CN208708055U - Supporting structure, radiating subassembly and electronic equipment using the supporting structure - Google Patents
Supporting structure, radiating subassembly and electronic equipment using the supporting structure Download PDFInfo
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- CN208708055U CN208708055U CN201821150502.2U CN201821150502U CN208708055U CN 208708055 U CN208708055 U CN 208708055U CN 201821150502 U CN201821150502 U CN 201821150502U CN 208708055 U CN208708055 U CN 208708055U
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- heat
- supporting structure
- cooling stand
- fin
- cooling
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
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- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a kind of supporting structure, using the radiating subassembly and electronic equipment of the supporting structure, for installing in the housing of the electronics device, comprising: cooling stand, the cooling stand is for installing euthermic chip；Cooling fin, the cooling fin are coated on the euthermic chip and the cooling stand；And at least one heat transfer fin, one end of the heat transfer fin is set on the cooling stand, the other end extends outward and the preset heat release hole on the close shell.It radiates compared to traditional heat loss through convection mode and fan air blast, the heat-transfer effect of above-mentioned heat transfer structure is good, and more preferably, without expending additional energy, use cost is low, and compact overall structure for heat distribution performance, occupies little space.
Description
Technical field
The utility model relates to product technical field of heat dissipation, more particularly to a kind of supporting structure, using the supporting structure
Radiating subassembly and electronic equipment.
Background technique
Currently, a part display equipment, such as intelligent education machine, all-in-one machine etc. usually need on the market in order to realize video capability
Camera is additionally installed, camera is fixed by the bracket in the surface frame of equipment.Camera can generate after working long hours
A large amount of heat is collected inside head shell, endangers the service life and safety of electronic component.Existing common heat dissipation
Mode is that the corresponding heat release hole that opens up carries out heat dissipation by convection type or installs inside the housing on the forward and backward shell of camera
Fan carries out air blast heat dissipation.However the heat dissipation effect of heat loss through convection mode depends on the quantity and size of heat release hole, thus radiate
It is ineffective, and install fan and radiated and not only will increase the overall volume of camera, while energy consumption is high.
Summary of the invention
Based on this, the utility model it is necessary to provide a kind of supporting structure, using the radiating subassembly and electricity of the supporting structure
Sub- equipment has good heat dissipation effect, and volume compact.
Its technical solution is as follows:
A kind of supporting structure, comprising:
Cooling stand, the cooling stand is for installing euthermic chip；
Cooling fin, the cooling fin are coated on the euthermic chip and the cooling stand；And
At least one heat transfer fin, one end of the heat transfer fin is set on the cooling stand, the other end is to extension
It opens up and is used for close to preset heat release hole on shell.
When using above-mentioned supporting structure in electronic equipment, euthermic chip is attached to cooling stand with back side direction first
Upper realization installation is fixed, and cooling fin is coated on the front and cooling stand of euthermic chip later, is set to heat dissipation branch at this time
Heat release hole of the free end of at least one heat transfer fin on frame on shell.As a result, when electronic device works make to generate heat
When chip generates amount of heat, since the back side heat transfer coefficient of euthermic chip is poor, so that most heats can pass through
Front is transmitted on cooling fin, transfers heat to cooling stand by cooling fin again later, eventually by heat transfer fin by heat
It is distributed by heat release hole into the external environment of shell.It radiates compared to traditional heat loss through convection mode and fan air blast, it is above-mentioned
The heat-transfer effect of heat transfer structure is good, and more preferably, without expending additional energy, use cost is low for heat distribution performance, and whole knot
Structure is compact, occupies little space.
The technical solution of the application is further described below:
Further, the cooling fin includes convergence part, the first sticking part for being connected to the convergence part side and connection
In the convergence part other side and with spaced second sticking part of first sticking part, the euthermic chip and it is described dissipate
Hot bracket is connected between first sticking part and second sticking part.
Further, the cooling stand is equipped with containing groove, and the euthermic chip is embedded in the containing groove.
It further, further include at least one first locking member, the cooling stand offers at least one first assembly
Hole, the euthermic chip offer at least one second pilot hole opposite with first pilot hole, first locking member
It wears and is fixed in first pilot hole and second pilot hole.
Further, limit card convex, the limit card convex and institute are provided on at least side cell wall of the containing groove
State euthermic chip abutting.
