CN208691624U - A kind of circular package pad structure under BGA - Google Patents
A kind of circular package pad structure under BGA Download PDFInfo
- Publication number
- CN208691624U CN208691624U CN201820897083.2U CN201820897083U CN208691624U CN 208691624 U CN208691624 U CN 208691624U CN 201820897083 U CN201820897083 U CN 201820897083U CN 208691624 U CN208691624 U CN 208691624U
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- pad
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- via hole
- bga
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Abstract
The utility model provides the circular package pad structure under a kind of BGA, including pad, and pad is circular pad, and circular pad has been peripherally installed with via hole, and the length at the edge of the Edge Distance circular pad of each via hole is greater than 0.1mm.Circular package pad structure under BGA provided by the utility model, pad is provided in round pad, so that the length at the edge of the Edge Distance circular pad of each via hole is greater than 0.1mm, the distance between circular pad is arrived to increase the edge of via hole, allow the bottom surface of BGA package to place more capacitors, improve the filter effect of capacitor element, ensure that the stability of product, the durability of chip is improved, while but also when making under product more simply, conveniently.
Description
Technical field
The utility model relates to the circular package pad structures under a kind of BGA.
Background technique
Printed circuit board (Printed Circuit Board, pcb board) is also known as printed circuit board, printed wiring board, is electricity
The important component of physical support and the signal transmission of sub- product.The full name of BGA is Ball Grid Array(ball bar battle array
The PCB of array structure), it is a kind of package method that integrated circuit uses organic support plate.
The encapsulation welding tray of 0402 capacitor under PCB design phase, BGA is to do rectangular pad processing, because of square pads
Its right angle is corresponding with the via pad in route, and spacing is too close, influences the filter effect of power supply；And if passing through Force Deletion mistake
If the mode in hole reaches filter effect increasing capacitor element, the heat dissipation effect that will lead to BGA is bad, influences the load of power supply
Stream.
The above deficiency, has much room for improvement.
Utility model content
In order to overcome the shortcomings of existing technology, the utility model provides the circular package pad structure under a kind of BGA.
Technical solutions of the utility model are as described below:
A kind of circular package pad structure under BGA, including pad, the pad are circular pad, the circular pad
Be peripherally installed with via hole, the length at the edge of circular pad described in the Edge Distance of each via hole is greater than 0.1mm.
Further, the circular pad is peripherally installed with there are four the via hole, four via holes surround it is rectangular, and
The distance between the adjacent via hole is equal.
Further, the diameter of the circular pad is 0.5mm.
Further, the distance of center circle of the two neighboring circular pad is 1mm.
Further, the bottom of the circular pad is equipped with welding resistance and opens a window and connect with welding resistance windowing, the welding resistance
The length at the edge of circular pad described in the Edge Distance of windowing is 0.05mm.
According to the utility model of above scheme, the beneficial effect is that: the round envelope under BGA provided by the utility model
Pad is provided in round pad by welding equipment dish structure, so that the length at the edge of the Edge Distance circular pad of each via hole is big
In 0.1mm, to increase the edge of via hole to the distance between the edge of circular pad, so that the bottom surface of BGA package can be with
More capacitors are placed, the filter effect of capacitor element is improved, ensure that the stability of product, improve the durable of chip
Property, while but also when being made under product more simply, conveniently.
Detailed description of the invention
It, below will be to embodiment or the prior art in order to illustrate more clearly of the technical scheme in the embodiment of the utility model
Attached drawing needed in description is briefly described, it should be apparent that, the accompanying drawings in the following description is only that this is practical new
Some embodiments of type for those of ordinary skill in the art without creative efforts, can be with root
Other attached drawings are obtained according to these attached drawings.
Fig. 1 is the structural schematic diagram of the utility model；
Fig. 2 is the circular pad structural schematic diagram of the utility model.
Wherein, each appended drawing reference in figure:
1- via hole；2- circular pad；The windowing of 3- pad.
Specific embodiment
In order to which technical problem to be solved in the utility model, technical solution and beneficial effect is more clearly understood, with
Lower combination accompanying drawings and embodiments, the present invention will be further described in detail.It should be appreciated that specific reality described herein
Example is applied only to explain the utility model, is not used to limit the utility model.
It should be noted that it can be directly to when an element is known as " being connected to " another element
Another element is indirectly connected on another element.In addition, term " first ", " second " are used for description purposes only, and
It cannot be understood as indicating or implying relative importance or implicitly indicate the quantity of indicated technical characteristic.It defines as a result,
The feature of " first ", " second " can explicitly or implicitly include one or more of the features.
