CN208649450U - A kind of exposure mask panel assembly - Google Patents
A kind of exposure mask panel assembly Download PDFInfo
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- CN208649450U CN208649450U CN201821080019.1U CN201821080019U CN208649450U CN 208649450 U CN208649450 U CN 208649450U CN 201821080019 U CN201821080019 U CN 201821080019U CN 208649450 U CN208649450 U CN 208649450U
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- mask plate
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- panel assembly
- block piece
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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Abstract
The utility model discloses a kind of exposure mask panel assembly, is related to technical field of solar cell manufacturing, designs to improve the service performance of conductive film.The exposure mask panel assembly includes the first mask plate and the second mask plate；First mask plate and the second mask plate include frame, the block piece that multiple intervals are laid is provided in the frame, the block piece will be divided into the open region and blocked area being staggeredly spaced in the frame, the opening plot structure of first mask plate and the second mask plate block that plot structure is identical, first mask plate block plot structure and the opening plot structure of the second mask plate is identical.Exposure mask panel assembly provided by the utility model is used to improve the performance of conductive film.
Description
Technical field
The utility model relates to technical field of solar cell manufacturing more particularly to a kind of exposure mask panel assemblies.
Background technique
HIT solar battery is a trend of Mirae Corp. at present, and HIT solar battery can promote unit area
Generated energy can also reduce installation cost, can further promote the occupation rate of market of new energy.And a-Si/c-Si is heterogeneous
Connection solar cell is expected to its high photoelectric conversion efficiency and low temperature process as following one of the mainstream photovoltaic technology, so
Its welcome increasingly by numerous users.
Sputtering method plated film is a main technique link for preparing solar battery, and the purpose is to form transparent conductive oxide
Object film such as ITO, IWO etc., people usually require that it should have higher light transmission in application transparent conductive oxide film
Rate has good electric conductivity again.Layer of transparent conductive oxide film is usually required in the light-receiving surface of solar battery to be used to
Photo-generated carrier is collected, while more sunlight irradiation energy being allowed to enter the absorbed layer of solar battery, this layer of electrically conducting transparent
The performance of sull has very important influence to the performance of solar battery, for example, light transmittance influences the short circuit of battery
Current density (Isc)；The fill factor (FF) of conductivity influence battery.
However, the light transmittance and conductivity of transparent conductive oxide film are the parameter of conflict, the raising of conductivity
It can cause the decline of light transmittance, similarly, the raising of light transmittance can also cause the decline of conductivity.Such as: usually raising conductivity
Method be increase transparent conductive oxide film in carrier concentration, still, the increase of carrier concentration will increase again
Absorption of the bright conductive oxide film to light, especially long-wave band light, this reduces the saturating of transparent conductive oxide film
Light rate；The method for usually improving light transmittance is to reduce the thickness of transparent conductive oxide film, and still, transparent conductive oxide is thin
The increase of film thickness reduces the conductivity of transparent conductive oxide film again.
At present in the fabrication of a solar cell, it is the disposable deposition for completing transparent conductive oxide film, adopts
With disposable deposition transparent conductive oxide film, it is ensured that have in transparent conductive oxide film positioned at the region of base part
There is higher conductivity, while also to guarantee the light transmission with higher of the region of not set electrode in transparent conductive oxide film
Property and higher conductivity be unable to satisfy, if by twice deposition form transparent conductive oxide film, make electrically conducting transparent
Sull not only meets the region conductivity with higher positioned at base part, also has the region of not set electrode
Higher translucency, if it is necessary for designing one kind the mask plate deposited twice can be rapidly completed.
Utility model content
The embodiments of the present invention provide a kind of exposure mask panel assembly, and main purpose is can be quickly complete in substrate surface
At the plated film in two regions, the film layer for plating two regions is not superimposed, and ensures respective characteristic.