Further, including multiple heat transfer fins, multiple heat transfer fin separations are set to the cooling stand
It goes up and all extends to close to the heat release hole.
Further, the heat transfer fin is arcuate structure, wavy shaped configuration or detour type structure.
Further, the cooling stand is additionally provided with mounting plate, and the assembly of at least one third is offered on the mounting plate
Hole, the third pilot hole are used for and the preset hole immovable fitting on the shell.
The application also provides a kind of radiating subassembly, for install in the housing of the electronics device comprising euthermic chip and
Supporting structure as described above, the euthermic chip are installed on the supporting structure.When electronic device works make heat generating core
When piece generates amount of heat, since the back side heat transfer coefficient of euthermic chip is poor, so that most heats can be by just
Face is transmitted on cooling fin, transfers heat to cooling stand by cooling fin again later, leads to heat eventually by heat transfer fin
Heat release hole is crossed to distribute to the outside of shell.It radiates compared to traditional heat loss through convection mode and fan air blast, above-mentioned heat transfer structure
Heat-transfer effect it is good, more preferably, without expending additional energy, use cost is low, and compact overall structure for heat distribution performance, accounts for
It is small with space.
The application also provides a kind of electronic equipment comprising front housing, rear shell and radiating subassembly as described above, the front housing
And/or heat release hole is offered in the rear shell, the radiating subassembly, which is set to after the front housing and the rear shell split, to be formed
In cavity.
When using above-mentioned radiating subassembly in electronic equipment, euthermic chip is attached to cooling stand with back side direction first
Upper realization installation is fixed, and cooling fin is coated on the front and cooling stand of euthermic chip later, is set to heat dissipation branch at this time
Heat release hole of the free end of at least one heat transfer fin on frame on shell.As a result, when electronic device works make to generate heat
When chip generates amount of heat, since the back side heat transfer coefficient of euthermic chip is poor, so that most heats can pass through
Front is transmitted on cooling fin, transfers heat to cooling stand by cooling fin again later, eventually by heat transfer fin by heat
It is distributed by heat release hole to the outside of shell.It radiates compared to traditional heat loss through convection mode and fan air blast, above-mentioned heat transfer knot
The heat-transfer effect of structure is good, and more preferably, without expending additional energy, use cost is low, and compact overall structure for heat distribution performance,
It occupies little space.
Detailed description of the invention
Fig. 1 is the assembling structure schematic diagram of radiating subassembly described in the utility model embodiment；
Fig. 2 is the configuration schematic diagram of electronic equipment described in the utility model embodiment.
Description of symbols:
10, radiating subassembly, 100, euthermic chip, 200, cooling stand, 210, containing groove, 212, limit card convex, 220,
Mounting plate, 300, cooling fin, 310, convergence part, the 320, first sticking part, the 330, second sticking part, 400, heat transfer fin, 500,
Front housing, 600, rear shell, 700, heat release hole.
Specific embodiment
It is below in conjunction with attached drawing and specifically real for the purpose of this utility model, technical solution and advantage is more clearly understood
Mode is applied, the utility model is described in further detail.It should be understood that the specific embodiments described herein
Only to explain the utility model, the protection scope of the utility model is not limited.
It should be noted that when element is referred to as " being fixedly arranged on ", " being set to " or " install in " another element, it can be with
Directly on the other element or there may also be elements placed in the middle.When an element is considered as " connection " another yuan
Part, it can be directly to another element or may be simultaneously present centering elements；One element and another element
The concrete mode being fixedly connected can be achieved by the prior art, and details are not described herein, it is preferred to use the fixation side of threaded connection
Formula.
Unless otherwise defined, all technical and scientific terms used herein and belong to technical field of the invention
The normally understood meaning of technical staff is identical.Term as used herein in the specification of the present invention is intended merely to description tool
The purpose of the embodiment of body, it is not intended that in the limitation present invention.Term " and or " used herein includes one or more
Any and all combinations of relevant listed item.
" first " described in the utility model, " second " do not represent specific quantity and sequence, are only used for title
It distinguishes.
As depicted in figs. 1 and 2, a kind of radiating subassembly 10 of the embodiment shown for the application, sets for being installed in electronics
In standby shell, electronic equipment can be camera, monitor etc., be illustrated by taking camera as an example below.The radiating subassembly
10 include a supporting structure, and the supporting structure applied to camera includes: cooling stand 200, cooling fin 300 and at least one biography
Hot fin 400.
