of the mapping figure of sorting machine scanning mapping and test machine scanning as a result, control System control sorting thimble 13 processed picks sorting chip automatically, and generates data and deposit the gear current end the Bin gear information of automatic printing The chip stepping of label, this batch finishes.Square piece, the quality of detection chip, by the core in this square piece are removed on attaching frame 20 The bottom surface of piece is attached in addition a piece of empty film, completes pour mask, and the release paper for protection is sticked in the front of chip after pour mask, Further according to bar code, square piece is labelled, last human eye detection, completes sorting work.

Wherein it is possible to which the chip stepping on disk is picked out, that then classifies is attached in square piece.

In other embodiments, in addition to the above-mentioned chip that quality on disk is intact is selected in square piece (referred to as Just choose), the substandard products chip on disk can also be selected into square piece (referred to as counter to choose).It is counter choose it is identical with the process just chosen, Do not make burden herein.

In conclusion the utility model is selected the chip on disk to square piece side by sorting thimble, cancel existing Swing arm fetching device, cancel suction nozzle absorption chip retransfer reset place mode, chip is directly ejected using thimble so that Chip and disk are removed, while the mode of classification is completed in rearrangement to square piece.It sorts thimble to reset chip onto empty film, chip It can settle at one go, it is not easy to it drops off, puts neatly, avoid picking and placing material suction nozzle scratch chip, it is easy to maintain.The utility model simplifies Mechanism reduces process flow, improves efficiency, and reduces production cost.

The above-mentioned technology contents that the utility model is only further illustrated with embodiment, in order to which reader is easier to understand, But the embodiments of the present invention is not represented is only limitted to this, any technology done according to the utility model extends or recreation, By the protection of the utility model.The protection scope of the utility model is subject to claims.

Claims (10)

1. a kind of die grading mechanism, including sorting frame, and the adhesive holder set on sorting frame side；It is characterized in that, described point Choosing is provided with through-hole；The through-hole is for the fixed wafer film for being pasted with chip；The side that the sorting frame is distal to adhesive holder is set There is sorting thimble；The adhesive holder is equipped with for attaching the empty film for being sorted chip；The wafer film is oppositely arranged with empty film, and Opposite face is equipped with the adhered layer of fixed chip.

2. a kind of die grading mechanism according to claim 1, which is characterized in that the sorting thimble, which is set to, to be equipped with In thimble lid center；The thimble is covered with the through-hole across sorting thimble.

3. a kind of die grading mechanism according to claim 2, which is characterized in that the thimble lid is sent out with the vacuum being equipped with Generating apparatus connection；The thimble lid is equipped with several equally distributed adsorption holes of annular towards sorting frame one end, so that thimble lid Wafer film is adsorbed, sorting thimble ejects chip from wafer back of the membrane.

4. a kind of die grading mechanism according to claim 3, which is characterized in that the adsorption hole is distributed in the outer of through-hole Week.

5. a kind of die grading mechanism according to claim 1, which is characterized in that the edge of the through-hole is equipped with button Ring；The wafer film is fixed on the expansion crystalline substance ring being equipped with；The brilliant ring of the expansion is fixedly clamped in retaining ring.

6. a kind of die grading mechanism according to claim 5, which is characterized in that the retaining ring is equipped with notch, and notch Two sides are fixedly connected with the both ends of the spring being equipped with respectively, so that retaining ring expands brilliant ring by the way that spring force is fixed；The sorting frame is close Clamping block is equipped in incision.

7. a kind of die grading mechanism stated according to claim 1, which is characterized in that the through-hole two sides are provided with for unloading Expand the blowpit of brilliant ring.

8. a kind of die grading mechanism according to claim 1, which is characterized in that the adhesive holder is distal to sorting frame side Equipped with apical axis；Apical axis setting corresponding with sorting thimble.

9. a kind of die grading mechanism according to claim 1, which is characterized in that it is described sorting thimble tip diameter be 15-25μm。

10. a kind of die grading mechanism according to claim 1, which is characterized in that further include apart from detection piece；The inspection Part is surveyed for detecting sorting the distance between frame and adhesive holder.