CN208706634U

CN208706634U - A kind of standard ASAAC high-performance radiator structure

Info

Publication number: CN208706634U
Application number: CN201820838064.2U
Authority: CN
Inventors: 李余凡; 王鹏
Original assignee: SICHUAN HONGCHUANG ELECTRONIC TECHNOLOGY Co Ltd
Current assignee: SICHUAN HONGCHUANG ELECTRONIC TECHNOLOGY Co Ltd
Priority date: 2018-05-31
Filing date: 2018-05-31
Publication date: 2019-04-05
Anticipated expiration: 2028-05-31

Abstract

The utility model discloses a kind of standard ASAAC high-performance radiator structures, including heat-dissipating cover plate and radiating bottom plate, the heat-dissipating cover plate include substrate, and the upper surface of base plate is provided with radiation tooth, and the base lower surface is provided with temperature-uniforming plate；Using structure disclosed by the utility model, the heat dissipation performance of heat-dissipating cover plate can be effectively improved, to improve the heat dissipation performance of ASAAC；Situations such as heat-dissipating cover plate local temperature is concentrated when increasing equalizing plate structure effective solution chip heat loss through conduction, and temperature distribution is non-uniform for heat-dissipating cover plate, and heat conduction velocity is slow；It improves traditional design form and is difficult to the problem of meeting the radiating requirements of high power Version module, be improved the stability of product.

Description

A kind of standard ASAAC high-performance radiator structure

Technical field

The utility model relates to electronic technology fields, and in particular to a kind of standard ASAAC high-performance radiator structure.

Background technique

As the volume of chip is smaller and smaller, power is higher and higher, and the surface heat flux of chip itself is relatively large, For on the Conduction heat-sink structure part shell of ASAAC structure, requirement due to integral module to weight, weight is generally less than at present Equal to 1kg；Classical heat-dissipating cover plate structure design is typically all the form that substrate adds fin, is able to satisfy under general condition and requires not Stringent dissipating-heat environment demand, when very high to cooling requirements, this traditional design is difficult to meet the requirements.

It is general to require to be heat loss through conduction for the chip cooling of ASAAC construction module at this stage, i.e., by euthermic chip with The radiating boss of substrate is close to by heat conductive pad, and the heat-radiating substrate back side is heat dissipation toothing, thus by the heat of chip via convex Platform is dispersed into environment to radiating fin again achievees the purpose that heat dissipation, and heat dissipation performance is poor.

For the ASAAC construction module using wind-cooling heat dissipating, i.e., the radiating boss of euthermic chip and substrate is passed through thermally conductive Pad is close to, and the heat-radiating substrate back side carries out fan heat without heat dissipation toothing, using fan, requires module heat dissipating very stringent, it is desirable that Heat exchange quickly can be carried out with environment, temperature is unable to concentrations, carries out heat analysis to existing heat-dissipating cover plate design at present It can be found that heat-dissipating cover plate local temperature is concentrated when chip heat loss through conduction, temperature distribution is non-uniform for heat-dissipating cover plate, heat conduction speed Rate is slow, strongly limits heat dissipation effect；Furthermore traditional design form is difficult to meet the radiating requirements of high power Version module.When When fan fails, from it is original it is air-cooled become natural cooling when, original module dissipation component ambient temperature can assemble scattered quickly Hair is not gone out, and seriously affects the service life of device, there is very big hidden danger and risk, it can be seen that such heat-dissipating cover plate structure Very big to air-cooled dependence, if will decline moment without wind regime heat-sinking capability, heat dissipation effect is also undesirable.

Simultaneously because traditional radiator structure, substrate is indeformable when to guarantee processing and good heat dissipation effect, substrate are thick Degree necessarily is greater than certain numerical value (>=1mm), and substrate is mostly solid, when substrate too thin (<1mm), weight saving, but That integral heat sink effect is bad, especially when heat-dissipating cover plate have a direction size it is larger when (> 150mm) process when substrate be easy Buckling deformation occurs.

Utility model content

The purpose of this utility model is that: a kind of standard ASAAC high-performance radiator structure is provided, solve currently used for The technical problem of the radiator structure heat dissipation performance difference of ASAAC structure.

The technical solution adopted in the utility model is as follows:

A kind of standard ASAAC high-performance radiator structure, including heat-dissipating cover plate and radiating bottom plate, the heat-dissipating cover plate include base Plate, the upper surface of base plate are provided with radiation tooth, and the base lower surface is provided with temperature-uniforming plate.

Further, the base lower surface is provided with the radiating boss for conducting euthermic chip heat, the samming Plate covers the radiating boss and other regions of base lower surface.

Further, the temperature-uniforming plate with a thickness of 3-5mm.

Further, the radiation tooth with a thickness of 0.5-1.5mm.

Further, the space width of the radiation tooth is 1-3mm.

Further, the height of the radiation tooth is 3-4mm.

Further, the substrate uses hollow structure.

In conclusion by adopting the above-described technical solution, the beneficial effects of the utility model are:

1. using structure disclosed by the utility model, the heat dissipation performance of heat-dissipating cover plate can be effectively improved, to improve The heat dissipation performance of ASAAC.

2. heat-dissipating cover plate local temperature is concentrated when increasing equalizing plate structure effective solution chip heat loss through conduction, dissipating cover Situations such as plate temperature is unevenly distributed, and heat conduction velocity is slow；Traditional design form is improved to be difficult to meet high power version mould The problem of radiating requirements of block, is improved the stability of product.