Wherein, the cooling stand 200 is for installing the euthermic chip 100；The cooling fin 300 is coated on the hair
On hot chip 100 and the cooling stand 200；One end of the heat transfer fin 400 is set on the cooling stand 200, is another
Extend outward and for close to preset heat release hole 700 on shell in one end.
Specifically, euthermic chip 100 is camera pcb board, camera body dress directly can be associated in camera pcb board
On, related work is executed for controling camera body, when work can generate amount of heat, and cooling stand 200 is used as heat generating core
The installation carrier of piece 100, and undertake transmitting sub-fraction heat responsibility, cooling fin 300 by with euthermic chip 100 and heat dissipation
Bracket 200 contacts, and plays main heat transfer role, and the last one medium of fin 400 then as heat dissipation that conducts heat, and heat is discharged
Hull outside.
When using above-mentioned radiating subassembly 10 in electronic equipment, euthermic chip 100 is attached to back side direction first scattered
It realizes that installation is fixed on hot bracket 200, cooling fin 300 is coated on to front and the cooling stand 200 of euthermic chip 100 later
On, it is set to heat release hole of the free end of at least one heat transfer fin 400 on cooling stand 200 on shell at this time
700.As a result, when electronic device works make euthermic chip 100 generate amount of heat, since the back side of euthermic chip 100 passes
Hot coefficient is poor, so that most heats can be transmitted on cooling fin 300 by front, later again by cooling fin 300
Cooling stand 200 is transferred heat to, distributes heat to outside shell by heat release hole 700 eventually by heat transfer fin 400
In portion's environment.It radiates compared to traditional heat loss through convection mode and fan air blast, the heat-transfer effect of above-mentioned heat transfer structure is good, heat
More preferably, without expending additional energy, use cost is low, and compact overall structure for distribution performance, occupies little space.
Please continue to refer to Fig. 1 and Fig. 2, in an alternative embodiment, the cooling fin 300 includes convergence part 310, connection
In 310 side of convergence part the first sticking part 320 and be connected to 310 other side of convergence part and with it is described first patch
Spaced second sticking part 330 in conjunction portion 320, the euthermic chip 100 and the cooling stand 200 are connected to described
Between one sticking part 320 and second sticking part 330.In this way, euthermic chip 100 and cooling stand 200 can be reliable clamping
Good heat transfer is realized between the first sticking part 320 and the second sticking part 330, and then through convergence part 310, it is ensured that heat
It passes out in time, and above-mentioned dress connection structure is simple, is convenient to mount and dismount.
Further, the material of the cooling fin 300 is graphite, copper, aluminium, aluminium alloy, silver, tungsten or magnesium.Specifically, this reality
Applying cooling fin 300 in example is graphite flake, has heat transfer coefficient height, the good advantage of thermal conduction effect, and durable, service life
It is long；In addition, graphite flake is preferably U-shaped component, when installation, can be directly fastened on euthermic chip 100 and cooling stand 200, dress connection
Mode is simple.Certainly, cooling fin is also possible to the combination of above-mentioned any two kinds or more substances.
In addition, cooling stand 200 it is optional be the materials such as aluminium alloy, copper, aluminium plate；Specific in the present embodiment, radiate
Bracket 200 is aluminum plate, by die casting or punch forming, structural strength with higher and good heat transfer property.
As shown in Figure 1, further, the cooling stand 200 is equipped with containing groove 210, the euthermic chip 100 is embedded
In in the containing groove 210.Thus euthermic chip 100, which can be nested in containing groove 210, realizes that installation is fixed, dress connection
Mode is simple.It should be noted that the groove width of containing groove 210 should be adapted to the width of euthermic chip 100, thus pass through slot
Fixation can be realized in the clamping of wall, and without causing excessive compression to lead to it euthermic chip 100, deformation occurs.
Further, limit card convex 212, the limit are provided on at least side cell wall of the containing groove 210
Card convex 212 is abutted with the euthermic chip 100.In this way, while ensuring that euthermic chip 100 consolidates installation, additionally it is possible to reduce
With the contact area of cell wall, reduces frictional force when easy to disassemble and be easier to take out.