In order to achieve the above objectives, the embodiments of the present invention adopt the following technical scheme that
A kind of exposure mask panel assembly, the exposure mask panel assembly include:
First mask plate；
Second mask plate, second mask plate are complementary with first mask structure being；Wherein, first mask plate
Include frame with the second mask plate, the block piece that multiple intervals are laid is provided in the frame, the block piece will be described
It is divided into the open region and blocked area being staggeredly spaced in frame, the opening plot structure of first mask plate and the second mask plate
Block that plot structure is identical, first mask plate block plot structure and the opening plot structure of the second mask plate is identical.
Exposure mask panel assembly provided by the embodiment of the utility model passes through complementary structure, the first mask plate matched and
Two mask plates can quickly finish plated film in the first area of substrate surface and second area respectively, and then make two regions
Film layer is not superimposed, and is had respective service performance, is finally improved the characteristic of entire film layer.
Optionally, the exposure mask panel assembly further include:
Load-bearing part, at least provided with one for placing the mounting groove of substrate on the load-bearing part, wherein the substrate is
Pass through the substrate of first mask plate and the second mask plate plated film.
Optionally, the groove depth of the mounting groove is more than or equal to the thickness of the substrate.
Optionally, the edge contour of first mask plate and second mask plate covers the side of the substrate surface
Edge profile.
Optionally, first mask plate and the second mask plate pass through location structure and are mounted on the load-bearing part.
Optionally, the location structure includes the location hole opened up on said frame and is arranged on the load-bearing part
Positioning pin.
Optionally, the location hole has multiple, and multiple location holes are laid along the edge of the frame.
Optionally, the location hole is waist-shaped hole or circular hole.
Optionally, the block piece in the frame of first mask plate includes that multiple first block pieces and multiple second are blocked
Part, multiple first block pieces are laid along the frame first direction of the first mask plate, and multiple second block pieces are along first
The frame second direction of mask plate is laid, between all having between two neighboring first block piece and two neighboring second block piece
Gap, the gap form the open region on the first mask plate, and first block piece and the second block piece form the first mask plate
On blocked area, wherein the frame first direction and second direction of the first mask plate are orthogonal.
Optionally, the block piece in the frame of second mask plate includes that multiple third block pieces and the multiple 4th are blocked
Part, multiple third block pieces are laid along the frame first direction of the second mask plate, and multiple 4th block pieces are along second
The frame second direction of mask plate is laid, between all having between two neighboring third block piece and two neighboring 4th block piece
Gap, the gap form the open region on the second mask plate, and the third block piece and the 4th block piece form the second mask plate
On blocked area, wherein the frame first direction and second direction of the second mask plate are orthogonal.
Detailed description of the invention
Fig. 1 is a kind of structural schematic diagram of first mask plate provided by the embodiment of the utility model；
Fig. 2 is the partial enlarged view of Fig. 1；
Fig. 3 is the partial enlarged view of Fig. 1；
Fig. 4 is a kind of structural schematic diagram of second mask plate provided by the embodiment of the utility model；
Fig. 5 is the partial enlarged view of Fig. 4；
Fig. 6 is the partial enlarged view of Fig. 4；
Fig. 7 is a kind of structural schematic diagram of load-bearing part provided by the embodiment of the utility model；
Fig. 8 is the partial enlarged view of Fig. 7；
Fig. 9 is a kind of structural representation after substrate surface deposits the first conductive film provided by the embodiment of the utility model
Figure；
Figure 10 is the partial enlarged view of Fig. 9；
Figure 11 is a kind of structural representation after substrate surface depositing second conductive film provided by the embodiment of the utility model
Figure；
Figure 12 is the partial enlarged view of Figure 11；
Figure 13 is provided by the embodiment of the utility model a kind of in substrate surface the first conductive film of deposition and the second conductive film
Partial structural diagram afterwards.
Specific embodiment
The utility model embodiment exposure mask panel assembly is described in detail with reference to the accompanying drawing.
