CN209690631U - Radiator structure and VR equipment - Google Patents
Radiator structure and VR equipment Download PDFInfo
- Publication number
- CN209690631U CN209690631U CN201920548618.XU CN201920548618U CN209690631U CN 209690631 U CN209690631 U CN 209690631U CN 201920548618 U CN201920548618 U CN 201920548618U CN 209690631 U CN209690631 U CN 209690631U
- Authority
- CN
- China
- Prior art keywords
- mainboard
- heat sink
- radiator structure
- stepped screw
- screw
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 229910002804 graphite Inorganic materials 0.000 claims description 4
- 239000010439 graphite Substances 0.000 claims description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- 239000005030 aluminium foil Substances 0.000 claims description 3
- 239000011889 copper foil Substances 0.000 claims description 3
- AHADSRNLHOHMQK-UHFFFAOYSA-N methylidenecopper Chemical compound [Cu].[C] AHADSRNLHOHMQK-UHFFFAOYSA-N 0.000 claims description 3
- 239000002105 nanoparticle Substances 0.000 claims description 3
- 238000005452 bending Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 206010020843 Hyperthermia Diseases 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000036031 hyperthermia Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000000191 radiation effect Effects 0.000 description 2
- PZZOEXPDTYIBPI-UHFFFAOYSA-N 2-[[2-(4-hydroxyphenyl)ethylamino]methyl]-3,4-dihydro-2H-naphthalen-1-one Chemical compound C1=CC(O)=CC=C1CCNCC1C(=O)C2=CC=CC=C2CC1 PZZOEXPDTYIBPI-UHFFFAOYSA-N 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 230000003190 augmentative effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a kind of radiator structure and VR equipment, belong to technical field of electronic equipment, radiator structure includes heat sink and the screw for the heat sink to be fixed on to mainboard, the screw is stepped screw, elastic component is clamped between the head of the stepped screw and the plane of the mainboard, the mainboard is provided with the through-hole for passing through for the stepped screw, the diameter that the stepped screw is located at the through hole is less than the diameter of the through-hole, and the step surface of the stepped screw acts against on the heat sink；VR equipment includes host, the host includes upper cover and lower cover, mainboard bracket is installed between the upper cover and the lower cover, mainboard is installed on the mainboard bracket, the mainboard is connected with above-mentioned radiator structure, the design can avoid the difference of mainboard and heat sink thermal expansion coefficient and caused by influence of crust deformation mainboard performance, guarantee the normal display of image, extend the service life of equipment.
Description
Technical field
The utility model belongs to technical field of electronic equipment, and in particular to a kind of radiator structure and VR equipment.
Background technique
With the continuous development of virtual reality and augmented reality, in order to improve the experience of terminal user, helmet
The processing capacity of some key modules of mainboard is more and more stronger, while the calorific value of chip is also increasing, so heat dissipation problem
Just at very important link.
In order to which quickly the heat of chip sheds, heat sink can be used in some projects, by mainboard and dissipated with screw
Hot plate locks together, can achieve the purpose of rapid cooling in this way.
But there are also drawback, when main board work for a period of time, the temperature of chip increases quickly, and mainboard and heat sink also can
Temperature increases；But since mainboard is different with the material of heat sink, thermal expansion coefficient difference is very big, the two parts are tightly locked one
It rises, mainboard can be deformed by heat sink stretch bending, and the chip on mainboard also can cause the miopragia of device with deformation.Some figures
As the component of processing, because of the deformation of chip, the severity that image can also distort will cause component function on mainboard when serious
Failure.
Utility model content
The technical problem to be solved by the utility model is to provide a kind of radiator structure and VR equipment, can avoid mainboard and
The difference of heat sink thermal expansion coefficient and caused by influence of crust deformation mainboard performance, guarantee the normal display of image, extend equipment
Service life.