It further, further include at least one first locking member (not shown), the cooling stand 200 opens up
There is at least one first pilot hole, the euthermic chip 100 offers at least one opposite with first pilot hole second
Pilot hole, first locking member, which is worn, to be fixed in first pilot hole and second pilot hole 700.By so setting
It sets, can further improve the bonding strength and fastness of euthermic chip 100 Yu cooling stand 200.Optionally, the first locking member
For bolt, the first pilot hole and the second pilot hole are threaded hole, are fixed by the realization installation that is spirally connected of bolt and threaded hole.When
So, in other embodiments, it can also be realized and be installed by fixed forms such as buckle, wedging, riveting, bondings.
Based on any of the above embodiments, including multiple heat transfer fins 400, multiple heat transfer fins 400
It is arranged at intervals on the cooling stand 200 and all extends to close to the heat release hole 700.In this way, heat can be by multiple
Heat transfer fin 400 is discharged by heat release hole 700 simultaneously, improving heat radiation efficiency and effect, it is ensured that each electronic component is in safety
In working environment.
Further, the heat transfer fin 400 is arcuate structure, wavy shaped configuration or detour type structure.In this way, not only may be used
It, while can also be according to different installation hull shapes and radiating requirements, flexibly with by increasing surface area come improving heat radiation efficiency
The heat transfer fin 400 of suitable shape is selected, guarantees heat dissipation.
In another alternative embodiment, the cooling stand 200 is additionally provided with mounting plate 220, opens on the mounting plate 220
Equipped at least one third pilot hole, the third pilot hole is used for and the preset hole immovable fitting on the shell.In this way, the
Three pilot holes can be adapted to threaded hole preset on shell, and then realize that installation is fixed by locking members such as screw, bolts.
Please continue to refer to Fig. 1, the application also provides a kind of radiating subassembly 10, for installing in the housing of the electronics device,
It includes euthermic chip 100 and supporting structure as described above, and the euthermic chip 100 is installed on the supporting structure.When
Electronic device works and make euthermic chip 100 generate amount of heat when, since the back side heat transfer coefficient of euthermic chip 100 is poor,
So that most heats can be transmitted on cooling fin 300 by front, transferred heat to again by cooling fin 300 later
Cooling stand 200 is distributed heat to the outside of shell by heat release hole 700 eventually by heat transfer fin 400.Compared to tradition
Heat loss through convection mode and fan air blast heat dissipation, the heat-transfer effect of above-mentioned heat transfer structure is good, heat distribution performance more preferably, without consumption
Take additional energy, use cost is low, and compact overall structure, occupies little space.
Please continue to refer to Fig. 2, the application also provides a kind of electronic equipment comprising front housing 500, rear shell 600 and institute as above
The radiating subassembly 10 stated offers heat release hole 700 on the front housing 500 and/or the rear shell 600, and the radiating subassembly 10 is set
The front housing 500 is placed in be formed in hollow cavity with after 600 split of rear shell.
When using above-mentioned radiating subassembly 10 in electronic equipment, euthermic chip 100 is attached to back side direction first scattered
It realizes that installation is fixed on hot bracket 200, cooling fin 300 is coated on to front and the cooling stand 200 of euthermic chip 100 later
On, it is set to heat release hole of the free end of at least one heat transfer fin 400 on cooling stand 200 on shell at this time
700.As a result, when electronic device works make euthermic chip 100 generate amount of heat, since the back side of euthermic chip 100 passes
Hot coefficient is poor, so that most heats can be transmitted on cooling fin 300 by front, later again by cooling fin 300
Cooling stand 200 is transferred heat to, distributes heat to outside shell by heat release hole 700 eventually by heat transfer fin 400
Portion.It radiates compared to traditional heat loss through convection mode and fan air blast, the heat-transfer effect of above-mentioned heat transfer structure is good, and heat is sporadic
Can more preferably, without expending additional energy, use cost is low, and compact overall structure, occupies little space.
Each technical characteristic of embodiment described above can be combined arbitrarily, for simplicity of description, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, all should be considered as described in this specification.
Above-described embodiments merely represent several embodiments of the utility model, the description thereof is more specific and detailed,
But it cannot be understood as the limitations to utility model patent range.It should be pointed out that for the common skill of this field
For art personnel, without departing from the concept of the premise utility, various modifications and improvements can be made, these are belonged to
The protection scope of the utility model.Therefore, the scope of protection shall be subject to the appended claims for the utility model patent.