Term " first ", " second " are used for description purposes only in the description of the present invention, and should not be understood as indicating
Or it implies relative importance or implicitly indicates the quantity of indicated technical characteristic." first ", " second " are defined as a result,
Feature can explicitly or implicitly include one or more of the features.In the description of the present invention, unless otherwise
Illustrate, the meaning of " plurality " is two or more.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " is pacified
Dress ", " connected ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or integrally
Connection；It can be mechanical connection, be also possible to be electrically connected；Can be directly connected, can also indirectly connected through an intermediary,
It can be the connection of two element inner segments.For the ordinary skill in the art, above-mentioned art can be understood with concrete condition
The concrete meaning of language in the present invention.
The utility model embodiment provides a kind of exposure mask panel assembly, and the exposure mask panel assembly is used to plate in substrate surface
Film, the exposure mask panel assembly include:
First mask plate and second mask plate complementary with first mask structure being；Wherein, first mask plate
Include frame with the second mask plate, the block piece that multiple intervals are laid is provided in the frame, the block piece will be described
It is divided into the open region and blocked area being staggeredly spaced in frame, the opening plot structure of first mask plate and the second mask plate
Block that plot structure is identical, first mask plate block plot structure and the opening plot structure of the second mask plate is identical.
Specifically in substrate surface plated film, a surface of the substrate includes first area and second area, and described
Two regions are that remaining region of first area was removed on the substrate surface, the shape of the open region on first mask plate with
The shape of the first area is identical, that is, passes through first area plated film of first mask plate in the substrate, second exposure mask
The shape of open region on plate is identical as the shape of the second area, i.e., by second mask plate the of the substrate
Two region plated films.Specifically in the first area plated film of substrate surface, first mask plate is placed on substrate surface, by institute
The shape for stating the open region on the first mask plate is identical as the shape of the first area, makes the first area of substrate surface in this way
Being exposed by the open region on the first mask plate, the second area of substrate surface is blocked by the blocked area of the first mask plate, this
Sample can by the first mask plate substrate surface first area depositional coating.
Specifically in the second area plated film of substrate surface, second mask plate is placed on substrate surface, due to described
The shape of open region on second mask plate is identical as the shape of the second area, makes the second area of substrate surface logical in this way
It crosses the open region on the second mask plate to expose, the first area of substrate surface is blocked by the blocked area of the second mask plate, in this way
Can by the second mask plate substrate surface second area depositional coating.
By the first mask plate and the second mask plate in the corresponding region plated film of substrate surface, i.e., in first area plated film
When, second area is blocked, and when second area plated film, first area is then blocked, this ensure that the area Liang Ge being finally completed
The phenomenon that film layer in domain is not in be superimposed in respective region, imbricate, has ensured the film layer institute in corresponding region
The characteristic having.
Exemplary, as depicted in figs. 1 and 2, first mask plate 1 includes the first frame 1-1, is arranged in the first frame 1-
The block piece that multiple intervals in 1 are laid, the block piece include that first be arranged in the first frame 1-1 along first direction hides
Block piece 1-2 and the second block piece 1-3, the two neighboring first block piece 1-2 being arranged in a second direction and two neighboring
Gap is all had between two block piece 1-3, the gap forms the first open region 1-4, and the first block piece 1-2 and second hides
Block piece 1-3 forms the first blocked area, wherein the first direction and second direction of the frame 1-1 of the first mask plate 1 is orthogonal.