In order to solve the above technical problems, the technical solution of the utility model is:
Radiator structure, the screw including heat sink and for the heat sink to be fixed on to mainboard, the screw are step
Screw, is clamped with elastic component between the head of the stepped screw and the plane of the mainboard, the mainboard is provided with for supplying
The through-hole that the stepped screw passes through, the diameter that the stepped screw is located at the through hole are less than the diameter of the through-hole, institute
The step surface for stating stepped screw acts against on the heat sink.
Further, the elastic component is O-ring.
Further, the O-ring is rubber ring.
Further, the O-ring is silica gel ring.
Further, the tail portion of the stepped screw pass through after the elastic component and the mainboard with the heat sink screw thread
Connection.
Further, it is smooth surface that the stepped screw, which is located at the part of the through hole,.
Further, the heat sink is provided with the avoid holes for being avoided to the chip on the mainboard.
Further, the heat sink is bonded with equal backing far from the side of the mainboard.
Further, the equal backing is made of graphite flake, nano-sized carbon copper, copper foil or aluminium foil.
VR equipment, including host, the host include upper cover and lower cover, are equipped with master between the upper cover and the lower cover
Board mount is equipped with mainboard on the mainboard bracket, and the mainboard is connected with above-mentioned radiator structure.
After above-mentioned technical proposal, the beneficial effects of the utility model are:
Since the radiator structure of the utility model includes heat sink and screw for heat sink to be fixed on to mainboard, screw
For stepped screw, elastic component is clamped between the head of stepped screw and the plane of mainboard, mainboard is provided with for for step spiral shell
Follow closely across through-hole, stepped screw is located at the diameter of the diameter of through hole less than through-hole, and the step surface of stepped screw acts against scattered
On hot plate, in normal state, stepped screw makes elastic component by certain deformation is pressed with, and mainboard pressure can be given mainboard always
It is pressed on heat sink, when the chip adstante febre on mainboard, mainboard is raised simultaneously with the temperature of heat sink, and is had different
Size expansion, due to, the step surface of stepped screw acts against on heat sink, and screw is not completely locked by mainboard and heat sink,
On mainboard the diameter of through-hole is greater than the diameter of screw, and mainboard can be relative to heat sink moving radially along screw, therefore mainboard
Deformation and the deformation of heat sink are immediately asynchronous to be deformed by other side's stretch bending.
In the utility model, stepped screw passes through elastic component and mainboard is threadedly coupled with heat sink, is located at mainboard and elasticity
Stepped screw at part is smooth surface, and the stepped screw at mainboard and elastic component is that smooth surface can prevent screw thread to master
The side of through-hole causes to wear on plate.
In the utility model, heat sink is bonded with equal backing far from the side of mainboard, has good heat conduction and heat radiation effect,
The case where can avoid heat sink surface temperature distribution unevenness, localized hyperthermia caused to burn out mainboard.
Since the VR equipment of the utility model includes host, host includes upper cover and lower cover, is installed between upper cover and lower cover
There is mainboard bracket, mainboard is installed on mainboard bracket, mainboard is connected with above-mentioned radiator structure, can avoid mainboard distortion, guarantees
The normal display of image, extends the service life of equipment.
In conclusion the radiator structure and VR equipment of the utility model solve the mainboard of radiator structure in the prior art
With the difference of heat sink thermal expansion coefficient the problem of cause deformation, the radiator structure and VR equipment mainboard of the utility model are heated
Can be mobile relative to heat sink when expansion, can be avoided the difference of mainboard and heat sink thermal expansion coefficient and caused by influence of crust deformation master
The performance of plate guarantees the normal display of image, extends the service life of equipment.
Detailed description of the invention
Fig. 1 is the decomposition texture schematic diagram of the utility model radiator structure；
Fig. 2 is the cross-sectional view schematic diagram of the utility model radiator structure；
Fig. 3 is the enlarged structure schematic diagram in the portion A in figure；
In figure, 1- mainboard, 2- heat sink, the equal backing of 3-, 4- stepped screw, 5- elastic component, 6- through-hole, 7- threaded hole, 8-
Chip, 9- avoid holes.