Claims (10)
1. a kind of supporting structure characterized by comprising
Cooling stand, the cooling stand is for installing euthermic chip；
Cooling fin, the cooling fin are coated on the euthermic chip and the cooling stand；And
At least one heat transfer fin, one end of the heat transfer fin is set on the cooling stand, the other end extends simultaneously outward
For close to preset heat release hole on shell.
2. supporting structure according to claim 1, which is characterized in that the cooling fin include convergence part, be connected to it is described
First sticking part of convergence part side and be connected to the convergence part other side and with first sticking part spaced
Two sticking parts, the euthermic chip and the cooling stand are connected between first sticking part and second sticking part.
3. supporting structure according to claim 1, which is characterized in that the cooling stand is equipped with containing groove, the hair
Hot chip is embedded in the containing groove.
4. supporting structure according to claim 3, which is characterized in that it further include at least one first locking member, it is described to dissipate
Hot bracket offers at least one first pilot hole, and the euthermic chip offers at least one opposite with first pilot hole
A second pilot hole, first locking member, which is worn, to be fixed in first pilot hole and second pilot hole.
5. supporting structure according to claim 3, which is characterized in that be arranged on at least side cell wall of the containing groove
There is limit card convex, the limit card convex is abutted with the euthermic chip.
6. supporting structure according to claim 1, which is characterized in that including multiple heat transfer fins, multiple biographies
Hot fin separation is set on the cooling stand and all extends to close to the heat release hole.
7. supporting structure according to claim 6, which is characterized in that the heat transfer fin is arcuate structure, waveform knot
Structure or detour type structure.
8. supporting structure according to claim 1, which is characterized in that the cooling stand is additionally provided with mounting plate, the peace
At least one third pilot hole is offered in loading board, the third pilot hole is used to match with the preset hole fastening on the shell
It closes.
9. a kind of radiating subassembly, for installing in the housing of the electronics device, which is characterized in that including euthermic chip and as above-mentioned
The described in any item supporting structures of claim 1 to 8, the euthermic chip are installed on the supporting structure.
10. a kind of electronic equipment, which is characterized in that including front housing, rear shell and such as above-mentioned radiating subassembly as claimed in claim 9,
Heat release hole is offered on the front housing and/or the rear shell, the radiating subassembly is set to the front housing and the rear shell split
It is formed in hollow cavity afterwards.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821150502.2U CN208708055U (en) | 2018-07-19 | 2018-07-19 | Supporting structure, radiating subassembly and electronic equipment using the supporting structure |
| PCT/CN2018/118639 WO2020015273A1 (en) | 2018-07-19 | 2018-11-30 | Support structure, heat dissipation assembly using support structure, and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821150502.2U CN208708055U (en) | 2018-07-19 | 2018-07-19 | Supporting structure, radiating subassembly and electronic equipment using the supporting structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208708055U true CN208708055U (en) | 2019-04-05 |
Family
ID=65938740
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821150502.2U Active CN208708055U (en) | 2018-07-19 | 2018-07-19 | Supporting structure, radiating subassembly and electronic equipment using the supporting structure |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN208708055U (en) |
| WO (1) | WO2020015273A1 (en) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005228954A (en) * | 2004-02-13 | 2005-08-25 | Fujitsu Ltd | Heat conduction mechanism, heat dissipation system, and communication apparatus |
| TWM361047U (en) * | 2009-01-08 | 2009-07-11 | Acbel Polytech Inc | Thin type electronic device |
| CN102307453A (en) * | 2011-08-31 | 2012-01-04 | 昆山锦泰电子器材有限公司 | U-shaped bent cooling fin |
| CN204141542U (en) * | 2014-09-15 | 2015-02-04 | 杭州超视科技有限公司 | For the radiator structure of monitoring equipment auxiliary lighting apparatus |
| CN206018829U (en) * | 2016-08-31 | 2017-03-15 | 芜湖美智空调设备有限公司 | Shooting head cartridge and indoor apparatus of air conditioner |
-
2018
- 2018-07-19 CN CN201821150502.2U patent/CN208708055U/en active Active
- 2018-11-30 WO PCT/CN2018/118639 patent/WO2020015273A1/en active Application Filing
Also Published As
| Publication number | Publication date |
|---|---|
| WO2020015273A1 (en) | 2020-01-23 |
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