Exemplary, as shown in Figure 4 and Figure 5, second mask plate 2 includes the second frame 2-1, is arranged in the second frame 2-
The block piece that multiple intervals in 1 are laid, the block piece include that the third being arranged in the second frame 2-1 along first direction hides
Between also having between block piece 2-2 and the 4th block piece 2-3 being arranged in a second direction, the two neighboring third block piece 2-2
Gap, the gap form the second open region 2-4, and the third block piece 2-2 and the 4th block piece 2-3 form second and block
Area, the first direction and second direction of the frame 2-1 of the second mask plate 2 are orthogonal, wherein the two neighboring third block piece 2-
Clearance distance between 2 is equal to the width of the first block piece 1-2, and the width of the 4th block piece 2-3 is equal to two neighboring the
Clearance distance between two block piece 1-3 thus makes the screening of the opening plot structure and the second mask plate of first mask plate 1
Keep off that plot structure is identical, first mask plate block plot structure and the opening plot structure of the second mask plate is identical, finally make the
The complementary structure of one mask plate 1 and the second mask plate 2.
In the specific implementation, for the ease of depositing corresponding film layer by the first mask plate 1 and the second mask plate 2, such as
Shown in Fig. 7, the exposure mask panel assembly further includes load-bearing part 3, at least provided with one for placing the lining on the load-bearing part 3
The mounting groove 3-1 at bottom, it is preferred that the mounting groove 3-1 have it is multiple, multiple mounting groove 3-1, which are arranged, can place multiple substrates,
Similarly, first mask plate 1 and the second mask plate 2 also have multiple, and plating membrane efficiency thus can be improved.
Exemplary, first mask plate 1 and the second mask plate 2 are mounted on the load-bearing part 3 by location structure,
The location structure includes the positioning pin for opening up location hole on said frame and being arranged on the load-bearing part, such as Fig. 1 and
Shown in Fig. 3, offer first positioning hole 1-5 on shown first frame 1-1, the first positioning hole 1-5 can have it is multiple, it is more
A first positioning hole 1-5 is arranged along the edge of the first frame 1-1, as shown in Figure 4 and Figure 6, opens up on the second frame 2-1
Have a second location hole 2-5, second location hole 2-5 can be it is multiple, multiple second location hole 2-5 are along the second frame 2-1's
Edge setting, and after the first frame 1-1 and the second frame 2-1 are stacked, the first positioning hole 1-5 and second location hole
2-5 is oppositely arranged, it is preferred that the central axis of first positioning hole 1-5 and second location hole 2-5 are on same straight line.And institute
The structure for stating first positioning hole 1-5 and second location hole 2-5 is same or different, for example, can be selected from waist-shaped hole, circular hole or rectangular
One of hole.As shown in Figure 7 and Figure 8, positioning pin 3-2 is provided on the load-bearing part 3, it is preferred that the positioning pin 3-2's
Quantity is identical as the quantity of first positioning hole 1-5 and second location hole 2-5, and the length of the positioning pin 3-2 is at least more than described
The sum of the thickness of first mask plate 1 and the second mask plate 2.
Exemplary, the groove depth of the mounting groove 3-1 is more than or equal to the thickness of the substrate, in this way can be embedding by the substrate
Enter in mounting groove 3-1, facilitates plated film.
For convenience the substrate is placed in mounting groove 3-1 or substrate of taking out of mounting groove 3-1, the peace
The slot profile of tankage 3-1 exceeds the edge contour of the substrate.
When it is implemented, the edge contour of first mask plate 1 and second mask plate 2 covers the substrate table
The edge contour in face, after the substrate is placed in the mounting groove 3-1, first mask plate 1 and described second is covered
Diaphragm plate 2 can cover the substrate, and the purpose designed in this way is: if the first mask plate 1 or the second mask plate 2 be not by substrate
Marginal surface is completely covered, and is easy to appear when carrying out substrate two sides plated film around plating, eventually leads to solar battery appearance
Short circuit phenomenon.
In addition, the block piece and the first frame 1-1 in first mask plate 1 are in integral structure, second mask plate 2
In block piece be also in integral structure, and first mask plate 1, the second mask plate 2 and the load-bearing part with the second frame 2-1
3 be the one of which in glass, ceramics, graphite, aluminium alloy, stainless steel or plastics.