Specific embodiment
The present invention will be further described with reference to the accompanying drawings and examples.
The orientation being related in this specification is subject to shown in attached drawing, and relative positional relationship is only represented, and is not represented absolutely
Positional relationship.
Embodiment one:
As shown in Figure 1, Figure 2 and Fig. 3 is jointly shown, radiator structure, including heat sink 2 and for heat sink 2 to be fixed on mainboard 1
Screw, screw be stepped screw 4, be clamped with elastic component 5 between the head and mainboard 1 of stepped screw 4, mainboard 1 is arranged useful
In the through-hole 6 passed through for stepped screw 4, stepped screw 4 is located at the diameter that the diameter at through-hole 6 is less than through-hole 6, stepped screw 4
Step surface act against on heat sink 2.In normal state, stepped screw 4 makes elastic component 5 be pressurized and has certain deformation,
Mainboard 1 can be pressed on heat sink 2 to 1 pressure of mainboard always, when 8 adstante febre of chip on mainboard 1, mainboard 1 is with heat dissipation
The temperature of plate 2 raises simultaneously, and has different size expansions, since the step surface of stepped screw 4 acts against on heat sink 2
The limit to 4 installation length of stepped screw is formed, can prevent stepped screw 4 from locking mainboard 1 and heat sink 2, through-hole on mainboard 1
6 diameter is greater than the diameter of stepped screw 4, and mainboard 1 can be relative to the moving radially along screw 4 of heat sink 2, therefore mainboard 1
Deformation and the deformation of heat sink 2 will not be deformed asynchronous by other side's stretch bending, and the setting of elastic component 5 can avoid because of step spiral shell
Existing tolerance leads to the case where loosening between mainboard 1 and heat sink 2 between nail 4.Wherein, elastic component 5 is O-ring, and O-ring can
Think rubber ring or silica gel ring, preferably O-ring is rubber ring in present embodiment.
As shown in Figure 1, Figure 2 and Fig. 3 jointly shown in, the tail portion of stepped screw 4 after elastic component 5 and mainboard 1 with 2 spiral shell of heat sink
Line connection, heat sink 2 are provided with threaded hole 7 compatible with stepped screw 4.It is light that stepped screw 4, which is located at the part at through-hole 6,
Sliding surface, can prevent screw thread from causing to wear to the side of through-hole 6 on mainboard 1.Wherein, the head of stepped screw 4 is to be relatively large in diameter
One end, tail portion be the lesser one end of diameter.
As shown in Figure 1, heat sink 2 is provided with the avoid holes 9 for avoiding the chip 8 on mainboard 1, avoid weighing wounded
Chip 8.Heat sink 2 is bonded with equal backing 3 far from the side of mainboard 1, and equal backing 3 has good heat conduction and heat radiation effect, can keep away
The case where exempting from heat sink 2 surface temperature distribution unevenness, localized hyperthermia caused to burn out mainboard 1.Wherein, heat sink 2 can be by copper, aluminium
Equal metal materials or the material of other good heat conductivities are made, and preferred heat sink 2 is made of aluminum in present embodiment.Equal backing 3
It can be by one of graphite flake, nano-sized carbon copper, copper foil or aluminium foil or other flexible thin-film materials with high plane thermal conductivity
It is made, preferably backing 3 is the equal backing 3 of graphite in present embodiment, and good heat conduction effect is at low cost.
The radiator structure of the utility model is fixed mainboard and heat sink by using stepped screw and elastic component, and step
The diameter that screw is located at through hole is less than the diameter of through-hole, and the step surface of stepped screw acts against on heat sink, when mainboard and dissipates
When hot plate expanded by heating, mainboard can be avoided mainboard and heat sink heat relative to heat sink moving radially along stepped screw
The difference of the coefficient of expansion and caused by influence of crust deformation mainboard performance, guarantee the normal display of image, extend equipment use the longevity
Life.