3. use this structure, successfully solve substrate it is too thin (<1mm), especially when heat-dissipating cover plate have size it is larger when (> 150mm), substrate is easy to happen the problem of buckling deformation, therefore not only makes substrate in the case where very thin using this structure, does not send out Change shape, while heat dissipation performance is good, reduces the weight of structure entirety.

4. it is radiated using air cooling way, it is air-cooled to become natural cooling even if fan fails, increase equalizing plate structure, makes device The temperature of part reaches junction temperature and the time of invalid temperature extends, and extends the time up to 20%-40%, strives for very for making a return voyage for complete machine Long time, the also stronger unfailing performance for improving product and complete machine.

5. structure, which can be used for Conduction heat-sink structure, can be used for air-cooled heat dissipation structure, structure is greatly improved Heat dissipation performance.

Detailed description of the invention

The utility model will illustrate by example and with reference to the appended drawing, in which:

Fig. 1 is the overall structure figure of the utility model；

Fig. 2 is the first view of heat-dissipating cover plate in the utility model；

Fig. 3 is the second view of heat-dissipating cover plate in the utility model；

Appended drawing reference: 1- heat-dissipating cover plate, 101- radiation tooth, 102- heat-radiating substrate, 103- temperature-uniforming plate, 104- radiating boss, 2- radiating bottom plate.

Specific embodiment

All features disclosed in this specification or disclosed all methods or in the process the step of, in addition to mutually exclusive Feature and/or step other than, can combine in any way.

It elaborates below with reference to Fig. 1-3 pairs of the utility model.

Specific embodiment 1

A kind of standard ASAAC high-performance radiator structure, including heat-dissipating cover plate 1 and radiating bottom plate 2, the heat-dissipating cover plate 1 wrap Substrate 102 is included, 102 upper surface of substrate is provided with radiation tooth 101, and 102 lower surface of substrate is provided with temperature-uniforming plate 103. 1 local temperature of heat-dissipating cover plate is concentrated when increasing by 103 structure effective solution of temperature-uniforming plate chip heat loss through conduction, 1 temperature of heat-dissipating cover plate Situations such as degree is unevenly distributed, and heat conduction velocity is slow, while enhancing the heat dissipation performance using air-cooled heat dissipation structure.

Specific embodiment 2

Structure of the present embodiment based on the further open heat-dissipating cover plate of embodiment 1,102 lower surface of the substrate setting are useful In the radiating boss 104 of conduction euthermic chip heat, 102 lower surface of substrate is removed not to be covered with the coupling part of radiating bottom plate etc. Warm plate 103, other regions are all covered with temperature-uniforming plate 103.The radiating boss 104 is contacted with the euthermic chip to be radiated is needed, The heat for generating euthermic chip is distributed through the conduction of radiating boss 104 to substrate 102, then by radiation tooth 101, the hair Hot chip is arranged on pcb board, and the pcb board is mounted on radiating bottom plate 2, using this structure, greatly enhances using conduction The heat dissipation performance of radiator structure.

Specific embodiment 3

The present embodiment is based on embodiment 2, further the structural parameters of open heat-dissipating cover plate.

The temperature-uniforming plate 103 with a thickness of 4mm；

The radiation tooth 101 with a thickness of 0.5mm, the space width of the radiation tooth 101 is 2mm, has both ensured radiation tooth 101 performance can also ensure the weight demands of total, while reducing windage to a certain extent and increasing wind speed.

The height of the radiation tooth 101 is 3.5mm, and the height for increasing radiation tooth 101 makes 101 air-admitting surface of radiation tooth Increase, improves heat dissipation effect.

The substrate 102 uses hollow structure, and wall thickness is very thin, increases the thickness of substrate 102, has ensured substrate 102 Intensity reduces the weight of substrate 102, and the applicability of product is made to be greatly improved with reliability.

Claims

1. a kind of standard ASAAC high-performance radiator structure, including heat-dissipating cover plate and radiating bottom plate, it is characterised in that: the heat dissipation Cover board (1) includes substrate (102), and substrate (102) upper surface is provided with radiation tooth (101), substrate (102) lower surface It is provided with temperature-uniforming plate (103).

2. a kind of standard ASAAC high-performance radiator structure according to claim 1, it is characterised in that: the substrate (102) Lower surface is provided with the radiating boss (104) for conducting euthermic chip heat, and temperature-uniforming plate (103) the covering heat dissipation is convex Platform (104) and substrate (102) other regions of lower surface.

3. a kind of standard ASAAC high-performance radiator structure according to claim 1, it is characterised in that: the temperature-uniforming plate (103) with a thickness of 3-5mm.

4. a kind of standard ASAAC high-performance radiator structure according to claim 1, it is characterised in that: the radiation tooth (101) with a thickness of 0.5-1.5mm.

5. a kind of standard ASAAC high-performance radiator structure according to claim 1, it is characterised in that: the radiation tooth (101) space width is 1-3mm.

6. a kind of standard ASAAC high-performance radiator structure according to claim 1, it is characterised in that: the radiation tooth (101) height is 3-4mm.

7. a kind of standard ASAAC high-performance radiator structure according to claim 1, it is characterised in that: the substrate (102) Using hollow structure.