The utility model embodiment also provides a kind of method for plating conductive film in substrate surface using above-mentioned exposure mask panel assembly,
The film plating process of the conductive film includes:
First conductive film is deposited in the first area of substrate surface using the first mask plate；
Second area depositing second conductive film using the second mask plate in substrate surface, first conductive film and second
Conductive film forms conductive film, and the conductivity that the conductive film above the substrate first area is located in the conductive film is greater than second
The conductivity of the conductive film of overlying regions is located at the light transmittance of the conductive film above the substrate second area in the conductive film
Greater than the light transmittance of the conductive film above first area.
When specific plated film, can according to the different demands to subregional in the middle part of conductive film conductivity and light transmittance, by
The deposition twice of substrate surface completes the preparation of conductive film, wherein the first conductive film is deposited in the first area of substrate surface,
The second area depositing second conductive film of substrate surface finally makes to be located above the substrate first area in the conductive film of preparation
The conductivity of conductive film be greater than the conductivity of the conductive film above second area, the substrate second is located in the conductive film
The light transmittance of the conductive film of overlying regions is greater than the light transmittance of the conductive film above first area.For example, the substrate is hetero-junctions
When the n-type doping silicon layer or p-type doped silicon layer of solar battery, the conductive film is on n-type doping silicon layer or p-type doped silicon layer
Conductive film, the conductive film plated by this method can meet in n-type doping silicon layer or p-type doped silicon layer to be connect with gate line electrode
The position of touching conductivity with higher and other transmission regions light transmittance with higher, and then improve entire hetero-junctions
The photoelectric conversion efficiency of solar battery.
It should be understood that the sequence of the first conductive film of deposition and the second conductive film can be interchanged.
Exemplary, the film plating process of the conductive film includes:
S1: the first conductive film is deposited in the first area of substrate surface using the first mask plate；In substrate surface deposition the
Structural schematic diagram after one conductive film is shown in Fig. 9 and Figure 10；
S2: use the second mask plate in the second area depositing second conductive of substrate surface (being deposited with the first conductive film)
Film, the structural schematic diagram after substrate surface depositing second conductive film be Figure 11 and Figure 12 shown in, first conductive film and
Second conductive film forms conductive film, referring to Fig.1 shown in 3.
Above-mentioned steps S1 and step S2 can be interchanged, exemplary, and the film plating process of the conductive film includes:
S1: using the second mask plate the second area of substrate surface the second conductive film of area deposition；
S2: conductive in the first area of substrate surface (being deposited with the second conductive film) deposition first using the first mask plate
Film, second conductive film and the first conductive film form conductive film.
In the description of this specification, particular features, structures, materials, or characteristics can be real in any one or more
Applying can be combined in any suitable manner in example or example.
Above description is only a specific implementation of the present invention, but the protection scope of the utility model is not limited to
In this, anyone skilled in the art within the technical scope disclosed by the utility model, can readily occur in variation
Or replacement, it should be covered within the scope of the utility model.Therefore, the protection scope of the utility model should be with the power
Subject to the protection scope that benefit requires.
Claims (10)
1. a kind of exposure mask panel assembly, which is characterized in that the exposure mask panel assembly includes:
First mask plate；
Second mask plate, second mask plate are complementary with first mask structure being；Wherein, first mask plate and
Two mask plates include frame, the block pieces that multiple intervals are laid are provided in the frame, the block piece is by the frame
Inside it is divided into the open region and blocked area being staggeredly spaced, the opening plot structure of first mask plate and blocking for the second mask plate
Plot structure is identical, first mask plate block plot structure and the opening plot structure of the second mask plate is identical.
2. exposure mask panel assembly according to claim 1, which is characterized in that the exposure mask panel assembly further include:
Load-bearing part, at least provided with one for placing the mounting groove of substrate on the load-bearing part, wherein the substrate is to pass through
The substrate of first mask plate and the second mask plate plated film.
3. exposure mask panel assembly according to claim 2, which is characterized in that the groove depth of the mounting groove is more than or equal to the lining
The thickness at bottom.