Embodiment two:
VR equipment, including host, host include upper cover and lower cover, and mainboard bracket, mainboard are equipped between upper cover and lower cover
Mainboard is installed, mainboard is connected with the radiator structure in embodiment one on bracket, it is ensured that when mainboard and heat sink expanded by heating
Mainboard will not be deformed by heat sink stretch bending, so that image can normally be shown.Front housing and camera are connected on front side of lower casing
Bracket, rear side are connected with architrave foam, wherein the front side of lower casing is the side far from human face, and rear side is close to human body face
The side in portion.
It is abnormal to can avoid mainboard by connecting the radiator structure in embodiment one on mainboard for the VR equipment of the utility model
Become, mainboard can proper heat reduction, and guarantee the normal display of image, extend the service life of equipment.
Although the foregoing describe specific embodiment of the present utility model, it should be appreciated by those skilled in the art,
Described embodiment is only a part of the embodiment of the utility model, and instead of all the embodiments, these are only to lift
Example explanation, the protection scope of the utility model is limited by described claims.Those skilled in the art is without departing substantially from this
It, can be to these embodiments under any creative labor of no process under the premise of the principle and essence of utility model
Various changes or modifications are made, but these change and modification each fall within the protection scope of the utility model.
Claims (10)
1. radiator structure, the screw including heat sink and for the heat sink to be fixed on to mainboard, which is characterized in that the spiral shell
Nail is stepped screw, and elastic component, the mainboard setting are clamped between the head of the stepped screw and the plane of the mainboard
There is the through-hole for passing through for the stepped screw, the diameter that the stepped screw is located at the through hole is less than the through-hole
Diameter, the step surface of the stepped screw act against on the heat sink.
2. radiator structure according to claim 1, which is characterized in that the elastic component is O-ring.
3. radiator structure according to claim 2, which is characterized in that the O-ring is rubber ring.
4. radiator structure according to claim 2, which is characterized in that the O-ring is silica gel ring.
5. radiator structure according to claim 1, which is characterized in that the tail portion of the stepped screw passes through the elastic component
It is threadedly coupled with after the mainboard with the heat sink.
6. radiator structure according to claim 5, which is characterized in that the stepped screw is located at the part of the through hole
For smooth surface.
7. radiator structure according to claim 1, which is characterized in that the heat sink is provided with for the mainboard
The avoid holes that are avoided of chip.
8. radiator structure according to claim 1, which is characterized in that a side bonds of the heat sink far from the mainboard
There is equal backing.
9. radiator structure according to claim 8, which is characterized in that the equal backing is by graphite flake, nano-sized carbon copper, copper foil
Or aluminium foil is made.
10.VR equipment, including host, the host include upper cover and lower cover, are equipped with master between the upper cover and the lower cover
Board mount is equipped with mainboard on the mainboard bracket, which is characterized in that the mainboard is connected with any one of claim 1 to 9 institute
The radiator structure stated.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920548618.XU CN209690631U (en) | 2019-04-19 | 2019-04-19 | Radiator structure and VR equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920548618.XU CN209690631U (en) | 2019-04-19 | 2019-04-19 | Radiator structure and VR equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209690631U true CN209690631U (en) | 2019-11-26 |
Family
ID=68608109
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920548618.XU Expired - Fee Related CN209690631U (en) | 2019-04-19 | 2019-04-19 | Radiator structure and VR equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209690631U (en) |
-
2019
- 2019-04-19 CN CN201920548618.XU patent/CN209690631U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20201015 Address after: 261031 north of Yuqing street, east of Dongming Road, high tech Zone, Weifang City, Shandong Province (Room 502, Geer electronic office building) Patentee after: GoerTek Optical Technology Co.,Ltd. Address before: 266104 Laoshan Qingdao District North House Street investment service center room, Room 308, Shandong Patentee before: GOERTEK TECHNOLOGY Co.,Ltd. |
|
| TR01 | Transfer of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20191126 |