Please refer to Fig. 1 to Fig. 2, the circular package pad structure under a kind of BGA, including pad, pad are circular pad 2,
Circular pad 2 has been peripherally installed with via hole 1, and the length at the edge of the Edge Distance circular pad 2 of each via hole 1 is greater than 0.1mm.
The working principle of circular package pad structure under BGA provided in this embodiment are as follows: pad is provided in round weldering
Disk 2, so that the length at the edge of the Edge Distance circular pad 2 of each via hole 1 is greater than 0.1mm, to increase the side of via hole 1
Edge is the distance between to circular pad 2.
Circular package pad structure under BGA provided in this embodiment has the beneficial effect that BGA provided by the utility model
Under circular package pad structure, pad is provided in round pad 2, so that the Edge Distance circular pad 2 of each via hole 1
The length at edge is greater than 0.1mm, to increase the edge of via hole 1 to the distance between the edge of circular pad 2, so that BGA
The bottom surface of encapsulation can place more capacitors, improve the filter effect of capacitor element, ensure that the stability of product, improve
The durability of chip, at the same but also it is more simple when being made under product, conveniently.
Preferably, circular pad 2 is peripherally installed with there are four via hole 1, four via holes 1 surround it is rectangular, and adjacent vias 1 it
Between be equidistant.
Preferably, the diameter of circular pad 2 is 0.5mm.
Preferably, the distance of center circle of two neighboring circular pad 2 is 1mm.
Preferably, the bottom of circular pad 2 is equipped with welding resistance windowing 3 and connect with welding resistance windowing 3, the edge of welding resistance windowing 3
The length at the edge apart from circular pad 2 is 0.05mm.
The above is only the preferred embodiment of the utility model only, is not intended to limit the utility model, all at this
Made any modifications, equivalent replacements, and improvements etc., should be included in the utility model within the spirit and principle of utility model
Protection scope within.
Claims (3)
1. the circular package pad structure under a kind of BGA, it is characterised in that: including pad, the pad is circular pad, described
Circular pad has been peripherally installed with via hole, and the length at the edge of circular pad described in the Edge Distance of each via hole is greater than
0.1mm；
The circular pad is peripherally installed with there are four the via hole, and four via holes surround rectangular, and the adjacent via hole
The distance between it is equal；
The bottom of the circular pad is equipped with welding resistance and opens a window and connect with welding resistance windowing, the Edge Distance of the welding resistance windowing
The length at the edge of the circular pad is 0.05mm.
2. the circular package pad structure under BGA as described in claim 1, it is characterised in that: the diameter of the circular pad
For 0.5mm.
3. the circular package pad structure under BGA as claimed in claim 2, it is characterised in that: the two neighboring round weldering
The distance of center circle of disk is 1mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820897083.2U CN208691624U (en) | 2018-06-11 | 2018-06-11 | A kind of circular package pad structure under BGA |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820897083.2U CN208691624U (en) | 2018-06-11 | 2018-06-11 | A kind of circular package pad structure under BGA |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208691624U true CN208691624U (en) | 2019-04-02 |
Family
ID=65878336
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820897083.2U Active CN208691624U (en) | 2018-06-11 | 2018-06-11 | A kind of circular package pad structure under BGA |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208691624U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112272453A (en) * | 2020-10-21 | 2021-01-26 | 歌尔光学科技有限公司 | PCB (printed Circuit Board) and manufacturing process thereof, chip set and DLP (digital light processing) projector |
-
2018
- 2018-06-11 CN CN201820897083.2U patent/CN208691624U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112272453A (en) * | 2020-10-21 | 2021-01-26 | 歌尔光学科技有限公司 | PCB (printed Circuit Board) and manufacturing process thereof, chip set and DLP (digital light processing) projector |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP02 | Change in the address of a patent holder |
Address after: 11F, Metro financial technology building, 9819 Shennan Avenue, Shenda community, Yuehai street, Nanshan District, Shenzhen, Guangdong 518000 Patentee after: EDADOC Co.,Ltd. Address before: 518000, 12H-12I, 12th Floor, Kangjia Research Building, 28 Science and Technology South 12 Road, Nanshan District, Shenzhen City, Guangdong Province Patentee before: EDADOC Co.,Ltd. |
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| CP02 | Change in the address of a patent holder |