4. exposure mask panel assembly according to claim 2, which is characterized in that first mask plate and second mask plate
Edge contour cover the edge contour of the substrate surface.
5. exposure mask panel assembly according to claim 2, which is characterized in that first mask plate and the second mask plate are logical
Location structure is crossed to be mounted on the load-bearing part.
6. exposure mask panel assembly according to claim 5, which is characterized in that the location structure includes being provided with the frame
On location hole and the positioning pin that is arranged on the load-bearing part.
7. exposure mask panel assembly according to claim 6, which is characterized in that the location hole have it is multiple, it is multiple described fixed
It is laid along the edge of the frame in position hole.
8. exposure mask panel assembly according to claim 6, which is characterized in that the location hole is waist-shaped hole or circular hole.
9. exposure mask panel assembly according to claim 1, which is characterized in that the block piece in the frame of first mask plate
Including multiple first block pieces and multiple second block pieces, frame first party of multiple first block pieces along the first mask plate
To laying, multiple second block pieces along the first mask plate frame second direction lay, two neighboring first block piece and
Gap is all had between two neighboring second block piece, the gap forms the open region on the first mask plate, and described first hides
Block piece and the second block piece form the blocked area on the first mask plate, wherein the frame first direction of the first mask plate and second
Direction is orthogonal.
10. exposure mask panel assembly according to claim 1, which is characterized in that blocking in the frame of second mask plate
Part includes multiple third block pieces and multiple 4th block pieces, frame first of multiple third block pieces along the second mask plate
Direction is laid, and multiple 4th block pieces are laid along the frame second direction of the second mask plate, two neighboring third block piece
Gap is all had between two neighboring 4th block piece, the gap forms the open region on the second mask plate, the third
Block piece and the 4th block piece form the blocked area on the second mask plate, wherein the frame first direction of the second mask plate and the
Two directions are orthogonal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821080019.1U CN208649450U (en) | 2018-07-09 | 2018-07-09 | A kind of exposure mask panel assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821080019.1U CN208649450U (en) | 2018-07-09 | 2018-07-09 | A kind of exposure mask panel assembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208649450U true CN208649450U (en) | 2019-03-26 |
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ID=65783331
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821080019.1U Active CN208649450U (en) | 2018-07-09 | 2018-07-09 | A kind of exposure mask panel assembly |
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| Country | Link |
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| CN (1) | CN208649450U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111850467A (en) * | 2020-08-04 | 2020-10-30 | 京东方科技集团股份有限公司 | Metal mask plate assembly, OLED display panel and display device |
| WO2020252864A1 (en) * | 2019-06-21 | 2020-12-24 | 武汉华星光电半导体显示技术有限公司 | Mask plate, mask device and application method thereof |
-
2018
- 2018-07-09 CN CN201821080019.1U patent/CN208649450U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020252864A1 (en) * | 2019-06-21 | 2020-12-24 | 武汉华星光电半导体显示技术有限公司 | Mask plate, mask device and application method thereof |
| CN111850467A (en) * | 2020-08-04 | 2020-10-30 | 京东方科技集团股份有限公司 | Metal mask plate assembly, OLED display panel and display device |
| CN111850467B (en) * | 2020-08-04 | 2022-08-02 | 京东方科技集团股份有限公司 | Metal mask plate assembly, OLED display panel and display device |
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Effective date of registration: 20210112 Address after: 101102 102-lq307, 1-3 / F, building 26, 17 huanke Middle Road, Jinqiao Science and technology industrial base, Tongzhou Park, Zhongguancun Science and Technology Park, Tongzhou District, Beijing Patentee after: Deyun Chuangxin (Beijing) Technology Co.,Ltd. Address before: 100176 10th floor, building 2, yard 9, Ronghua South Road, Yizhuang Economic and Technological Development Zone, Daxing District, Beijing Patentee before: Juntai innovation (Beijing) Technology Co.,Ltd. |